JPH0918137A - Jig plate for solder jointing and production of electronic component mounting board - Google Patents

Abstract

PURPOSE: To obtain a jig plate for solder jointing excellent in durability in which molten solder can be fed sufficiently into a through hole of printed wiring board in order to enhance solder jointing between the printed wiring board and a lead frame and a method for producing an electronic component mounting board using the jig plate. CONSTITUTION: A printed wiring board 7 is provided with a solder jointing hole 13 for feeding molten solder 5 sufficiently into a through hole 71. An inner shielding part 11 has upper surface formed at a lower position than the upper surface of an outer shielding part 12 thus providing a recess 10 to be fitted with the printed wiring board 7. A recessed step part 121 for receiving solder flow is made around a soldering hole 13 in the lower surface of outer shielding part 12 covering the surface of a lead frame 6. A coupling part is provided between the inner shielding part 11 and the step part 121.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering jig plate used for soldering a lead frame to a printed wiring board, and a method for manufacturing an electronic component mounting board using the jig plate.

[0002]

2. Description of the Related Art Conventionally, as an electronic component mounting substrate, for example, as shown in FIG. 14, there is a substrate in which a lead frame 6 is soldered to an upper surface of a printed wiring board 7. The printed wiring board 7 has a through hole 71 penetrating the insulating substrate 75.
And an electronic component 92 which is provided substantially in the center of the insulating substrate 75.
And a wiring pattern 52 provided on the surface of the insulating substrate 75.

The mounting recess 720 has a mounting hole 72 in the insulating substrate 75 and a heat radiating plate 9 covering the lower side of the mounting hole 72.
3. The electronic component 92 mounted in the mounting recess 720 is electrically connected to the wiring pattern 52 by the bonding wire 920. The inner wall of the through hole 71 is covered with the metal plating film 51. The through hole 71 has solder 5 inside.
By being filled with 0, it is soldered to the inner lead portion 61 of the lead frame 6 located in the upper opening. In the electronic component mounting apparatus 9 described above,
The printed wiring board 7 and the inner lead portion 61 are covered with a sealing resin 94 with the outer lead portion 62 exposed.

Next, when soldering the lead frame 6 to the upper surface of the printed wiring board 7, a jig plate 99 for soldering is used, as shown in FIGS. 15 and 16, for example. That is, the jig plate 99 has a soldering hole 93 for supplying the molten solder 5 between the inner lead portion 61 of the lead frame 6 and the through hole 71 of the printed wiring board 7. Further, the jig plate 99 is provided with the soldering holes 9
An inner shield portion 91 for arranging the printed wiring board 7 is provided inside 3 and an outer shield portion 92 for covering the surface of the lead frame 6 is provided outside the soldering hole 93. The inner shielding portion 91 and the outer shielding portion 92 are connected by a connecting portion 95 and are integrally configured.

With the printed wiring board 7 and the lead frame 6 placed on the inner shielding portion 91 of the jig plate 99, the jig plate 99 is jetted with the molten solder 5 and the liquid surface of the solder bath. Dip it in and solder it. This gives
The molten solder 5 is supplied into the through hole 71 and is joined to the inner lead portion 61 arranged above it.

[0006]

However, when soldering the printed wiring board and the lead frame to each other using the jig plate, the opening width H of the soldering hole 93 must be a certain value or more. And this opening width H is shown in Table 1.
As shown in FIG. 5, the opening width H of the soldering hole 93 needs to be increased as the thickness F of the jig plate increases. Further, when the solder jet pressure is reduced, it is necessary to increase the opening width H of the soldering hole 93.

