JPH09183945A - Conductive polyaniline doped with camphorsulfonic acid - Google Patents

Conductive polyaniline doped with camphorsulfonic acid

Info

Publication number
JPH09183945A
JPH09183945A JP8339753A JP33975396A JPH09183945A JP H09183945 A JPH09183945 A JP H09183945A JP 8339753 A JP8339753 A JP 8339753A JP 33975396 A JP33975396 A JP 33975396A JP H09183945 A JPH09183945 A JP H09183945A
Authority
JP
Japan
Prior art keywords
polyaniline
film
doped
camphorsulfonic acid
cresol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8339753A
Other languages
Japanese (ja)
Inventor
Jae Wook Kim
在旭 金
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mando Machinery Corp
HL Mando Corp
Original Assignee
Mando Machinery Corp
Mando Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mando Machinery Corp, Mando Corp filed Critical Mando Machinery Corp
Publication of JPH09183945A publication Critical patent/JPH09183945A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D179/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09D161/00 - C09D177/00
    • C09D179/02Polyamines
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/24Electrically-conducting paints
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/127Intrinsically conductive polymers comprising five-membered aromatic rings in the main chain, e.g. polypyrroles, polythiophenes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/06Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
    • H01B1/12Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
    • H01B1/124Intrinsically conductive polymers
    • H01B1/128Intrinsically conductive polymers comprising six-membered aromatic rings in the main chain, e.g. polyanilines, polyphenylenes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electromagnetism (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a coating composition useful to form an electromagnetic- wave-shielding highly conductive film on an electronic device, instrument or apparatus by mixing a polyaniline with a plurality of specified compounds.
SOLUTION: A polyaniline (in the form of an emeraldine base) is mixed with camphorsulfonic acid and an aromatic hydroxy compound, desirably m- cresol. An epoxy resin in an amount of desirably 10-50wt.%, based on the total weight of the final composition, is optionally added to the obtained mixture. The conductivity of the emeraldine base form polyaniline doped with camphorsulfonic acid dopant which improves the adhesion of a conductive film varies with the solvent used. The conductivity of a film prepared by using specially m-cresol as the solvent is the most excellent.
COPYRIGHT: (C)1997,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、ショウノウスルホ
ン酸でドーピングされたポリアニリン伝導性フィルム及
び電磁波遮蔽のための前記フィルム製造用のコーティン
グ組成物(coating composition)に関する。
FIELD OF THE INVENTION The present invention relates to a polyaniline conductive film doped with camphorsulfonic acid and a coating composition for producing the film for electromagnetic wave shielding.

【0002】[0002]

【従来の技術】種々の電子/電気機器によって発生され
る電磁波は、他の機器の作動を妨害し、また人が電磁波
に長期間さらされると疾病が誘発されることが知られて
いる。かかる現象は電磁障害(EMI:Electromagneti
c Interference)と呼ばれ、発生源機器から放出される
電磁波を遮蔽する方法(EMI shielding)がここ数年の
間集中的に研究されてきた。従来のEMI遮蔽法に、発
生源機器を、金属ケース、または伝導性物質(例えば、
カーボンブラック、黒鉛、亜鉄酸塩、ステンレス鋼、
銀、銅、ニッケル、鉛など)を粉末、織物、メッシュ、
リボンまたはフレークの形態で含有するプラスチックケ
ースで囲むという方法がある。しかし、金属ケースはそ
の重量及び費用のため実用的でなく、伝導性充填剤を含
有するプラスチックケースは、ケースの物理的特性の低
下、複雑な製造工程を要することによる製造費用の増
加、伝導性充填剤の分布が均一でない場合現れる低いE
MI遮蔽効果などの問題点を有する。
2. Description of the Related Art It is known that electromagnetic waves generated by various electronic / electrical devices interfere with the operation of other devices and cause a disease when a person is exposed to electromagnetic waves for a long time. This phenomenon is caused by electromagnetic interference (EMI: Electromagneti).
c Interference), a method of shielding the electromagnetic waves emitted from the source equipment (EMI shielding) has been intensively studied for several years. In addition to the conventional EMI shielding method, the source device is attached to a metal case, or a conductive material (for example,
Carbon black, graphite, ferrite, stainless steel,
Silver, copper, nickel, lead, etc.) powder, fabric, mesh,
There is a method of surrounding with a plastic case containing in the form of ribbon or flake. However, the metal case is not practical due to its weight and cost, and the plastic case containing the conductive filler deteriorates the physical properties of the case, increases the manufacturing cost due to the complicated manufacturing process, and increases the conductivity. Low E that appears when the filler distribution is not uniform
There are problems such as MI shielding effect.

