JPH09121084A - Electrode structure for terminal of substrate - Google Patents
Electrode structure for terminal of substrateInfo
- Publication number
- JPH09121084A JPH09121084A JP7275870A JP27587095A JPH09121084A JP H09121084 A JPH09121084 A JP H09121084A JP 7275870 A JP7275870 A JP 7275870A JP 27587095 A JP27587095 A JP 27587095A JP H09121084 A JPH09121084 A JP H09121084A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- hole
- terminal
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、基板の端子用電極
構造に関し、特に、端子電極を介して電子回路等に入ろ
うとする静電気を外部へ逃がすための新規な改良に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal electrode structure for a substrate, and more particularly to a novel improvement for discharging static electricity that enters the electronic circuit or the like via the terminal electrode to the outside.
【０００２】[0002]
【従来の技術】従来、用いられていたこの種の基板の端
子用電極構造においては、基板の信号間やグランドとの
間にバリスタ又はパワーツェナーダイオードを接続する
ことにより、外部（例えば、パチンコ台の玉発射装置の
ように人間の手や玉）からの静電気が基板のコネクタの
端子を経て電子回路に入ることを防止するようにしてい
た。2. Description of the Related Art In this type of substrate terminal electrode structure that has been conventionally used, an external (for example, pachinko machine stand) is connected by connecting a varistor or a power Zener diode between the signals of the substrate and the ground. Like the ball launcher, human hands and balls) were designed to prevent static electricity from entering the electronic circuit through the terminals of the connector on the board.
【０００３】[0003]
【発明が解決しようとする課題】従来の基板の端子用電
極構造は、以上のように構成されていたため、次のよう
な課題が存在していた。すなわち、静電気がコネクタの
端子から基板のＩＣ等に入り込むことは、バリスタやパ
ワーツェナーダイオードだけでは十分に防ぎ切れず、基
板内部のトランジスタ、ＩＣ、抵抗、コンデンサ等の電
子部品を劣化させ、やがては破損に至らせることになっ
ていた。Since the conventional terminal electrode structure for a substrate is configured as described above, the following problems exist. That is, static electricity cannot be sufficiently prevented from entering the IC or the like of the board from the terminals of the connector by the varistor or the power Zener diode alone, and deteriorates electronic parts such as transistors, ICs, resistors and capacitors in the board, and eventually It was supposed to be damaged.
【０００４】本発明は、以上のような課題を解決するた
めになされたもので、特に、端子電極を介して電子回路
等に入ろうとする静電気を外部へ逃がすようにした基板
の端子用電極構造を提供することを目的とする。The present invention has been made in order to solve the above problems, and in particular, the terminal electrode structure of the substrate is designed to let the static electricity that tries to enter the electronic circuit or the like through the terminal electrode escape to the outside. The purpose is to provide.
【０００５】[0005]
【課題を解決するための手段】本発明による基板の端子
用電極構造は、基板に形成された端子用電極を介して信
号の入出力を行うようにした基板の端子用電極構造にお
いて、前記端子用電極の周囲に輪状に形成されたハンダ
レジスト部と、前記ハンダレジスト部の周囲に輪状に形
成され接地されたアース電極と、を備え、前記端子用電
極に存在する静電気を前記アース電極を介して逃がすよ
うにした構成である。A terminal electrode structure for a substrate according to the present invention is a terminal electrode structure for a substrate, wherein a signal is input and output through a terminal electrode formed on the substrate. A solder resist portion formed in a ring shape around the electrode for electrodes, and a ground electrode formed in a ring shape around the solder resist portion and grounded, and static electricity existing in the electrode for the terminal is passed through the ground electrode. This is a configuration that allows it to escape.
【０００６】さらに詳細には、前記端子用電極の中心に
は前記基板に形成された貫通孔が設けられている構成で
ある。More specifically, the through-hole formed in the substrate is provided at the center of the terminal electrode.
【０００７】さらに詳細には、前記貫通孔にはコネクタ
のメイル端子が挿入される構成である。従って、外部か
ら端子用電極に入ってきた静電気は、アース電極に飛ん
でアースに逃げるため、全ての静電気を確実に除去する
ことができる。More specifically, the mail terminal of the connector is inserted into the through hole. Therefore, the static electricity that has entered the terminal electrode from the outside escapes to the ground electrode and escapes to the ground, so that all the static electricity can be reliably removed.
