JPH09116053A - Integrated circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To miniaturize a shape of an entire as for a terminal arrangement direction of an integrated circuit in an integrated circuit device mounted an integrated circuit wherein a terminal is arranged parallel to a pair of opposite side surfaces of, for example, a TV camera, is mounted. SOLUTION: When an integrated circuit 12 is held, a plate-like member 13 is formed so that it is bent at one edge face of the integrated circuit 12 from a rear of the integrated circuit 12 and thereafter it is extended and folded to an outside of a terminal of the integrated circuit 12. The folded part is fixed to a holding member 11 and is pressed to the holding member 11 from a rear of the integrated circuit 12 by the plate-like member 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit device, and when applied to, for example, a television camera and holding an integrated circuit such as a solid-state image pickup device, the back surface of the integrated circuit is bent at one end surface of the integrated circuit. After that, a plate-shaped member is formed so as to be folded back to the outside of the terminal of the integrated circuit, the folded-back portion is fixed to the holding member, and the plate-shaped member presses the holding member from the back surface of the integrated circuit. , Miniaturize the overall shape in the terminal arrangement direction of the integrated circuit.

[0002]

2. Description of the Related Art Conventionally, in an optical device such as a television camera, not only is a light-receiving element such as a solid-state image sensor connected to an internal signal processing circuit, but also these light-receiving elements are positioned and held with respect to an optical system. It is designed to do.

For example, FIGS. 5 and 6 are a front view and a side view of a CCD solid-state image pickup device which is a light receiving device of this type.
The CCD solid-state imaging device 1 is formed by housing an imaging device chip in a dual in-run type package and sealing the front surface of this package with a transparent member such as glass.
The CCD solid-state image pickup device 1 is formed such that both ends thereof are extended in the arrangement direction of the terminals, and mounting holes 2a and 2b are formed at the centers of the extended portions.

Further, in the CCD solid-state image pickup device 1, positioning holes 3a and 3b are formed at positions deviated from the mounting holes 2a and 2b, and the positioning holes 3a are formed.
The semiconductor chips are positioned and stored with reference to 3 and 3b. As a result, when the CCD solid-state imaging device 1 is held in the optical system, it is positioned with respect to the optical system by the positioning holes 3a and 3b, and then screwed using the mounting holes 2a and 2b.
It can be easily and surely held.

On the other hand, FIGS. 7 and 8 show another CCD.
2A and 2B are a front view and a side view of the solid-state image pickup device. In the CCD solid-state image pickup device 5, the mounting holes 2a and 2b and the positioning holes 3a and 3b are omitted, and the length of the terminals in the arrangement direction is shortened accordingly. In addition to the above, the CCD solid-state imaging device 1 described above with reference to FIGS. 5 and 6 is formed.

This CCD solid-state image pickup device 5 is shown in FIG.
As shown in FIG. 3, at both ends where the terminals are not arranged, the both ends of the leaf springs 6a and 6b extending outward from the both ends are pressed by the leaf springs 6a and 6b being pressed against the mounting member 7 from the incident surface side. After being attached to the mounting member 7 by being screwed to the mounting member 7 with the screw 8, the mounting member 7 and the mounting member 7 are positioned and fixed to the optical system, and are thereby held by the optical system.

[0007]

By the way, this kind of CC
The D solid-state image sensor is formed by being housed in a dual in-run type package as shown in FIG. This CC
D For the general shape of a solid-state image sensor, the CCD described above
As shown in FIG. 11, in each case of the solid-state image pickup devices 1 and 5, the CCD solid-state image pickup device is screwed in the region B outside the terminals in the longitudinal direction of the CCD solid-state image pickup device. With this, when the CCD solid-state image pickup devices 1 and 5 are held in the optical system, there is a problem that the overall shape of the CCD solid-state image pickup devices 1 and 5 becomes large in the longitudinal direction.

As one method for solving this problem, C
A direction orthogonal to the longitudinal direction of the CD solid-state image pickup devices 1 and 5,
A method of screwing the CCD solid-state image sensor on the outside of the terminal (region C in FIG. 11) can be considered. However, since a wiring pattern connected to the terminals is assigned to this area C, it is difficult to secure a screwing area, and if a leaf spring or the like is used, the terminals may be short-circuited. The area A is the back surface of the CCD solid-state image sensor.