【0003】最近、EMI遮蔽をはじめ多くの産業分野
で有用な新しい物質としてポリピロール、ポリアセチレ
ン、ポリアニリン及びポリチオフェンのような伝導性重
合体の開発・研究が行われている。伝導性重合体のう
ち、ポリアニリンが特に高いドーピング能力を有する。
下記式(I)の構造を有するポリアニリンのドーピング
されていない低分子量体は、ポリアニリンのエメラルジ
ン(emeraldine)塩基形態または単に“エメ
ラルジン塩基(EB)”とよばれている(J.G.Masterら
による“Syn.Met.,41,715(1991)”参照)。
Recently, conductive polymers such as polypyrrole, polyacetylene, polyaniline and polythiophene have been developed and studied as new substances useful in many industrial fields including EMI shielding. Among the conductive polymers, polyaniline has a particularly high doping ability.
The undoped low molecular weight polyaniline having the structure of formula (I) is referred to as the emeraldine base form of polyaniline or simply "emeraldine base (EB)" (JG Master et al., " Syn.Met " ). . , 41 , 715 (1991) ”).

【0004】[0004]

【化1】 Embedded image

【0005】EBは多くの極性有機溶媒に溶け、EBを
含有するかかる溶液は、それをガラス板上に塗り広げた
後溶媒を蒸発させるなどの方法によってドーピングされ
ていないポリアニリン(脱ドーピングポリアニリン)の
フィルムを製造するのに使用し得る。この脱ドーピング
ポリアニリンフィルムは10-9S/cm程度の低い電気
伝導度を有するが、例えば該フィルムをHCl水溶液に
浸漬するなどしてプロトン(陽子)でドーピングすると
下記式(II)のようなポリセミキノン(polysemiquin
one)ラジカル陽イオンが形成されるため、伝導度が1
0桁程度増加して約5S/cmとなる。
EB is soluble in many polar organic solvents, and such a solution containing EB is a solution of undoped polyaniline (dedoped polyaniline) by methods such as spreading it on a glass plate and then evaporating the solvent. It can be used to make films. This dedoped polyaniline film has a low electric conductivity of about 10 −9 S / cm, but when the film is doped with protons (protons) by immersing the film in an aqueous HCl solution, a polysemiquinone of the following formula (II) is obtained. (Polysemiquin
one) conductivity is 1 because radical cations are formed
It increases by about 0 digits and becomes about 5 S / cm.

【0006】[0006]

【化2】 Embedded image

【0007】日本特許公開公報第92−348161号
は、式(III)の還元された構造を有する高分子量ポ
リアニリン、p−トルエンスルホン酸及び酸化剤を含有
するN−メチルピロリドン(NMP)溶液を用いて製造
したフィルムを高温で活性化した伝導性ポリアニリンフ
ィルムを開示している。
Japanese Patent Publication No. 92-348161 uses an N-methylpyrrolidone (NMP) solution containing a high molecular weight polyaniline having a reduced structure of formula (III), p-toluenesulfonic acid and an oxidizing agent. Disclosed is a conductive polyaniline film in which the film produced by the above is activated at high temperature.

【0008】[0008]

【化3】 Embedded image

【0009】特に、NMP溶液をガラス板上に展開して
100℃以上で加熱すると、酸化性プロトン−ドーピン
グ過程が進行して高い機械的強度を有する伝導性フィル
ムが得られる。しかし、前記方法によって生成したポリ
アニリンフィルムは約1S/cm以下の比較的低い伝導
度を有し、その表面抵抗は105Ω/□程度である。
In particular, when the NMP solution is spread on a glass plate and heated at 100 ° C. or higher, a conductive film having high mechanical strength is obtained due to the progress of the oxidizing proton-doping process. However, the polyaniline film produced by the above method has a relatively low conductivity of about 1 S / cm or less, and its surface resistance is about 10 5 Ω / □.

