JPH09214108A - Pattern forming method and pattern forming equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pattern forming method and a pattern forming equipment which can simply form a pattern of high precision. SOLUTION: Ink retained on an intaglis 2 is once transferred on a blanket B, and then transferred on a board S to be printed. At this time, the steady flow viscosity of used ink is set to be in a range of 300-3000 poise, the critical surface tension of the blanket is set to be 20-30 dyne/cm, the hardness is set to be 40-80 deg., and the viscoelasticity tan δ is set to be in a range of 0.05-0.20. The ink transferred on the board S to be printed is baked and made a pattern.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern forming method in an electronic device such as an integrated circuit or an image display device, and a pattern forming device.

[0002]

2. Description of the Related Art In recent years, patterns of electrodes, resistors, dielectrics and the like in electronic devices such as integrated circuits and image display devices have been required to be formed with higher accuracy and at lower manufacturing cost. ing.

Conventionally, as a pattern forming method in the electronic device as described above, a thin film etching method in which a thin film having desired characteristics formed by vapor deposition, sputtering, plating or the like is etched by photolithography,
Examples thereof include a thick film etching method in which a film formed by applying ink by a screen printing method or the like is etched by a photolithography method, a printing method such as a screen printing method, an intaglio offset method, and the like.

[0004]

However, although the above-mentioned thin film etching method and thick film etching method can form a highly accurate pattern, the manufacturing cost becomes high because of the etching step. There was a problem. Further, for example, in the case of forming a pattern such as an electrode on a large-area substrate such as a large image display device of 40 to 50 inches, a large number of large thin film forming devices, large exposure devices, and large etching devices are required, In this respect as well, there is a problem that the manufacturing cost increases.

Further, since the screen printing method described above does not have an etching step and is simpler than the above-described thin film etching method and thick film etching method, it is expected to reduce the manufacturing cost. In the case where the circuits are concentrated in a very small area, or in the case of an electrode pattern used in an image display device which has recently been increased in size, for example, a plasma display panel (PDP) aiming at an increase in size of 40 to 50 inches. Has a problem that the required dimensional accuracy cannot be satisfied. In particular, when the electrode pattern of a large-sized image display device is formed, the dimensional accuracy of the peripheral portion of the electrode pattern is reduced, which is not practical.

Further, in the conventional intaglio offset method, the transfer rate of ink from the blanket to the substrate to be printed is low, the film thickness and the line width vary greatly during continuous printing, and a pattern having the required dimensional accuracy is stabilized. It was difficult to print continuously.

The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a pattern forming method and a pattern forming apparatus capable of easily forming a highly accurate pattern.

[0008]

In order to achieve such an object, the pattern forming method of the present invention comprises an ink having a steady flow viscosity of 300 to 3000 poise and a critical surface tension of 20 to 30 dyne / cm. Using a blanket having a hardness of 40 to 80 ° and a viscoelasticity tan δ of 0.05 to 0.20, the ink held in the intaglio is once transferred onto the blanket, and then the ink is placed on the blanket. From the ink to the substrate to be printed, and then the ink is baked.

In the pattern forming method of the present invention, the ink contains 40 to 90% by weight of conductive powder, 1 to 10% by weight of glass powder, and 5 to 55% by weight of binder resin. It is configured to be ink.

A first aspect of the pattern forming apparatus is an intaglio plate, an ink supply unit for supplying ink to the intaglio plate, and a doctor unit for scraping off unnecessary portions of the ink supplied from the ink supply unit to the intaglio plate. A blanket cylinder for once receiving the ink held in the intaglio and transferring it to the substrate to be printed, and a stage for mounting the substrate to be printed. The blanket cylinder has a critical surface tension of 20. ~
A blanket having a hardness of 30 dyne / cm, a hardness of 40 to 80 ° and a viscoelasticity tan δ of 0.05 to 0.20 was attached to the peripheral surface.

Further, the pattern forming apparatus of the present invention is configured to have an ink wiping portion for wiping off the ink remaining on the intaglio plate after the ink is wiped off by the doctor portion.

Further, the pattern forming apparatus of the present invention is configured such that the intaglio plate has a cylindrical shape, and the blanket cylinder is capable of being brought into contact with and separated from the cylindrical intaglio plate.

A second aspect of the pattern forming apparatus is an intaglio plate, an ink supply unit for supplying ink to the intaglio plate, and a doctor unit for scraping off unnecessary portions of the ink supplied from the ink supply unit to the intaglio plate. And a delivery roller around which a long blanket for receiving the ink held in the intaglio and transferring it to the substrate to be printed is wound,
An impression cylinder for bringing the blanket sent out from the sending roller into contact with the intaglio plate to receive ink, a take-up roller for taking up the blanket passing through the impression cylinder, the impression cylinder and the take-up A backup roller provided in the blanket transporting path between the roller and a roller; and a stage on which the substrate to be printed is placed. The blanket has a critical surface tension of 20 to 30 dyne / cm 2,
Hardness is 40-80 °, viscoelasticity tan δ is 0.05-0.2
The configuration is set to be in the range of 0.

