JPH09161297A - Semiconductor laser device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor laser device capable of precisely adjusting an assembling position of an optical part for a semiconductor laser element with simple constitution. SOLUTION: This device is provided with a support mechanical part 31 supporting the optical part 32 so as to become movable in the prescribed direction for an optical block 11c1 and a movement mechanical part 33 moving the optical part 32 so as to match a line 32b or a mark 35 showing the axis of the optical part 32 with a central line constituted of an optical element structural body by engaging it with the side end of the optical part 32 or an engagement part 32a formed on a part of the part 32.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device for irradiating an optical disk with laser light through an optical system component.

[0002]

2. Description of the Related Art As is well known, in a system for recording and reproducing information using an optical disk as a recording medium, such as a write-once type optical disk drive device, the optical disk is irradiated with laser light. An optical head device incorporating the semiconductor laser device is provided. This optical head device is arranged so as to face the signal recording surface of a rotationally driven optical disc, and records information by irradiating the optical disc with laser light or receives reflected light from the optical disc. Reading information.

FIG. 9 shows an optical head device incorporating such a conventional semiconductor laser device. In FIG. 9, reference numeral 11 in the drawing is an optical head main body, and an objective lens 11a for irradiating and receiving laser light on an optical disk (not shown) is exposed at the upper part of the drawing. Further, the optical head main body 11 has a tracking direction of the optical disk (direction shown by arrow BB in the drawing).
Both side parts corresponding to (only one side part is shown in the figure)
The focus actuator coil 12a and the tracking actuator coils 13a and 13a are installed in. These focus actuator coils 12a
And tracking actuator coils 13a, 13a
Are interposed in a magnetic closed circuit formed by a magnet installed in a frame (not shown).

Further, one end of the heat dissipation plate 14 is attached to the side surface of the optical head main body 11 opposite to the side surface in the vicinity of the objective lens 11a among the both side surfaces orthogonal to the tracking direction. There is. The other end of the heat sink 14 is
The optical head main body 11 is bent at a substantially right angle so as to cover the upper surface in the figure, and its tip reaches near the objective lens 11a and is used for heat dissipation by forced convection generated by rotation of the optical disk.

As shown in FIG. 10, the optical head body 11 is composed of a first casing 11b, a second casing 11c and a plate 15. This second housing 11c
An optical block 11c1 having a substantially quadrangular prism shape is integrally formed in the center of the first housing 11b so as to project toward the corresponding opening end direction.

Here, when the second housing 11c is mounted on the first housing 11b, first, the optical block 11c thereof is installed.
1 is inserted into the open end of the first housing 11b, and then, for example, a pair of joint holes 11c formed at both ends thereof.
2, 11c2 (only one shown in the figure) is fitted to a pair of joining pins 11b1 and 11b1 (only one shown in the figure) projecting outward from the opening end of the first housing 11b. As a result, the integrated optical head body 11 is formed.

A plate body 15 is removably provided on the side of the second housing 11c to which the heat dissipation plate 14 is attached. Although described in detail later, the plate body 15 is provided with a semiconductor laser element 17, a flexible printed wiring board 16 and a semiconductor laser element 17,
The optical element structure formed by the signal detector 18, the photodetector 19 and the like is thermally bonded. Here, this plate 15 is
As shown in FIG. 11, for example, a pair of joint holes 15a, 15a formed at both ends of the pair of joint pins 11 projecting outward from corresponding opening ends of the second housing 11c.
By fitting with c3 and 11c3, it is integrated with the second housing 11c. And this plate 1
On the outer side of 5, a heat radiating plate 14 formed by bending a plate made of a heat conductive material such as aluminum into a substantially L shape is attached by, for example, a heat conductive adhesive.

At this time, the optical head main body 11 has focus actuator coils 12a and 12b, and a pair of tracking actuators, respectively, on both side surfaces corresponding to the tracking direction (the direction indicated by arrow BB in the figure). Coils 13a, 13a and 13b, 1
3b and are attached. And this optical head body 1
In the state in which 1 is supported by the frame via a movable support (not shown), the focus actuator coils 12a, 12b and the tracking actuator coils 13a, 13b are placed in the magnetic path formed by the magnets attached to the frame. Will be intervened. A support portion of a support body (not shown) attached to the frame is fitted into a fitting hole 11d formed in the upper and lower parts (only the upper part is shown in FIGS. 9 to 11) of the optical head body 11. The optical head body 11 itself is supported.