【0010】本発明者らは、EMI遮蔽用の新たな低分
子量物質を開発するために鋭意研究した結果、ポリアニ
リンコーティング溶液の製造において特定のドーパント
及び溶媒を用いた場合、ドーピングされたエメラルジン
塩基フィルムの伝導度が以前に報告された値に比べて著
しく増加し、1〜2桁高くなることを発見した。
The present inventors have conducted extensive research to develop a new low molecular weight substance for EMI shielding, and as a result, when a specific dopant and solvent were used in the production of a polyaniline coating solution, a doped emeraldine base film was used. It has been found that the conductivity of γ is significantly increased over the previously reported values and is 1-2 orders of magnitude higher.

【0011】[0011]

【発明が解決しようとする課題】したがって、本発明の
目的は、電子機器または装置のケース上にEMI遮蔽用
の高伝導性ポリアニリンフィルムを形成するのに使用し
得る新規なコーティング溶液を提供することである。
Accordingly, it is an object of the present invention to provide a new coating solution that can be used to form a highly conductive polyaniline film for EMI shielding on the case of electronic equipment or devices. Is.

【0012】本発明の他の目的は、EMI遮蔽に効果的
なフィルムでコーティングされた電子機器または装置用
ケースを提供することである。
Another object of the present invention is to provide a film-coated electronic device or device case effective for EMI shielding.

【0013】[0013]

【課題を解決するための手段】本発明の一側面に基づく
と、ポリアニリン、ショウノウスルホン酸及び芳香族ヒ
ドロキシ化合物を含むコーティング組成物が提供され
る。
According to one aspect of the invention, there is provided a coating composition comprising polyaniline, camphorsulfonic acid and an aromatic hydroxy compound.

【0014】本発明の別の側面によると、ショウノウス
ルホン酸でドーピングされたポリアニリンを含む伝導性
フィルムでコーティングされた電子装置用ケースが提供
される。
According to another aspect of the present invention, there is provided a case for an electronic device coated with a conductive film containing polyaniline doped with camphorsulfonic acid.

【0015】[0015]

【発明の実施の形態】本明細書で用いられる用語“ポリ
アニリン”は、エメラルジン塩基(EB)形態のポリア
ニリン(式(I))を示し、EBと同義的に使用され得
る。EBは一般に、8,000乃至20,000の範囲
の小さい分子量を有し、極性有機溶媒(例えばN−メチ
ルピロリドン(NMP)、クロロホルム、ギ酸、フェノ
ール誘導体など)に可溶である。前記EBを含有する溶
液はドーピングされていないポリアニリンフィルム(脱
ドーピングポリアニリンフィルム)の製造に使用でき
る。
DETAILED DESCRIPTION OF THE INVENTION The term "polyaniline" as used herein refers to polyaniline (Formula (I)) in the emeraldine base (EB) form and may be used interchangeably with EB. EBs generally have a low molecular weight in the range of 8,000 to 20,000 and are soluble in polar organic solvents such as N-methylpyrrolidone (NMP), chloroform, formic acid, phenol derivatives and the like. The solution containing the EB can be used to prepare an undoped polyaniline film (dedoped polyaniline film).