Further, the pattern forming apparatus of the present invention is configured to have an ink wiping portion for wiping off the ink remaining on the intaglio plate after the ink is wiped off by the doctor portion.

Further, the pattern forming apparatus of the present invention is configured such that the intaglio plate has a cylindrical shape, and the impression cylinder can be brought into contact with and separated from the cylindrical intaglio plate.

In the pattern forming apparatus of the present invention, the intaglio plate is constructed so that the temperature can be adjusted within the range of 20 to 100 ° C.

According to the present invention as described above, the ink held on the intaglio plate is once transferred onto the blanket and then transferred onto the substrate to be printed. At this time, the steady flow viscosity of the ink is 3
It is in the range of 00 to 3000 poise, the critical surface tension of the blanket is 20 to 30 dyne / cm, and the hardness is 40 to 80.
°, viscoelasticity tan δ is in the range of 0.05 to 0.20, the transfer rate of ink from the blanket to the substrate to be printed is extremely high, and a high-definition pattern that faithfully reproduces the fine pattern of the intaglio plate is printed. It can be formed on a substrate.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The preferred embodiments of the present invention will be described below.

First, the pattern forming apparatus of the present invention will be described. FIG. 1 is a schematic configuration diagram showing a first embodiment of a pattern forming apparatus of the present invention. In FIG. 1, the pattern forming apparatus 1 includes a cylinder-shaped intaglio 2, and this intaglio 2
An ink supply unit 3 for supplying ink to the ink, a doctor unit 4 for scraping off unnecessary portions of the ink supplied to the intaglio 2, a blanket cylinder 5 having a blanket B mounted on its peripheral surface, and a substrate S to be printed are placed. A stage 6 for cleaning, an ink wiping unit 7 for wiping the ink of the intaglio 2, and a blanket cleaning unit 8 are provided.

FIG. 2 is a schematic block diagram showing a second embodiment of the pattern forming apparatus of the present invention. In FIG. 2, the pattern forming device 11 is a cylindrical intaglio 1
2. An ink supply unit 13 for supplying ink to the intaglio plate 12, a doctor unit 14 for scraping off unnecessary portions of the ink supplied to the intaglio plate 12, and an ink held in the intaglio plate 12 for once receiving and printing A delivery roller 15 around which a long blanket B for transferring onto a substrate is wound.
An impression cylinder 16 for bringing the blanket B sent from the sending roller 15 into contact with the intaglio 12 to receive ink, a take-up roller 18 for taking up the blanket B that has passed through the impression cylinder, and an impression cylinder. 16, a backup roller 17 provided in a blanket transport path between the take-up roller 18 and the take-up roller 18, a transport roller 19, a stage 20 on which the substrate S to be printed is placed, and an ink wiping unit 21 for wiping ink off the intaglio plate 12. It has and.

The intaglio plates 2 and 12 are provided with an image area and a non-image area, and the image area has a groove shape for forming a pattern. Usually, the longitudinal direction of the groove of the image area is an intaglio plate. It is preferable that the circumferential direction of the cylinder is 2,12.

The image portions (patterns) formed on the intaglio plates 2 and 12 can have various patterns. In the present invention, the minimum line width of the groove forming the image portions is about 20 μm, and the non-image portion is not. The minimum width (minimum pattern formation interval) can be set to about 20 μm. Further, the depth (plate depth) of the groove constituting the image portion is preferably about 5 to 50 μm.

Such intaglio plates 2 and 12 can be produced by a conventional intaglio plate making method and are not particularly limited. For example, by forming a temperature control flow path inside the intaglio cylinder to adjust the temperature of the intaglio in the range of 20 to 100 ° C. and setting the temperature of the intaglio higher than room temperature, the ink on the plate surface It is possible to control the viscosity and speed up the doctor and acceptance speed.

The ink supply parts 3 and 13 are not particularly limited, and an ink supply device having a conventionally known mechanism such as a dispenser or an inking roll can be used.

Further, the intaglio plates 2 and 12 of the doctor parts 4 and 14
The contact pressure to the
It can be set appropriately. There is no particular limitation on the material of the doctor parts 4 and 14, and SK steel, stainless steel, which has been conventionally used as a member for a doctor, and a material whose hardness is increased by plating the blade surface (for example, SK steel, etc.) Of which the hardness is increased by plating nickel or ceramics on its surface). The dimensions of the doctor parts 4 and 14 can be appropriately set according to the effective width of the intaglio plates 2 and 12, the material of the doctor parts 4 and 14, and the like.

The blanket cylinder 5 constituting the pattern forming apparatus 1 has a blanket mounted on its peripheral surface.
The blanket cylinder 5 preferably has a circularity of ± 10 μm or less and a cylindricity of ± 10 μm or less. In addition, the impression cylinder 16 and the backup roller 17 constituting the pattern forming apparatus 11 are also the same as the blanket cylinder 5 described above.
It is preferable that the circularity is ± 10 μm or less and the cylindricity is ± 10 μm or less.