The present invention has been made in view of the above points, and an object thereof is to propose an integrated circuit device which can be miniaturized in its overall shape in the direction in which terminals are continuous.

[0010]

In order to solve such a problem, the present invention is applied to an integrated circuit device in which an integrated circuit having terminals arranged in parallel is mounted on a pair of opposed side surfaces. In this integrated circuit device, the integrated circuit is held so as to face the specified holding member via the specified plate member. At this time, the plate-shaped member extends in the arrangement direction of the terminals on the back side of the surface of the integrated circuit facing the previous holding member, and then, on at least one end surface of the integrated circuit, on the holding member side or this holding member. Bends to the opposite side, and this bent portion extends in the direction orthogonal to the direction in which the terminals are arranged, and the extended tip bends so that the outside of the terminals is almost parallel to the back surface of the terminals. A fixing portion that extends in the direction of arranging the terminals and is fixed to the previous holding member is formed in the extended portion, and the integrated circuit is pressed against the holding member from the back surface side and held.

At this time, the fixing portion is made to be a screw hole.

Further, at this time, in the previous fixing portion, a part is bent toward the holding member side at an angle of approximately 90 degrees to form a projection, and in the previous holding member, a cylindrical projection or groove into which the projection is inserted is formed. The protrusion to be formed is formed.

Instead of this, a projection is formed on the plate-shaped member from the front surface on the back surface side toward the integrated circuit, and the projection presses the integrated circuit.

Further, instead of this, the plate-like member has a notch on one end face thereof that extends to the surface on the back face side, and the holding member has an adjusting jig corresponding to this notch. To have a positioning hole.

Alternatively, the above integrated circuit receives the incident light from the surface side facing the holding member, and the holding member has a through hole for guiding the incident light.

Further, instead of this, the above-mentioned holding member has a convex portion forming a positioning reference surface on the surface facing the integrated circuit, and the reference surface faces the holding member of the integrated circuit. Be in contact with the surface.

Further, at this time, the convex portion is arranged so as to face the protrusion for pressing the integrated circuit.

Further, the mounting member forms a cylindrical wall surface surrounding the through hole on the surface opposite to the surface facing the integrated circuit.

By these means, the integrated circuit is held by the specified holding member via the specified plate member, and this plate member is provided on the back surface of the integrated circuit.
Extends in the terminal arrangement direction and bends at the end surface, then extends in the direction orthogonal to the terminal arrangement direction and bends, extends outside the terminal, almost in the terminal arrangement direction of the integrated circuit, and in this extended portion, If the fixing portion for the holding member is formed, the fixing portion can be formed outside the terminal arrangement side surface of the integrated circuit. As a result, the integrated circuit can be pressed against the holding member and held by the plate member, and the size in the terminal arrangement direction can be reduced.

At this time, if the above-mentioned fixing portion is a screw hole, it can be fixed with a simple structure.

At this time, if a protrusion is formed by bending a part of the above-mentioned fixing portion and a cylindrical protrusion or the like into which the protrusion is inserted is formed in the holding member, it is preliminarily positioned when screwed. be able to.

Alternatively, a protrusion is formed on the previous plate-shaped member toward the integrated circuit from the surface on the back side, and by pressing the integrated circuit by this protrusion, even if the plate-shaped member bends It can be pressed, and by pressing at a position apart from the fixing portion by bending, it is possible to reliably press even with a small area of the protrusion.

Further, instead of this, the plate-like member has a notch on one end face thereof that extends to the rear surface side, and the former holding member has a positioning hole for the adjustment jig corresponding to the notch. With such a structure, the integrated circuit can be moved by an eccentric driver or the like and easily positioned.

Alternatively, if the preceding integrated circuit receives the incident light from the surface on the holding member side, and the holding member has a through hole for guiding the incident light, an image pickup device or the like can be provided. Can be applied to the integrated circuit device.

Further, instead of this, the holding member has a convex portion having a reference surface for positioning on the surface facing the integrated circuit, and the reference surface allows contact with the integrated circuit. For example, it is possible to perform the positioning by this reference plane.