[0007]

[Table 1]

However, if the opening width H of the soldering hole is increased, the durability of the jig plate 99 is reduced. In addition, the solder inflow amount becomes excessive, and a solder bridge may be formed between adjacent through holes in the printed wiring board. Further, as the opening width H becomes larger, the mask area around the through hole becomes narrower, so that the portion covered by the inner shielding portion 91 on the lower surface of the printed wiring board 7 is reduced and the degree of freedom in designing the printed wiring board is reduced. Becomes smaller. On the contrary, if the opening width of the soldering hole is made small, the supply of solder into the through hole becomes insufficient, which may result in a defective joint between the jig plate and the lead frame.

In view of the above conventional problems, the present invention can sufficiently supply molten solder to the through holes of the printed wiring board, enhance the solder joint property between the printed wiring board and the lead frame, and have durability. It is intended to provide a jig board for soldering a printed wiring board and a method for manufacturing a board for mounting an electronic component, which are excellent in manufacturing.

[0010]

The present invention has a soldering hole for supplying molten solder between an inner lead portion of a lead frame and a through hole of a printed wiring board, and is located inside the soldering hole. In the jig plate for solder joining, an inner shield part for arranging the printed wiring board is provided on the other hand, and an outer shield part for covering the surface of the lead frame is provided on the outside of the soldering hole. The upper surface is formed at a position lower than the upper surface of the outer shielding portion to form a fitting recess for fitting the printed wiring board, and the lower surface of the outer shielding portion has the soldering hole of On the outside, a concave solder inflow step portion is provided so as to surround the soldering hole, and between the inner shielding portion and the solder inflow step portion, a connecting portion for connecting the two is provided. The jig plate for solder joining is characterized by

What is most noticeable in the present invention is that a fitting recess for fitting the printed wiring board is provided on the upper surface of the jig plate, and a soldering hole is provided on the lower surface of the outer shielding part. That is, a concave solder inflow step is provided so as to surround the outside.

The fitting recess is composed of an inner shielding portion for disposing the printed wiring board, a soldering hole formed so as to surround an outer wall of the inner shielding portion, and an inner wall of the outer shielding portion. (Fig. 1). External dimensions A of the recess for fitting
Is 0.1 to 0.2 larger than the external dimension C of the printed wiring board.
It is preferably mm larger (see FIG. 4). If it is less than 0.1 mm, it may be difficult to arrange the printed wiring board in the fitting recess. On the other hand, 0.2 mm
If it exceeds, the position where the printed wiring board is arranged is not fixed, and it may be difficult to solder-bond the printed wiring board and the lead frame at an accurate position.

The depth D of the recess for fitting is preferably D≤T with the thickness T of the printed wiring board (see FIG. 4). When the depth D of the recess for fitting is larger than the thickness T of the printed wiring board (D> T), a gap is formed between the lower surface of the printed wiring board and the upper surface of the inner shield portion, and Molten solder may infiltrate between them and contaminate the lower surface of the printed wiring board.

Further, the difference between the depth D of the recess for fitting and the thickness T of the printed wiring board is preferably 0.6 mm or less. If the difference between the depth D and the thickness T exceeds 0.6 mm, the printed wiring board and the lead frame may not be stably arranged on the jig plate. Further, due to the step between the upper surface of the printed wiring board and the upper surface of the outer shielding portion, the inner lead portion that is disposed so as to extend between the two may be bent.

The solder inflow step is formed on the lower surface of the outer shield,
It is provided in a concave shape so as to surround the outside of the soldering hole.
The lower surface of the solder inflow step is higher than the lower surface of the jig plate. The step W between the lower surface of the solder inflow step portion and the lower surface of the jig plate is equal to or larger than the thickness E of the inner shield portion and smaller than the thickness F of the jig plate by 0.3 mm or more, That is, it is preferable that the relationship of E ≦ W ≦ F−0.3 (mm) is established (see FIG. 4). If W <E, the molten solder may not be sufficiently supplied into the through hole. On the other hand, in the case of W> F-0.3 (mm), the strength of the outer shielding portion may decrease.