【０００８】[0008]
【発明の実施の形態】以下、図面と共に本発明による基
板の端子用電極構造の好適な実施の形態について詳細に
説明する。図１において符号１で示されるものは、プリ
ント基板からなる基板であり、この基板１には周知のス
ルーホール処理によって形成された貫通孔２が形成さ
れ、この貫通孔２の周囲にはハンダによる端子用電極３
が形成されている。この端子用電極３の周囲には輪状に
形成されたハンダレジスト部４が形成されており、この
ハンダレジスト部４の周囲には輪状に形成されたハンダ
によるアース電極５が設けられている。このアース電極
５はアース６に接地されており、前記端子用電極３を囲
むように形成されている。従って、この基板１には周知
のコネクタの受体（図示せず）が設けられ、この貫通孔
２内に挿入された周知のコネクタのメイル端子（図示せ
ず）はこの端子用電極３と導通する。このメイル端子が
外部に接続され前記受体にＩＣ等の電子部品（図示せ
ず）が接続されている場合、外部から入ってきた静電気
はアース電極５を介してアース６に逃げ、基板１の電子
部品には入り込むことはなく、電子部品の劣化や損傷を
避けることができる。なお、この端子用電極３には貫通
孔２が形成された場合について述べたが、貫通孔２に限
ることなく、例えば、ピン等の突起物を貫通孔２の代わ
りに用いることもできる。なお、実験の結果、ハンダレ
ジスト部４の幅は約０.５ミリ、アース電極５の幅も約
０.５ミリで静電気を逃がすことができた。BEST MODE FOR CARRYING OUT THE INVENTION Preferred embodiments of a terminal electrode structure for a substrate according to the present invention will be described in detail below with reference to the drawings. A reference numeral 1 in FIG. 1 is a substrate made of a printed circuit board. A through hole 2 formed by a well-known through hole process is formed in the substrate 1, and solder is provided around the through hole 2. Terminal electrode 3
Are formed. A ring-shaped solder resist portion 4 is formed around the terminal electrode 3, and a ring-shaped solder ground electrode 5 is provided around the solder resist portion 4. The ground electrode 5 is grounded to the ground 6, and is formed so as to surround the terminal electrode 3. Therefore, a well-known connector receiving body (not shown) is provided on the substrate 1, and a well-known connector mail terminal (not shown) inserted into the through hole 2 is electrically connected to the terminal electrode 3. To do. When this mail terminal is connected to the outside and an electronic component (not shown) such as an IC is connected to the receiving body, the static electricity that has entered from the outside escapes to the ground 6 via the ground electrode 5, and the It does not get into the electronic parts, and it is possible to avoid deterioration or damage to the electronic parts. Although the case where the through hole 2 is formed in the terminal electrode 3 has been described, the projection is not limited to the through hole 2, and a projection such as a pin may be used instead of the through hole 2. As a result of the experiment, the width of the solder resist portion 4 was about 0.5 mm and the width of the ground electrode 5 was about 0.5 mm, and static electricity was able to escape.
【０００９】[0009]
【発明の効果】本発明による基板の端子用電極構造は、
以上のように構成されているため、次のような効果を得
ることができる。すなわち、基板の端子用電極の周囲に
ハンダレジスト部を介して設けられたアース電極によ
り、静電気を逃がし、基板の電子部品等には静電気が入
ることを防止し、電子部品の早期劣化及び損傷を防ぎ、
例えば、モータの駆動回路及び各種制御回路の損傷を防
止することができる。The electrode structure for the terminal of the substrate according to the present invention is
With the above configuration, the following effects can be obtained. In other words, the ground electrode provided around the terminal electrode on the board via the solder resist section releases static electricity, prevents static electricity from entering the electronic parts of the board, and prevents early deterioration and damage of the electronic parts. Prevent
For example, damage to the motor drive circuit and various control circuits can be prevented.
【図１】本発明による基板の端子用電極を示す構成図で
ある。FIG. 1 is a configuration diagram showing a terminal electrode of a substrate according to the present invention.
１ 基板 ２ 貫通孔 ３ 端子用電極 ４ ハンダレジスト部 ５ アース電極 1 Substrate 2 Through Hole 3 Terminal Electrode 4 Solder Resist 5 Ground Electrode
Claims (3)
して信号の入出力を行うようにした基板(1)の端子用電
極構造において、前記端子用電極(3)の周囲に輪状に形
成されたハンダレジスト部(4)と、前記ハンダレジスト
部(4)の周囲に輪状に形成され接地されたアース電極(5)
と、を備え、前記端子用電極(3)に存在する静電気を前
記アース電極(5)を介して逃がすように構成したことを
特徴とする基板の端子用電極構造。1. A terminal electrode structure of a substrate (1), wherein a signal is input and output through a terminal electrode (3) formed on the substrate (1), the terminal electrode (3) A ring-shaped solder resist part (4) around the periphery, and a ground electrode (5) grounded around the solder resist part (4) and grounded.
And a structure for discharging static electricity existing in the terminal electrode (3) through the ground electrode (5).
(1)に形成された貫通孔(2)が設けられていることを特徴
とする請求項１記載の基板の端子用電極構造。2. The substrate at the center of the terminal electrode (3)
2. The terminal electrode structure for a substrate according to claim 1, wherein the through hole (2) formed in (1) is provided.
子が挿入される構成よりなることを特徴とする請求項２
記載の基板の端子用電極構造。3. A structure in which a mail terminal of a connector is inserted into the through hole (2).
The electrode structure for a terminal of the described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7275870A JPH09121084A (en) | 1995-10-24 | 1995-10-24 | Electrode structure for terminal of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7275870A JPH09121084A (en) | 1995-10-24 | 1995-10-24 | Electrode structure for terminal of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09121084A true JPH09121084A (en) | 1997-05-06 |
Family
ID=17561589
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7275870A Pending JPH09121084A (en) | 1995-10-24 | 1995-10-24 | Electrode structure for terminal of substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09121084A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106954338A (en) * | 2017-05-05 | 2017-07-14 | 恒鸿达科技有限公司 | A kind of mainboard anti-jamming circuit |
-
1995
- 1995-10-24 JP JP7275870A patent/JPH09121084A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106954338A (en) * | 2017-05-05 | 2017-07-14 | 恒鸿达科技有限公司 | A kind of mainboard anti-jamming circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20051027 |
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| A131 | Notification of reasons for refusal |
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