Further, at this time, if the convex portion is arranged so as to face the projection for pressing the integrated circuit, the shearing force on the integrated circuit can be effectively avoided.

If the mounting member is formed with a cylindrical wall surface surrounding the through hole on the surface opposite to the integrated circuit, the optical axis can be aligned with this wall surface as a reference. it can.

[0028]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is an exploded perspective view showing an image pickup element assembly applied to an image pickup apparatus according to the first embodiment of the present invention. This image pickup device is formed by holding the image pickup element assembly 10 in an optical system and then connecting a wiring board.

This image pickup device assembly 10 includes a CCD solid state image pickup device 12 on the image pickup device holding surface of a positioning member 11.
After mounting, the leaf spring 13 is screwed to the positioning member 11 from the back surface of the CCD solid-state imaging device 12, and the CCD solid-state imaging device 12 is held by the positioning member 11.

That is, the positioning member 11 is formed by cutting aluminum die-cast and then painting it in black. The positioning member 11 is formed in a substantially rectangular plate shape and has a through hole 14 formed in the center. As a result, the positioning member 11 has the through hole 14
Light emitted from the optical system is guided to the CCD solid-state imaging device 12 via the. Therefore, the positioning member 11
The CCD solid-state image sensor 12 is held in the area indicated by the symbol AR1 with the through hole 14 as the center.

Further, the positioning member 11 has cylindrical projections 15a and 15 on both sides of the through hole 14 in the longitudinal direction in the area AR1 for holding the CCD solid-state image pickup device 12.
b is formed. The protrusions 15a and 15b are formed by cutting the upper end surface of the protrusions 15a and 15b. In the positioning member 11, as shown in FIG.
When the columnar projections 15a and 15b are held.
The upper end surface of the abuts on the light receiving surface of the CCD solid-state image sensor 12,
Thereby, the CCD solid-state image pickup device 12 can be positioned with respect to the positioning member 11 in the optical axis direction of the image pickup device assembly 10.

Further, the positioning member 11 is formed with a cylindrical projection 16 so as to surround the through hole 14 in the vicinity of the area AR1 for holding the CCD solid-state image pickup device 12.
When the CCD solid-state image pickup device 12 is held, the side faces of the projections 16 are in contact with the side faces of the CCD solid-state image pickup device 12 on which the terminals are arranged. As a result, the positioning member 11 positions the CCD solid-state image sensor 12 with the protrusion 16 in the direction orthogonal to the direction in which the terminals of the CCD solid-state image sensor 12 are arranged. The protrusion 16 is shown in FIG.
As shown in FIG. 3, the height is set to a specified value or less, so that the terminals are not short-circuited when the CCD solid-state imaging device 12 is mounted.

Further, the positioning member 11 is arranged in the vicinity of the area AR1 for holding the CCD solid-state image pickup device 12, and outside the projections 15a and 15b.
a and 17b are provided, and the projections 17a and 17b hold the CCD solid-state image pickup device 12 so that the CCD solid-state image pickup device 12 is not largely displaced in the longitudinal direction.

Further, the positioning member 11 has the area AR
A cylindrical protrusion 19 having a screw hole is formed outside the terminal of the CCD solid-state imaging device 12 described above with reference to FIG. 11 so as to surround the region 1, and in a region C. Adjacent to each protrusion 19,
Inside each protrusion 19, in the terminal arrangement direction of the CCD solid-state image sensor 12, a cylindrical protrusion 20 having substantially the same shape as the protrusion 19.
Are formed. Thereby, the positioning member 11 is formed so that the leaf spring 13 can be screwed by the protrusion 19 while the leaf spring 13 is positioned by the inner protrusion 20.

Here, the leaf spring 13 is formed by processing a plate-shaped member to form a rectangular central portion, and both short sides of this rectangular shape are bent toward the positioning member at an angle of approximately 90 degrees. It is formed so that it extends in both the extending direction and both sides. Further, the leaf spring 13 is bent at the upper end side at an angle of about 90 degrees at the tip spreading on both sides of this short side, extends substantially parallel to the rectangular region of the central portion, and is screwed to this extended portion. Through hole 23 is formed, and the tip of the extended portion is bent toward the positioning member at an angle of 90 degrees to form a projection 24. As a result, the leaf spring 13 is projected onto the positioning member 11 by the screw 25 through the through hole 23.
The CCD solid-state imaging device 12 is screwed to the positioning member 11 and is pressed and held by the positioning member 11 from the back surface side.