It is preferable that the solder inflow stepped portion expands downward on its lower surface (FIGS. 10 to 12). As a result, the opening area between the solder inflow step portion and the outer wall of the inner shield portion is increased, so that more molten solder can be supplied into the soldering hole provided between the two portions and the through hole. It is possible to reliably fill the inside with the molten solder. For the same reason, the outer wall of the inner shield is preferably chamfered on the lower surface (FIGS. 12 and 13).

The soldering hole is a hole formed between the outer wall of the inner shield and the inner wall of the outer shield. The soldering holes are opened at the positions where the through holes of the printed wiring board are arranged. The opening width H of the soldering hole is 0.7 to 2.
It is preferably 0 mm (see FIG. 4). 0.7 mm
If it is less than the range, it may be difficult to sufficiently supply the molten solder into the through holes. On the other hand, 2.0 mm
If the value exceeds the range, the molten solder is sufficiently supplied into the through hole, but the exposed area of the printed wiring board becomes large, which may reduce the degree of freedom in designing the printed wiring board.

The jig plate preferably has a sandwiching flat plate for sandwiching the printed wiring board and the lead frame with the upper surface of the jig plate (FIG. 8). As a result, the printed wiring board and the lead frame can be securely fixed, and the handling becomes easy.

Further, it is preferable that the jig plate has a fixture for integrally fixing the above four members in a state where the printed wiring board and the lead frame are sandwiched by the sandwiching flat plate (FIG. 8). ). The fixing device is, for example,
The jig plate, the printed wiring board, the lead frame, and the sandwiching flat plate are stacked to have a fitting portion for inserting and fixing these four members. As a result, the above four persons can be handled integrally, and the handling becomes easy.

Next, as a method of manufacturing an electronic component mounting board using the jig plate, for example, a printed wiring board having a through hole and an inner lead portion of a lead frame are soldered in the through hole. In the method of manufacturing an electronic component mounting board including the printed wiring board and the lead frame by soldering by supplying the molten solder, first, the molten solder is supplied between the inner lead portion and the through hole. A soldering hole for soldering, an inner shielding portion for arranging a printed wiring board inside the soldering hole, and an outer side for covering the surface of the lead frame outside the soldering hole. A shield portion is provided, and the upper surface of the inner shield portion is formed at a position lower than the upper surface of the outer shield portion, and has a fitting recess for arranging the printed wiring board. Constitute, also in the lower surface of the outer shield part, the outer holes for with the solder has solder inflow step portion of the concave so as to surround the holes for the attached solder, also,
A jig plate for solder joining having a connecting portion for connecting the inner shield portion and the solder inflow step portion is prepared, and then the inner lead portion is provided above the opening of the through hole. The lead frame is placed on the printed wiring board so that it is positioned, the printed wiring board is fitted into the fitting recess of the jig board, and then the soldering hole of the jig board is located below. Therefore, there is a method of manufacturing an electronic component mounting substrate, characterized in that the molten solder is infiltrated into the through hole to fill the through hole and bond the through hole to the lead frame portion.

The printed wiring board and the lead frame are preferably adhered to each other in advance before they are placed on the jig board. As a result, during the soldering process, the soldering can be performed at an accurate position without causing a positional deviation between the printed wiring board and the lead frame. Others are the same as those described for the jig plate.

[0022]

In the jig plate for solder joining according to the present invention, the fitting recess for fitting the printed wiring board is provided on the upper surface of the jig plate. When the printed wiring board is fitted into the fitting recess, the printed wiring board is fixed in place by the upper surface of the inner shield and the inner wall of the outer shield that form the fitting recess. Therefore, according to the jig plate, the printed wiring board can be accurately positioned and fixed.

Further, a concave solder inflow step portion is provided on the lower surface of the outer shielding portion so as to surround the outside of the soldering hole. Therefore, the solder inflow step portion expands the width of the lower surface opening of the soldering hole. Therefore, when the lower surface of the jig plate is dipped in the molten solder and the molten solder is jetted and supplied, a large amount of the molten solder is supplied to the vicinity of the opening of the through hole exposed in the soldering hole. Therefore, the molten solder easily enters the through holes. Therefore, the molten solder is sufficiently supplied into the through hole, and the solder connection between the through hole and the inner lead portion can be reliably performed.

