JPH09193441A - Printing head for powder flying-type recording - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a printing head for powder scattering-type recording. SOLUTION: Glass epoxy substrates 20, 21 are electrically connected to both sides in the width direction of a strip-like flexible printed circuit board 19. In addition, a control electrode 18 on the peripheral edge of a through hole 17 formed in the flexible printed circuit board 19 is electrically connected to a wiring pattern 33 on the glass epoxy substrate 20, 21 through a wiring pattern 32 and anisotropic electroconductive films 30, 31. On the glass epoxy substrates 20, 21 a semiconductor integrated circuit chip 32 and a circuit part 35 are mounted. In the semiconductor integrated circuit chip 34, a driver for driving a voltage to be applied to the control electrode 18 through the wiring pattern 33 is included. Thus it is possible to reduce the use quantity of the flexible printed circuit board 19 and reduce a replacement cost when a faulty semiconductor integrated circuit chip 34 is generated, so that the manufacturing cost of a printing head 13 can be decreased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a powder flying type recording print head for printing by directly adhering a powdery developer onto a recording member without forming an electrostatic latent image.

[0002]

2. Description of the Related Art Conventionally, P.P. F. 1 by Carlson
A so-called electrophotographic recording device invented in 938 is widely used. In the electrophotographic method, an electrostatic latent image is formed on a photoconductive photoconductor, toner, which is a charged powdery developer, is adsorbed, the toner image is transferred onto a recording member such as paper, and heat fusion is performed. Let me record. In such an electrophotographic system, the photoconductive photoconductor is expensive and the burden of maintenance is heavy.

In recent years, a powder flying type recording system as shown in FIG. 6 has been proposed. Typical prior art is disclosed in, for example, Japanese Patent Application Laid-Open No. 4-221970. The cylindrical developing roller 1 carries the toner 2 which is a powdery developer having magnetism on its surface by magnetically attracting it. The developing roller 1 rotates around its axis and conveys the toner 2 carried on the surface to the area where the print head 3 is provided. The print head 3 is interposed between the developing roller 1 and the recording paper 4, and the recording paper 4 is placed on the back electrode 5. The print head 3 is formed by using a flexible printed wiring board, which is abbreviated as FPC, a plurality of through holes 7 are formed in a film-like insulating substrate 6 such as polyimide, and a control electrode 8 is provided on the periphery thereof. Has been.

When the toner 2 is negatively charged, a positive voltage is applied to the control electrode 8 and a high positive voltage is applied to the back electrode 5, the toner adhered to the surface of the developing roller 1 by magnetic attraction. 2 is attracted by the electrostatic force and flies from the surface of the developing roller 1. The toner 2 that has passed through the through holes 7 is
Accelerated by the positive potential of the back electrode 5, it reaches and adheres to the recording paper 4, and printing and recording corresponding to the electric field applied to the control electrode 8 are performed.

[0005]

A flexible printed wiring board is used as the print head 3 for recording in the powder flying method as shown in FIG. Flexible printed wiring boards are expensive. Further, in order to apply a voltage to the control electrode 8 to perform print control, it is necessary to provide a driver circuit for driving each control electrode 8. When a large number of control electrodes 8 are provided in order to increase the resolution of a printed image, it is necessary to mount a large number of semiconductor integrated circuit chips including drivers correspondingly. The semiconductor integrated circuit chip is directly mounted on the insulating substrate 6 by a face bonding method or the like. After mounting the semiconductor integrated circuit chip,
Since it will be coated with a protective synthetic resin,
It is very difficult to confirm the operation and replace the semiconductor integrated circuit chip.

If a semiconductor integrated circuit chip has a defective product, the entire print head 3 becomes defective, and an expensive flexible printed wiring board is wasted.

An object of the present invention is to provide a powder flying type recording print head which can reduce the cost and can easily confirm the operation of the mounted semiconductor integrated circuit chip.