In the present invention, as the blanket B, the critical surface tension is 20 to 30 dyne / cm, the hardness is 40 to 80 °,
It is characterized by using a blanket having a viscoelasticity tan δ in the range of 0.05 to 0.20.

The critical surface tension of the blanket is measured by cutting the blanket to be measured into an appropriate size and measuring the contact angle meter CA-
It is determined from a Zisman plot measured with a type D (manufactured by Kyowa Interface Science Co., Ltd.). The solvents used for the Zisman plot and their surface tensions are shown below.

Solvent name Surface tension (dyne / cm) -Ethanol ... 20.05-Diethylene glycol monoethyl ether ... 31.9-Trimethylolpropane triacrylate ... 35.5-Diallyl phthalate ... 36.8 Generally, the critical surface tension is 20. Rubber materials in the range of up to 30 dyne / cm include dimethyl siloxane, methyl vinyl siloxane, methyl fluoro vinyl siloxane, methyl phenyl vinyl siloxane, and the above polymers and NB.
R, EPDM, blends and copolymerization systems with styrene-butadiene rubber (SBR), fluororubber, and NBR, EP
Examples thereof include those obtained by mixing silicone oil or the like into DM, SBR, etc., and those obtained by baking NBR, EPDM, SBR in a siloxane atmosphere at 100 to 200 ° C. for about 1 hour to form a coat layer having a small surface energy.

The critical surface tension of the blanket is 30 dyne /
When it exceeds cm, the wettability of the surface rubber layer of the blanket to the ink is too high, and the ink transfer rate from the blanket to the printed substrate S becomes low, which causes piling. If the critical surface tension is less than 20 dyne / cm,
The transferability of the ink from the intaglio plates 2 and 12 to the blanket is lowered, and the reproducibility of fine lines and line width is lowered, which is not preferable.

Next, the hardness and viscoelasticity of the rubber material whose critical surface tension is set to a predetermined value as described above are 40 to 80 ° in hardness and 0.05 to 0.05 in viscoelasticity tan δ, respectively.
Adjust so that the range is 0.20.

The hardness of the blanket is JIS C TY.
It is measured using a PE rubber hardness meter. In addition, the viscoelasticity (tan δ) of the blanket is Rheovibron DDV-II-
It is measured at a temperature of 20 ° C. and a frequency of 11 Hz by EP (Orientec Co., Ltd.).

The hardness and viscoelasticity of the blanket rubber material are determined by the density of cross-linking groups in the raw rubber, the localized state of cross-linking groups, the type of filler, the content rate, the particle size, the surface treatment, the type of cross-linking agent, 1
The secondary vulcanization conditions (temperature, time, etc.) can be adjusted by the presence or absence of secondary vulcanization and the conditions thereof. Here, fumed silica, crushed silica, precipitated silica, calcium bicarbonate, calcium carbonate, diatomaceous earth, talc, quartz powder and the like can be used as the filler.

If the hardness of the blanket is less than 40 °, the ink receiving shape from the intaglio will be poor, and if the hardness exceeds 80 °, the ink transfer shape to the printing substrate will be poor, which is not preferable. On the other hand, the viscoelasticity of the blanket tan
When δ is less than 0.05, the transferability of the ink from the intaglio plates 2 and 12 to the blanket is reduced, the image lines are thinned, and the edge precision is reduced, which is not preferable, and the viscoelasticity tan δ is 0.
When it exceeds 20, the viscous physical properties of the blanket become too large, which adversely affects the chucking of the printed substrate, which is not preferable.

The blanket used is not limited to the so-called compressible type blanket, but may be a solid type blanket having no compression layer.

By mounting the blanket B as described above on the blanket cylinder 5 of the pattern forming apparatus 1, the ink transfer rate from the blanket to the substrate S to be printed becomes extremely high, and continuous printing of fine patterns is possible. Becomes Further, in the pattern forming apparatus 11, the blanket B as described above is fed out from the roller 15 → the impression cylinder 16 →
By feeding the backup roller 17 to the take-up roller 18, the backup roller 1
It is possible to continuously print a fine pattern with a very high ink transfer rate from the blanket B to the substrate S to be printed at the arrangement position of 7.

The stages 6 and 20 move reciprocally in the direction of arrow a in FIGS. 1 and 2 with the substrate S to be printed placed. The printing substrate S may be held on the stages 6 and 20 by any method such as mechanical holding by a chuck or the like, suction holding by suction or the like. Also, stage 6,
The flatness of 20 is preferably ± 20 μm or less. Such movement of the stages 6 and 20 can be performed by a known driving method such as motor driving using a ball screw and a linear guide, and positioning accuracy is ± 10 μm or less and straightness is ±.
It is preferable that the vertical movement is 10 μm or less and the vertical movement is ± 10 μm or less.

