JPH09199821A - Connecting element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable the connecting element to be connected simply by adjusting the ambient temperature also any deformation due to unexpected stress to be corrected by heat treatment by a method wherein a through hole inserted part is composed of a shape memory alloy for depressing the through hole at a temperature exceeding the transformation temperature to fix the through hole. SOLUTION: As for the material of the action mechanism part of a connector terminal 3 having a hexagonal type aperture part in the inserted part of the connecting element, a shape memory alloy having the transformation temperature set up at the temperature not exceeding the applicable lower limit temperature of a circuit board making the material memorize a shape so that the maximum diagonal length in an action mechanism part may exceed the inner diameter of the through hole 2 at a temperature exceeding the transformation temperature is applicable. In order to start the packaging step, the shape of the connector terminal is previously deformed in such a shape that the action mechanism part of the connector terminal may be inserted into the through hole 2 of a circuit board 1 at allowance and after the insertion of the action mechanism part also at the temperature not exceeding the transformation temperature, the ambient temperature is turned into a temperature exceeding the transformation temperature.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a connector terminal,
The present invention relates to a connection element connection technology effective when applied to a connection element such as a lead terminal, a crimp terminal, and a pop lippet of a semiconductor element.

[0002]

2. Description of the Related Art Conventionally, a connector terminal in a connector housing of a connector for obtaining electrical continuity by connecting electronic circuit boards to each other or a cable to the electronic circuit board,
For lead terminals of semiconductor elements, crimp terminals for crimping and connecting to wire materials, and connecting elements such as pop-lippets used for connecting structures, common metals such as copper alloys and aluminum are used for the connecting elements. Has been done.

[0003]

There are various types of the above-mentioned connecting element in terms of shape, wire rod mounting method, board mounting method, and the like. However, what can be said in common is that it is difficult to return the shape to the original shape once the shape is changed, and it takes labor to use a tool or the like to change the shape. Therefore, it takes a lot of labor and time to attach wires by crimping, attach to the board by press-fitting, connect structures by crimping, or correct deformation due to unexpected stress. There was a problem that it could not be used.

The present invention has been made in order to solve the above-mentioned problems, and enables the connection to be performed only by adjusting the ambient temperature without requiring labor such as using a tool. The purpose is to be able to similarly correct the deformation due to unexpected stress by heat treatment.

[0005]

A connecting element according to the present invention is a connecting element that is inserted into a through hole of an electronic circuit board and has one end and the other end connected to required parts, respectively. The structure is made of a shape memory alloy, and the through hole is pressed at a temperature equal to or higher than the transformation temperature to be fixed to the through hole.

Further, a connection element which is inserted into a through hole of an electronic circuit board and has one end and the other end connected to required parts respectively, and the through hole insertion part is made of a shape memory alloy and has a temperature higher than a transformation temperature. The structure is made thinner than the through hole.

Also, one end is connected to the semiconductor functional element inside the outer package, and the other end is a connecting element as a lead terminal that is drawn out of the outer package so that the other end can be connected to a circuit pattern through a through hole of an electronic circuit board or the like. The structure is such that the through-hole insertion portion is made of a shape memory alloy, and the through-hole is pressed and fixed to the through-hole at a temperature equal to or higher than the transformation temperature.

Further, a connection element as a connector terminal for obtaining electrical continuity in a connector connecting the electronic circuit boards to each other, the electronic circuit boards to the cables, or the cables to each other, and in the housing of the convex side connector And is made of a shape memory alloy in whole or in part.

A connecting element as a crimping terminal in which a conductive wire is connected to one end by a crimping method and the other end is fixed to a terminal block or the like, and the material of the crimping portion is a shape memory alloy. is there.

Further, the connection element is a pop-lippet for mechanically connecting the plate-shaped structures together, and at least the caulking portion is made of a shape memory alloy.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below. The shape memory alloy used throughout the embodiments of the present invention has a crystalline structure in which a phase change occurs in a solid state due to a temperature change. Is an alloy capable of returning to a memorized shape when deformed in advance at a temperature higher than a temperature called a transformation point. Also, Ti-N
i alloy, Cu-Zn alloy, Cu-Sn alloy, Ni-Al
Various alloys and the like have been developed, and it is necessary to appropriately select from the above alloys depending on the temperature conditions of manufacture and use of a product including a connecting element, and further the use of the connecting element such as electrical conductivity and structural strength. Embodiment 1. 1 and 2 show a first embodiment of the present invention.
FIG. 6 is an explanatory view showing a work of connecting or disconnecting the connecting element by the method.