【0016】EBと有機スルホン酸とを含有する溶液は
特定条件下で製造でき、この溶液は、ドーピングされた
EBフィルムの製造に直接使用し得る。ドーピングされ
たEBフィルムを直接製造するこの方法は、脱ドーピン
グポリアニリンフィルムを別個の処理段階でドーピング
する方法よりもずっと簡単であり、またこの方法による
と広範囲な電気的特性をフィルムに与え得ることが明ら
かになった。例えば、ショウノウ−10−スルホン酸
(CSA)をドーパントとして用いてドーピングしたE
Bフィルムの伝導性は用いる溶媒によって大きく変化
し、溶媒をクロロホルム、ギ酸、m−クレゾールと変え
ると、伝導度は0.5S/cm、5S/cm、190S
/cmと変化する。一方、溶媒としてm−クレゾールを
用い、ドーパントをナフタレンスルホン酸(NSA)、
ドデシルベンゼンスルホン酸(DBSA)、CSAと変
えると、フィルムの伝導度は0.6S/cm、15S/
cm、190S/cmと変化する。ここで観察された伝
導度の大きな変化は、先行技術からはまったく予想でき
なかったものであり、用いられた溶媒とドーパントによ
って異なった結晶構造を有するドーピングされたEBが
形成されるためであると推測される。
A solution containing EB and an organic sulfonic acid can be prepared under specific conditions, and this solution can be directly used for preparing a doped EB film. This method of directly producing a doped EB film is much simpler than the method of doping a dedoped polyaniline film in a separate processing step, and it can also give the film a wide range of electrical properties. It was revealed. For example, E doped with camphor-10-sulfonic acid (CSA) as a dopant
The conductivity of the B film varies greatly depending on the solvent used. When the solvent is changed to chloroform, formic acid, or m-cresol, the conductivity is 0.5 S / cm, 5 S / cm, 190 S.
It changes with / cm. On the other hand, using m-cresol as a solvent, the dopant is naphthalene sulfonic acid (NSA),
When changed to dodecylbenzene sulfonic acid (DBSA) and CSA, the conductivity of the film is 0.6S / cm, 15S / cm.
cm and 190 S / cm. The large change in conductivity observed here was completely unexpected from the prior art, as the solvent used and the dopant formed doped EBs with different crystal structures. Guessed.

【0017】ドーピングされたポリアニリンの高伝導性
フィルムの製造に使用し得る本発明のコーティング溶液
は、少なくとも下記の3つの成分を含有する;(i)エ
メラルジン塩基形態のポリアニリン、(ii)立体障害
を有する(sterically crowded)アルカンスルホン酸
(例えば、ショウノウ−10−スルホン酸)及び(ii
i)フェノール、クレゾール、キシレノール及びこれら
の誘導体からなる群から選ばれた芳香族ヒドロキシ化合
物を含む溶媒。本発明の最も好ましいコーティング組成
物はポリアニリン、ショウノウ−10−スルホン酸及び
m−クレゾールを含む。
The coating solution of the present invention which can be used for the production of highly conductive films of doped polyaniline contains at least three components: (i) emeraldine base form of polyaniline, (ii) steric hindrance. Sterically crowded alkane sulfonic acids (eg camphor-10-sulfonic acid) and (ii
i) A solvent containing an aromatic hydroxy compound selected from the group consisting of phenol, cresol, xylenol and derivatives thereof. The most preferred coating composition of the present invention comprises polyaniline, camphor-10-sulfonic acid and m-cresol.

【0018】本発明のコーティング組成物を使って、電
子装置用ケースの表面に伝導性フィルムをコーティング
して、EMIを効果的に遮蔽することができる。かかる
適用において、ケースの表面をプライマーでプレコーテ
ィングすることによってより優れた接着性を有する伝導
性フィルムを形成し得る。本発明の伝導性フィルムの接
着性を向上させる他の方法としては、最終組成物の総重
量を基準として10乃至50重量%の範囲の量のエポキ
シ樹脂を更に含むコーティング組成物を使用するという
方法があり、また、当技術分野における公知の他の適切
な手段も利用し得る。
The coating composition of the present invention can be used to coat a conductive film on the surface of an electronic device case to effectively shield EMI. In such applications, the surface of the case can be precoated with a primer to form a conductive film with better adhesion. Another method of improving the adhesion of the conductive film of the present invention is to use a coating composition further containing an epoxy resin in an amount ranging from 10 to 50% by weight based on the total weight of the final composition. , And other suitable means known in the art may also be utilized.

【0019】下記実施例は本発明を更に詳細に例示する
ためのもので、本発明の範囲を限定するものではない。
The following examples serve to illustrate the present invention in more detail and do not limit the scope of the invention.

【0020】[0020]

【実施例】実施例及び比較例において、電磁遮蔽効果は
下記のように測定した。図1に示すように、サンプルフ
ィルム(3)を電磁波発生装置(1)と検出器の間に置
き、その遮蔽効果を下記式によって決定した。
[Examples] In Examples and Comparative Examples, the electromagnetic shielding effect was measured as follows. As shown in FIG. 1, the sample film (3) was placed between the electromagnetic wave generator (1) and the detector, and its shielding effect was determined by the following formula.