The ink wiping parts 7 and 21 are for wiping off unnecessary ink remaining on the intaglio plates 2 and 12 after the ink is scraped off by the doctor parts 4 and 14.
The pair of feeding rollers 7a, 21a and the winding rollers 7b, 21b, the wiping rollers 7c, 21c located between these, and the feeding rollers 7a, 21a.
The wiping film 7 which is wound around the winding rollers 7b and 21b through the wiping rollers 7c and 21c.
d and 21d. In the illustrated example, the wiping rollers 7c and 21c are opposed to the intaglio plates 2 and 12 via the wiping films 7d and 21d, and the surface of the intaglio plates 2 and 12 rotating in the clockwise direction (direction of arrow b in the figure) is By moving the wiping films 7d and 21d in opposite directions (from the bottom to the top in the figure), unnecessary ink adhering to the non-image areas of the intaglio plates 2 and 12 is removed. At this time, the pressing force of the wiping rollers 7c and 21c against the intaglio plates 2 and 12 and the relative speed between the intaglio plates 2 and 12 and the wiping films 7d and 21d can be appropriately set.

The wiping films 7d and 21d may be any of metal foil, synthetic fiber, synthetic resin, rubber and the like, and more specifically, aluminum foil, aluminum vapor-deposited polyethylene terephthalate film, polyethylene terephthalate. Polyvinyl chloride film, polystyrene film, polyvinyl butyral film, polycarbonate film, polymethylmethacrylate film, polyvinyl acetate film, nylon 66 film and the like can be used.

In the pattern forming apparatus 1 of the present invention, a commercially available blanket cleaning device can be used as the blanket cleaning unit 8.

In the pattern forming apparatuses 1 and 11 as described above, the intaglio plates 2 and 12 when the ink is transferred from the intaglio plates 2 and 12 to the blanket B on the blanket cylinder 5 or the blanket B conveyed on the impression cylinder. The speed (circumferential speed) v of the peripheral surface and the moving speed v of the blanket B are 1 to 300 mm.
/ Sec, preferably about 10 to 100 mm / sec. Further, the moving speed V of the printing substrate S and the moving speed V of the blanket B when the ink is transferred from the blanket B to the printing substrate S held on the stages 6 and 20 are
It may be 1 to 300 mm / sec, preferably about 100 to 300 mm / sec.

Further, the pattern forming apparatuses 1 and 11 of the present invention
Then, the intaglio 2 and the blanket cylinder 5 may be separable from each other, and the intaglio 12 and the impression cylinder 16 may be separable from each other. As a result, after the transfer of ink from the intaglio plates 2 and 12 to the blanket is completed at a predetermined speed v, the blanket cylinder 5 is separated from the intaglio plate 2 or the impression cylinder 16 is separated from the intaglio plate 12 and the blanket cylinder 5 or It is possible to transfer the ink from the blanket to the substrate S to be printed at a predetermined speed V by changing the rotation speeds of the cylinder 16, the feeding roller 15, and the winding roller 18.

Next, the pattern forming method of the present invention will be described including the operation of the pattern forming apparatus 1 described above.

First, ink is supplied from the ink supply unit 3 onto the intaglio plate 2 that rotates at a predetermined speed in the direction of arrow b in FIG. Next, the intaglio plate 2 comes into contact with the doctor part 4 to scrape off unnecessary ink, so that the ink is retained in the image area (groove part) of the intaglio plate 2. The unnecessary ink adhering to the non-image area is wiped off by the wiping film 7d of the ink wiping unit 7.

The ink held on the image area of the intaglio plate 2 is then attached to the peripheral surface of the blanket cylinder 5 by contacting the blanket cylinder 5 which rotates at a predetermined speed in the direction of arrow c. It is once transferred to blanket B. At this time, the speed of the peripheral surface of the intaglio 2 (circumferential speed) and the speed of the peripheral surface of the blanket cylinder 5 (circumferential speed) v are in the above range
The ink is transferred from the intaglio 2 to the blanket B at a speed of 300 mm / sec, preferably about 10 to 100 mm / sec.

Next, after the stage 6 on which the substrate S to be printed is placed moves to the right in FIG. 1 and the alignment with the blanket cylinder 5 to which the ink has been transferred is completed as described above,
It moves to the right while being in contact with the blanket cylinder 5, the ink is transferred onto the substrate S to be printed, and the printing of the electrodes is completed. At this time, the moving speed V of the printed substrate S and the speed (circumferential speed) V of the peripheral surface of the blanket cylinder 5 are in the above range (1 to 3).
00 mm / sec, preferably about 100 to 300 mm / sec).

After the printing of the ink on the substrate S to be printed is completed in this way, the stage 6 moves to the left in FIG. 1 and returns to the original position, and the substrate S to be printed is removed from the stage 6. A new substrate S to be printed is placed.

As described above, the pattern formation on the printed substrate S by the pattern forming apparatus 1 is completed, and the forming apparatus 1 repeats the same operation to continuously form the pattern on the printed substrate S. it can. Further, the blanket cleaning section 8 may clean the blanket B every time one pattern formation is completed, or may be carried out after pattern formation is performed a predetermined number of times continuously.

On the other hand, the printed substrate S taken out from the stage 6 is subjected to a baking process for the printed ink. The firing temperature can be appropriately set according to the ink used, and can be set, for example, in the range of 400 to 600 ° C. By performing such baking, a pattern is formed on the substrate S to be printed.

