JPH09148225A - Wafer holder and apparatus for micromachining - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer holder for facilitating micromachining and a micromachining system such as an exposure device. SOLUTION: A wafer holder 3A comprises a plurality of wafer carriages 12 in the same plane, a wafer support 12a protruding on the periphery of each wafer carriage, and a suction hole 12b in the center of the wafer support 12a to secure the wafer 2. The wafer carriage 12 is moved to the periphery by a drive 13 to subject the wafer to a treatment such as expansion.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a substrate holder and a fine processing apparatus using the same.

[0002]

2. Description of the Related Art In semiconductor integrated circuit devices, higher integration and fine processing have been promoted, and accordingly, fine processing of wiring and the like using an exposure apparatus is required.

By the way, the inventor of the present invention has examined a manufacturing technique of a semiconductor integrated circuit device which requires fine processing. The following is a technique studied by the present inventors, and the outline is as follows.

That is, in a manufacturing process of a semiconductor integrated circuit device, a manufacturing process of manufacturing a plurality of semiconductor elements on a wafer-shaped semiconductor substrate and an insulating film such as an interlayer insulating film having a wiring layer and a through hole are formed on the semiconductor substrate. A photolithography technique using an exposure apparatus is used in the manufacturing process for manufacturing.

The exposure apparatus sets a wafer, which is a substrate to be exposed, on a wafer holder and transfers the pattern of a photomask onto a photoresist film provided on the surface of the wafer.

In the above-described wafer holder of the exposure apparatus, the contact portion with the wafer to be exposed is a smooth surface, and a hole or groove connected to the vacuum apparatus is provided in a part of the contact surface. Alternatively, the wafer placed on the surface of the wafer is fixed to the wafer holder by vacuum suction through the groove.

As a document describing the exposure apparatus, for example, November 20, 1987, "Electronic Materials" published by the Industrial Research Society, November 1987, supplementary volume, p78.
~ P83.

[0008]

However, according to the wafer holder in the above-mentioned exposure apparatus, when particles adhere to the back surface of the wafer which is the substrate to be exposed,
Since the rough flatness of the surface of the wafer is disturbed, the depth of focus at the time of exposure is deviated at that portion, which causes a problem that the transferred pattern has a dimensional defect or a poor resolution.

Further, according to the wafer holder in the exposure apparatus, when the wafer, which is the substrate to be exposed, is warped in a convex shape or a concave shape, when the state where the wafer is attracted to the wafer holder is observed from above, the wafer shrinks. Since it is fixed to the wafer holder in this state, it is difficult to accurately transfer the pattern on the photomask to the photoresist film formed on the surface of the wafer.

Therefore, it is difficult to perform fine processing when a fine processed body such as a semiconductor integrated circuit device is manufactured by the photolithography technique using the above-mentioned exposure apparatus.

An object of the present invention is to provide a substrate holder which can be easily microfabricated.

Another object of the present invention is to provide a microfabrication apparatus such as an exposure apparatus using a substrate holder which facilitates microfabrication.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the substrate holder of the present invention has a plurality of substrate moving bodies arranged on the same plane, a substrate mounting portion having a shape projecting from the outer periphery thereof, and a substrate at the central portion of the substrate mounting portion. A substrate fixing mechanism for fixing is provided, and the substrate moving body can perform processing such as moving the substrate moving body in the outer peripheral direction to extend the substrate in response to a request for increasing the flatness of the substrate.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, components having the same function are denoted by the same reference numerals, and redundant description will be omitted.

(Embodiment 1) FIG. 1 is a schematic side view showing an exposure apparatus which is an embodiment of the present invention, and FIG. 2 is a schematic plan view showing a wafer holder which is an embodiment of the present invention.
FIG. 3 is a schematic enlarged sectional view showing this wafer holder.

As shown in FIG. 1, the exposure apparatus 1 of the present embodiment is a reduction projection exposure apparatus having a reduction rate of, for example, 1/5, and a wafer 2 to be exposed is set on the wafer. The holder 3 is incorporated in the XY stage 4.

Further, it is a mask mounting table on which the condenser lens 6 and the photomask 7 are aligned and set on the optical path connecting the wafer holder 3 and the light source 5.
A Y stage 8 and an imaging optical system 9 are arranged. The condenser lens 6 converts the light 10 emitted from the light source 5 into parallel light and irradiates the photomask 7 with the parallel light.

The exposure apparatus 1 according to the present embodiment also controls the wafer holder 3, the XY stage 4, the XY stage 8 on which the photomask is set, and the like.
1 is provided.

As shown in FIGS. 2 and 3, the wafer holder 3 of the present embodiment is provided with a wafer mounting portion 12a around the wafer moving body 12, and has a hole in the central portion of the wafer mounting portion 12a. 12b is arranged.

