JPH09190990A - Semiconductor wafer fixing sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to obtain a long-term antistatic effect by laminating an antistatic material layer between a substrate sheet and an adhesive material layer with an amount of lamination in a specified range. SOLUTION: As an antistatic material layer 1, an antistatic material of acrylic copolymer is applied to one surface of a substrate sheet 2 of polyvinyl chloride and is laminated. At this time, the amount of lamination is 0.01 to 5.0g/m<2> and coating is performed by a gravure coater. On the surface at the opposite side of the antistatic material layer 1, an acrylic adhesive is coated with Comma roll coater to form an adhesive material layer 3. Finally, a peel-off paper S is adhered to the surface of the adhesive material layer 3. Fixing sheet obtained is charged, and the half life of charge was measured, and an effect of prohibiting electrostatic charge, which was generated in dicing or back grind process or when peeling off the peel-off paper, to a semiconductor wafer over a long period of time was recognized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer fixing sheet for cutting and separating a semiconductor wafer into chips so that the semiconductor wafer is not scattered undesirably, and a semiconductor wafer is fixed when polishing the semiconductor wafer. The present invention relates to a semiconductor wafer fixing sheet which is applied to a semiconductor wafer fixing sheet and which is not particularly charged with static electricity.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor wafer fixing sheet, an adhesive layer is provided on one surface of a synthetic resin sheet as a base sheet, and further, in order to protect the adhesive layer, A release paper is laminated on the adhesive layer.

[0003]

However, when the semiconductor wafer fixing sheet is charged with static electricity, not only the semiconductor wafer is adversely affected, but also fine particles of dust in the periphery and cutting generated during dicing. There is a problem that the semiconductor wafer is contaminated by adsorbing powder or the like. When the semiconductor wafer fixing sheet is charged with static electricity, it is electrically insulating to remove the release paper from the semiconductor wafer fixing sheet and to cool the blade during wafer cutting in the dicing process to wash away the cutting powder. For example, when high-purity ultrapure water is sprayed.

Further, in the semiconductor wafer fixing sheet, since the IC (integrated circuit) surface is stuck to the sheet when the wafer is polished, there is a problem that the IC is destroyed when static electricity is generated.

As a means for solving such a problem, there is known a semiconductor wafer fixing sheet in which a base material sheet having an adhesive layer laminated on one surface and an antistatic agent laminated on the other surface (for example, actual flat sheet 6). -20442 publication).

However, when an antistatic agent is laminated as a surface layer, there is a problem that the antistatic effect cannot be obtained for a long time due to peeling due to external impact.

Therefore, an object of the present invention is to provide a semiconductor wafer fixing sheet which can obtain an antistatic effect for a long term.

[0008]

Means for Solving the Problems As a result of intensive studies in view of the above, the present inventors have found that a main part is composed of a base sheet and an adhesive layer laminated on one surface of the base sheet. In the sheet for fixing a semiconductor wafer, an antistatic agent layer is added in an amount of 0.01 to 5.0 g / m between the base material sheet and the adhesive layer.
It has been found that the above problems can be solved by stacking ^two layers, and the present invention has been completed.

Here, the principle that the antistatic agent layer, which is a feature of the present invention, is laminated between the base material sheet and the pressure-sensitive adhesive layer to exert an antistatic effect is that both of the semiconductor wafer fixing sheet are This is achieved by creating a depolarizing electric field between the surface layer and the antistatic agent layer and weakening the lines of electric force generated by dielectric charging. Further, since the antistatic agent layer is in the intermediate layer of the sheet, the antistatic effect can be obtained on both the surface of the base material sheet and the surface of the pressure-sensitive adhesive layer. Further, in the present invention, generally used primers (members that exert an anchor effect between the pressure-sensitive adhesive layer and the base sheet)
Since the above antistatic agent can be used as a substitute, it can be produced by the conventional production process without lowering the productivity.

As the antistatic agent, surfactants such as acrylic amphoteric, acrylic cation, and maleic anhydride-styrene anion are preferable. The products as the antistatic agent include Bondip PA, Bondip PX,
Bondip AW, Bondip P (manufactured by Konishi), SAFTMA ST1000, 1100, 1200, 2
000, the same 2100, the same 2100NSA, the same 3000,
Examples thereof are 3600 and 6000 (manufactured by Mitsubishi Chemical Corporation). The metal antistatic agent is not preferable because it has a drawback that the surface of the pressure-sensitive adhesive layer laminated on the surface of the antistatic agent has streaks and lacks surface smoothness. Further, the antistatic agent layer may be used by mixing with a primer, and as the primer, conventionally known ones such as acrylic copolymer and isocyanate can be adopted. If the coating amount of the antistatic agent is too small, the antistatic effect cannot be obtained, and if the antistatic effect is stacked over a certain amount, the antistatic effect will reach a peak and only the cost will increase.
0.01~5.0g / m ² weight stack well, preferably from the amount of lamination of 0.4~1.0g / m ^2.