Reference numeral 1 is a printed circuit board, 2 is a through hole of the printed circuit board, and 3 is a connector terminal having an action mechanism. For example, as shown in the drawing, the through hole insertion portion of the connecting element has a hexagonal opening. It has a simple structure. 3a is a thinly deformed action mechanism portion. For the material of the action mechanism part of the connector terminal 3, a shape memory alloy whose transformation temperature is set to be lower than the lower limit temperature of use of the substrate is used. Above the transformation temperature, the maximum diagonal length of the action mechanism part is equal to or larger than the inner diameter of the through hole. The shape that makes

At the time of mounting, the shape is modified in advance so that the nectar terminal can be inserted below the transformation temperature and the action mechanism portion of the connector terminal can be inserted into the through hole 2 of the substrate 1 with a margin as shown in 3a of FIG. Similarly, after the insertion into the through hole 2 below the transformation temperature, and by setting the ambient temperature to above the transformation temperature, the connector terminals are restored to the memorized shape, and the action mechanism section of the through hole 2
And is fixed to the through hole 2. Since the operating temperature of the substrate 1 is equal to or higher than the transformation temperature of the shape memory alloy, the fixing of the connector terminal 3 to the substrate 1 is maintained.

Contrary to the above case, the shape of the action memory portion of the connector terminal is a shape memory alloy whose transformation temperature is set higher than the upper limit temperature of use of the substrate. 3a, the action mechanism is deformed into a thin shape that can be inserted into the through hole of the substrate with a margin and the shape is stored. At the time of mounting, the connector terminals are deformed into a shape such that the maximum diagonal length of the action mechanism portion is equal to or larger than the inner diameter of the through hole at a transformation temperature or lower, and the mounting is performed by a pressing method as shown in FIG. When removing the mounted connector terminal, the connector terminal is restored to the shape as shown in 3a of FIG. 2 by setting the ambient temperature above the transformation temperature. Therefore, the connector terminal may be replaced or the wiring may be changed. The connector terminal can be easily removed when removing the terminal.

Embodiment 2 FIG. 3 is a perspective view showing an IC to which the connection element according to the second embodiment of the present invention is applied. 4 and 5 are explanatory views showing the work of connecting or disconnecting the connecting element according to the second embodiment of the present invention. Four
Is an IC which is a semiconductor element, 5 is a lead terminal having an action mechanism, 6 is a printed circuit board on which the IC 4 is mounted, 7 is a through hole of the printed circuit board 6, and 7 is an enlarged action mechanism portion of the lead terminal 5. It is a thing.

A general metal such as a copper alloy is used as a material for a lead terminal of a general semiconductor element such as an IC. When mounting on a printed circuit board, the lead terminal is inserted into a through hole of the board. It is fixed by soldering. In this embodiment, the lead terminal, the portion in contact with the inner side surface of the through hole is an action mechanism, and the material of the portion is a shape memory alloy whose transformation temperature is set to the lower limit temperature of the substrate or less, The shape such that the maximum diagonal length of the action mechanism portion is equal to or larger than the inner diameter of the through hole at the transformation temperature or higher is stored. By using such lead terminals, the IC can be mounted on the substrate according to the same principle as that of the first embodiment. The detailed description is given in the first embodiment, and is omitted here.

Contrary to the above case, by using a shape memory alloy whose transformation temperature is set to be higher than the upper limit temperature of use of the substrate as the material of the action mechanism portion of the lead terminal of the IC, the embodiment is realized. According to the same principle as in No. 1, the IC can be easily removed after mounting on the substrate. The detailed description is given in the first embodiment, and is omitted here.