【0021】 遮蔽効果(dB)=10×log(P1/P2)Shielding effect (dB) = 10 × log (P1 / P2)

【0022】(前記式でP1は入射される電磁波の電力
を示し、P2は検出器によって受信された電磁波の電力
である)。
(Where P1 is the power of the incident electromagnetic wave and P2 is the power of the electromagnetic wave received by the detector).

【0023】電磁波源とサンプル間の距離がλ/(2π)
より大きい場合はASTM(米国材料試験協会):D4
935−89に従ってフランジ型同軸伝送線測定機を使
って遮蔽効果を決定した。
The distance between the electromagnetic wave source and the sample is λ / (2π)
If greater than ASTM (American Society for Testing and Materials): D4
The shielding effect was determined using a flange type coaxial transmission line measuring instrument according to 935-89.

【0024】製造例:ポリアニリン(エメラルジン塩
基)の製造 アニリン20ml(約0.22モル)を1N塩酸溶液3
00mlに溶かして0℃に冷却し、これに、1N塩酸溶
液200mlにペルオキソ二流酸アンモニウム[(NH
4228]11.5g(約0.05モル)を溶かして
得た溶液を0℃で撹拌しながら2分の時間をかけて加え
た。この混合物(5分後濃緑色に変化)を0℃で90分
間撹拌した。生成した固体沈殿物を濾過し、濾液の色が
無くなるまで1N塩酸溶液で洗浄し、10分間風乾して
50%プロトン化されたポリアニリン粉末を得た。この
プロトン化ポリアニリン粉末を0.1N NH4OH5
00mlに加え、1N NH4OH溶液でpHを9に調
整しながら15時間撹拌して中和されたポリアニリン粉
末を得、この粉末を濾過して0.1N NH4OH溶液
で洗浄した後、10トール(1333.2Pa)の下で
48時間乾燥して分子量約70,000のエメラルジン
塩基形態のポリアニリンを得、これを乳鉢・乳棒で粉末
にして保管した。
Production Example : Production of polyaniline (emeraldine base) 20 ml (about 0.22 mol) of aniline was added to a 1N hydrochloric acid solution 3
It was dissolved in 00 ml and cooled to 0 ° C., and to this was added 200 ml of 1N hydrochloric acid solution ammonium peroxodiphosphate [(NH
4 ) 2 S 2 O 8 ] 11.5 g (about 0.05 mol) was dissolved and the resulting solution was added over 2 minutes while stirring at 0 ° C. The mixture (turned dark green after 5 minutes) was stirred at 0 ° C. for 90 minutes. The formed solid precipitate was filtered, washed with a 1N hydrochloric acid solution until the filtrate became colorless, and air-dried for 10 minutes to obtain a 50% protonated polyaniline powder. This protonated polyaniline powder was added to 0.1N NH 4 OH 5
In addition to 00 ml, neutralized polyaniline powder was obtained by stirring for 15 hours while adjusting the pH to 9 with 1N NH 4 OH solution, and the powder was filtered and washed with 0.1N NH 4 OH solution, and then 10 It was dried under a Toll (1333.2 Pa) for 48 hours to obtain polyaniline in the form of emeraldine base having a molecular weight of about 70,000, which was stored as a powder with a mortar and pestle.

【0025】実施例1:ショウノウスルホン酸でドーピ
ングされたポリアニリンフィルム 製造例で得られたポリアニリン粉末0.724gとショ
ウノウ−10−スルホン酸0.927g(0.004モ
ル)を乳鉢・乳棒を使ってよく混合した。得られた粉末
混合物を溶媒(m−クレゾール、クロロホルム、または
ギ酸)50gに入れて10分間撹拌し、少量の不溶分を
濾過して除いてポリアニリンとショウノウスルホン酸を
含有する透明な溶液を得た。この溶液をガラス板上に注
いだ後、60℃に保持された対流オーブン内で15時間
乾燥してショウノウスルホン酸でドーピングされたポリ
アニリンフィルムを得た。
Example 1 : Polyaniline film doped with camphorsulfonic acid 0.724 g of the polyaniline powder obtained in the preparation example and 0.927 g (0.004 mol) of camphor-10-sulfonic acid were used in a mortar and pestle. Mixed well. The obtained powder mixture was put in 50 g of a solvent (m-cresol, chloroform, or formic acid) and stirred for 10 minutes, and a small amount of insoluble matter was removed by filtration to obtain a transparent solution containing polyaniline and camphorsulfonic acid. . The solution was poured onto a glass plate and then dried in a convection oven maintained at 60 ° C. for 15 hours to obtain a camphorsulfonic acid-doped polyaniline film.