The wafer moving body 12 is provided with a recess 12c inside the wafer moving body 12 by arranging the wafer mounting portion 12a in a protruding state around the wafer moving body 12.

Therefore, even if particles adhere to the back surface of the wafer 2 which is the substrate to be exposed, the flatness of the front surface of the wafer 2 is not disturbed by the recess 12c inside the wafer moving body 12. As a result, it is possible to prevent a problem that the transferred pattern has a dimensional defect or a poor resolution due to the deviation of the focal depth during exposure due to the particles attached to the back surface of the wafer 2. You can

The hole 12b is a hole through which the wafer 2, which is the substrate to be exposed, can be vacuum-sucked, and is connected to a vacuum device (not shown).

In this case, the vacuum suction of the wafer 2 is performed, but a wafer fixing mechanism for fixing various wafers 2 such as electrostatic suction may be used.

At the center of the wafer moving body 12, there is provided a driving body 13 capable of widening or narrowing the wafer moving body 12 in the direction of the outer peripheral portion thereof.

The drive unit 13 is controlled by the drive unit control unit 14.
It can be moved vertically.

The drive body 13 can be moved in the vertical direction by the input data of the drive body control unit 14, and the wafer mover 12 can be moved in the outer peripheral direction by the drive body 13. Therefore, the wafer mover is moved. It is possible to adjust the separation distance of the opposing regions of the wafer mounting portion 12 a provided on the outer periphery of 12.

The driving body 13 can move each wafer moving body 12 evenly. By arranging a driving body such as a piezo element on each wafer moving body 12,
It is possible to adopt a mode in which each fixed body 12 is independently moved by using a driving body connected to each wafer moving body 12.

Further, the wafer moving body 12 fixes the wafer 2 which is the substrate to be exposed by the four wafer moving bodies 12. However, as another mode of the wafer moving body, there are 5, 8, or 16 wafer moving bodies. And a plurality of wafer moving bodies can be independently driven.

As shown in FIG. 3, the entire shape of the wafer 2 which is the substrate to be exposed set in the wafer holder 3 of this embodiment is convexly warped.

When the pattern of the photomask is transferred onto the wafer 2 in this state, the state where the wafer 2 is attracted to the wafer holder 3 is observed from above, and the wafer 2 is fixed to the wafer holder 3 in a contracted state. As a result, the pattern on the photomask 7 cannot be accurately transferred to the photoresist film formed on the surface of the wafer.

Therefore, in the exposure apparatus 1 using the wafer holder 3, as shown in FIG.
By moving the driving body 13 in the upward direction according to the input data of 4, it is possible to move the wafer moving body 12 so that the wafer moving body 12 expands in the outer peripheral direction thereof. Can be pulled in any direction.

As a result, the entire shape of the wafer 2 can be made linear and the wafer 2 having a flat surface can be obtained.

In this case, the data for expanding the wafer 2 which is the substrate to be exposed is etched into the measured value of the rough flatness of the surface of the wafer 2 or the photoresist film formed on the surface of the wafer 2. It can be determined by a combination of measured values of the existing patterns.

Therefore, by controlling the wafer fixing portion 12 by the input data to which the data is added, the wafer 2 can be expanded and the rough flatness of the wafer 2 can be set to a predetermined value.

Further, the rough flatness of the wafer 2 is measured by
This can be carried out by irradiating the reference surface and the surface of the wafer 2 with the laser beam spread in a planar shape and measuring their interference fringes that can be formed.

Further, the rough flatness of the wafer 2 is measured by
This can be performed by scanning the laser light or the wafer 2 in a state where the laser light is in the form of a sheet beam.

Further, the rough flatness of the wafer 2 is measured by
It can be performed by irradiating the wafer 2 with one or several laser beams from an oblique direction and by observing the position of the reflected light. In this case, the laser beam or the wafer 2
Can be scanned or stepped.

The distance between the patterns of the etched patterns of the wafer 2 which is the stretched substrate to be exposed is measured by using the position measuring device of the exposure device 1 so that the exposure device arranged on the wafer 2 is exposed. This can be done by measuring the alignment mark coordinates of 1 and the coordinate system of the XY stage 4 in which the wafer 2 and the wafer holder 3 are incorporated.
In this case, the XY stage 4 is equipped with a laser interferometer.

Further, the measurement of the inter-pattern distance of the etched pattern of the wafer 2 which is the stretched substrate to be exposed is performed by measuring the inter-pattern distance between the mask pattern in the photomask 7 and the inter-pattern distance transferred to the surface of the wafer 2. The difference can be measured by the control unit 11.

According to the exposure apparatus 1 having the wafer holder 3 described above, the measurement result or measurement of the expansion / contraction state of the wafer 2 or the positional relationship between the pattern transferred to the wafer 2 and the mask pattern of the photomask 7 is performed. While controlling the wafer holder 3, the wafer 2 can be adjusted to a predetermined state.