Embodiment 3. 6 and 7 are explanatory views showing a connecting element according to Embodiment 3 of the present invention. 8 is a housing of a convex connector, 9 is a connector terminal of a concave connector at one end, and the other end is connected to a printed pattern wiring (through a through hole) of a board or a wire (soldering, lapping, etc.) ) Is a connector terminal of the convex connector.

As the material of the connector terminal 9, a shape memory alloy whose transformation temperature is set to be higher than the upper limit temperature of use of the connector is used, and a normal shape is stored.
By doing so, even if the connector terminal is deformed like the connector terminal 9a of FIG. 7 due to stress received during manufacturing, transportation, inspection process, actual use, etc., by setting the ambient temperature to the transformation temperature or higher, The deformed connector terminal is shown in Fig. 6.
To restore the original normal shape connector terminal like.

Embodiment 4 8 and 9 are explanatory views showing the work of connecting or disconnecting the connecting element according to the fourth embodiment of the present invention. Reference numeral 10 is a connector terminal for connecting the wire material by crimping, and 11 is a wire material for crimping the connector terminal 10. For the material of the crimping part of the connector terminal 10,
A shape memory alloy is used whose transformation temperature is set below the lower limit of use of the connector terminal, but the shape is such that the crimping portion is crimped to the wire at the transformation temperature or higher as shown in 4a of FIG. Remember.

When connecting the wire rod, the connector terminals are deformed below the transformation temperature so that the crimping portion can be connected to the wire rod as shown in FIG. 8, and the wire rod is inserted into the crimping portion below the transformation temperature. After that, by setting the ambient temperature to the transformation temperature or higher, the connector terminal is restored to the stored shape of 4a in FIG. 9 and the wire is connected and fixed. Although the connector terminals are used, the operating temperature is higher than the transformation temperature, so that the wire material is kept connected and fixed to the connector terminals.

Contrary to the above case, as the material of the crimping portion of the connector terminal, a shape memory alloy whose transformation temperature is set to be higher than the upper limit temperature of use of the connector terminal is used,
At the transformation temperature or higher, the pressure-bonded portion is memorized so as to have a shape as shown in FIG. At the time of crimping and connecting the wire material, the crimping and connecting is performed at a temperature not higher than the transformation temperature by a method using a crimping tool to obtain a state as shown in FIG. When removing the wire from the crimped portion, the connector terminal is restored to the shape shown in FIG. 8 by setting the ambient temperature to the transformation temperature or higher, so that the connector terminal can be easily removed.

Embodiment 5 10 and 11 are explanatory views showing the work of connecting or disconnecting the connecting element according to the fifth embodiment of the present invention. Reference numeral 12 is a crimp terminal for connecting a wire material by crimping, and 13 is a wire material for crimping connection to the crimp terminal. As the material of the crimping portion of the crimping terminal 12, a shape memory alloy whose transformation temperature is set to be lower than or equal to the lower limit of use temperature is used, but above the transformation temperature, the crimping portion is as shown in 12a of FIG. The shape is memorized so that the wire is crimped to.

Before connecting the wire rods, the crimp terminals are deformed in advance to a temperature below the transformation temperature so that the crimp portion can be connected to the wire rods as shown in 12 of FIG. 10, and the wire rods are also crimped below the transformation temperature. After the insertion into the portion, the ambient temperature is raised to the transformation temperature or higher, whereby the crimp terminal is restored to the stored shape of 12a in FIG. 11 and the wire is connected and fixed. Since the use temperature of the crimp terminal is not less than the transformation temperature, the wire is still fixed to the crimp terminal.

Contrary to the above case, as the material of the crimping portion of the crimping terminal, a shape memory alloy whose transformation temperature is higher than the upper limit operating temperature of the crimping terminal is used. The part is stored so as to have a shape as shown in 12 of FIG. When crimping and connecting wires,
At the transformation temperature or lower, crimp connection using a crimping tool,
The state shown in FIG. 11 is obtained. When the wire is removed from the crimp portion, the crimp terminal is restored to the shape shown in 12 of FIG. 10 by setting the ambient temperature to the transformation temperature or higher, so that the wire can be easily removed.

