JPH09142857A - Apparatus for holding metallic mold - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus for holding a metallic mold capable of transferring the operation to the next step in an ultrashort time. SOLUTION: This apparatus for holding a metallic mold 1 comprises a ring 2 having a tapered part (2a) for locating the metallic mold 1, a sleeve 3 brought into contact with the tapered part (2a) of the ring 2 and center aligning the ring 2 with the metallic mold 1, a vertically movable metallic mold presser 22 capable of fixing the metallic mold 1, a vertically movable ring presser 21 capable of fixing the ring 2 and a heating means for the metallic mold 1 and the ring 2. The metallic mold 1 is fitted into the inner side of the ring 2 and both the metallic mold 1 and the ring 2 are set in the ring presser 21, which is then lifted with a driving device 17 to bring the tapered part (2a) into contact with a tapered part (3a). The ring 2 is located in a metallic mold supporting unit 4. The metallic mold presser 22 is subsequently lifted with a driving device 18 to fix the metallic mold 1 to the metallic mold supporting unit 4. The metallic mold 1 and the ring 2 are heated with a heater 5 so that the clearance between the metallic mold 1 and the ring 2 may be zero or shrink fitted by a difference in thermal expansion. Thereby, the metallic mold 1 is automatically aligned.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold holding device in a glass forming device.

[0002]

2. Description of the Related Art Conventionally, the following inventions have been disclosed as a mold holding device. For example, Japanese Patent Laid-Open No. 6-1448
In the mold holding device described in Japanese Patent Publication No. 51, the mold is fitted inside the mold support by utilizing the difference in the coefficient of thermal expansion, and is fixed by the mold retainer.

[0003]

However, as disclosed in Japanese Patent Laid-Open No. 6-144851, the mold is made of a material whose thermal expansion coefficient is larger than that of the mold support. At room temperature, there is a clearance between the outside diameter of the mold and the inside diameter of the mold support, and when heating, the above clearance becomes zero or interference fit. Since the inner diameter of the mold support is set, it is necessary to cool the mold to a temperature at which a clearance that allows the mold to be taken out from the mold support is generated in the mold replacement work after the molding process. As a result, the heated mold is cooled to a temperature at which the mold can be taken out, the mold is replaced, and then the newly held mold is heated.Therefore, it takes time to replace the mold. However, it is difficult to cope with the production of various small quantities.

The present invention has been made in view of the above-mentioned problems of the prior art, and it is an object of the present invention to provide a mold holding device which can improve the above-mentioned work contents and can move to the next production process in a very short time. To aim.

[0005]

Means for Solving the Problems In order to solve the above problems, the present invention is configured as follows. According to the invention of claim 1, in a mold holding device for fixing a mold to a mold support by fitting and pressing, a ring provided with a taper part for positioning the mold, and a taper part of the ring. A sleeve provided with a tapered portion that abuts and centers the mold, a vertically movable mold pressing mechanism that fixes the mold, a ring vertically movable pressing mechanism that fixes the ring, and a mold and a ring. A heating means was provided. Claim 2
According to the invention of claim 1, in the structure of claim 1, the ring retainer is composed of the suction means.

Next, the operation of the mold holding device of the present invention will be described. In the die holding device according to claim 1 of the present invention, the taper portion of the ring for holding the die is brought into contact with and fixed to the taper portion of the sleeve arranged outside the die support body by the ring retainer. Align the centerline of the ring with the centerline of the mold support. The die is held by the die support by the die pressing. When the mold and ring are heated by the heating means in this state and heated to a predetermined temperature, the clearance between the outer diameter of the mold and the inner diameter of the ring is set to zero or interference fit. The mold is centered automatically. In the die holding device according to the second aspect, the taper portion of the ring and the taper portion of the sleeve are suction-contacted by the suction means. At this time, it is possible to detect the state of suction contact by the vacuum gauge provided in the suction means, and determine whether the center line of the ring matches the center line of the mold support. The other actions are similar to those of the first aspect.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a mold holding device according to the present invention will be described below in detail with reference to the drawings. [First Embodiment of the Invention] A first embodiment of the present invention will be described with reference to FIGS. 1 is a sectional front view showing a part of a mold holding device according to a first embodiment of the present invention, FIG. 2 is a sectional view showing a state in which a ring is set in the mold, and FIG. 3 is a ring between the mold and the ring. It is sectional drawing which shows the state set to the presser.

The mold 1 is fitted to the inner surface of the ring 2,
The die retainer 22 abuts and fixes the tip of the die support 4. The mold retainer 22 is connected to the drive device 18 via the connecting members 19 and 16 and is vertically movable. Further, the mold support 4 has a base end portion on the heat insulating material 10,
Is held by the heat insulating material holder 9 and the heat insulating material holder 9 is fitted and held by the base plate 11, respectively. The space between the mold support holder 8 and the base plate 11 arranged on the base end side of the mold support 4 is The base end portion of the mold support 4, the heat insulating material 10, and the heat insulating material holder 9 are clamped and fixed via the pressing rod 12, the disc spring 23, and the nut 24.

