JPH09183050A - Substrate chamfering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance productivity by performing total inspection while easily stabilizing the diameters, roundness, and concentricity of the inner and outer circumferences of a substrate to accurate values inside a machine in chamfering the substrate using a chamfering machine. SOLUTION: This substrate chamfering device 10 has a measuring device 12, for continuously measuring the diameters of the inner and outer circumferences of a substrate machined by a chamfering machine 11, and a measurement processing device 13 which calculates the average diameters, maximum diameters, minimum diameters and roundness of the inner and outer circumferences and concentricity of the inner and outer circumferences from the measurements transmitted from the measuring device 12, and measuring elements in the measuring device 12 which make contact with the inner and outer circumferences of the substrate are made of diamond.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chamfering apparatus for a recording medium substrate represented by a hard disk substrate.

[0002]

2. Description of the Related Art Conventionally, a magnetic disk substrate is chamfered on its inner and outer peripheral end faces. This is to prevent the disk from being scratched when the disk is lifted to be conveyed to a predetermined position in the manufacturing process of the magnetic disk or the like.

In the prior art, the chamfered substrate is extracted after the chamfering process, and the diameter, roundness, and concentricity of the inner and outer peripheral portions of the substrate are measured by a measuring device, and the measurement result is obtained. Those that are out of the allowable range will be discarded.

At this time, in the prior art, the above-mentioned measuring device has a tracing stylus which is in pressure contact with the inner peripheral portion or the outer peripheral portion of the substrate,
This probe is made of cemented carbide.

[0005]

However, during chamfering of substrates, the life of the grindstone decreases as the chamfering of a large number of substrates progresses, and as a result, the inner and outer peripheral portions of the substrate are Machining dimensional accuracy gradually deteriorates. For this reason, when it is noticed that a processing defect occurs in the sampling inspection after processing, a large number of defective products having defective circularity and defective concentricity may have already been produced.

A magnetic disk substrate having a defective circularity or concentricity is likely to cause uneven rotation of the magnetic disk and a data error. In particular, when the track density of the magnetic disk is high, the followability of the magnetic head to the track of the magnetic disk becomes poor.

Further, since the measuring element of the measuring device is made of cemented carbide, wear of the measuring element 100 progresses as shown in FIG. When it exceeds the number of times, as shown in FIG. 14B, the measurement error Δ (difference between the actual value and the measured value) of the measuring device becomes remarkably large. This lowers the reliability of the measuring device and produces a defective product due to a measurement error despite the measurement, which hinders the productivity.

An object of the present invention is to easily and accurately determine the diameter, roundness, and concentricity of the inner and outer peripheral portions of a substrate when the substrate is chamfered by a chamfering machine. The aim is to make it possible to consistently perform 100% inspection and improve productivity. Further, the defective product is discharged to the outside of the machine and the life of the grindstone is judged according to the inspection result.

[0009]

The present invention according to claim 1 is a substrate chamfering device for chamfering an end face of a donut-shaped substrate, which is provided with a grindstone, and the grindstone is used for the end face of the substrate. Chamfering machine for chamfering, measuring device for continuously measuring the inner and outer diameters of the substrate processed by the chamfering machine, and the inner circumference from the measurement result from the measuring device The average diameter, the maximum diameter, the minimum diameter and the circularity of the portion and the outer peripheral portion, and a measurement processing device for calculating the concentricity of the inner peripheral portion and the outer peripheral portion, the inner peripheral portion of the substrate in the measuring device or The probe contacting the outer circumference is made of diamond.

According to the present invention of claim 2, in addition to the invention of claim 1, the average diameter, the maximum diameter, the minimum diameter, the roundness and the concentricity calculated by the measurement processing device are appropriate. It is determined whether or not there is any, and if it is inappropriate, a discard signal is output, and the chamfering machine discards the substrate having an improper chamfered shape out of the chamfering machine based on the discard signal. It has a means.

According to a third aspect of the present invention, in the present invention according to the first or second aspect, further, the processed substrate in which the measurement results of the concentricity and the roundness calculated by the measurement processing device are inappropriate. When a specific number of sheets are discharged in a certain period, it is regarded as the life of the grindstone and means for notifying the replacement time of the grindstone is provided.

The present invention described in claim 4 is the first to third aspects of the present invention.
In any one of the present inventions, the substrate is made of a non-metallic material.