Next, FIG. 12 shows a specific structure of the plate member 15. The plate 15 is made of a material having a high thermal conductivity such as an aluminum material, and the semiconductor laser element 17, the signal detector 18, the photodetector 19 and the like are thermally joined to the substantially central portion thereof. In addition, the flexible printed wiring board 16
Is attached to the surface of the plate body 15 to which the semiconductor laser element 17 and the like are joined by a heat conductive adhesive such as solder.
Then, the semiconductor laser element 17, the signal detector 18, the photodetector 19 and the like are directly attached to the plate body 15 through the cutout portion 16a which is formed by cutting out the flexible printed wiring board 16. In addition, each wiring of the semiconductor laser element 17, the signal detector 18, and the photodetector 19 is connected to a bonding wire provided on the flexible printed wiring board 16,
They are glued so that they correspond to each other.

Then, as shown in FIG. 13, the laser beam C emitted from the semiconductor laser element 17 advances in a direction parallel to the signal recording surface of the optical disc, that is, a direction indicated by an arrow D1 in the figure, and reaches the optical block 11c1. After passing through the attached hologram element 20, which is an optical system component, the reflecting mirror 2
It is reflected by 1 at a right angle, that is, in the direction indicated by arrow E1 in the figure, and is irradiated onto the optical disk through the objective lens 11a. Further, the laser beam C applied to the optical disc strikes the signal recording surface of the optical disc, is reflected, and follows the path opposite to the above, and is received by the signal detector 18 by the hologram element 20. The photodetector 19 detects the amount of backward light emitted from the semiconductor laser element 17, outputs an electric signal corresponding to the amount of emitted light to a light emission amount control device (not shown), and outputs it to the semiconductor laser element 17. It controls the current. Therefore, the emission intensity of the laser light C and the backward light emitted from the semiconductor laser device 17 is kept constant.

On the other hand, the semiconductor laser element 17 and the signal detector 18 are attached to a fixing member 22 joined to the plate body 15, as shown in FIG. In addition, the photodetector 19
Are directly attached to the plate body 15. The semiconductor laser element 17 has a light emitting point 17a such that the light emitting point 17a is located at a distance F from the center point 18a of the signal detector 18.
The positioning is adjusted along a line 18b connecting the center point 18a with the center point 18a. Here, the semiconductor laser element 17, the signal detector 18, the photodetector 19, and the fixing member 22 are referred to as an optical element structure.

Here, as shown in FIG. 15, the plate body 15 to which the semiconductor laser element 17 and the like are bonded is, as shown in FIG. 15, the light emitting point 17a of the semiconductor laser element 17 and the center point 18 of the signal detector 18.
The line 18b connecting the line a and the central axis of the hologram element 20 shown by the arrow YY in the drawing are fitted in parallel with each other in the opening side of the second casing 11c. The hologram element 20 has an arrow X- in the figure such that its center coincides with the light emitting point 17a of the semiconductor laser element 17.
X direction, arrow Y-Y direction, arrow θ in the figure
The alignment is adjusted in the direction indicated by, and thereafter the second housing 1
It is adhered to the optical block 11c1 of 1c. At this time,
The alignment adjustment of the hologram element 20 is performed by the optical microscope 2
This is done by using 3.

However, in the conventional semiconductor laser device as described above, when the optical microscope 23 is used, the position of the hologram element 20 largely shifts with respect to a slight movement, and thus the positioning adjustment / bonding work is troublesome. However, there is a problem that work efficiency is low.

[0014]

As described above, in the conventional semiconductor laser device, when the alignment is performed so that the light emitting point of the semiconductor laser element and the center of the hologram element coincide with each other, a slight amount of the hologram element Since the position is largely displaced with respect to the movement, there is a disadvantage that positioning adjustment / adhesion work takes time and work efficiency deteriorates.
An object of the present invention is to provide a semiconductor laser device capable of accurately adjusting a mounting position of an optical system component with respect to a semiconductor laser element with a simple structure.