The outer surface of the ring 2 has an inclination angle θ.
It is formed in a taper shape (hereinafter referred to as a taper portion 2a) having a large diameter in the lower part having (in the present embodiment, 50 °). The ring 2 is held by a ring retainer 21, and the ring retainer 21 is connected to a drive device 17 via connecting members 20 and 15 and is vertically movable.

Above the ring 2, a sleeve 3 fitted to the outer surface of the mold support 4 is arranged. At the tip of the sleeve 3, a taper portion 3a having the same inclination angle θ as the taper portion 2a of the ring 2 is formed with a large diameter on the lower side. The ring 2 can be positioned by abutting the tapered portions 2a, 3a.

The drive unit 17 is an air cylinder 17a.
And a sensor 17b. The air cylinder 17a is fixed via a spacer 14 to a fixing base 13 fixed to the base plate 11 with a cylinder rod directed downward, and the connecting member 15 is fixed to the tip of the cylinder rod. Further, two sensors 17b are fixed to the air cylinder 17a at intervals in the vertical direction, and can detect whether the position of the air cylinder rod is near the upper end and the lower end. As a result, when the air cylinder 17a is driven in the vertical direction in the figure, the ring retainer 21 also moves in the vertical direction via the connecting members 15 and 20. Further, the drive device 18 has the same structure as the drive device 17, and the air cylinder 1
8a and sensor 18b, and air cylinder 1
8a is the fixed base 13 with the cylinder rod facing upward.
Have been. The connecting member 1 is attached to the tip of the cylinder rod.
6 is fixed, and when the air cylinder 18a is driven in the vertical direction in the figure, the die holder 22 is also interlocked with the connecting members 16 and 19 to move in the vertical direction.

A heater 5 is arranged on the outer circumference of the sleeve 3. The heater 5 is covered with a heater lid 6 and a heater lid 7 so that heat of the heater 5 and oxides and the like generated from the heater 5 are not exposed to the outside. This heater lid 7
Is fixed to the die support holder 8.

The material of the mold 1 is set to be larger than the thermal expansion coefficient of the material of the ring 2. In the present embodiment, the material of the mold 1 is cemented carbide (coefficient of thermal expansion 7 × 10 ⁻⁶ /
), The material of the ring 2, the sleeve 3 and the mold support 4 is oxynitride of silicon and aluminum (coefficient of thermal expansion 3 × 10 ⁻⁶ /
° C).

Next, the operation of the mold holding device having the above structure will be described. First, as shown in FIG. 2, the inner diameter portion of the ring 2 is inserted into the die 1, and the die 1 is set on the ring retainer 21 as shown in FIG. 3 using a dedicated die exchange jig such as tweezers. To do. Then, by moving the air cylinder 17a to raise the ring retainer 21, the ring 2 is held with the tapered portion 2a in contact with the tapered portion 3a of the sleeve 3. As a result, the ring 2 is positioned by the sleeve 3, and the center line of the ring 2 is located in the mold support 4
Will be aligned with the centerline of.

Next, by moving the air cylinder 18a and raising the die pressing member 22, the die 1 is held in contact with the die supporting member 4. The mold 1 is the heater 5
When heated to a predetermined temperature by, the clearance between the outer diameter of the mold 1 and the inner diameter of the ring 2 is set to zero or interference fit, so that the mold 1 is automatically centered. .

After molding a predetermined number of products with the mold 1 held in the above state, the air cylinder 18a is operated and the mold retainer 22 is lowered. Next, the air cylinder 17a is operated to lower the ring retainer 21. At this time,
The mold 1 is removed from the mold support 4 while being held by the ring retainer 21 together with the ring 2. Then, the die 1 together with the ring 2 is taken out from the ring retainer 21 by using a dedicated die exchange jig such as tweezers. And
When the ring 2 and the mold 1 are gradually cooled outside the molding chamber, the heat fitting is loosened and removed.

Next, the other mold 1 which is previously set on the other ring 2 and preheated in a preheating furnace (not shown) is held by the sleeve 3 and the mold support 4 in the same manner as the above-mentioned operation procedure. It At this time, since the mold support 4 and the like are not cooled and the mold 1 and the ring 2 are preheated in advance, it takes almost no time to heat the mold 1 to a predetermined value.

During heating, the members holding the mold 1 and the ring 2 extend in the vertical direction in the figure, but the air cylinder 18
By giving a margin to the stroke of a and 17a,
The mold 1 and the ring 2 are always held by a constant force regardless of the extension of the holding member. Further, when the force of releasing the molded product (for example, glass) from the mold 1 is abnormally large, and the releasing force becomes larger than the holding force of the air cylinders 18a and 17a, the cylinder rods of the air cylinders 18a and 17a will be damaged. It operates and the sensors 18b and 17b are turned off. As a result, the operation of the molding machine can be stopped, so that an accident such as damage to the mold 1 can be prevented.

As described above, the first embodiment of the present invention
According to the mold holding device described above, the mold 1 can be easily attached and detached by moving the air cylinders 18a and 17a and moving the mold presser 22 and the ring presser 21 up and down in any case. As a result, without cooling the mold 1,
Moreover, the preheated die can be attached and detached, and the time required for die exchange can be greatly reduced.