Embodiment 6 FIG. 12 and 13 are explanatory views showing work of connecting or disconnecting a connecting element according to a sixth embodiment of the present invention. Reference numeral 14 is a poppet for connecting structures, and reference numerals 15 and 16 are structures. As the material for the crimped portion of the pop lipet 14, a shape memory alloy whose transformation temperature is lower than or equal to the lower limit operating temperature of the pop lippet is used. Above the transformation temperature, the crimped portion is as shown in 14a of FIG. First, the opened shape is stored so as to be larger than the hole diameter formed in the structures 15 and 16.

When connecting the structures to each other, the pop-lippet is preliminarily kept at a temperature not higher than the transformation temperature, and the caulking portion is made thinner than the diameter of the holes formed in the structures 15 and 16 as shown in FIG. By transforming it into a shape that allows it to pass through and inserting the pop lippet into the hole below the transformation temperature as well, by setting the ambient temperature to above the transformation temperature, the pop lippet
The structure 1 is restored to the stored shape of 14a in FIG.
5 and 16 are connected and fixed. Since the use temperature of the pop lippet is higher than the transformation temperature, the connection of the structures 15 and 16 by the pop lippet is maintained.

Contrary to the above case, as the material of the caulking portion of the pop lipet, a shape memory alloy having a transformation temperature higher than the upper limit temperature of use of the pop lippet is used. The part is memorized so as to have a shape as shown in FIG. Structure 1
When connecting 5 and 16, the structure 1 below the transformation temperature
After inserting into the holes drilled in 5, 16 with a caulking tool,
The caulking portion is caulked into a shape as shown at 14a in FIG. 13 to be connected. At the time of separating the structures 15 and 16, by setting the ambient temperature to the transformation temperature or higher, the pop lippet is restored to the shape shown in 14 of FIG. 12, and therefore the pop lippet can be easily separated by pulling it out of the hole. it can.

As described above, a shape memory alloy having an effective transformation temperature is used as a material of a part or the whole of the connecting element, and the wire rod is attached / detached, attached / detached to / from the substrate, or connected to or removed from the structure. Connection and disconnection are performed by the shape restoring action of the shape memory alloy by adjusting the ambient temperature. Further, by using a shape memory alloy that remembers a normal shape, the deformation due to unexpected stress can be corrected by the shape restoring action by adjusting the ambient temperature as described above.

[0030]

As described above, according to the present invention, a connecting element which is inserted into a through hole of an electronic circuit board and whose one end and the other end are respectively connected to required parts, and which has a through hole insertion part is formed. By using a memory alloy and pressing the through hole at a temperature higher than the transformation temperature to fix the through hole to the through hole, the effort and technology using tools etc. for press-fit mounting of the connection element on the electronic circuit board. There is an effect that it can be easily performed by only adjusting the ambient temperature without the need of.

A connecting element which is inserted into a through hole of an electronic circuit board and has one end and the other end connected to required parts respectively, and the through hole insertion part is made of a shape memory alloy and has a temperature higher than a transformation temperature. With the structure that is thinner than the through hole, the connection element can be removed from the electronic circuit board only by adjusting the ambient temperature, and the labor required for the removal can be omitted.

Further, one end is connected to the semiconductor functional element inside the outer package, and the other end is connected to the outside of the outer package so that the other end can be connected to the circuit pattern through the through hole of the electronic circuit board or the like. In the structure, the through-hole insertion part is made of a shape memory alloy, and the through-hole is pressed at a temperature equal to or higher than the transformation temperature to fix the through-hole to the electronic circuit board. There is an effect that the press-fit mounting can be easily and collectively performed only by adjusting the ambient temperature without requiring labor and technique using tools.

A connecting element as a connector terminal for obtaining electrical continuity in a connector for connecting the electronic circuit boards to each other, the electronic circuit boards to the cables, or the cables to each other, and in the housing of the connector on the convex side. Since all or part of it is made of shape memory alloy, it can be corrected by heat treatment even if the connector terminal is deformed by unexpected stress, so the labor required for correction can be saved and it is also necessary to remove and replace. Since there is no repair parts, the cost of repair parts can be reduced.