[0015]

In a semiconductor laser device according to the present invention, an optical element structure having a semiconductor laser element and a light receiving element integrally is built in an optical block for supporting an optical system component, thereby providing a semiconductor It is intended for a semiconductor laser device that irradiates a laser beam generated from a laser element onto an optical disc through an optical system component and guides reflected light from the optical disc to a light receiving element by the optical system component.

A support mechanism portion for supporting the optical system component so as to be movable in a predetermined direction with respect to the optical block and an engaging portion formed at a side end of the optical system component or a part thereof. By combining them, a moving mechanism portion for moving the optical system component is provided so that a line or mark representing the axis of the optical system component and the center line formed by the optical element structure are aligned.

According to this structure, the optical system component is moved in the predetermined direction by the moving mechanism section without adjusting the position of the optical system component by the hand of the maker. Therefore, the center line of the optical system component is moved. However, the position of the optical system component can be adjusted in a predetermined direction so that it coincides with the center line formed by the optical element assembly.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an embodiment of the present invention. In FIG. 1, the same parts as those in FIG. That is, on the upper surface of the optical block 11c1 of the second housing 11c,
A frame 31 formed in a substantially C shape is attached.
A substantially circular hologram element 32 is fitted on the inner peripheral surface of the frame 31. The hologram element 32 is fitted in the frame 31 so that its peripheral surface is rotatably engaged with the inner peripheral surface of the frame 31. Further, on the peripheral surface of the hologram element 32, a toothed portion 32a having, for example, a substantially sawtooth shape is formed in a part thereof.

On the upper surface of the optical block 11c1, a substantially cylindrical jig 3 is provided in the vicinity of the meshing portion 32a of the hologram element 32.
3 extends upward in the drawing. This jig 33 has
A gear 33a having a shape substantially the same as that of the meshing portion 32a of the hologram element 32 is fitted to one end of the optical block 11c1.

The gear 33a is meshed with the meshing portion 32a of the hologram element 32. Then, the hologram element 32 is rotated counterclockwise or clockwise in the figure by rotating the jig 33 clockwise or counterclockwise in the figure. Therefore, the center line 32b of the hologram element 32 is located at the light emitting point 1 of the semiconductor laser element 17.
7a and the center point 18a of the signal detector 18 are adjusted to coincide with a line 18b. After that, the peripheral surface of the hologram element 32 is attached to the inner peripheral surface of the frame 31 by UV solidification.

The jig 33 may be rotated by the hand of the maker, or may be rotated by connecting to the automatic control device. On the other hand, the jig 33 is rotatably fitted in a fitting hole 34 provided near the opening side of the frame 31, as shown in FIG.
That is, by providing the fitting hole 34 on the upper surface of the optical block 11c1, accurate fine adjustment of the hologram element 32 becomes possible.

Further, the hologram element 32 has a structure shown in FIG.
As shown in FIG. 2, two lattices 32c1 and 32c2 separated by a center line 32b are formed in the approximate center thereof. These gratings 32c1 and 32c2 transmit the laser light C generated from the semiconductor laser element 17 and guide it to the signal recording surface of the optical disc, and the laser light C reflected by hitting the signal recording surface of the optical disc is detected by the signal detector 18 described above. It leads to. And these lattices 32c
1, 32c2, that is, on the coaxial circumference of the hologram element 32, four marks 35, 35, 35, 35
Are arranged so as to correspond to the directions indicated by arrows X1-X2 and Y1-Y2 in the figure. These marks 35, 35, 3
5, 35 are arranged on the extension of the center line 32b and along the alternate long and short dash line in the figure.

Therefore, in the hologram element 32,
It is possible to adjust the alignment in the direction indicated by the arrow Y1-Y2 in the figure corresponding to the center line 32b, and also possible to adjust the alignment in the direction indicated by the arrow X1-X2 in the figure.