[0008]

The present invention is arranged between a cylindrical developer carrier for holding a magnetic powdery developer and an accelerating electrode for accelerating and attracting the developer, and Flying powder recording for controlling the electric field control by ejecting the developer from the developer carrier and attaching the developer onto the recording member inserted in the flight path to the acceleration electrode. Print head having a plurality of through holes,
A flexible printed wiring board on which control electrodes are individually formed on the periphery of each through hole, and an electrical connection with each control electrode on the flexible printed wiring board is provided around the flexible printed wiring board. And a rigid printed wiring board on which a wiring pattern connected to is formed. According to the present invention, the rigid printed wiring board is electrically connected around the flexible printed wiring board on which the control electrodes of the powder flying recording print head are formed. Since the flexible printed wiring board only needs to be used in the vicinity of the control electrode, the total material cost can be reduced.

The flexible printed wiring board of the present invention has a strip shape extending in the axial direction of the cylindrical developer carrier, and two rigid printed wiring boards are used, and the flexible printed wiring board has a strip shape. The printed wiring board is connected to both ends in the width direction perpendicular to the length direction. According to the invention, the flexible printed wiring board is formed in a strip shape extending in the axial direction of the cylindrical developer carrier, and the two rigid printed wiring boards are connected to both ends in the width direction thereof. Since the rigid printed wiring boards are provided at both ends in the width direction, the flexible printed wiring board in the middle can be surely held even if curved in accordance with the shape of the cylindrical developer carrier.

Further, the present invention is characterized in that an anisotropic conductive film is provided in an electrical connection portion between the flexible printed wiring board and the rigid printed wiring board. According to the invention, since the flexible printed wiring board and the rigid printed wiring board are electrically connected by the anisotropic conductive film,
A large number of connection wiring patterns can be easily connected. Since the flexible printed wiring board and the rigid printed wiring board can be separately processed until they are connected by the anisotropic conductive film to confirm the operation, a highly reliable print head can be obtained.

Further, the present invention is characterized in that the rigid printed wiring board is made of glass epoxy and can mount the semiconductor integrated circuit chip for driving the control electrodes.
According to the present invention, a semiconductor integrated circuit chip can be directly mounted on a rigid printed wiring board made of glass epoxy, and the control electrodes can be electrically driven, so that the print head can be formed in a small size. it can.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a schematic structure of a powder flying type recording apparatus according to an embodiment of the present invention. The entire surface of the developing roller 11, which is a developer bearing member, is N or S.
It is a magnet roller that is magnetized to hold the toner 12 which is a magnetic powdery developer while magnetically attracting it. The print head 13 is arranged at a slight distance from the surface of the developing roller 11. On the side opposite to the side where the print head 13 faces the developing roller 11, recording paper or OH
A conductor roller 15, which is an acceleration electrode, is arranged at an interval such that a recording member 14 such as a P sheet can be inserted.

In the print head 13, a plurality of through holes 17 are formed in a flexible insulating substrate 16 made of a heat resistant insulating film such as polyimide, and a control electrode 18 is provided at the peripheral portion of each through hole 17. There is. Such a flexible printed wiring board 19 has a strip shape extending in the axial direction of the developing roller 11, and a glass epoxy board 20 which is a rigid printed wiring board on both ends in the width direction perpendicular to the axial direction. , 2
1 is arranged respectively. Flexible printed wiring board 19
Between the developing roller 11 and the developing roller 11, except for the portion where the through hole 17 is formed, an elastic foam layer 2 such as a urethane sheet.
2 and 23 are interposed to maintain the space between the surface of the developing roller 11 and the control electrode 18. A recording member guide 24 is provided on the conveyance path of the recording member 14, and the recording head 13 is provided.
The insertion of the recording member 14 between the conductor roller 14 and the conductor roller 14 is facilitated. The developing roller 11 is connected to a bias power supply 25 for applying a bias voltage of about 0 to + 300V. A control power supply 26 for applying a voltage of about +300 V is connected to the control electrode 18. An accelerating power supply 27 that gives an accelerating voltage of +1500 V is connected to the conductor roller 15. Around the conductor roller 15, a guard electrode 29 to which a negative voltage is applied from the repulsion power supply 28 is provided.