Next, the pattern forming method of the present invention will be described including the operation of the pattern forming apparatus 11 described above.

First, ink is supplied from the ink supply unit 13 onto the intaglio plate 12 which rotates at a predetermined speed in the direction of arrow b in FIG. Next, the intaglio 12 comes into contact with the doctor section 14 and unnecessary ink is scraped off.
The ink is held in the image area (groove) of No. 2, and the unnecessary ink adhering to the non-image area of the intaglio plate 12 is wiped by the wiping film 21d of the ink wiping section 21 even if the ink passes through the doctor section 14. Wiped off.

The ink held on the image area of the intaglio 12 as described above is once transferred onto the blanket B by contacting the blanket B passing over the impression cylinder 15 rotating in the direction of arrow c. At this time, the speed of the peripheral surface of the intaglio 12 (circumferential speed) and the moving speed of the blanket B (circumferential speed) v
Is in the above range (1 to 300 mm / sec, preferably 10 to
The ink is transferred from the intaglio 2 to the blanket B at about 100 mm / sec.

Next, the blanket B is conveyed by the conveying roller 1.
The backup roller 17 is sent via 9 while
After the stage 20 on which the substrate S to be printed is placed moves to the right in FIG. 2 and the alignment with the blanket to which the ink has been transferred is completed as described above, the backup roller 1
In the lower part of 7, the blanket B is moved to the right while being in contact with the blanket B, the ink is transferred onto the substrate S to be printed, and the printing of the pattern is completed. Moving speed V of the substrate S to be printed at this time
And the moving speed V of the blanket B are in the above range (1 to 3).
00 mm / sec, preferably about 100 to 300 mm / sec).

After the printing of the ink on the substrate S to be printed is completed in this way, the stage 20 moves leftward in FIG. 2 and returns to the original position, and the substrate S to be printed is removed from the stage 20. A new substrate S to be printed is placed.

With the above, the pattern formation on the substrate S to be printed by the pattern forming apparatus 1 is completed, and the forming apparatus 11 repeats the same operation to continuously form the pattern on the substrate S to be printed. it can.

On the other hand, the printed substrate S taken out from the stage 20 is subjected to a baking process for the printed ink. The firing temperature can be appropriately set according to the ink used, and can be set, for example, in the range of 400 to 600 ° C. By performing such baking, a pattern is formed on the substrate S to be printed.

Here, a conductive ink will be described as an example of the ink that can be used in the above-described pattern forming method of the present invention.

The conductive ink used has a steady flow viscosity of 3
The ink is in the range of 00 to 3000 poise. The steady flow viscosity was measured using a CarryMed CS100 rheometer at a measurement temperature of 20 ° C. and a measurement shear rate of 0.01 to 20.
It can be measured in the range of 0 / sec. Steady flow viscosity is 3
When it is less than 00 poise, the ink transfer rate from the blanket to the substrate S to be printed becomes less than 100%, and 30
When it exceeds 00 poise, the ink transfer rate from the intaglio plates 2 and 12 to the blanket is 50% or less, and the reproducibility of fine lines and line reproducibility are further deteriorated, which is not preferable.

As such a conductive ink, one containing 40 to 90% by weight of the conductive powder, 1 to 10% by weight of the glass powder and 5 to 55% by weight of the binder resin can be preferably used.

As the conductive powder, Ag, Au, Pt,
A simple substance such as Pd, Al, Ni, and C, an alloy, or a mixture thereof can be used. The particle size of such conductive powder is preferably about 1 to 10 μm.

Further, the glass powder is for softening or melting when the electrode pattern printed as described above is fired so that the conductive powder is firmly adhered to the substrate S to be printed. Therefore, the glass powder needs to have a softening point that is 10 to 200 ° C. lower than the firing temperature. As such a glass powder, PbO is contained in an amount of 50% by weight or more, and as other components, it has an effect of preventing phase separation of glass, adjusts a softening point, and has a coefficient of thermal expansion in the substrate S to be printed. Al ₂ O ₃ , to match
B ₂ O ₃ , SiO ₂ , MgO, CaO, SrO, Ba
O, ZnO, TiO ₂ , ZrO ₂ or the like may be appropriately selected and contained.

The particle size of such glass powder is suitably crushed to about 350 mesh. When the content of the glass powder in the conductive ink is less than 1% by weight, the adhesive force between the conductive ink and the substrate S to be printed at the time of firing becomes insufficient, and when it exceeds 10% by weight, it is formed by firing. This is not preferable because the conductivity of the formed electrode pattern is insufficient.

Further, the binder resin contained in the conductive ink is preferably a resin which can be burned at a low temperature and which is decomposed and vaporized during firing so that the carbide does not remain in the electrode. Specifically, ethyl cellulose, methyl cellulose, nitrocellulose, cellulose acetate, cellulose propionate, cellulose resins such as cellulose butyrate, methyl methacrylate,
Examples of the acrylic resin include polymers such as ethyl methacrylate, normal butyl methacrylate, isobutyl methacrylate, isopropyl methacrylate, 2-ethyl methacrylate, and 2-hydroxyethyl methacrylate.