【0026】このように製造したフィルムの伝導度は使
用した溶媒によって下記のように変化した。
The conductivity of the thus-produced film changed as follows depending on the solvent used.

【0027】 [0027]

【0028】溶媒としてm−クレゾールを用いて製造し
たショウノウスルホン酸でドーピングされたポリアニリ
ンフィルムは、前述のように著しく高い伝導度を有し、
また2乃至5Ω/□の低い表面抵抗を有した。フランジ
型同軸伝送線測定機を用いてEMI遮蔽効果を測定した
ところ、図2に示したように、10乃至1000MHz
の範囲の周波数で38乃至41dBの高いEMI遮蔽効
果を示した。このm−クレゾールを溶媒として用いて製
造したフィルムの物性測定の結果を表1に示す。
The camphorsulfonic acid-doped polyaniline film prepared using m-cresol as a solvent has a remarkably high conductivity as described above,
It also had a low surface resistance of 2 to 5 Ω / □. When the EMI shielding effect was measured using a flange type coaxial transmission line measuring machine, as shown in FIG.
It showed a high EMI shielding effect of 38 to 41 dB in the frequency range of. Table 1 shows the results of measuring the physical properties of a film produced using this m-cresol as a solvent.

【0029】比較例1:ドデシルベンゼンスルホン酸で
ドーピングされたポリアニリンフィルム ショウノウスルホン酸の代わりにドデシルベンゼンスル
ホン酸(DBSA)0.004モルを用い、m−クレゾ
ールを溶媒として用いて実施例1の手順を繰り返すこと
によって、ドデシルベンゼンスルホン酸でドーピングし
たポリアニリンフィルムを得た。このフィルムの物性を
表1に示す。
Comparative Example 1 : Polyaniline Film Doped with Dodecylbenzene Sulfonic Acid 0.004 mol of dodecylbenzene sulfonic acid (DBSA) was used in place of camphor sulfonic acid and m-cresol was used as the solvent in the procedure of Example 1. By repeating the above, a polyaniline film doped with dodecylbenzenesulfonic acid was obtained. Table 1 shows the physical properties of this film.

【0030】比較例2:ナフタレンスルホン酸でドーピ
ングされたポリアニリンフィルム ショウノウスルホン酸の代わりにナフタレンスルホン酸
(NSA)0.004モルを用い、m−クレゾールを溶
媒として用いて実施例1の手順を繰り返すことによっ
て、ナフタレンスルホン酸でドーピングしたポリアニリ
ンフィルムを得た。このフィルムの物性を表1に示す。
Comparative Example 2 : Polyaniline film doped with naphthalene sulfonic acid The procedure of Example 1 is repeated using 0.004 mol of naphthalene sulfonic acid (NSA) instead of camphor sulfonic acid and using m-cresol as the solvent. Thus, a polyaniline film doped with naphthalenesulfonic acid was obtained. Table 1 shows the physical properties of this film.

【0031】比較例3:HClでドーピングされたポリ
アニリンフィルム HCl0.004モルを用いて実施例1と同様な手順で
HClでドーピングしたポリアニリンフィルムを製造し
た。このフィルムの物性を表1に示す。
Comparative Example 3 Polyaniline Film Doped with HCl A HCl-doped polyaniline film was prepared by the same procedure as in Example 1 using 0.004 mol of HCl. Table 1 shows the physical properties of this film.

【0032】参照例:カーボンブラックを含有するポリ
アニリンフィルム 製造例で得られたポリアニリン粉末2gをNMP30m
lに撹拌しながら徐々に加えた後、カーボンブラック
1.5gをそれに加えて混入させた。生成した混合物を
ガラス板上に注ぎ、実施例1のように乾燥してカーボン
ブラックを含有するポリアニリンフィルムを得た。この
フィルムの物性を表1に示す。
Reference Example : Polyaniline Film Containing Carbon Black 2 g of the polyaniline powder obtained in the Production Example was added to 30 m of NMP.
After gradually adding to 1 liter with stirring, 1.5 g of carbon black was added thereto and mixed. The resulting mixture was poured onto a glass plate and dried as in Example 1 to obtain a polyaniline film containing carbon black. Table 1 shows the physical properties of this film.

