JPH091695A - Structure of resin molding - Google Patents

Structure of resin molding

Info

Publication number
JPH091695A
JPH091695A JP17666095A JP17666095A JPH091695A JP H091695 A JPH091695 A JP H091695A JP 17666095 A JP17666095 A JP 17666095A JP 17666095 A JP17666095 A JP 17666095A JP H091695 A JPH091695 A JP H091695A
Authority
JP
Japan
Prior art keywords
boss
panel
resin molded
molded product
resin molding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17666095A
Other languages
Japanese (ja)
Inventor
Motohisa Shiina
元久 椎名
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kenwood KK
Original Assignee
Kenwood KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kenwood KK filed Critical Kenwood KK
Priority to JP17666095A priority Critical patent/JPH091695A/en
Publication of JPH091695A publication Critical patent/JPH091695A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent a boss for protecting a surface of a resin molding body from being folded during transportation and assembly. CONSTITUTION: A boss 2 is formed integrally with a resin molding body 1 through a hinge 2a and protrudes from the surface of the resin molding body. A stopper 3 for receiving the boss 2 when the boss 2 supports the resin molding body 1 and deforms is provided integrally with the resin molding body 1 at a position opposite to the boss 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は樹脂成形品に係わり、
特に、運送時や部品組付け時等に樹脂成形品を支えるボ
スの構造に関する。
This invention relates to a resin molded product,
In particular, it relates to the structure of a boss that supports a resin molded product during transportation or assembly of parts.

【0002】[0002]

【従来の技術】電子機器のパネル等の樹脂成形品には、
輸送時に疵が付くことを防止し、あるいは樹脂成形品に
ヒンジやツマミがあるときにこれらの変形を防止するた
めに保護用のボスが設けられたものがある。これらのボ
スは樹脂成形品が用いられた最終製品には不要であり、
組立て時に除去しやすいようになっている。
2. Description of the Related Art For resin molded products such as panels of electronic devices,
There is a boss provided for protection in order to prevent flaws from being formed during transportation or to prevent deformation of a resin molded product when it has a hinge or a knob. These bosses are not needed in the final product where resin molded products are used,
It is easy to remove when assembling.

【0003】図7にこのような電子機器のパネルのボス
の例を示す。図に示すようにボス2はパネル本体1と薄
肉部を介して一体に成形されている。このボス2は輸送
時に薄肉部の部分で折れることがあった。
FIG. 7 shows an example of a boss of a panel of such an electronic device. As shown in the figure, the boss 2 is integrally formed with the panel body 1 via a thin portion. The boss 2 was sometimes broken at the thin portion during transportation.

【0004】このパネルの裏面に部品を組付ける状態を
図8に示す。先ず、ボスを取り除いた後、図8(a)に
示すように、パネル1はその表面形状に合わせた専用の
治具6の上に載せられる。このようにしてパネルに疵が
付くことを防止し、また、ぐらつきを防止する。そし
て、図8(b)に示すようにパネル1の裏面に部品7、
7が組み付けられる。一般に製造ラインで扱うパネルの
種類は多く、パネルの形状に合わせた治具6として多く
の種類が必要であり、さらに、同一製品を生産するライ
ンの本数が複数ある場合も複数の治具が必要となり、製
造コストを増大させていた。
FIG. 8 shows a state in which parts are assembled on the back surface of this panel. First, after removing the boss, the panel 1 is placed on a dedicated jig 6 adapted to its surface shape, as shown in FIG. In this way, the panel is prevented from being scratched and wobble is prevented. Then, as shown in FIG. 8B, the component 7,
7 is assembled. Generally, there are many types of panels handled on the production line, and many types of jigs 6 are required to match the shape of the panels. Furthermore, even when there are multiple lines for producing the same product, multiple jigs are required. Therefore, the manufacturing cost was increased.

【0005】[0005]

【発明が解決しようとする課題】この発明は上記した点
に鑑みてなされたものであって、その目的とするところ
は、輸送時にボスが折れることなく、また、樹脂成形品
への部品の組付け時に治具を必要とすることのない樹脂
成形品の構造を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and an object thereof is to prevent the boss from breaking during transportation and to assemble the parts into the resin molded product. An object is to provide a structure of a resin molded product that does not require a jig when attaching.

【0006】[0006]

【課題を解決するための手段】この発明の樹脂成形品の
構造は、ヒンジ部を介して本体に連なるボスを樹脂成形
品の表面より突出させ、前記ボスが変形したときボスを
受けるストッパを本体に設けたものである。
According to the structure of a resin molded product of the present invention, a boss connected to the main body via a hinge portion is projected from the surface of the resin molded product, and a stopper for receiving the boss when the boss is deformed is provided in the main body. It was installed in.