2 and 3 show the construction of the print head 13 shown in FIG. 2 is a plan view and FIG. 3 is a sectional view taken along the section line III-III in FIG. The control electrode 18 is formed in a ring shape on the peripheral edge of the through hole 17, and via the wiring patterns 32 and 33 electrically connected through the anisotropic conductive films 30 and 31, the semiconductor integrated circuit chip 34.
And a drive circuit including the circuit component 35. Anisotropic conductive films 30 and 31 are provided between the flexible printed wiring board 19 and the glass epoxy boards 20 and 21 to electrically connect the wiring patterns 32 and 33. A plurality of semiconductor integrated circuit chips 34 and circuit components 35 are mounted on the glass epoxy substrates 20 and 21,
The voltage drive for the control electrode 18 is performed. A connector 36 is provided at one end of each of the glass epoxy substrates 20 and 21 in the longitudinal direction to electrically connect to the outside.

The control electrode 18 is preferably driven with a voltage as high as possible. The semiconductor integrated circuit chip 34 has a high speed and a high withstand voltage (300V DC) of 64 BIT.
A total of 26 pieces of 13 pieces are mounted on each of the glass epoxy boards 20 and 21 by using the one having the drive output of. A 0.1 μF capacitor chip is provided as a circuit component 35 for each semiconductor integrated circuit chip 34. At the connecting portion between the flexible printed wiring board 19 and the glass epoxy boards 20 and 21, 1664 patterns with a pattern width of 0.1 mm and a pitch of 0.25 mm are used as anisotropic conductive films (abbreviated as ZAF)
Connect with 0 and 31 respectively. Anisotropic conductive film 30, 31
In, the fine particles of the conductor are dispersed, and the conductive particles come into contact with each other only in the compression direction to establish an electrical conduction state. Even if electrical connection is made using the anisotropic conductive films 30 and 31, insulation of 10 MΩ or more is ensured between the adjacent wiring patterns 32 on the flexible printed wiring board 19. It is ensured that the electrical resistance through the anisotropic conductive films 30 and 31 is 500Ω or less between the bonding pad on which the semiconductor integrated circuit chip 34 is mounted and the control electrode 18.

FIG. 4 shows a flexible printed wiring board 19 and a glass epoxy board 20 with anisotropic conductive films 30 and 31 interposed therebetween.
21 shows an electrical connection state with 21. As shown in Fig. 4 (1),
The wiring pattern 32 and the glass epoxy substrate 2 on the flexible printed wiring board 19 with the anisotropic conductive films 30 and 31 interposed therebetween.
With the wiring patterns 33 of 0 and 21 facing each other, they are pressed in the vertical direction as shown in FIG. 4 (2). Between the wiring patterns 32 and 33, the anisotropic conductive films 30 and 31 are compressed, and particles of conductive nickel (Ni) or the like dispersed in the thermosetting resin are brought into contact with each other to achieve conductivity in the thickness direction. Occurs. When the thermosetting resin is cured as it is, the anisotropic connection is performed so that the wiring patterns 32 and 33 are electrically connected to each other and almost no crosstalk occurs between the adjacent wiring patterns 32 or the wiring patterns 33. You can

FIG. 5 shows the formation state of the control electrode 18.
The control electrode 18 can be formed by mechanically punching the flexible printed wiring board 19 with a drill or the like, or by punching with a laser, but etching is preferably performed with an alkaline solvent. For example, 1728 through holes 17 are formed at the same time, and the control electrode 1
The thickness of the copper (Cu) layer to be 8 is 35 μm, and the insulating substrate 16
When the thickness of the polyimide is 50 μm, the through holes 17 of the insulating substrate 16 are tapered and have a maximum diameter of 23.
There is a through hole 17 having a diameter of 0 μm and a minimum diameter of 150 μm. If the control electrode 18 is etched from one side and the insulating substrate 16 is etched from the opposite side with a solvent, the hole position is not displaced.

Although the glass epoxy substrates 20 and 21 are used as the rigid printed wiring boards in the embodiments of the invention described above, other types of boards such as ceramic boards can be used.