As the base material sheet of the semiconductor wafer fixing sheet according to the present invention, conventionally known base material sheets can be appropriately selected and used, and examples thereof include polyvinyl chloride, polyethylene, polypropylene, polyester film and ethylene. There are vinyl alcohol films and the like.

For the pressure-sensitive adhesive layer, conventionally known acrylic pressure-sensitive adhesives, rubber-based pressure-sensitive adhesives, etc., or a mixture thereof can be used. As the acrylic pressure-sensitive adhesive, a conventionally known one in which a main monomer, a co-monomer and a functional group-containing monomer are appropriately selected and a main component is appropriately mixed with a curing agent and the like can be appropriately adopted. Further, as the rubber-based pressure-sensitive adhesive, an elastomer, a tackifying resin as a main member, and additives such as a softening agent, an antioxidant, a curing agent, a filler, an ultraviolet absorber and a light stabilizer are appropriately selected and added. You can use what you have done.

Examples of the elastomer contained in the rubber adhesive include natural rubber, synthetic isoprene rubber, styrene-butadiene rubber, styrene-butadiene block copolymer, styrene-isoprene block copolymer, butyl rubber, polyisobutylene, polybutadiene, Polyvinyl ether, silicone rubber, polyvinyl isobutyl ether, chloroprene rubber, nitrile rubber, graft rubber, recycled rubber, styrene / ethylene / butylene / block polymer, styrene / propylene / butylene / block polymer, styrene / isoprene / block polymer, acrylonitrile / butadiene Copolymer, acrylonitrile / acrylic ester copolymer, methyl / methacrylate / butadiene copolymer, polyisobutylene / ethylene / propylene copolymer , There is an ethylene vinyl acetate copolymer.

Examples of the tackifying resin contained in the rubber-based adhesive include rosin-based resins, terpene-based resins, aliphatic petroleum resins, aromatic petroleum resins, hydrogenated petroleum resins, coumarone.
It includes indene resin, styrene resin, alkylphenol resin, and xylene resin. Examples of the rosin-based resin include rosin, polymerized rosin, hydrogenated rosin, rosin ester, and hydrogenated rosin ester. Examples of the terpene resin include a terpene resin, a terpene phenol resin, an aromatic modified terpene resin, and a rosin phenol resin. As the hydrogenated petroleum resin, there are aromatic type, dicyclopentadiene type, and aliphatic type.

Examples of the softening agent contained in the rubber-based pressure-sensitive adhesive include plasticizer, polybutene, liquid tackifying resin, low polyisobutylene polymer, low polyvinyl isobutyl ether polymer, lanolin, depolymerized rubber, process oil,
There is additional oil.

As the anti-aging agent contained in the above-mentioned rubber-based adhesive, a phenol-based anti-aging agent, an amine-based anti-aging agent,
Bence imidazole anti-aging agents and the like.

Examples of the curing agent contained in the rubber-based pressure-sensitive adhesive include isocyanates, sulfur and vulcanization accelerators, polyalkylphenols, organic peroxides and the like, alone or in a mixture.
Examples of the isocyanate include phenylene diisocyanate, tolylene diisocyanate, diphenyl metadiisocyanate, hexamethylene diisocyanate, cyclohexane diisocyanate and the like. Examples of the sulfur and the vulcanization accelerator include thiazole vulcanization accelerators, sulfenamide vulcanization accelerators, thiuram vulcanization accelerators, and dithioate vulcanization accelerators alone or in a mixture. Examples of the polyalkylphenol include butylphenol, octylphenol, nonylphenol and the like. As the organic peroxide, dichromyl peroxide, ketone peroxide, peroxyketal, hydroperoxide, dialkyl peroxide, peroxy ester,
Examples include peroxydicarbonate.

As the curing agent that can be used in the acrylic pressure-sensitive adhesive, amine curing agents, epoxy curing agents,
There are simple substances or mixtures of isocyanate, polyalkylphenol, organic peroxide and the like.