Further, the meshing portion 32a of the hologram element 32 is formed.
In FIG. 4, it may be formed into a shape as shown in FIGS. Here, in FIG. 4A, the meshing portion 32a of the hologram element 32 is one in which concave portions and convex portions are continuously formed in a predetermined arrangement. Then, the meshing portion 3 of the hologram element 32 in the case of FIG.
2a is similar to the shape in FIG. 1 and has a relatively large number of teeth. Further, the meshing portion 32a of the hologram element 32 in the case of FIG. 4C is formed to have a substantially concave shape. Alternatively, the meshing portion 32a of the hologram element 32 may be formed in a substantially convex shape.

Therefore, according to the above-mentioned embodiment, the hologram element 32 is rotated by the jig 33 without adjusting the position of the hologram element 32 by the hand of the manufacturer, so that the center line of the hologram element 32 is rotated. 32b is a light emitting point 17a of the semiconductor laser device 17
And a line 1 connecting the center point 18a of the signal detector 18 with
The position of the hologram element 32 can be adjusted so as to match 8b.

FIG. 5 shows a second embodiment of the present invention. In FIG. 5, reference numeral 41 in the figure is a frame formed in a substantially U-shape, and is attached to the upper surface of the optical block 11c1 of the second housing 11c. This frame 41
A hologram element 42 having a substantially quadrilateral shape is fitted to the inner peripheral surface of the. In this case, the frame 41 and the hologram element 42
The size is set so that the hologram element 42 can be moved in a predetermined direction with an interval.

In the hologram element 42, in a state of being fitted in the frame 41, a substantially sawtooth-shaped meshing portion 42a is formed at a part of the side end on the opening side of the frame 41. The gear 33a of the jig 33 is provided near the opening side of the frame 41. The gear 33a is meshed with the meshing portion 42a of the hologram element 42.
Then, the hologram element 42 is slid in the direction indicated by the arrow H1 or H2 in the figure by rotating the gear 33a clockwise or counterclockwise in the figure.
Therefore, the hologram element 42 has the center line 42
The position b is adjusted so as to eliminate a deviation in a predetermined direction (a direction indicated by H1 or H2 in the drawing) with respect to a line 18b connecting the light emitting point 17a of the semiconductor laser device 17 and the center point 18a of the signal detector 18. .

The center line 42b of the hologram element 42 is the light emitting point 17a of the semiconductor laser element 17.
And a line 1 connecting the center point 18a of the signal detector 18 with
It is prepositioned so as to be parallel to 8b.

Therefore, according to the second embodiment, the hologram element 42 is slid by rotating the gear 33a of the jig 33.
The center line 42b of the hologram element 42 is aligned with the line 18b connecting the light emitting point 17a of the semiconductor laser element 17 and the center point 18a of the signal detector 18, and the deviation in a predetermined direction from the line 18b is adjusted. .

FIG. 6 shows a third embodiment of the present invention. In FIG. 6A, a reference numeral 51 in the figure is a fixing portion formed in a substantially U shape, and is attached to the upper surface of the optical block 11c1 of the second housing 11c. This fixed part 5
1, an opening 51a is formed at the side end corresponding to the direction indicated by arrow Y2 in the figure. Further, a frame 52 formed in a substantially U-shape is fitted to the inner peripheral surface of the fixed portion 51. A support portion 54 that rotatably supports the substantially circular hologram element 53 is fitted to the inner peripheral surface of the frame 52. The fixed portion 51, the frame 52, and the support portion 54 are sized so that there is an interval for allowing the frame 52 and the support portion 54 to move in a predetermined direction.

As shown in FIG. 6B, the hologram element 53 is projected upward from the supporting portion 54 in the figure. Further, a substantially sawtooth-shaped meshing portion 53a is formed on a part of the peripheral surface of the hologram element 53. The support portion 54 that supports the hologram element 53 is the frame 5
In a state in which the frame 52 is fitted to the frame 2, a substantially sawtooth-shaped meshing portion 54a is integrally formed on a part of the side surface on the opening side of the frame 52. Further, the frame 52, in a state of being fitted to the fixed portion 51, integrally forms a substantially sawtooth-shaped meshing portion 52a on a part of the side surface of the fixed portion 51 on the opening 51a side.