According to the first aspect of the present invention,
Has the effect of Measuring device for continuously measuring the diameter of the inner peripheral portion and the outer peripheral portion of the substrate processed by the chamfering machine, the average diameter of the inner peripheral portion and the outer peripheral portion from the measurement results from this measurement value, the maximum diameter,
It has a minimum diameter and roundness, and a measurement processing device for calculating the concentricity of the inner peripheral portion and the outer peripheral portion. Therefore, it is possible to easily inspect all the diameters, roundness, and concentricity of the inner peripheral portion and the outer peripheral portion of the substrate in the machine.

Since the measuring elements of the measuring device are made of diamond, even if the measuring elements are repeatedly measured in order to inspect all the processed substrates, the abrasion of the measuring elements does not progress for a long period of time. The measurement error of the measuring device (difference between the actual value and the measured value) becomes negligibly small over a long period of time. Therefore, the measuring device can stably output an accurate measured value over a long period of time, improve measurement reliability, and improve processing productivity.

According to the second aspect of the present invention, the following operations are provided. A substrate (a substrate with a bad chamfered shape) having an inappropriate average diameter, maximum diameter, minimum diameter, roundness, and concentricity calculated by the measurement processing device is discarded outside the machine under the control of the chamfering machine. Therefore, the defective substrate is not conveyed to a lower process after the chamfering process and is not subjected to useless processing, and the productivity can be improved.

According to the third aspect of the present invention, the following effects are obtained. The concentricity and roundness of the substrate are strongly influenced by the machinability of the grindstone. Therefore, by monitoring that the specified number of defective circularity and concentricity defects calculated by the measurement processing device are discharged within a certain period, the life of the grindstone is determined, and the grindstone replacement time can be easily and reasonably determined. I can know.

According to the present invention, there is provided the following operation. When the substrate is made of a brittle non-metallic material such as carbon substrate, tempered glass, crystallized glass, ceramic, silicon,
The machinability of the grindstone has a particularly strong influence on the processing dimensional accuracy of the substrate. Therefore, for substrates made of non-metallic materials,
It is particularly useful to improve the processing accuracy and productivity of the substrate.

[0018]

1 is a block diagram showing a chamfering machine, FIG. 2 is a plan view showing an example of a chamfering machine, FIG. 3 is a front view of FIG. 1, and FIG. 4 is a side view of FIG. 5, FIG. 5 is a schematic diagram showing a chamfering processing state by a grindstone, FIG. 6 is a schematic diagram showing a chamfered shape of a substrate, FIG. 7 is a schematic diagram showing a measuring device, and FIG. 8 is a VI of FIG.
FIG. 9 is a schematic diagram showing an outer diameter measuring machine, FIG. 10 is a schematic diagram showing an inner diameter measuring machine, FIG. 11 is a schematic diagram showing an internal structure of the measuring machine, and FIG. 12 is an outer view. FIG. 13 is a schematic diagram showing the operation of the gauge head of the diameter measuring machine, and FIG. 13 is a schematic diagram showing the operation of the gauge head of the inner diameter measuring machine.

As shown in FIG. 1, a substrate inner / outer diameter / chamfering device 10 as a substrate chamfering device includes an outer diameter end face 3 and an inner diameter end face 5 of a donut-shaped substrate 1 and their chamfered portions 3A. Inner / outer diameter / chamfering machine 11 for grinding 5A
And a measuring device 12 for measuring the inner diameter and the outer diameter of the substrate 1,
A measurement processing device 13 for processing the measurement data from the measurement device 12 and a control device 14 for controlling the inner / outer diameter / chamfering machine 11 are configured.

As shown in FIGS. 2 to 4, the inner / outer diameter / chamfering machine 11 is installed on a machine base 15 and is provided with a holding table 16 at four equal positions, and a rotary table 17 which rotates in the direction of arrow A.
And the holding table 16 installed on the first stage of the machine base 15.
Supply / recovery unit 18 for loading / unloading the substrate 1 into / from the machine base 1
5, the outer diameter / chamfering unit 19 for grinding the outer diameter 3 of the substrate 1 and the chamfered portion 3A having the outer diameter 3, and the third stage of the machine base 15. , The inner diameter 5 of the substrate 1 and an inner diameter / chamfering processing unit 20 for grinding the chamfered portion 5A of the inner diameter 5, and the control device 14 includes a rotary table 17, a supply / recovery unit 18, and an outer diameter. The operations of the chamfering processing unit 19 and the inner diameter / chamfering processing unit 20 are controlled.