Examples of the filler contained in the rubber adhesive include zinc white, titanium oxide, silica, aluminum hydroxide, calcium carbonate, barium sulfate, starch, clay, talc and the like. Further, examples of the antiaging agent include 2,6 di-tertiarybutyl-4-methylphenol, 2,5 di-tertiarybutyl hydroquinone, mercaptobenzimidazole, 1,1 bis (4 hydroxyphenol) cyclohexane, and phenol. Neil beta naphthylamine and the like.

In the present invention, it goes without saying that an overcoating agent layer, which will be described later, may be laminated on the surface of the base material sheet.

Another aspect of the present invention is mainly a base sheet, an adhesive layer laminated on one surface of the base sheet, and an overcoating agent layer laminated on the other surface of the base sheet. In a sheet for fixing a semiconductor wafer, the antistatic agent layer is 0.01 to 5.0 between the base material sheet and the pressure sensitive adhesive layer and / or the base material sheet and the overcoating agent layer.
It is characterized in that the layers are laminated at a lamination amount of g / m ² .

According to the present invention, even if a blade for dicing a semiconductor wafer fixed on the adhesive layer cuts beyond the adhesive layer, there is a possibility that it will cut directly to the antistatic agent layer. Since it is lower than that of the invention, more stable antistatic effect can be obtained.

The overcoating agent layer used in the present invention is necessary for disposing the antistatic agent layer in the intermediate layer of the sheet for fixing a semiconductor wafer, which is a feature of the present invention. By providing the polar electric field, the antistatic effect can be exhibited.

As the overcoating agent, acrylic ester type, modified acrylic ester type, polymethylmethacrylate type and the like can be used. Specific products include PARHC
Examples include RON precoat 200 (manufactured by Negami Kogyo Co., Ltd.) and PES Resin S-100 (manufactured by Takamatsu Yushi Co., Ltd.).

Another aspect of the present invention is mainly composed of a base material sheet, an adhesive layer laminated on one surface of the base material sheet, and an overcoating agent layer laminated on the other surface of the base material sheet. In a sheet for fixing a semiconductor wafer, the antistatic agent is compounded in the base material sheet in an amount of 0.01 to 7.5 parts by weight based on 100 parts by weight of the base material of the base sheet. It is a thing.

In the present invention, since the base sheet is preliminarily blended with the antistatic agent, the number of lamination steps can be reduced, and a highly productive semiconductor wafer fixing sheet can be obtained.

[0027]

BEST MODE FOR CARRYING OUT THE INVENTION The best semiconductor wafer chip according to the present invention will be described in detail with reference to FIG.

FIG. 1 is a vertical sectional view schematically showing a first embodiment according to the present invention. This semiconductor wafer fixing sheet comprises a base material sheet 2 made of polyvinyl chloride and having a thickness of 70 μm, and a thickness 10 laminated on one surface of the base material sheet 2.
An acrylic adhesive (Olivine BPS5448 manufactured by Toyo Ink Co., Ltd.) as the adhesive layer 3 having a thickness of μm is provided. Between the base sheet 2 and the pressure-sensitive adhesive layer 3, an acrylic copolymer as an antistatic agent layer 1 (manufactured by Konishi Co .; Bondip PA)
Are stacked with a stacking amount of 0.5 g / m ² . In the figure, reference numeral S is a release paper.

This semiconductor wafer fixing sheet is manufactured by the following manufacturing method. That is, in this example, the antistatic agent as the antistatic agent layer 1 was applied to one surface of the base sheet 2 by a gravure coater at a stacking amount of 0.5 g / m ² , and the other side of the base sheet 2 was coated. The acrylic pressure sensitive adhesive as the pressure sensitive adhesive layer 3 is applied to the surface of the antistatic agent 1 which is the surface of No. 1 by the comma roll coater method, and finally the release paper S is attached to the surface of the pressure sensitive adhesive layer 3. Being manufactured.

The semiconductor wafer fixing sheet according to this example was electrified by a domestometer analyzer U (manufactured by Shishido Electrostatics Co., Ltd.), which was a charge-voltage measuring instrument, and the electrification half-life was measured. The initial electrification value was 1.53 KV. The half-life was 2 seconds. Since the same method and measuring device for the initial charging value and the charging half-life are used in the following examples and comparative examples, the description in each column will be omitted.