In the exposure apparatus 1 having the wafer holder 3 described above, the wafer holder 3 has the driving body control unit 14
By moving the driving body 13 in the upward direction according to the input data of, the wafer moving body 12 can be moved by the driving body 13 so as to expand in the outer peripheral direction thereof.
The wafer 2 can be pulled in the outer peripheral direction of the wafer moving body 13.

As a result, even if the overall shape of the wafer 2 set on the wafer holder 3 is convexly warped, the overall shape of the wafer 2 can be made linear and the wafer 2 having a flat surface. It can be in the state of.

Therefore, since the pattern on the photomask 7 can be transferred to the photoresist film formed on the surface of the wafer 2 while the wafer 2 is linear and the surface of the wafer 2 is flattened, a fine pattern can be obtained. Can be transferred with high precision.

In the exposure apparatus 1 using the wafer holder 3 described above, the wafer moving body 12 in the wafer holder 3 is in the state of projecting to the periphery thereof.
Are arranged, the inside of the wafer moving body 12 has a recess 12c.

Therefore, the concave portion 12c inside the wafer moving body 12 can prevent the flatness of the front surface of the wafer 2 from being disturbed even if particles adhere to the back surface of the wafer 2 which is the substrate to be exposed.

As a result, due to the particles adhering to the back surface of the wafer 2, the depth of focus at the time of exposure is deviated due to the structure of the wafer holder as in the conventional case. It is possible to prevent a defect that an image defect occurs.

In the exposure apparatus 1 having the wafer holder 3 described above, the wafer holder 3 is built in the XY stage 4, but as a wafer holder that can set the photomask on the XY stage 8 for operating the photomask 7. It is possible to adopt a mode of use or a mode in which a wafer holder is incorporated in either or both of the XY stage 4 and the XY stage 8.

According to the exposure apparatus 1 having the wafer holder 3 described above, it is possible to achieve a photolithography technique for forming a fine pattern with high precision and capable of fine processing, so that various semiconductor integrated circuit devices which are fine processed bodies can be obtained. The present invention can be applied to various kinds and various manufacturing processes or a manufacturing technology of a microfabricated body such as a display element such as a liquid crystal element or a printed circuit board, and the microfabrication can be easily performed with high precision.

(Second Embodiment) FIG. 5 is a schematic enlarged cross-sectional view showing a part of a wafer holder according to another embodiment of the present invention.

In the wafer holder 15 of this embodiment, the surface of the wafer mounting portion 12a of the wafer holder 3 of the above-described first embodiment has a different shape, and the other regions are the same as those of the above-described embodiment. The wafer holder 3 has the same configuration as the wafer holder 3.

As shown in FIG. 5, the wafer mounting portion 12a of the wafer holder 15 of this embodiment is the wafer 2
The protrusion 12d is provided so that it can intervene in the hole 2a and the groove 2b provided in the.

In the exposure apparatus using the wafer holder 15 of the present embodiment, the drive body 13 is moved upward by the input data of the drive body control section 14, so that the wafer mover 12 is moved by the drive body 13. Since the wafer 2 can be moved so as to widen in the outer peripheral direction, the wafer 2 can be pulled in the outer peripheral direction of the wafer moving body 13.

As a result, the entire shape of the wafer 2 can be made linear and the wafer 2 having a flat surface can be obtained.

In this case, the wafer mounting portion 12a of the wafer holder 15 has a hole 2a and a groove 2b for the wafer 2.
Since the convex portion 12d intervening in the wafer is provided, when the wafer 2 is extended by the wafer moving body 12,
The movement of the wafer 2 corresponding to the change of the wafer moving body 12 can be reliably performed.

The wafer mounting portion 12a of the wafer holder 15 shown in FIG. 5 is provided with the convex portion 12d, but it may be provided with various forms such as pins and the like and the hole of the wafer 2 may be provided. By changing the shapes of the grooves 12a and the grooves 2b and providing the wafer 2 with convex portions,
Corresponding concave portions such as grooves may be provided in the wafer mounting portion 12a.

Further, the wafer mounting portion 12a of the wafer holder 15 may have a mode in which a fine concavo-convex portion is formed on the surface by roughening treatment or the like.

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the invention. It goes without saying that it can be changed.

For example, by incorporating the wafer holder of the present invention into a microfabrication device such as an ion implantation device, a focused ion beam device or an electron beam drawing device, a microfabricated body can be formed with high precision.

[0061]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). In the exposure apparatus having the substrate holder of the present invention, the substrate holder is moved by the driver in the upward direction according to the input data from the driver control unit so that the driver moves the substrate moving body in the outer peripheral direction. Therefore, the substrate can be pulled in the outer peripheral direction of the substrate moving body.