The supply / recovery unit 18 is a first unit of the machine base 15.
On the stage, the loader arm 21 is used to place the unprocessed substrate 1 in the supply cassette 22 on the holding table 16 of the rotary table 17, and the unloader arm 23 is used to hold the processed substrate 1 on the holding table 16. Collection cassette 24 from
Collect inside.

The holding table 16 on the rotary table 17 sucks the placed substrate 1. A jig clamp device 25 is installed on the second and third stages of the machine base 15, and a pressing force is applied to the substrate 1 attracted by the holding base 16 by the action of hydraulic pressure or water pressure to hold the substrate 1. Clamp on the base 16. In addition, stage recognition switches 26 are installed on the first, second, third and fourth stages of the machine base 15, and it is confirmed that the holding table 16 has reached each stage by the rotation of the rotary table 17. .

The outer diameter / chamfering processing unit 19 and the inner diameter / chamfering processing unit 20 have substantially the same structure.
7 and a grindstone motor 28 for rotating the multi-step grindstone 27
Through the elevating part 29 and the horizontal moving part 30.
It is installed in the central column 31 of. The elevating part 29 is installed on the horizontal slider 35 of the horizontal moving part 30.
The multi-step grindstone 27 and the grindstone motor 2 are attached to the lifting slider 33 of
8 is installed. The elevating part 29 moves (sends) the multi-step grinding wheel 27 in the same direction by moving the elevating slider 33 up and down (moving in the Z direction) by the elevating motor 32. The horizontal moving unit 30 moves the horizontal slider 35 in the horizontal direction (X direction) by the horizontal moving motor 34 to move (send) the multi-step grindstone 27 in the same direction.

Here, each multi-step grindstone 27 of the outer diameter / chamfering processing unit 19 and the inner diameter / chamfering processing unit 20 is the substrate 1
At the same time that the outer diameter end surface 3 and the inner diameter end surface 5 are ground, the chamfered portions 3A and 5A are ground on the outer diameter end surface 3 and the inner diameter end surface 5. The multi-step grindstone 27 shown in FIG.
The multi-step grindstone 2 shown in FIG. 5B is provided with a large number of steps for simultaneously grinding the outer diameter end surface 3 and the chamfered portion 3A (FIG. 6).
7 is provided with a large number of steps for simultaneously grinding the inner diameter end surface 5 of the substrate 1 and the chamfered portion 5A (FIG. 6).

Next, the grinding operation of the inner / outer diameter / chamfering machine 11 using the multi-step grindstones 27 of the outer diameter / chamfering processing unit 19 and the inner diameter / chamfering processing unit 20 will be described.
In the first stage shown in FIG. 2, the controller 14 operates the unloader arm 23 to recover the processed substrate 1 on the holding table 16 of the rotary table 17 into the recovery cassette 24, and then operates the loader arm 21. To place the unprocessed substrate 1 in the supply cassette 22 on the holding table 16,
Adsorb.

The controller 14 rotates the rotary table 17 by 90 degrees so that the holding table 16 holding the unprocessed substrate 1 moves to the second position.
When the stage is reached, the stage recognition switch 26 is turned on to confirm its position. Further, after confirming that the substrate 1 is adsorbed by the holding table 16, the control device 14 operates the jig clamp device 25 and confirms the clamping of the substrate 1 by the jig clamp device 25.

Thereafter, the controller 14 rotates the substrate 1 via the holding table 16 and operates the grindstone motor 28 in the outer diameter / chamfering processing unit 19 to rotate the multi-step grindstone 27. After confirming the rotations of the substrate 1 and the multi-step grindstone 27, the controller 14 moves the multi-step grindstone 27 by a predetermined feed amount Z.
After being moved in the X direction, the outer diameter end surface 3 of the substrate 1 is ground by moving a predetermined feed amount in the X direction, and at the same time, the chamfered portion 3A is ground on the outer diameter end surface 3.

The control device 14 rotates the rotary table 17 by 90 degrees thereafter, and when the substrate 1 on which the outer diameter end surface 3 and the chamfered portion 3A are processed reaches the third stage, uses the stage recognition switch 26. Recognizing this position, the substrate 1 is attracted to the holding table 16, the substrate 1 is clamped by the jig clamp device 25, and the multi-step grindstone 27 of the inner diameter / chamfering processing unit 20 is clamped.
Thus, similarly to the outer diameter / chamfering unit 19, the inner diameter end surface 5 of the substrate 1 and the chamfered portion 5A of the inner diameter end surface 5 are simultaneously ground.