【0033】[0033]

【表1】 [Table 1]

【0034】表1の結果から分かるように、実施例1で
m−クレゾールを溶媒として用いて製造した本発明のフ
ィルムは、他の伝導性フィルムに比べて伝導体及びEM
I遮蔽物質として優れた性能を有する。
As can be seen from the results shown in Table 1, the film of the present invention prepared by using m-cresol as a solvent in Example 1 is a conductor and EM as compared with other conductive films.
I has excellent performance as a shielding material.

【図面の簡単な説明】[Brief description of the drawings]

【図1】遮蔽効果測定法を概略的に示した図。FIG. 1 is a diagram schematically showing a shielding effect measuring method.

【図2】10乃至1000MHzの範囲における本発明
フィルムの遮蔽効果を示したグラフ。
FIG. 2 is a graph showing the shielding effect of the film of the present invention in the range of 10 to 1000 MHz.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 ポリアニリン、ショウノウスルホン酸
及び芳香族ヒドロキシ化合物を含むコーティング組成
物。
1. A coating composition comprising polyaniline, camphor sulfonic acid and an aromatic hydroxy compound.
【請求項2】 芳香族ヒドロキシ化合物がm−クレゾ
ールである請求項1に記載のコーティング組成物。
2. The coating composition according to claim 1, wherein the aromatic hydroxy compound is m-cresol.
【請求項3】 エポキシ樹脂を更に含む請求項2に記
載のコーティング組成物。
3. The coating composition according to claim 2, further comprising an epoxy resin.
【請求項4】 請求項1、2または3に記載のコーテ
ィング組成物を用いて生成したポリアニリン及びショウ
ノウスルホン酸を含む伝導性フィルム。
4. A conductive film comprising polyaniline and camphor sulfonic acid produced using the coating composition of claim 1, 2 or 3.
【請求項5】 請求項4に記載の伝導性フィルムでコ
ーティングされた電子装置用ケース。
5. An electronic device case coated with the conductive film according to claim 4.
JP8339753A 1995-12-20 1996-12-19 Conductive polyaniline doped with camphorsulfonic acid Pending JPH09183945A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1995-52565 1995-12-20
KR1019950052565A KR970058474A (en) 1995-12-20 1995-12-20 Electromagnetic shielding case

Publications (1)

Publication Number Publication Date
JPH09183945A true JPH09183945A (en) 1997-07-15

Family

ID=19441742

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Country Status (4)

Country Link
JP (1) JPH09183945A (en)
KR (1) KR970058474A (en)
CN (1) CN1158349A (en)
DE (1) DE19653196A1 (en)

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CA2309194A1 (en) * 1997-11-07 1999-05-20 Corning Communications Limited Conductive polymer compositions
DE10038201A1 (en) * 2000-08-04 2002-02-14 Siemens Axiva Gmbh & Co Kg New electrolytes for electrolytic capacitors and their use
KR20020082243A (en) * 2001-04-19 2002-10-31 주식회사 두람하이테크 Electromagnetic radiation shielding composition and preparing method thereof
TWI551637B (en) * 2009-06-12 2016-10-01 Idemitsu Kosan Co Conjugate conjugated polymer composition
CN103137848B (en) * 2013-02-06 2016-04-13 中国科学院上海硅酸盐研究所 Obtain the method for high-performance polyaniline base thermoelectric material
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Publication number Priority date Publication date Assignee Title
JP2007529586A (en) * 2004-03-18 2007-10-25 オルメコン・ゲーエムベーハー Composition comprising a colloidal conductive polymer and carbon
WO2006126448A1 (en) * 2005-05-27 2006-11-30 Idemitsu Kosan Co., Ltd. Conductive polymer multilayer body
JP5114197B2 (en) * 2005-05-27 2013-01-09 出光興産株式会社 Conductive polymer laminate

Also Published As

Publication number Publication date
CN1158349A (en) 1997-09-03
KR970058474A (en) 1997-07-31
DE19653196A1 (en) 1997-06-26

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