Further, a large amount of molten solder can be supplied to the vicinity of the lower opening of the through hole without increasing the opening width of the soldering hole. Therefore, it is possible to sufficiently secure the shielding area of the printed wiring board by the inner shielding portion. Therefore, no solder bridge is formed between adjacent through holes. In addition, the degree of freedom in designing the printed wiring board is increased.

Further, as described above, since the molten solder can be easily infiltrated, the portion in contact with the molten solder can be minimized and damage to the printed wiring board due to the high temperature molten solder can be suppressed. Further, since the opening width of the soldering hole can be reduced, the durability of the jig plate can be improved. Further, by adjusting the level difference between the lower surface of the solder inflow step and the lower surface of the jig plate, the molten solder is sufficiently supplied into the through hole, and the jig plate is thickened to improve durability. Can be increased.

According to the present invention, the molten solder can be sufficiently supplied to the through holes of the printed wiring board, the solder bondability between the printed wiring board and the lead frame is enhanced, and the printed wiring board is excellent in durability. A jig plate for soldering a wiring board and a method for manufacturing an electronic component mounting board can be provided.

[0027]

【Example】

Example 1 FIG. 1 is a plan view showing a jig plate for solder joining and a method of manufacturing an electronic component mounting board using the jig plate according to an example of the present invention.
This will be described with reference to FIG. The jig plate for solder joining in this example is
As shown in FIG. 1, a soldering hole 13 for supplying the molten solder 5 is provided between the inner lead portion 61 of the lead frame 6 and the through hole 71 of the printed wiring board 7. Further, the jig plate 1 has an inner shield portion 11 on which the printed wiring board 7 is arranged inside the soldering hole 13,
Outside the soldering hole 13, an outer shielding portion 12 that covers the surface of the lead frame 6 is provided.

The upper surface of the inner shield portion 11 has the outer shield portion 12
Is formed at a position lower than the upper surface of the printed wiring board 7
To form a fitting recess 10 for fitting. Further, on the lower surface of the outer shielding portion 12, the soldering hole 13
A concave solder inflow step portion 121 is provided on the outer side of the so as to surround the soldering hole.

Further, as shown in FIGS. 2 and 3, a connecting portion 15 is provided between the inner shielding portion 11 and the solder inflow step portion 121 to connect them. In this example, the inner shielding portion 11 is connected to the solder inflow step portion 121 by four connecting portions 15 from the four directions, but is connected diagonally by two connecting portions 15 from two directions. It can also be connected.

The fitting recess 10 is, as shown in FIG.
An inner shielding portion 11 on which the printed wiring board 7 is arranged, and a soldering hole 13 formed so as to surround an outer wall of the inner shielding portion.
And the inner side wall of the outer shield portion 12.
External dimensions A of the recess 10 for fitting are 2.5 mm × 2.5 m
m, which is 0.2 m larger than the external dimension C of the printed wiring board
m larger. The depth D of the fitting recess 10 is the same as the thickness T of the printed wiring board 7.

The solder inflow step 121 is formed by the outer shield 12
Is provided in a concave shape on the lower surface so as to surround the outside of the soldering hole 13. The lower surface of the solder inflow step portion 121 is located higher than the lower surface of the jig plate 1. Step 121 for solder inflow
Difference W between the lower surface of the jig plate 1 and the lower surface of the jig plate 1 is 0.5 mm, which is equal to or larger than the thickness E of the inner shield portion 11 and is 0.3 mm or more than the thickness F of the jig plate 1. small.