However, the above-mentioned measuring device 12 is installed on the fourth stage of the machine base 15, and the diameters of the inner peripheral portion and the outer peripheral portion of the chamfered substrate 1 are continuously measured. There is.

The measuring device 12 is, as shown in FIG.
The center column 31 of No. 5 is equipped with an elevating table 43 that can be elevated and lowered by an elevating cylinder 42 via a linear guide 41. The elevating table 43 has an outer diameter measuring machine 44 and an inner diameter measuring machine 45.
have. When the substrate 1 is positioned on the fourth stage by the rotation of the rotary table 17, the measuring device 12 lowers the measuring machines 44 and 45 from the raised position to the substrate corresponding position, and detects the inner peripheral portion and the outer peripheral portion of the substrate 1. Measure the diameter.

As shown in FIGS. 8, 9 and 11, the outer diameter measuring device 44 includes a pair of outer diameter measuring elements 5 made of diamond.
One. Each outer diameter measuring element 51 is a swing arm 5.
2, the swing arm 52 is swingably supported by an L-shaped leaf spring fulcrum 53. In addition, the swing arm 52 is elastically urged by the measuring pressure adjusting tension spring 54 in a direction in which the outer diameter measuring element 51 is pressed against the outer peripheral portion of the substrate 1 to set the outer diameter measuring element 51 to the measurement work position (FIG. 12).
(A)), and the relief actuator 5 when not measuring
5, the outer diameter measuring element 51 is separated from the outer peripheral portion of the substrate 1 against the elastic force of the measurement pressure adjusting tension spring 54 so that the outer diameter measuring element 51 can be set to the standby position (FIG. 12).
(B)). Further, the swing arm 52 is the outer diameter measuring element 51.
Is provided with a differential transformer 56 for detecting the position of the outer diameter probe 51 when it is pressed against the outer peripheral portion of the substrate 1. Thereby, the outer diameter measuring machine 44 measures the outer diameter of the substrate 1 as follows.

(1) A pair of outer diameter measuring elements 5 of the outer diameter measuring device 44
With 1 set in the standby position, a standard substrate having a standard inner / outer diameter and ideal roundness and concentricity is arranged between the pair of outer diameter measuring elements 51. After that, a pair of outer diameter probe 5
1 is set to the measurement work position, and both outer diameter probe 5 at that time
The outputs G ₁ and G ₂ of the differential transformer 56 corresponding to 1 are set to zero.

(2) A pair of outer diameter measuring elements 5 of the outer diameter measuring device 44
With 1 set to the standby position, the outer diameter measuring device 44 is set to the substrate corresponding position. After that, the pair of outer diameter measuring elements 51 is set to the measurement work position, and the substrate 1 is rotated in a state where the outer diameter measuring element 51 is pressed against the outer peripheral portion of the substrate 1 and corresponds to both outer diameter measuring elements 51 at that time. Outputs of differential transformer 56 G _1, G
₂ is continuously obtained at a large number of measurement points in the circumferential direction of the substrate 1 and used as the outer diameter measurement value.

As shown in FIGS. 8 and 10, the inner diameter measuring machine 45 has a pair of inner diameter measuring elements 61 made of diamond. Each inner diameter measuring element 61 is attached to a swing arm 62, and the swing arm 62 is swingably supported on an L-shaped leaf spring type fulcrum (corresponding to the fulcrum 53 of the outer diameter measuring machine 44). Further, the swing arm 62 is a tension spring for measuring pressure adjustment (a tension spring 54 for measuring pressure adjustment of the outer diameter measuring machine 44).
(Corresponding to), the inner diameter measuring element 61 is repulsed in a direction in which the inner diameter measuring element 61 is pressed against the inner peripheral portion of the substrate 1 to set the inner diameter measuring element 61 to the measurement work position (FIG. 13 (A)), and the relief actuator 65 is set when not measuring. The inner diameter probe 61 can be set to the standby position by separating the inner diameter probe 61 from the inner peripheral portion of the substrate 1 against the elastic force of the measurement pressure adjusting tension spring (FIG. 1).
3 (B)). Further, the swing arm 62 is the inner diameter measuring element 6
A differential transformer (corresponding to the differential transformer 56 of the outer diameter measuring machine 44) for detecting the position of the inner diameter measuring element 61 when 1 is pressed against the inner peripheral portion of the substrate 1 is provided. This allows
The inner diameter measuring machine 45 measures the inner diameter of the substrate 1 as follows.