[0031]

EXAMPLES An experimental example of the first example of the present invention will be described in detail together with a comparative example based on FIG. 1 and Table 1. FIG. 1 schematically shows a vertical cross section of the basic structure of the semiconductor wafer fixing sheet in the first example and the comparative examples 1 and 2. In Table 1, "○" in the primer effect indicates a state in which the anchor effect has occurred on the entire laminated portion,
“Δ” indicates a state in which the anchor effect is produced only partially, and “×” indicates a state in which the anchor effect is not produced (the same applies to Tables 2 and 3 below).

The semiconductor wafer fixing sheet in this embodiment is a base sheet 2 made of polyvinyl chloride and having a thickness of 70 μm.
And a thickness of 10 μ stacked on one surface of the base sheet 2.
The acrylic adhesive (Olivene BPS5448 manufactured by Toyo Ink Co., Ltd.) is provided as the adhesive layer 3 of m. An acrylic copolymer (manufactured by Konishi Co., Ltd .; Bondip PA) as the antistatic agent layer 1 is laminated between the base sheet 2 and the pressure-sensitive adhesive layer 3 in the respective laminating amounts disclosed in Table 1. There is. In addition,
In the figure, reference numeral S is a release paper.

[0033]

[Table 1]

As can be seen from Experiments 1 to 6 and Comparative Examples 1 and 2 in the first embodiment, the antistatic effect is exhibited when the layered amount of the antistatic agent 1 is 0.01 g / m ² or more, and particularly 0. A high effect could be obtained from 0.4 g / m ² or more.

Further, in this embodiment, since the antistatic agent layer is laminated between the base material sheet and the pressure-sensitive adhesive layer, the antistatic layer and the surface layer of both of the semiconductor wafer fixing sheets are prevented. An antistatic effect was exhibited by providing a depolarizing electric field with the agent layer. Further, since the antistatic agent layer is in the intermediate layer of the sheet, the antistatic effect could be obtained on both the surface of the base material sheet and the surface of the pressure-sensitive adhesive layer. In addition, in this example, since a generally used primer (a member that exerts an anchoring effect between the pressure-sensitive adhesive layer and the base sheet) can be substituted with the antistatic agent, the conventional manufacturing process can be used. It was possible to manufacture without lowering productivity.

A second embodiment of the present invention will be described in detail with reference to a comparative example based on FIG. 2 and Table 2. FIG. 2 schematically shows a vertical cross section of the basic structure of the semiconductor wafer fixing sheet in the second example and the comparative examples 3 and 4.

This semiconductor wafer fixing sheet is made of polyvinyl chloride and has a base material sheet 2 having a thickness of 70 μm, and one surface of the base material sheet 2 has an acrylic adhesive as an adhesive layer 3 (Toyo Ink Co., Ltd.). Olivine BPS5448) having a thickness of 10 μm is laminated, and PARHCRO as a polymethylmethacrylate-based overcoating agent layer 4 is provided on the other surface.
N precoat 200 (manufactured by Negami Kogyo Co., Ltd.) is laminated, and an acrylic copolymer (manufactured by Konishi Co., Ltd .; Bondip PA) as an antistatic agent layer 1 is provided between the base sheet 2 and the overcoat agent layer 4. The layers are stacked in the respective stacking amounts disclosed in Table 2.

[0038]

[Table 2]

As can be seen from Experiments 1 to 6 and Comparative Examples 3 and 4 in the second embodiment, the antistatic effect is exhibited when the layered amount of the antistatic agent 1 is 0.01 g / m ² or more, particularly 0. A high effect could be obtained from 0.4 g / m ² or more.

According to the present embodiment, even if the blade for dicing the semiconductor wafer fixed on the pressure-sensitive adhesive layer is cut beyond the pressure-sensitive adhesive layer, the base material sheet is directly cut and electrified. Since it is not cut into the inhibitor layer, a more stable antistatic effect can be obtained.

A third embodiment of the present invention will be described in detail with reference to a comparative example based on FIG. 3 and Table 3. FIG. 3 schematically shows a vertical cross section of the basic structure of the semiconductor wafer fixing sheet in the third example and the comparative examples 5 and 6.

This semiconductor wafer fixing sheet comprises a base sheet 2 made of polyvinyl chloride and having a thickness of 70 μm, and an acrylic adhesive as a pressure-sensitive adhesive layer 3 on one side of the base sheet 2 (Toyo Ink Co., Ltd.). Olivine BPS 5448) having a thickness of 10 μm is laminated on the other surface, and the overcoating agent layer 4 is formed on the other surface.
Acrylic Emulsion as a Peth Resin S-1
00 (made by Takamatsu Yushi Co., Ltd.) is laminated. Then, in the base sheet 2, the acrylic copolymer (manufactured by Konishi Co., Ltd .; Bondip PA) as the antistatic agent 1 is shown in Table 3 with respect to 100 parts by weight of polyvinyl chloride as a main component. It is compounded in the compounding ratio.