[0019]

As described above, according to the present invention, since the rigid printed wiring board is provided around the expensive flexible printed wiring board, the print head can be formed at a low cost and the mechanical printing Reinforcement can also be made.

Further, according to the present invention, since the rigid printed wiring boards are electrically connected to both end portions in the width direction of the strip-shaped flexible printed wiring board, the outer peripheral surface of the cylindrical developer carrier is shaped. Bending the flexible printed wiring board together,
The rigid printed wiring boards on both sides can securely hold the print head.

Further, according to the present invention, since the flexible printed wiring board and the rigid printed wiring board are electrically connected to each other through the anisotropic conductive film, the printed wiring board to be manufactured separately is The rigid printed wiring board can be easily electrically connected.

Further, according to the present invention, since the rigid printed wiring board is made of glass epoxy and the semiconductor integrated circuit chip for driving the control electrodes can be directly mounted, a compact and highly reliable print head can be obtained. You can

[Brief description of the drawings]

FIG. 1 is a sectional view showing a schematic structure of a powder flying recording apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a print head used in the recording apparatus of FIG.

FIG. 3 is a cross-sectional view taken along the line III-III in FIG. 2;

FIG. 4 is a simplified cross-sectional view showing a state in which the print heads of FIGS. 2 and 3 are connected by an anisotropic conductive film.

5 is a cross-sectional view showing a shape near a control electrode of the print head of FIG.

FIG. 6 is a cross-sectional view showing a schematic configuration of a powder flying recording apparatus according to the prior art.

[Explanation of symbols]

 11 Developing Roller 12 Toner 13 Print Head 14 Recording Member 15 Conductive Roller 16 Insulating Substrate 17 Through Hole 18 Control Electrode 19 Flexible Printed Wiring Board 20, 21 Glass Epoxy Substrate 30, 31 Anisotropic Conductive Film 32, 33 Wiring Pattern 34 semiconductor integrated circuit chip 35 circuit parts

 ─────────────────────────────────────────────────── ─── Continuation of the front page (71) Applicant 595116577 ROOM 1906-07, FORTRESS TOWER NO-250 KING'S RORD, HONG KONG (72) Inventor Katsuhiko Gotoda 567-1 Fusehata, Ikawadani, Nishi-ku, Hyogo Prefecture Tee・ And M Co., Ltd. (72) Inventor Hisanobu Inada 567-1 Fusehata, Igawatani-cho, Nishi-ku, Kobe-shi, Hyogo Prefecture T-and-M Co., Ltd. (72) Inventor Susumu Shoji Fusehata, Ikawadani-cho, Nishi-ku, Kobe 567-1 T & M Co., Ltd. (72) Inventor Fumio Kondo Fusehata, Ikawadani-cho, Nishi-ku, Kobe City, Hyogo 567-1 T & M Co., Ltd.

Claims (4)

[Claims] 1. A developing agent is disposed between a cylindrical developer carrier that holds a magnetic powdery developer and an acceleration electrode that accelerates and sucks the developer, and develops from the developer carrier by electric field control. A print head for powder flying type recording for ejecting an agent, depositing a developer on a recording member inserted in the flight path to an acceleration electrode, and performing recording corresponding to electric field control. On the flexible printed wiring board, which is provided around the flexible printed wiring board and the flexible printed wiring board on which the control electrodes are individually formed on the periphery of each of the through holes. And a rigid printed wiring board on which a wiring pattern electrically connected to each of the control electrodes is formed. 2. The flexible printed wiring board has a strip shape extending in the axial direction of a cylindrical developer carrier, and two rigid printed wiring boards are used to provide a strip-shaped flexible print. 2. The powder fly type recording print head according to claim 1, wherein the print head is connected to both end portions in a width direction perpendicular to the length direction of the wiring board. 3. The powder flying according to claim 1, wherein an anisotropic conductive film is provided in an electrical connection portion between the flexible printed wiring board and the rigid printed wiring board. Print head for recording. 4. The powder according to claim 1, wherein the rigid printed wiring board is made of glass epoxy, and the semiconductor integrated circuit chip for driving the control electrodes can be mounted on the rigid printed wiring board. Flying recording print head.