On the other hand, fitting holes 56, 5 for fitting one end of a substantially cylindrical jig 55 near the opening of the fixed portion 51 and the frame 52 on the upper surface of the optical block 11c1.
7 have been established. This jig 55 has fitting holes 56, 5
7 has a sawtooth-shaped gear 55a on one end side.
Are formed.

FIG. 7 shows how the position of the hologram element 53 is adjusted in the above structure. That is,
When the jig 55 is attached to the fitting hole 56, first, as shown in FIG.
As shown in (a), the gear 55a is the hologram element 53.
Is engaged with the tooth engagement portion 53a of the. In this state, the gear 55
The bottom surface of a is in contact with the top surface of the support portion 54. Then, the jig 55 is rotated clockwise or counterclockwise in FIG. 6 to rotate the hologram element 53 counterclockwise or clockwise in FIG. 6, whereby the center line 53b of the hologram element 53 is rotated. Light emitting point 17a of the semiconductor laser device 17 and center point 1 of the signal detector 18
The position is adjusted so as to coincide with the line 18b connecting with 8a.

Next, when the jig 55 is attached to the fitting hole 57 which is deeper than the fitting hole 56, first, as shown in FIG. Is engaged with. When the jig 55 is rotated clockwise or counterclockwise in FIG. 6, the support portion 54 is slid in the direction indicated by the arrow Y1 or Y2 in FIG.
The position is adjusted in the axial direction.

The jig 55 is the optical block 1 described above.
When it is attached to the fitting hole 58 provided on the opening 51a side of the fixed portion 51 on 1c1, first, as shown in FIG. 7C, the gear 55a is engaged with the meshing portion 52a of the frame 52. It The jig 55 is rotated clockwise or counterclockwise in FIG.
Slide and move in the direction indicated by the middle arrow X2 or X1,
Position adjustment in the X-axis direction is performed.

Therefore, according to the third embodiment described above, the hologram element 53 and the supporting portion 5 are moved by the jig 55.
4 and the frame 52 are movable, the center line 53b of the hologram element 53 is aligned with the line 18b connecting the light emitting point 17a of the semiconductor laser element 17 and the center point 18a of the signal detector 18, and It is possible to adjust the position of the hologram element 53 in the X-axis direction and the Y-axis direction. In addition, in the third embodiment, as shown in FIG.
The two jigs 55, 5 are fitted in the fitting holes 57, 58 provided in the
5 may be fitted and rotated simultaneously to adjust the position of the hologram element 53.

FIG. 8 shows a fourth embodiment of the present invention. In FIG. 8, reference numeral 61 in the figure is a hologram element formed in a substantially circular shape, and its approximate center, that is, the grating 6
A through hole 62 is provided between 1a and the grid 61b. That is, according to the fourth embodiment, the laser light C generated from the semiconductor laser device 17 is passed through the through hole 62, so that the position of the light emitting point 17 a of the semiconductor laser device 17 and the position of the through hole 62. Since they are matched with each other, it is possible to further simplify the alignment.

[0038]

As described in detail above, according to the present invention,
It is possible to provide a semiconductor laser device capable of accurately adjusting the mounting position of the optical system component with respect to the semiconductor laser element with a simple configuration.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an embodiment of a semiconductor laser device according to the present invention.

FIG. 2 is a view for explaining a positional relationship between a frame and a fitting hole in the same embodiment.

FIG. 3 is an enlarged plan view showing the hologram element according to the same embodiment.

FIG. 4 is a view for explaining the type of shape of an interlocking portion of the hologram element according to the same embodiment.

FIG. 5 is a perspective view showing a second embodiment of the present invention.

FIG. 6 is a perspective view showing a third embodiment of the present invention.

FIG. 7 is a sectional view shown for explaining the details of position adjustment of the hologram element in the third embodiment.

FIG. 8 is a plan view showing a fourth embodiment of the present invention.

FIG. 9 is a perspective view showing an optical head device incorporating a conventional semiconductor laser device.

FIG. 10 is an exploded perspective view showing a specific configuration of an optical head device body incorporating the conventional device.