Further, the conductive ink has a
Terpineol, butyl carbitol acetate, etc. can be contained as a solvent.

[0065]

Next, the present invention will be described in more detail with reference to examples.

Preparation of conductive ink As conductive powder, silver particles having an average particle diameter of 1 μm were prepared. Also, as a glass powder, IWF frit 7570
(Iwashiro Glass Co., Ltd. 300 mesh, softening point 440
Glass powder was prepared by crushing (.degree. C.) to a particle size of 350 mesh.

Further, as a binder resin, polyester acrylate oligomer, trimethylolpropane triacrylate, and hydroxyethyl acrylate are used as the binder resin.
A mixture prepared at 0:40:30 (weight ratio) was prepared.

Next, conductive powders, glass powders, and binder resins having the compositions shown in Table 1 below were mixed in a three-roll mill to prepare conductive inks A to C. The steady flow viscosity was measured under the following measurement conditions, and the results are shown in Table 1.

(Conditions for Measuring Steady Flow Viscosity) Using a CS100 rheometer manufactured by CarryMed, a measuring temperature of 20 ° C.
Measurement The shear rate is 100 / sec.

[0070]

[Table 1] Preparation of blanket After applying the surface rubber on the base material consisting of the base cloth and the compression layer,
The PET film was vulcanized while being pressed against the surface coated with rubber, and then the film was peeled off to form a surface rubber layer (thickness: about 100 μm) and a blanket (Sample 1 to Sample 1).
9) was produced. The production conditions of each blanket (Samples 1 to 9) were as shown below.

Sample 1: (Composition) KE-108 manufactured by Shin-Etsu Silicone Co., Ltd. 100 parts by weight Curing agent CAT-108 manufactured by Shin-Etsu Silicone Co., Ltd. 5 parts by weight Filler CERATOM FW-14 manufactured by Kakiuchi Co., Ltd. 30 parts by weight (vulcanization condition) Primary vulcanization 25 ° C., 75 hours Sample 2: (Composition) Shin-Etsu Silicone Co., Ltd. KE-742U ... 100 parts by weight Crosslinking agent Dimethyl-2,5 di-t-butylferroxy Hexane: 5 parts by weight (vulcanization condition) Primary vulcanization 170 ° C., 20 minutes Sample 3: (Composition) Shin-Etsu Silicone Co., Ltd. KE-785U: 100 parts by weight Crosslinking agent 2,5-Dimethyl-2,5 5 parts by weight (vulcanization condition) Primary vulcanization 170 ° C., 20 minutes Secondary vulcanization 200 ° C., 4 hours Sample 4: (Composition) FE361U manufactured by Shin-Etsu Silicone Co., Ltd. 100 parts Part Crosslinking agent C-8A ... 5 parts by weight (vulcanization condition) Primary vulcanization 165 ° C., 10 minutes Secondary vulcanization 200 ° C., 4 hours Sample 5: (Composition) KE-108 manufactured by Shin-Etsu Silicone Co., Ltd. 100 parts by weight Curing agent CAT-108 manufactured by Shin-Etsu Silicone Co., Ltd .... 5 parts by weight Aerosil 200 manufactured by Nippon Aerosil Co., Ltd. 15 parts by weight (vulcanization conditions) Primary vulcanization 25 ° C., 75 hours Sample 6: (composition ) Shin-Etsu Silicone Co., Ltd. KE-742U ... 100 parts by weight Cross-linking agent Dimethyl-2,5 di-t-butylferroxyhexane ... 5 parts by weight (vulcanization condition) Primary vulcanization 120 ° C., 20 minutes Sample 7: ( Composition) Shin-Etsu Silicone Co., Ltd. KE-785U 100 parts by weight Crosslinking agent 2,5-dimethyl-2,5 t-butylferroxyhexane 5 parts by weight (vulcanization conditions) Primary vulcanization 150 ° C, 40 Secondary vulcanization 2 minutes 0 ° C, 5 hours Sample 8: (Composition) KE-108 manufactured by Shin-Etsu Silicone Co., Ltd. 100 parts by weight Curing agent CAT-108 manufactured by Shin-Etsu Silicone Co., Ltd. 5 parts by weight CERATOM FW- manufactured by Kakiuchi Co., Ltd. 14 30 parts by weight Dimethyl silicone oil 5 parts by weight (vulcanization conditions) Primary vulcanization 25 ° C., 75 hours Sample 9: (Composition) Shin-Etsu Silicone KE-5570 100 parts by weight Japan Synthetic Rubber ( Co., Ltd. JSR N220SH 10 ... 10 parts by weight Cross-linking agent 2,5-dimethyl-2,5 t-butylferroxyhexane ... 5 parts by weight Sulfur ... 0.3 parts by weight Thallium ... 0.1 parts by weight (vulcanization condition) Primary vulcanization 150 ° C., 40 minutes Secondary vulcanization 200 ° C., 5 hours Critical surface tension of each blanket prepared as described above,
The hardness and viscoelasticity were as shown in Table 2 below.