(1) A pair of inner diameter measuring elements 6 of the inner diameter measuring device 45
In the state where 1 is set to the standby position, the above-mentioned standard substrate is arranged around the pair of inner diameter measuring elements 61. afterwards,
The pair of inner diameter gauges 61 is set to the measurement work position, and the output G of the differential transformer corresponding to both inner diameter gauges 61 at that time
_3, G ₄ a zero setting.

(2) A pair of inner diameter measuring elements 6 of the inner diameter measuring machine 45
With 1 set at the standby position, the inner diameter measuring machine 45 is set at the substrate corresponding position. After that, the pair of inner diameter measuring elements 61 is set to the measurement position, the substrate 1 is rotated in a state where the inner diameter measuring element 61 is pressed against the inner peripheral portion of the substrate 1, and the differentials corresponding to both inner diameter measuring elements 61 at that time. The outputs G ₃ and G ₄ of the transformer are continuously obtained at a large number of measurement points in the circumferential direction of the substrate 1 and used as inner diameter measurement values.

Next, in the measurement processing device 13, the outer diameter measuring instrument 44 measures the outer diameter measurement values G ₁ and G ₂ measured at a large number of measuring points in the circumferential direction of the substrate 1, and the inner diameter measuring instrument 45 measures the substrate. 1
Inner diameter measurement value G measured at many measurement points in the circumferential direction of
₃ , G ₄ is obtained, and the average diameter, the maximum diameter, the minimum diameter, the roundness, the concentricity between the inner peripheral portion and the outer peripheral portion of the substrate 1 are calculated as follows.

(1) Average outer diameter

[Equation 1]

(2) Average inner diameter

[Equation 2]

(3) Maximum outer diameter MAX (G ₁ + G ₂ )

(4) Minimum outer diameter MIN (G ₁ + G ₂ )

(5) Maximum inner diameter MAX (G ₃ + G ₄ )

(6) Minimum inner diameter MIN (G ₃ + G ₄ )

(7) Outer Diameter Roundness MAX (G ₁ + G ₂ ) -MIN (G ₁ + G ₂ )

(8) Roundness of inner diameter MAX (G ₃ + G ₄ ) -MIN (G ₃ + G ₄ )

(9) Concentricity

(Equation 3)

Therefore, the controller 14 is the measurement processor 1
The average diameter, the maximum diameter, the minimum diameter, the roundness, and the concentricity calculated by 3 are compared with their predetermined allowable values,
When the allowable range is exceeded, the board discard signal is output. Then, the chamfering machine 11 has a board rejecting device 71 for discarding the board 1 having an inappropriate chamfered shape out of the chamfering machine 11 based on the board discard signal.

Further, the control device 14 includes the measurement processing device 13
When the specific number of substrates 1 whose concentricity and roundness measured by the above are inadequate beyond their permissible range and are discharged in a certain period, it is regarded as the life of the grindstone 27 and a grindstone for notifying the replacement time It has a replacement time notification device 72.

The operation of this embodiment will be described below. A measuring device 12 that continuously measures the diameters of the inner peripheral portion and the outer peripheral portion of the substrate 1 processed by the chamfering machine 11, and the average diameter of the inner peripheral portion and the outer peripheral portion based on the measurement results from the measured values,
It has a maximum diameter, a minimum diameter, and a roundness, and a measurement processing device 13 for calculating the concentricity of the inner peripheral portion and the outer peripheral portion. Therefore, the diameters, roundness, and concentricity of the inner and outer peripheral portions of the substrate 1 can be easily inspected in the machine.

Since the measuring elements 51 and 61 of the measuring device 12 are made of diamond, the durability of the measuring elements 51 and 61 is improved even if the measurement by the measuring elements 51 and 61 is repeated in order to inspect all the processed substrates 1. As a result, the wear does not proceed for a long period of time, and the measurement error of the measuring device 12 (difference between the actual value and the measured value) becomes negligibly small over a long period of time. Therefore, the measuring device 12 can stably output accurate measurement values over a long period of time, improve the reliability of measurement, and improve the productivity of processing.