The soldering hole 13 is a hole formed between the outer wall of the inner shield 11 and the inner wall of the outer shield 12. The soldering hole 13 surrounds the outer side of the inner shield portion 11,
In addition, it is formed so as to surround the inside of the outer shield portion 12. The soldering holes 13 are opened at positions where the through holes 71 of the printed wiring board 7 are arranged. Soldering hole 13
Has an opening width H of 3.0 mm.

As shown in FIG. 8, the jig plate 1 has a sandwiching flat plate 2 for sandwiching the printed wiring board 7 and the lead frame 6 with the jig plate 1. Also,
The jig plate 1 has a fixture 3 that integrally fixes the four members in a state where the printed wiring board 7 and the lead frame 6 are sandwiched by the sandwiching flat plate 2.

The fixture 3 is an inverted L-shaped fitting portion for inserting and fixing the jig plate 1, the printed wiring board 7, the lead frame 6, and the sandwiching flat plate 2 in a laminated state. 32 and a flat base 31. The fitting portion 32 is fastened to the base 31 with screws 329. Then, between the fitting portion 32 and the base 31, there are formed insertion portions 320 into which the left and right end portions of the above-mentioned four laminated bodies are slid and inserted (FIGS. 8 and 9).

Next, a method of manufacturing an electronic component mounting substrate using the jig plate 1 will be described. First, the jig plate, the printed wiring board, and the lead frame are prepared. As shown in FIGS. 5 and 7, the printed wiring board 7 has
A wiring pattern 52 is provided on the surface thereof, and a mounting hole 72 for mounting an electronic component is provided at a substantially central portion thereof. Through hole 7
The inner wall of No. 1 is covered with a metal plating film 51.
Further, a solder resist film 78 is formed on the peripheral edge portion of the printed wiring board 7 outside the through hole formation portion.

As shown in FIG. 6, the lead frame 6 is
It has a large number of inner lead portions 61 arranged above the openings of the through holes 71, outer lead portions 62 provided outward from the inner lead portions 61, and a frame portion 65 for fixing the outer lead portions 62. doing.
The frame portion 65 is provided with a fixing hole 66.

Next, as shown in FIG. 7, the printed wiring board 7 and the lead frame 6 are bonded in advance with an adhesive 79. This is to prevent positional displacement between the printed wiring board 7 and the lead frame 6 during the solder joining process. Next, as shown in FIGS.
The lead frame 6 is arranged on the printed wiring board 7 so that the inner lead portion 61 is located above the opening of the through hole 71, and the printed wiring board 7 is fitted into the fitting recess 10.

Next, as shown in FIGS. 8 and 9, the sandwiching flat plate 2, the lead frame 6, the printed wiring board 7, and the jig board 1 are sequentially laminated. Next, the insertion part 3 formed between the base 31 and the fitting part 32 on both the left and right sides of this laminate.
It is fixed integrally by inserting into 20.

Next, the laminate and the fixture 3 are turned upside down from the state of FIG. 8 and faced to the molten solder bath as shown in FIG. Next, as shown in FIG. 1, the molten solder 5 is jetted into the through hole 71 from below the soldering hole 13 of the jig plate 1 so as to fill the through hole 71 and the through hole 71 and the inner lead portion. Solder joint with 62. As a result, a board for mounting electronic components is obtained.

Thereafter, with respect to the electronic component mounting board, the heat dissipation plate 93 is bonded, the electronic component 92 is mounted, the printed wiring board 7 is sealed with the sealing resin 94, as in the conventional case.
By cutting the lead terminal 62 and the frame portion 65, the electronic component mounting device 9 is obtained (see FIG. 14).

Next, the function and effect of this example will be described.
As shown in FIG. 1, the jig plate 1 for solder joining of this example is provided with a fitting recess 10 for fitting the printed wiring board 7 on the upper surface thereof. When the printed wiring board 7 is fitted into the fitting recess 10, the fitting recess 10
The printed wiring board 7 is fixed at a fixed position by the upper surface of the inner shield portion 11 and the inner wall of the outer shield portion 12 which constitute the. Therefore, according to the jig plate 1, the printed wiring board 7 can be accurately positioned and fixed.