The critical surface tension was measured with a contact angle meter CA-D type manufactured by Kyowa Interface Science Co., Ltd. using the following solvents and calculated from Zisman plot.

Solvent name Surface tension (dyne / cm 2) ・ Ethanol 20.05 ・ Diethylene glycol monoethyl ether 31.9 ・ Trimethylolpropane triacrylate 35.5 ・ Diallyl phthalate 36.8 The hardness of the surface rubber layer is JIS. It was measured using a C TYPE rubber hardness meter.

Further, the viscoelasticity tan δ was measured with Rheovibron DDV-II-EP manufactured by Orientec Co., Ltd. at a temperature of 20 ° C.
It was measured at a frequency of 11 Hz.

[0075]

[Table 2] Formation of Electrodes Electrode patterns were formed on a glass substrate (size 300 × 400 mm) by using the above conductive inks A to C and blanket samples 1 to 9 in the pattern forming apparatus as shown in FIG.

The intaglio offset type pattern forming apparatus used had the following specifications.

(Intaglio) -Size: Effective perimeter = 550 mm (body diameter about 180 mmφ) Effective length = 500 mm-Rotation speed: 5-300 mm / sec (peripheral speed) -Plate depth: 25 μm (ink supply part) Dispenser ( Doctor :) Size: Doctor = 450mm Holder = 600mm ・ Pressure: Variable air pressure ・ Operation: Vertical movement (Blanket cylinder) ・ Size: Effective circumference = 450mm (Cylinder diameter about 180mmφ) Effective length = 600mm ・ Rotation speed: 5 to 300 mm / sec (peripheral speed) ・ Operation: Vertical movement ・ Blanket mounting method: Entrainment method (stage) ・ Speed: 5 to 400 mm / second ・ Alignment: Pin contact method, XY adjustment mechanism, alignment camera ・ Surface plate size: 700 × 700 mm ・ Glass substrate holding method: Vacuum suction method ・ Surface plate flatness: 10 μm・ Method: Film wiping method ・ Film feed speed: 5 to 200 mm / sec ・ Film winding diameter: Approximately 200 mmφ ・ Wiping roller ： Rubber roller (diameter 100 mmφ) ・ Wiping film: Polyester film Image area formed on intaglio plate Is an electrode pattern (entire pattern size = 150 × 210 mm), plate depth 25 μ
m and the line width are different from each other in the range of 70 to 150 μm.

The peripheral speed v of the intaglio and blanket cylinder is 40 m
The blanket cylinder peripheral velocity V and the glass substrate moving velocity V were 300 mm / sec.

After the electrode pattern was printed on the glass substrate by the pattern forming apparatus as described above, the glass substrate was kept at 600 ° C. for 60 minutes to bake the conductive ink to form the electrode pattern (Samples 1 to 11). Formed. Further, the film thickness, pattern shape, and electric resistance value of the formed electrode pattern were measured and evaluated, and shown in Table 3 below.

The conductive inks A to C used for forming the electrode patterns (Samples 1 to 5) and the blanket sample 1 were used.
The combinations of 3 to 3 are shown in Table 3 below. In forming the electrode patterns (Samples 6 to 11), the following combinations of conductive ink A and blanket samples 4 to 9 were used.

Electrode sample 6: Combination of conductive ink A and blanket sample 4 Electrode sample 7: Combination of conductive ink A and blanket sample 5 Electrode sample 8: Combination of conductive ink A and blanket sample 6 Electrode sample 9: Conductivity Electrolytic ink A and blanket sample 7 combination Electrode sample 10: Conductive ink A and blanket sample 8 combination Electrode sample 11: Conductive ink A and blanket sample 9 combination

[0082]

[Table 3] As shown in Table 3, the steady flow viscosity is 300 to 3000.
Using ink sample A in the poise range, and having a critical surface tension of 20 to 30 dyne / cm, hardness of 40 to 80 °,
When the blanket samples (1 to 3) having a viscoelasticity tan δ in the range of 0.05 to 0.20 were used, the ink transfer rate was high, the conductivity and linearity were good, and the highly accurate electrode pattern (Sample 1, 4, 5) could be formed.

On the other hand, in the formation of the electrode pattern (Sample 6), chucking failure of the glass substrate occurred and it was impossible to form the electrode pattern. Further, in the formation of the electrode patterns (Samples 7, 9 and 10), defective transfer of ink from the intaglio to the blanket occurred, making it impossible to form the electrode pattern. Further, in the formation of the electrode patterns (Samples 8 and 11), defective transfer of ink from the blanket to the glass substrate occurred, and it was impossible to form the electrode pattern.