A connecting element as a crimp terminal in which a conductive wire is connected to one end by a crimping method and the other end is fixed to a terminal block or the like, and the material of the crimping portion is a shape memory alloy. It is possible to perform the crimping connection of the wire rods only by adjusting the ambient temperature without requiring labor such as using a tool.
Further, the wire material can be removed from the crimping portion only by adjusting the ambient temperature, and the labor required for the removal can be omitted. Further, the crimp terminal can be reused.

A connecting element as a pop lippet for mechanically connecting plate-like structures together, wherein at least the caulking portion is made of a shape memory alloy,
The caulking connection between the structures can be performed only by adjusting the ambient temperature without requiring labor such as using a tool.
Similarly, the structure can be separated only by adjusting the ambient temperature, and the labor required for removal can be omitted. In addition, the pop lippet can be reused.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing a work of connecting or disconnecting a connecting element according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a connecting or disconnecting operation of the connecting element according to the first embodiment of the present invention.

FIG. 3 is a perspective view showing an IC to which a connection element according to a second embodiment of the present invention is applied.

FIG. 4 is an explanatory diagram showing a work of connecting or disconnecting a connecting element according to a second embodiment of the present invention.

FIG. 5 is an explanatory diagram showing a work of connecting or disconnecting a connecting element according to a second embodiment of the present invention.

FIG. 6 is an explanatory diagram showing a connecting element according to a third embodiment of the present invention.

FIG. 7 is an explanatory diagram showing a state in which a part of the connection element according to the third embodiment of the present invention is deformed.

FIG. 8 is an explanatory diagram showing work for connecting or disconnecting a connecting element according to a fourth embodiment of the present invention.

FIG. 9 is an explanatory diagram showing work for connecting or disconnecting the connecting element according to the fourth embodiment of the present invention.

FIG. 10 is an explanatory diagram showing a work of connecting or disconnecting a connecting element according to a fifth embodiment of the present invention.

FIG. 11 is an explanatory diagram showing work for connecting or disconnecting the connecting element according to the fifth embodiment of the present invention.

FIG. 12 is an explanatory diagram showing work for connecting or disconnecting the connecting element according to the sixth embodiment of the present invention.

FIG. 13 is an explanatory diagram showing work for connecting or disconnecting the connecting element according to the sixth embodiment of the present invention.

[Explanation of symbols]

1, printed circuit board 2, through hole 3, connector terminal 4, IC 5, lead terminal 6, printed circuit board 7, through hole 8, convex connector housing 9, connector terminal 1
0, connector terminal 11, wire rod 12, crimp terminal 13, wire rod 14, pop lippet 15, structure 16, structure.

Claims (6)

[Claims] 1. A connection element which is inserted into a through hole of an electronic circuit board and has one end and the other end connected to required parts, respectively, wherein the through hole insertion part is made of a shape memory alloy,
A connecting element having a structure in which the through hole is pressed and fixed to the through hole at a temperature equal to or higher than a transformation temperature. 2. A connection element that is inserted into a through hole of an electronic circuit board and has one end and the other end connected to required parts, respectively, and the through hole insertion part is made of a shape memory alloy,
A connecting element having a structure that is thinner than the through hole at a temperature equal to or higher than a transformation temperature. 3. A connecting element as a lead terminal, which has one end connected to a semiconductor functional element inside the outer package and the other end that is drawn out of the outer package so as to be connected to a circuit pattern through a through hole of an electronic circuit board or the like. The connecting element is characterized in that the through-hole insertion portion is made of a shape memory alloy, and the through-hole is pressed and fixed to the through-hole at a temperature equal to or higher than a transformation temperature. 4. A connection element as a connector terminal for obtaining electrical continuity in a connector connecting between electronic circuit boards, between electronic circuit boards and cables, or between cables, etc., which is within a housing of a convex side connector. A connection element, which is attached to a part of the connection element and is wholly or partly made of a shape memory alloy. 5. A connection element as a crimp terminal for connecting a conductive wire to one end by a crimping method and fixing the other end to a terminal block or the like, wherein the material of the crimping portion is a shape memory alloy. Characteristic connection element. 6. A connection element as a pop lippet for mechanically connecting plate-shaped structures together, wherein at least the crimped portion is made of a shape memory alloy.