【0007】また、前記樹脂成形品の構造において、前
記樹脂成形品を電子機器のパネルとしたものである。
Further, in the structure of the resin molded product, the resin molded product is a panel of an electronic device.

【0008】[0008]

【作用】この発明の樹脂成形品の構造によれば、輸送時
にボスによりパネルを支えるようにすることにより樹脂
成形品表面を保護できる。ボスはヒンジ部で変形する
が、ストッパにより支えられるので、ヒンジの変形が一
定の範囲に抑えられヒンジが折れることはない。
According to the structure of the resin molded product of the present invention, the surface of the resin molded product can be protected by supporting the panel by the boss during transportation. Although the boss is deformed by the hinge portion, since it is supported by the stopper, the deformation of the hinge is suppressed within a certain range and the hinge is not broken.

【0009】また、樹脂成形品に部品を取付けるとき
は、ボスにより樹脂成形品を支えるようにすれば樹脂成
形品表面が曲面に形成されていても樹脂成形品は安定し
て支持され、また、樹脂成形品表面に疵がつくことがな
い。
When a component is mounted on the resin molded product, the resin molded product can be stably supported by supporting the resin molded product by a boss even if the surface of the resin molded product is formed into a curved surface. No scratches on the surface of resin molded products.

【0010】[0010]

【実施例】この発明の実施例である電子機器のパネル構
造を図面に基づいて説明する。図1は、この発明の実施
例である電子機器のパネルを示す斜視図である。図に示
すようにパネル本体1の表面から突出するようにボス
2、2…が4個パネル本体1と一体に設けられている。
図2に詳しく示すように、ボス2はヒンジ部2aを介し
て本体1と連なっている。ボス2と対向する位置にスト
ッパ3がパネル本体1と一体に設けられている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A panel structure of an electronic device according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing a panel of an electronic device according to an embodiment of the present invention. As shown in the figure, four bosses 2, 2 ... Are integrally provided with the panel body 1 so as to project from the surface of the panel body 1.
As shown in detail in FIG. 2, the boss 2 is connected to the main body 1 via a hinge portion 2a. A stopper 3 is provided integrally with the panel body 1 at a position facing the boss 2.

【0011】図3(a)にこのパネル本体1を保管ある
いは輸送するときの状態を示している。パネル本体1、
1…は仕切り板5,5…を介して重ねられる。このと
き、ボス2はヒンジ部で変形して斜めになる。図3
(b)にボス2の変形状態を示す。ボス2は変形して斜
めになり、ストッパ3で支えられている。
FIG. 3A shows a state in which the panel body 1 is stored or transported. Panel body 1,
1 ... are stacked via partition plates 5, 5. At this time, the boss 2 is deformed at the hinge portion and becomes oblique. FIG.
The deformed state of the boss 2 is shown in (b). The boss 2 is deformed and becomes oblique, and is supported by the stopper 3.

【0012】ボス2がストッパ3に当接すると、それ以
上ヒンジ部が変形することはなく、ヒンジ部が折れるこ
とがない。このような状態で、パネル本体1の表面は仕
切り板5に接触せず疵がつかない。ヒンジ部2aは薄い
のでひねれば簡単にボス2を取除くことができる。ボス
2を取除いた後には図6に示すように化粧パネル4、4
を取付けてヒンジ部2aの折れた後が隠される。ボス2
を取除かなくても、図5に示すように、ヒンジ部2aを
曲げてボス2をストッパ3と反対側に倒して化粧パネル
4を取付けてもよい。
When the boss 2 comes into contact with the stopper 3, the hinge portion is not further deformed and the hinge portion is not broken. In such a state, the surface of the panel body 1 does not come into contact with the partition plate 5 and is not scratched. Since the hinge portion 2a is thin, the boss 2 can be easily removed by twisting. After removing the boss 2, as shown in FIG.
Is attached and the hinge part 2a is hidden after being folded. Boss 2
Even if it is not removed, the decorative panel 4 may be attached by bending the hinge portion 2a and tilting the boss 2 to the side opposite to the stopper 3 as shown in FIG.