As a result, even when the overall shape of the substrate set in the substrate holder is convexly warped, the overall shape of the substrate can be made linear and the substrate has a flat surface. be able to.

Therefore, since the pattern on the photomask can be transferred to the photoresist film formed on the surface of the substrate while the substrate is linear and the surface is flattened, a fine pattern can be formed with high accuracy. Can be transferred to.

(2). In the exposure apparatus using the substrate holder of the present invention, the substrate moving body in the substrate holder is
By disposing the substrate mounting portion in a protruding state around the periphery thereof, the inside of the substrate moving body has a concave portion.

Therefore, the concave portion inside the substrate moving body can prevent the flatness of the front surface of the substrate from being disturbed even if particles adhere to the rear surface of the substrate which is the substrate to be exposed.

As a result, due to the particles adhering to the back surface of the substrate, the depth of focus at the time of exposure is deviated due to the structure of the substrate holder as in the conventional case, so that the transferred pattern has dimensional defects or resolution. It is possible to prevent a defect that a defect occurs.

(3). According to the exposure apparatus having the substrate holder of the present invention, it is possible to control the substrate holder while performing the measurement result or the measurement of the expansion / contraction state of the substrate or the positional relationship between the pattern transferred to the substrate and the mask pattern of the photomask. Thus, the substrate can be adjusted to a predetermined state.

(4). According to the exposure apparatus having the substrate holder of the present invention, since it is possible to achieve a photolithography technique for forming a fine pattern with high precision and capable of fine processing, various types and various types of semiconductor integrated circuit devices which are fine processed bodies can be obtained. By applying it to a manufacturing process or a manufacturing technology of a display element such as a liquid crystal element or a fine processed body such as a printed circuit board, the fine processing can be performed with high accuracy and easily.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing an exposure apparatus using a substrate holder according to an embodiment of the present invention.

FIG. 2 is a schematic plan view showing a substrate holder according to an embodiment of the present invention.

FIG. 3 is a schematic enlarged sectional view showing a substrate holder according to an embodiment of the present invention.

FIG. 4 is a schematic enlarged sectional view showing a substrate holder according to an embodiment of the present invention.

FIG. 5 is a schematic enlarged cross-sectional view showing a part of a substrate holder according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 exposure apparatus 2 wafer 2a hole 2b groove 3 wafer holder 4 XY stage 5 light source 6 condenser lens 7 photomask 8 XY stage 9 image forming optical system 10 light 11 control unit 12 wafer moving body 12a wafer mounting unit 12b hole 12c recess 12d Convex part 13 Driving body 14 Driving body control part 15 Wafer holder

Claims (9)

[Claims] 1. A plurality of substrate moving bodies arranged on the same plane, a substrate mounting portion having a shape protruding to an outer peripheral portion of the substrate moving body, and a substrate fixed to a central portion of the substrate mounting portion. A substrate holder, comprising: a substrate fixing mechanism, wherein the substrate moving body is configured to be movable in an outer peripheral direction thereof. 2. The substrate holder according to claim 1, wherein
A substrate holder comprising a driving body for moving the substrate moving body in an outer peripheral direction at a central portion of the plurality of substrate moving bodies. 3. The substrate holder according to claim 1, wherein
The substrate holder, wherein each of the plurality of substrate moving bodies includes a driving body for independently moving each of the substrate moving bodies in an outer peripheral direction thereof. 4. The substrate holder according to claim 1, wherein the substrate fixing mechanism is connected to a hole provided in a central portion of the substrate mounting portion and the hole. A substrate holder, wherein the substrate is fixed to the substrate mounting portion by adsorbing the substrate with a vacuum device. 5. The substrate holder according to claim 1, wherein a convex portion, a concave portion, or a concave-convex portion is provided on a part of a surface of the substrate mounting portion. holder. 6. A microfabrication apparatus, comprising: the substrate holder according to claim 1; and a processing unit that processes a microfabricated body set on the substrate holder. . 7. The microfabrication device according to claim 6,
A microfabrication apparatus comprising: an XY stage incorporating the substrate holder, an XY stage serving as a mask mounting table for a photomask, and an imaging optical system in an exposure apparatus. 8. The microfabrication device according to claim 7,
Two substrate holders are provided, the first substrate holder is incorporated in an XY stage arranged below the imaging optical system in the exposure apparatus, and the second substrate holder is connected in the exposure apparatus. A microfabrication device, which is incorporated in an XY stage which is a mask mounting table disposed above an image optical system. 9. The microfabrication device according to claim 7,
An XY stage that is arranged below the imaging optical system in the exposure apparatus or an XY that is a mask mounting table arranged above the imaging optical system in the exposure apparatus.
A microfabrication apparatus, wherein the substrate holder is incorporated in any of the XY stages of the stages.