On the lower surface of the outer shield portion 12, a concave solder inflow step portion 12 is formed so as to surround the outer side of the soldering hole 13.
1 is provided. Therefore, the opening width of the lower surface of the soldering hole 13 is increased by the solder inflow step 121. Therefore, when the lower surface of the jig plate 1 is dipped in the molten solder 5 and the molten solder 5 is supplied by jet flow, a large amount of the molten solder 5 is supplied up to the vicinity of the opening of the through hole 71 exposed in the soldering hole 13. It Therefore, the molten solder 5 easily enters the through hole 71. Therefore, the through hole 71
The molten solder 5 is sufficiently supplied therein, and the solder connection between the through hole 71 and the inner lead portion 61 can be reliably performed.

Further, a large amount of molten solder 5 can be supplied near the lower opening of the through hole without increasing the opening width H of the soldering hole 13. Therefore, it is possible to sufficiently secure the shielding area of the printed wiring board 7 by the inner shielding portion 11. Therefore, adjacent through hole 7
No solder bridge is formed between the two. Also,
The degree of freedom in designing the printed wiring board is increased.

Further, as described above, since the molten solder can easily infiltrate, the portion in contact with the molten solder can be minimized, and the damage to the printed wiring board 7 due to the high temperature molten solder can be suppressed. . Further, since the opening width H of the soldering hole 13 can be reduced, the durability of the jig plate 1 can be improved. Further, as shown in FIG. 4, by adjusting the step W between the lower surface of the solder inflow step portion 121 and the lower surface of the jig plate 1, the molten solder 5 is sufficiently supplied into the through hole 71, and at the same time, it is cured. The durability of the jig plate can be increased by increasing the thickness of the tool plate 1.

As shown in FIG. 8, the jig plate 1 has a fixture 3 for integrally fixing the above four members in a state where the printed wiring board 7 and the lead frame 6 are sandwiched by the sandwiching flat plate 2. doing. Therefore, the printed wiring board 7
The lead frame 6 and the lead frame 6 can be reliably fixed at the correct positions. In addition, the above four persons can be handled integrally, and the handling becomes easy.

In the present example, as shown in FIG. 5, the through hole 71 has a distance B from the end of the printed wiring board 7.
Is provided at a position of 1.8 mm. On the other hand, when the jig plate of the conventional example is used, even if the through hole is provided at the position where the distance B from the end of the printed wiring board is 1.8 mm, the molten solder is not sufficiently supplied into the through hole. It was Then, only when the distance B from the end of the printed wiring board was provided at a position of 2.6 mm, the molten solder was sufficiently supplied into the through hole.

This means that when the jig plate 1 of this example is used, the end portion of the printed wiring board 7 and its periphery are exposed to the solder inflow step 121, so that the vicinity of the end portion of the printed wiring board is affected. Even if a through hole is provided in the
It is considered that the molten solder 5 is sufficiently supplied therein.
On the other hand, when the jig plate 99 (see FIG. 15) of the conventional example is used, the end portion of the printed wiring board and its periphery are shaded by the outer shielding portion 92, and the molten solder 5 is difficult to be supplied. it is conceivable that. Therefore, according to the jig plate of this example,
Through holes can be provided near the ends of the printed wiring board, and the degree of freedom in designing the printed wiring board can be increased.

Example 2 In the jig plate 1 of this example, as shown in FIG. 10, the solder inflow step 121 is expanded downward on its lower surface. That is, the slope 122 is formed between the lower surface of the solder inflow step 121 and the lower surface of the jig plate 1. Others are the same as the first embodiment.