FIG. 11 is an exploded perspective view showing a specific configuration of an optical head device incorporating the same conventional device.

FIG. 12 is a plan view of the conventional device seen from directly above.

FIG. 13 is a diagram for explaining an optical path of an optical head device main body incorporating the same conventional device.

FIG. 14 is a perspective view showing details of an optical element structure in the conventional apparatus.

FIG. 15 is an exploded perspective view showing a specific configuration of the conventional device.

[Explanation of symbols]

 11c ... 2nd housing, 11c1 ... Optical block, 15 ... Plate, 17 ... Semiconductor laser element, 17a ... Emission point, 18 ... Signal detector, 18a ... Center point, 18b ... Line, 19 ... Photodetector, 31 ... Frame, 32 ... Hologram element, 32a ... Interlocking part, 32b ... Center line, 33 ... Jig, 33a ... Gear, 34 ... Fitting hole, 35 ... Mark, 41 ... Frame, 42 ... Hologram element, 42a ... Interlocking part, 51 ... Fixed part, 51a ... Opening part, 52 ... Frame, 52a ... Interlocking part, 53 ... Hologram element, 53a ... Interlocking part, 53b ... Center line, 54 ... Support part, 54a ... Interlocking part , 55 ... Jig, 55a ... Gear, 56 ... Fitting hole, 57 ... Fitting hole, 58 ... Fitting hole, 61 ... Hologram element, 62 ... Through hole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Hideaki Karahara, Inventor Hideaki Karahara, 3-3-9, Shimbashi, Minato-ku, Tokyo, Toshiba Abu E Co., Ltd. (72) Mineharu Uchiyama Shinsugita, Isogo-ku, Yokohama, Kanagawa Prefecture 8th Town, Toshiba Corporation Multimedia Technology Laboratory

Claims (7)

[Claims] 1. An optical block for supporting an optical system component,
By incorporating an optical element structure integrally having a semiconductor laser element and a light receiving element, laser light generated from the semiconductor laser element is applied to the optical disc through the optical system component, and reflected light from this optical disc. In a semiconductor laser device for guiding the optical system component to the light receiving element by the optical system component, a support mechanism section for supporting the optical system component so as to be movable in a predetermined direction with respect to the optical block, and a side of the optical system component. By engaging with an engaging portion formed at an end or a part thereof, the line or mark representing the axis of the optical system component and the center line formed by the optical element assembly are aligned with each other And a moving mechanism section for moving the semiconductor laser device. 2. The semiconductor laser according to claim 1, wherein the engaging portion formed at the side end of the optical system component or a part thereof has one of a tooth shape, a concave portion, and a convex portion. apparatus. 3. The support mechanism portion is a frame that engages with and supports the inner periphery of the optical system component so as to be rotatable with respect to the optical block, and is formed on the optical block. The semiconductor laser device according to claim 1, wherein: 4. The support mechanism portion is a frame that engages with and supports the inner periphery of the optical system component so as to be slidable in a predetermined direction with respect to the optical block. The semiconductor laser device according to claim 1, wherein the semiconductor laser device is formed on a block. 5. The support mechanism portion supports the optical system component by being engaged with an inner periphery of the optical component so as to be rotatable, and at a part of an outer peripheral side surface of the movement mechanism portion. A first frame having an engaging portion for supporting the first frame, the first frame being engaged with and supported by the inner periphery of the first frame so as to be slidable in the first direction, and A second frame having an engaging portion for engaging with the moving mechanism portion, and formed on the optical block so that the second frame is slidable in a second direction. The semiconductor laser device according to claim 1, further comprising a third frame that is supported by being engaged with an inner circumference thereof. 6. In the moving mechanism section, a positioning hole or a recess for determining a jig position for moving the optical system component in a predetermined direction is formed on the optical block provided with the optical system component. Claim 1 characterized by the above.
13. The semiconductor laser device according to claim 1. 7. A through hole is formed between the gratings of the optical system component so that a laser beam is passed therethrough so as to be substantially at the same position as the light emitting point of the semiconductor laser device. The semiconductor laser device according to claim 1.