The average diameter calculated by the measurement processing device 13,
The substrate 1 (the substrate 1 with a defective chamfered shape) having an inappropriate maximum diameter, minimum diameter, roundness and concentricity is discarded outside the machine under the control of the chamfering machine 11. Therefore, the defective substrate 1 is not conveyed to a lower process after the chamfering process and is not subjected to useless processing, and the productivity can be improved.

The concentricity and roundness of the substrate 1 are strongly influenced by the machinability of the grindstone 27. Therefore, the life of the grindstone 27 is determined by monitoring that the specific number of defective roundness and concentricity defects calculated by the measurement processing device 13 are discharged in a certain period, and the grindstone 27 replacement time can be simplified. You can reasonably know.

When the substrate 1 is made of a brittle non-metallic material such as a carbon substrate, the machinability of the grindstone 27 particularly strongly affects the processing dimensional accuracy of the substrate 1. Therefore, obtaining the above-mentioned actions (1) to (3) for the substrate 1 made of a non-metal material is particularly useful for improving the processing accuracy and productivity of the substrate 1.

The embodiment of the present invention has been described in detail above with reference to the drawings. However, the specific configuration of the present invention is not limited to this embodiment, and the design can be changed without departing from the gist of the present invention. Etc. are included in the present invention. For example, the substrate to which the present invention is applied is not limited to the carbonaceous carbon material substrate, and may be a plate glass, crystallized glass, or a nonmetallic brittle material such as silicon.

[0055]

As described above, according to the present invention, when a substrate is chamfered by a chamfering machine, the diameter, roundness and concentricity of the inner and outer peripheral portions of the substrate can be measured in the machine. You can easily and accurately inspect all products to improve productivity.

[Brief description of the drawings]

FIG. 1 is a block diagram showing a chamfering apparatus.

FIG. 2 is a plan view showing an example of a chamfering machine.

FIG. 3 is a front view of FIG. 1.

FIG. 4 is a side view of FIG. 1.

FIG. 5 is a schematic view showing a chamfering processing state with a grindstone.

FIG. 6 is a schematic view showing a chamfered shape of a substrate.

FIG. 7 is a schematic diagram showing a measuring device.

FIG. 8 is a view taken along the line VIII-VIII in FIG.

FIG. 9 is a schematic view showing an outer diameter measuring machine.

FIG. 10 is a schematic view showing an inner diameter measuring machine.

FIG. 11 is a schematic diagram showing an internal structure of the measuring machine.

FIG. 12 is a schematic view showing the operation of a probe of an outer diameter measuring machine.

FIG. 13 is a schematic diagram showing the operation of a probe of an inner diameter measuring machine.

FIG. 14 is a schematic diagram showing a conventional technique.

[Explanation of symbols]

 1 substrate 3 outer diameter end surface 3A chamfered portion 5 inner diameter end surface 5A chamfered portion 10 chamfering processing device 11 chamfering processing machine 12 measuring device 13 measurement processing device 14 control device 27 grindstone 51, 61 probe 71 substrate reject device 72 grindstone Replacement time notification device

Claims (4)

[Claims] 1. A substrate chamfering device for chamfering an end face of a donut-shaped substrate, comprising a grindstone, and a chamfering machine for chamfering the end face of the substrate with the grindstone; Measuring device for continuously measuring the diameter of the inner peripheral portion and the outer peripheral portion of the substrate processed by a machine, the average diameter of the inner peripheral portion and the outer peripheral portion from the measurement results from the measuring device, the maximum diameter, the minimum diameter and Circularity, having a measurement processing device for calculating the concentricity of the inner peripheral portion and the outer peripheral portion, wherein the probe contacting the inner peripheral portion or the outer peripheral portion of the substrate in the measuring device is made of diamond, Chamfering device for substrate. 2. An average diameter calculated by the measurement processing device,
It determines whether the maximum diameter, the minimum diameter, the circularity and the concentricity are appropriate, and outputs a discard signal when the diameter is inappropriate, and the chamfering machine determines whether the diameter is inappropriate based on the discard signal. 2. The chamfering apparatus for a substrate according to claim 1, further comprising means for disposing the chamfered substrate outside the chamfering machine. 3. When a specific number of processed substrates having improper concentricity and roundness measurement results calculated by the measurement processing device are discharged in a certain period, it is regarded as the life of the grindstone and the grindstone is replaced. The chamfering apparatus for a substrate according to claim 1 or 2, further comprising means for notifying a time. 4. The chamfering apparatus for a substrate according to claim 1, wherein the substrate is made of a non-metallic material.