In this example, the lower surface of the solder inflow step 121 is expanded downward. Therefore, the opening area between the lower surface of the solder inflow step portion 121 and the outer wall of the inner shield portion 11 becomes large, and more molten solder is supplied into the soldering hole 13 provided between the two. You can
Therefore, the molten solder can be sufficiently supplied into the through holes. In addition, in this embodiment, the same effect as that of the first embodiment can be obtained.

Embodiment 3 In the jig plate 1 of this embodiment, as shown in FIG. 11, a slope 123 is formed between the lower surface of the solder inflow step 121 and the outer wall of the solder inflow step 121. Has been done. Others are the same as the second embodiment.

In this example, as described above, the slope 123 provided between the lower surface of the solder inflow step 121 and the outer side wall.
As a result, the solder inflow step 121 is
Expand downwards. Therefore, similarly to the second embodiment, the molten solder can be sufficiently supplied into the through holes. In addition, in this embodiment, the same effect as that of the first embodiment can be obtained.

Embodiment 4 In the jig plate 1 of this embodiment, as shown in FIG. 12, the outer wall of the inner shield portion 11 is chamfered on its lower surface. That is, the outer wall of the inner shield portion 11 is chamfered to form a slope 111 that expands downward.
Others are the same as the second embodiment.

In this example, as described above, the peripheral portion of the inner shield portion 11 is chamfered on the lower surface thereof. Therefore, similarly to the second embodiment, the molten solder can be sufficiently supplied into the through holes. In addition, in this embodiment, the same effect as that of the first embodiment can be obtained.

Embodiment 5 In the jig plate 1 of this embodiment, as shown in FIG. 13, the lower part of the outer wall of the inner shield 11 is chamfered so that the space between the upper and lower surfaces of the outer wall of the inner shield 11 is reduced. A slope 112 is formed at the bottom. Others are the same as the first embodiment. In this example, since the lower part of the outer wall of the inner shield part 11 is chamfered, the lower opening width of the solder joint hole 13 is enlarged,
As in the second embodiment, the molten solder can be sufficiently supplied into the through holes. In addition, in this embodiment, the same effect as that of the first embodiment can be obtained.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a method of solder-bonding a printed wiring board and a lead frame using a jig plate for solder bonding in Embodiment 1.

FIG. 2 is a back view of a jig plate for solder joining according to the first embodiment.

FIG. 3 is a perspective view of the jig plate for solder joining of Example 1 as viewed from the back surface side.

FIG. 4 is a cross-sectional view of a jig plate for solder joining according to the first embodiment.

FIG. 5 is a rear view of the jig plate for solder joining in which the printed wiring board is fitted in the fitting recess in the first embodiment.

FIG. 6 is a plan view of the lead frame arranged on the upper surface of the printed wiring board in the first embodiment.

FIG. 7 is a cross-sectional view of a printed wiring board and a lead frame that are bonded together in the first embodiment.

FIG. 8 is an explanatory diagram showing a fixture in which a sandwiching flat plate, a lead frame, a printed wiring board, and a jig plate are fixed in Example 1.

FIG. 9 is an explanatory view showing a method of integrally fixing the sandwiching flat plate, the lead frame, the printed wiring board, and the jig plate in the first embodiment with a fixture.

FIG. 10 is a cross-sectional view of a jig plate for solder joining according to a second embodiment.

FIG. 11 is a cross-sectional view of a jig plate for solder joining according to a third embodiment.

FIG. 12 is a cross-sectional view of a jig plate for solder joining according to a fourth embodiment.

FIG. 13 is a cross-sectional view of a jig plate for solder joining according to a fifth embodiment.

FIG. 14 is a cross-sectional view of an electronic component mounting device in a conventional example.

FIG. 15 is an explanatory view showing a method of solder-bonding a printed wiring board and a lead frame using a jig plate for solder bonding in a conventional example.

FIG. 16 is a rear view of a jig plate for solder joining of a conventional example.