【0013】図4にパネル本体1に部品7、7を取付け
るときの状態を示す。パネル本体1はボス2、2に支え
られて安定し、また表面が作業台に接触しないのでパネ
ル本体1の表面に疵がつかない。このとき、ボス2は図
3(b)に示すように斜めとなってストッパ3に当接し
ている。輸送と組立ての順序は自由であり、また、輸送
と組立てが複数回繰り返されてもよい。
FIG. 4 shows a state in which the components 7, 7 are attached to the panel body 1. The panel body 1 is supported by the bosses 2 and 2 and is stable, and since the surface does not contact the workbench, the surface of the panel body 1 is not scratched. At this time, the boss 2 is in contact with the stopper 3 in an inclined manner as shown in FIG. The order of transportation and assembly is arbitrary, and transportation and assembly may be repeated multiple times.

【0014】[0014]

【発明の効果】この発明の樹脂成形品の構造によれば、
輸送時や組立て時に樹脂成形品本体の表面を保護するボ
スは折れることなく、また、不要となったときに容易に
除去できる。また、組立て時の治具が不要となる。
According to the structure of the resin molded product of the present invention,
The boss that protects the surface of the resin molded product body during transportation and assembly does not break, and can be easily removed when it is no longer needed. Further, a jig for assembling is unnecessary.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の実施例である電子機器のパネルを示
す斜視図である。
FIG. 1 is a perspective view showing a panel of an electronic device according to an embodiment of the present invention.

【図2】図2(a)は同パネルの部分を示す斜視図、図
2(b)は同部分を示す断面図である。
FIG. 2 (a) is a perspective view showing a portion of the panel, and FIG. 2 (b) is a sectional view showing the portion.

【図3】図3(a)は同パネルを重ねた状態を示す側面
図、図3(b)は同パネルの同状態における部分断面図
である。
FIG. 3 (a) is a side view showing a state in which the panels are stacked, and FIG. 3 (b) is a partial sectional view of the panel in the same state.

【図4】同パネルに部品を組付ける状態を示す側面図で
ある。
FIG. 4 is a side view showing a state in which parts are assembled to the panel.

【図5】同パネルのボスを変形させた状態を示す断面図
である。
FIG. 5 is a cross-sectional view showing a state in which a boss of the panel is deformed.

【図6】同パネルのボスを除去した後の処理を示す斜視
図である。
FIG. 6 is a perspective view showing a process after removing the boss of the panel.

【図7】図7(a)は従来の電子機器のパネルの部分を
示す斜視図、図7(a)は同パネルの同部分を示す断面
図である。
FIG. 7 (a) is a perspective view showing a panel portion of a conventional electronic device, and FIG. 7 (a) is a sectional view showing the same portion of the panel.

【図8】同パネルに部品を組付ける状態を示す斜視図で
ある。
FIG. 8 is a perspective view showing a state in which parts are assembled to the panel.

【符号の説明】[Explanation of symbols]

1 パネル本体 2 ボス、2a ヒンジ部 3 ストッパ 4 化粧パネル 5 仕切り板 6 治具 7 部品 1 Panel body 2 Boss, 2a Hinge part 3 Stopper 4 Decorative panel 5 Partition plate 6 Jig 7 Parts

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ヒンジ部を介して本体に連なるボスを樹
脂成形品の表面より突出させ、前記ボスが変形したとき
ボスを受けるストッパを本体に設けたことを特徴とする
樹脂成形品の構造。
1. A structure of a resin molded product, characterized in that a boss connected to the main body via a hinge portion is projected from the surface of the resin molded product, and a stopper for receiving the boss when the boss is deformed is provided in the main body.
【請求項2】 前記樹脂成形品が電子機器のパネルであ
る請求項1記載の樹脂成形品の構造。
2. The structure of the resin molded product according to claim 1, wherein the resin molded product is a panel of an electronic device.
JP17666095A 1995-06-20 1995-06-20 Structure of resin molding Pending JPH091695A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17666095A JPH091695A (en) 1995-06-20 1995-06-20 Structure of resin molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17666095A JPH091695A (en) 1995-06-20 1995-06-20 Structure of resin molding

Publications (1)

Publication Number Publication Date
JPH091695A true JPH091695A (en) 1997-01-07

Family

ID=16017479

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17666095A Pending JPH091695A (en) 1995-06-20 1995-06-20 Structure of resin molding

Country Status (1)

Country Link
JP (1) JPH091695A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041532B2 (en) 2000-04-28 2006-05-09 Micron Technology, Inc. Methods for fabricating interposers including upwardly protruding dams

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7041532B2 (en) 2000-04-28 2006-05-09 Micron Technology, Inc. Methods for fabricating interposers including upwardly protruding dams
US7115981B2 (en) 2000-04-28 2006-10-03 Micron Technology, Inc. Semiconductor device assemblies including interposers with dams protruding therefrom

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