[0084]

As described in detail above, according to the present invention, an ink having a constant flow viscosity of 300 to 3000 poise is used as the ink, and the ink retained on the intaglio plate is once transferred onto the blanket, Although transferred to the substrate to be printed, the critical surface tension of the blanket is 20 to 30 dyne / cm
, Hardness 40 to 80 °, viscoelasticity tan δ 0.05 to
Since it is in the range of 0.20, the ink transfer rate from the intaglio to the blanket and the ink transfer rate from the blanket to the substrate to be printed are extremely high, which makes it possible to faithfully reproduce the fine pattern of the intaglio. A fine pattern can be formed on a substrate to be printed, and it is used for an image display device with a large area such as electrodes, resistors, and dielectrics that are concentrated in a very small area like an integrated circuit. It is possible to easily form the pattern of the electrodes and the like with excellent linearity and high accuracy. Also, since the ink wiping unit is configured to wipe off unnecessary ink on the intaglio plate,
It is possible to form patterns without defects such as background stains, roughness, streaks, unevenness, pinholes, etc. without causing ink residue or excessive ink scraping by the doctor part. By doing so, it is possible to speed up the pattern print formation, and by enabling the blanket cylinder or impression cylinder and the cylinder-shaped intaglio to be separated from and contacted with each other, the ink transfer condition from the intaglio to the blanket and the printing from the blanket. The conditions for transferring ink to the substrate can be optimized independently, and it is possible to achieve both high precision pattern formation and reduction in manufacturing cost. Furthermore, by using a long blanket, it is possible to always form a pattern using a new surface of the blanket, and it is possible to stably and highly accurately form a pattern without replacing the blanket.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a first embodiment of a pattern forming apparatus of the present invention.

FIG. 2 is a schematic configuration diagram showing a second embodiment of a pattern forming apparatus of the present invention.

[Explanation of symbols]

 1, 11 ... Pattern forming device 2, 12 ... Intaglio 3, 13 ... Ink supply part 4, 14 ... Doctor part 5 ... Blanket cylinder 6, 20 ... Stage 7, 21 ... Ink wiping part 8 ... Blanket cleaning part 15 ... Sending out Roller 16 ... Impression cylinder 17 ... Backup roller 18 ... Winding roller B ... Blanket S ... Printed substrate

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI Technical display location C09D 11/00 PTH C09D 11/00 PTH

Claims (11)

[Claims] 1. An ink having a steady flow viscosity in the range of 300 to 3000 poise and a critical surface tension of 20 to 30 dyne / c.
m, hardness 40 to 80 °, viscoelasticity tan δ 0.05 to
Using a blanket in the range of 0.20, the ink held in the intaglio is once transferred onto the blanket, then the ink is transferred from the blanket onto the substrate to be printed, and then the ink is baked. A pattern forming method characterized by the above. 2. The ink is conductive powder of 40 to 90.
The pattern forming method according to claim 1, which is a conductive ink containing glass powder in an amount of 1 to 10% by weight and a binder resin in an amount of 5 to 55% by weight. 3. An intaglio plate, an ink supply unit for supplying ink to the intaglio plate, a doctor unit for scraping off unnecessary portions of the ink supplied from the ink supply unit to the intaglio plate, and an intaglio plate held by the intaglio plate. The blanket cylinder is provided with a blanket cylinder for receiving the ink and transferring the ink onto the substrate to be printed, and a stage on which the substrate to be printed is placed. The blanket cylinder has a critical surface tension of 20 to 30 dyne / cm 2 and a hardness of 40. ~ 80
A pattern forming apparatus, characterized in that a blanket having a viscoelasticity tan δ in the range of 0.05 to 0.20 is mounted on the peripheral surface. 4. The pattern forming apparatus according to claim 3, further comprising an ink wiping portion for wiping ink remaining on the intaglio plate after the ink is wiped off by the doctor portion. 5. The pattern forming apparatus according to claim 3, wherein the intaglio plate has a cylindrical shape. 6. The pattern forming apparatus according to claim 5, wherein the blanket cylinder is separable from and in contact with the cylindrical intaglio plate. 7. An intaglio plate, an ink supply section for supplying ink to the intaglio plate, a doctor section for scraping off unnecessary portions of the ink supplied from the ink supply section to the intaglio plate, and an intaglio plate held by the intaglio plate. A delivery roller around which a long blanket for receiving the ink and transferring it to the substrate to be printed is wound, and a blanket fed from the delivery roller is brought into contact with the intaglio plate to receive the ink. An impression cylinder, a take-up roller for taking up the blanket that has passed through the impression cylinder, a backup roller provided in the blanket conveyance path between the impression cylinder and the take-up roller, and the substrate to be printed. And a stage on which the blanket has a critical surface tension of 20.
A pattern forming apparatus characterized by having a hardness of -40 dyne / cm, a hardness of 40-80 °, and a viscoelasticity tan δ of 0.05-0.20. 8. The pattern forming apparatus according to claim 7, further comprising an ink wiping portion for wiping off the ink remaining on the intaglio plate after the ink is wiped off by the doctor portion. 9. The pattern forming apparatus according to claim 7, wherein the intaglio plate has a cylindrical shape. 10. The pattern forming apparatus according to claim 9, wherein the impression cylinder is separable from and in contact with the cylindrical intaglio plate. 11. The pattern forming apparatus according to claim 3, wherein the temperature of the intaglio plate can be adjusted within a range of 20 to 100 ° C.