[Second Embodiment of the Invention] A second embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a partially sectional front view showing a mold holding device according to a second embodiment of the present invention, FIG. 5 is a sectional view showing a state in which a ring is set on the mold, and FIG. 6 is a mold pressing tool. It is sectional drawing which shows the state set to. In the mold holding device according to the second embodiment of the present invention,
The ring retainer provided in the first embodiment of the present invention, the ring retainer drive device, and members related thereto are not provided, and the configuration is as follows.

A sleeve 3 inserted and fixed in a die holder 4
An annular passage 31 is provided in the inner diameter portion of the sleeve 3. In the annular passage 31, a plurality of branch holes 30 penetrating the lower tapered portion 3a of the sleeve 3 in the drawing are evenly arranged on the circumference. . A T-shaped passage 32 is provided inside the mold support 4. The lateral passage portion of the T-shaped passage 32 is formed at the same height as the annular passage 31 provided in the sleeve 3, and
The vertical passage portion of the T-shaped passage 32 is opened to the base end portion of the mold holding body 4 while being communicated with 1. Further, a center hole 33 is provided at the center of the heat insulating material holder 9 fitted and fixed to the base plate 11, and the T-shaped passage 32 is provided through the heat insulating material 10.
It is in communication with the vertical passage of the. A fitting 34 is provided in the center hole 33.
And a pipe 36 in which a vacuum gauge 35 is arranged is connected to a joint 34.
A vacuum generator (not shown) is connected to the pipe 36. Since other configurations are similar to those of the first embodiment of the present invention, the same members are designated by the same reference numerals and the description thereof is omitted.

Next, the operation of the mold holding device having the above structure will be described. First, the mold 1 (see FIG. 5) in which the ring 2 is inserted is set on the mold retainer 22 using a dedicated mold exchanging jig such as tweezers (see FIG. 6), and then is connected to the pipe 36 as illustrated. Not operating the vacuum generator to generate suction force on the taper portion 3a of the sleeve 3 while the air cylinder 1
8a is moved to raise the die presser 22, and the sleeve 3
The tapered portion 2a of the ring 2 is attracted and abutted to the tapered portion 3a of the sleeve 3 by the suction force generated in the tapered portion 3a. The vacuum gauge 35 can detect whether or not the suction contact between the taper portion 2a of the ring 2 and the taper portion 3a of the sleeve 3 is normal. Therefore, if an abnormality occurs, an operation error is caused by re-suction operation. It can be avoided. by this,
The centerline of the ring 2 will be aligned with the centerline of the mold support 4. When the die 1 is heated to a predetermined temperature by the heater 5, the clearance between the outer diameter of the die 1 and the inner diameter of the ring 2 is set to zero or interference fit, so that the die 1 automatically moves. Be centered. The other actions are similar to those of the first embodiment of the present invention.

As described above, the second embodiment of the present invention
According to the mold holding device described above, the same effect as that of the first embodiment of the present invention can be obtained. Further, in the second embodiment of the present invention, the vacuum gauge 3 capable of detecting whether or not the suction contact between the tapered portion 2a of the ring 2 and the tapered portion 3a of the sleeve 3 is normal.
Since 5 is provided, it is possible to avoid eccentricity of the mold 1 due to an operation error.

[0024]

As described above, according to the mold holding device of the present invention, the following effects can be obtained. Claim 1
According to the invention, the die can be easily attached and detached by moving the die retainer and the ring retainer up and down by the drive device in any case. As a result, the temperature of the mold can be removed without cooling, and it can be easily held with the preheated mold, so that the time required for mold replacement can be greatly shortened. According to the second aspect of the present invention, it is possible to determine whether the center line of the ring matches the center line of the mold support, and it is possible to avoid an eccentric state of the mold. Other effects are the same as those of the first aspect.

[Brief description of the drawings]

FIG. 1 is a partially sectional front view showing a mold holding device according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state where a ring is set in a mold.

FIG. 3 is a cross-sectional view showing a state in which a mold and a ring are set on a ring retainer.

FIG. 4 is a partially sectional front view showing a mold holding device according to a second embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a state where a ring is set in a mold.

FIG. 6 is a cross-sectional view showing a state in which the mold is set on the mold retainer.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mold 2 Ring 2a Tapered part 3 Sleeve 3a Tapered part 4 Mold support 21 Ring retainer 22 Mold retainer 17, 18 Drive device 30 Branch hole 31 Annular passage 32 T-shaped passage 33 Center hole 34 Joint 35 Vacuum gauge 36 Piping

Claims (2)

[Claims] 1. A mold holding device for fixing a mold to a mold support by fitting and pressing, a ring provided with a tapered portion for positioning the mold, and centering by abutting the tapered portion of the ring. A sleeve provided with a tapered portion, a vertically movable mold pressing mechanism that fixes the mold, a vertically movable ring pressing mechanism that fixes the ring, and a heating means for the mold and the ring. A mold holding device characterized by the above. 2. The mold holding device according to claim 1, wherein the ring retainer comprises a suction means.