[Explanation of symbols]

 1. . . Jig plate, 10. . . Recess for fitting, 11. . . Inner shield, 111, 112, 122, 123. . . Slope, 12. . . Outer shield 121. . . 13. Step for solder inflow, 13. . . Solder joint hole, 15. . . Connection part, 2. . . Clamping plate, 3. . . Fixing device, 5. . . Molten solder, 52. . . Wiring pattern, 6. . . Lead frame, 61. . . Inner lead part, 62. . . Outer lead part, 7. . . Printed wiring board, 71. . . Through hole, 72. . . Mounting holes,

Claims (10)

[Claims] 1. A soldering hole for supplying molten solder is provided between an inner lead portion of a lead frame and a through hole of a printed wiring board, and the printed wiring board is located inside the soldering hole. In the jig plate for solder joining, in which an inner shield portion for disposing the inner shield portion is provided, and an outer shield portion for covering the surface of the lead frame is provided outside the soldering hole, the upper surface of the inner shield portion has an outer shield portion. Is formed at a position lower than the upper surface of the portion to form a fitting recess for fitting the printed wiring board, and on the lower surface of the outer shielding portion, the solder is provided outside the soldering hole. Solder characterized by having a concave solder inflow step so as to surround the attachment hole, and having a connecting portion for connecting the inner shield and the solder inflow step Jig plate for joining. 2. The outer dimension of the recess for fitting is 0. 1 mm smaller than the outer dimension of the printed wiring board.
A jig plate for solder joining, which is 1 to 0.2 mm larger. 3. The solder joint according to claim 1, wherein the depth D of the fitting recess and the thickness T of the printed wiring board have a relationship of D ≦ T. Jig plate. 4. The method according to claim 1, wherein
A jig plate for solder joining, wherein the solder inflow step portion is expanded downward. 5. The method according to claim 1, wherein:
A jig plate for solder joining, wherein an outer wall of the inner shield portion is chamfered on a lower surface thereof. 6. The method according to any one of claims 1 to 5,
A jig plate for soldering, wherein the jig plate has a sandwiching flat plate for sandwiching the printed wiring board and the lead frame with the upper surface of the jig plate. 7. The jig plate according to claim 6, wherein the jig plate has a fixing tool for integrally fixing the printed wiring board and the lead frame to each other in a state of being sandwiched by the sandwiching flat plate. A jig plate for solder joining characterized by. 8. The fixture according to claim 7, wherein the fixture has a fitting portion for inserting and fixing the jig plate, the printed wiring board, the lead frame, and the sandwiching flat plate in a laminated state. A jig plate for solder joining characterized by having. 9. An electronic device including a printed wiring board and a lead frame, wherein a printed wiring board having a through hole and an inner lead portion of a lead frame are solder-joined by supplying solder into the through hole. In the method of manufacturing a component mounting board, first, a soldering hole for supplying molten solder is provided between the inner lead portion and the through hole, and a print is provided inside the soldering hole. An inner shield for arranging the wiring board is provided, and an outer shield for covering the surface of the lead frame is provided outside the soldering hole, and the upper surface of the inner shield is the upper surface of the outer shield. It is formed at a lower position than the above to form a fitting recess for arranging the printed wiring board, and on the lower surface of the outer shielding portion, outside the soldering hole, For solder joining, a concave solder inflow step portion is provided so as to surround the soldering hole, and a connecting portion that connects the inner shield portion and the solder inflow step portion is provided between the inner shield portion and the solder inflow step portion. A jig plate is prepared, and then a lead frame is arranged on the printed wiring board so that the inner lead portion is located above the opening of the through hole. Then, the printed wiring board is fitted into the through hole, and then the molten solder is infiltrated into the through hole from below the soldering hole of the jig board, thereby filling the inside of the through hole and the through hole and the lead frame part. A method for manufacturing an electronic component mounting substrate, the method comprising: 10. The method for manufacturing an electronic component mounting substrate according to claim 9, wherein the printed wiring board and the lead frame are adhered to each other before being arranged on the jig board. .