[0043]

[Table 3]

As can be seen from Experiments 1 to 6 and Comparative Examples 5 and 6 in the third embodiment, the compounding ratio of the antistatic agent 5 is preferably 0.01 part by weight, particularly 0.5 part by weight. Was good.

[0045]

The semiconductor wafer fixing sheet according to the present invention is a semiconductor wafer fixing sheet, the main part of which is a base sheet and an adhesive layer laminated on one surface of the base sheet. An antistatic agent layer is laminated between the base material sheet and the pressure-sensitive adhesive layer in a laminating amount of 0.01 to 5.0 g / m ² , so that even with a small amount of antistatic agent, a semiconductor wafer fixing sheet. It has the effect of not charging the static electricity generated when the release paper is peeled off or in the dicing process and the back grinding process.

A semiconductor wafer fixing sheet in another invention is formed by laminating a base material sheet, an adhesive layer laminated on one surface of the base material sheet, and the other surface of the base material sheet. In a semiconductor wafer fixing sheet, the main part of which is an overcoating agent layer, an antistatic agent layer of 0.01 to 5.0 g /
characterized in that laminated in lamination of m ^2, thereby in addition to the above effects, direct blade when dicing the semiconductor wafer being fixed on the adhesive layer also has cuts beyond the adhesive layer Since the possibility of cutting into the antistatic agent layer is lower than in the previous invention, a more stable antistatic effect can be obtained.

A semiconductor wafer fixing sheet according to another invention is formed by laminating a base material sheet, an adhesive layer laminated on one surface of the base material sheet, and the other surface of the base material sheet. In a semiconductor wafer fixing sheet, the main part of which is composed of an overcoat agent layer, an antistatic agent is added to the base sheet in an amount of 0.0 parts by weight based on 100 parts by weight of the base agent.
1 to 7.5 parts by weight are compounded, whereby a lamination process can be reduced and a highly productive semiconductor wafer fixing sheet can be obtained.

[Brief description of the drawings]

FIG. 1 is a sectional view schematically showing a first embodiment of a semiconductor wafer fixing sheet according to the present invention.

FIG. 2 is a sectional view schematically showing a second embodiment of the semiconductor wafer fixing sheet according to the present invention.

FIG. 3 is a sectional view schematically showing a third embodiment of the semiconductor wafer fixing sheet according to the present invention.

[Explanation of symbols]

 1 Antistatic Agent Layer 2 Base Sheet 3 Adhesive Layer 4 Overcoat Agent Layer 5 Antistatic Agent

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takashi Hayashi 2-13-1 Dai, Kamakura City, Kanagawa Toyo Kagaku Co., Ltd.

Claims (3)

[Claims] 1. A semiconductor wafer fixing sheet, the main part of which comprises a base sheet (2) and a pressure-sensitive adhesive layer (3) laminated on one surface of the base sheet (2). A sheet for fixing a semiconductor wafer, characterized in that the antistatic agent layer (1) is laminated between the material sheet (2) and the pressure-sensitive adhesive layer (3) at a lamination amount of 0.01 to 5.0 g / m ^2. . 2. A base material sheet (2), an adhesive layer (3) laminated on one surface of the base material sheet (2), and a pressure sensitive adhesive layer (3) laminated on the other surface of the base material sheet (2). In the semiconductor wafer fixing sheet whose main part is composed of the overcoating agent layer (4), the antistatic agent layer (1) is formed between the base sheet (2) and the overcoating agent layer (4). 01-5.0
A sheet for fixing a semiconductor wafer, wherein the sheet is fixed at a lamination amount of g / m ² . 3. A substrate sheet (2), an adhesive layer (3) laminated on one surface of the substrate sheet (2), and an adhesive layer (3) laminated on the other surface of the substrate sheet (2). In a sheet for fixing a semiconductor wafer, the main part of which is an overcoat agent layer (4), an antistatic agent (100 parts by weight of the main agent of the base material sheet (2) ( A semiconductor wafer fixing sheet, characterized in that 0.01 to 7.5 parts by weight of 5) are blended.