That is, in the leaf spring 13, the rectangular region in the central portion is arranged so as to face the back surface of the CCD solid-state image sensor 12, and the short side direction is formed sufficiently shorter than the CCD solid-state image sensor 12. Is formed so that the terminals of the CCD solid-state image sensor 12 are not short-circuited. In addition, this rectangular area has a CCD in the longitudinal direction.
The solid-state image pickup device 12 is formed to be longer than the corresponding length in the corresponding direction, and even if the CCD solid-state image pickup device 12 moves between the above-mentioned protrusions 17a and 17b, the movement is not limited.

Further, as shown in the cross section of FIG. 3, a projection 26 is formed in the rectangular area toward the CCD solid-state image sensor 12, and the projection 26 presses the back surface of the CCD solid-state image sensor 12. . As a result, the leaf spring 1
3 is the CCD solid-state image sensor 12 without fail even if the whole is bent.
You can press. Furthermore, this protrusion 26
Are formed at positions corresponding to the convex portions 15a and 15b of the positioning member 11, respectively, so that when the CCD solid-state imaging device 12 is pressed, shearing force is not applied to the CCD solid-state imaging device 12.

Further, the projection 26 is formed on an imaginary line connecting the through holes 24, whereby the CCD solid-state image pickup device 2 is formed.
When the plate spring 6 is pressed and screwed by the screw 25, a rotational force is not generated in the leaf spring 13 as indicated by an arrow a, so that the leaf spring 13 can be easily attached. There is.

On the other hand, the protrusions 24 of the leaf spring 13 are formed so as to correspond to the protrusions 20 adjacent to the protrusions 19, respectively, and are inserted into the protrusions 20 when the leaf spring 13 is screwed to the positioning member 11. The leaf spring 13 is prevented from being displaced. Thereby, the leaf spring 13 can be easily and surely mounted.

Thus, in the leaf spring 13 which holds the CCD solid-state image pickup device 12 from the back side in this way, CC
D is bent and extended along the short side of the solid-state imaging device 12,
Since the CCD solid-state image sensor 12 is screwed on the outside of the terminal, the image sensor assembly 10 has
The size of the CCD solid-state image pickup device 12 in the longitudinal direction can be made smaller than the conventional size, and the size of the entire image pickup apparatus can be made smaller accordingly.

Further, as described above, the CCD solid-state image pickup device 12
By bending and extending along the shorter side of the CCD solid-state image pickup device 12 and screwing it outside the terminals of the CCD solid-state image pickup device 12, in the CCD solid-state image pickup device 12, due to the bending of the plate spring 13, the through hole 23 becomes a large fulcrum. It is held by the positioning member 11 with a pressing force. Therefore, even the protrusion 26 having a small cross-sectional area can be pressed with a large pressing force to reliably position and hold the projection.

Further, in the leaf spring 13, a rectangular region in the central portion and arcuate notches 2 at both ends are formed.
7 is formed, and this notch 27 extends to the side surface portion, and this side surface portion extends in the short side direction of the CCD solid-state image sensor 12,
It is formed so as to be separated on both sides. As a result, the leaf spring 13 is formed so as to bend also on this side surface,
This also presses the CCD solid-state image sensor 12 with a large pressing force.

The positioning member 11 is formed with through holes 30a and 30b corresponding to the notches 27, so that the tip of the eccentric driver 31 is inserted into the through hole 30a or 30b as shown in FIG. In this state, rotate the eccentric driver 31 as shown by the arrow A,
As shown in, the CCD solid-state image sensor 12 can be moved in the longitudinal direction. As a result, the image pickup device assembly 10 is formed so that the through holes 30a or 30b can be selectively used to easily adjust the positioning in the longitudinal direction of the CCD solid-state image pickup device 12.

On this image pickup element holding surface, the positioning member 11 has cylindrical projections 34 formed at both end edges in the direction orthogonal to the terminal arrangement direction of the CCD solid-state image pickup element 12, and wiring is performed using the projections 34. The substrate is fixed. That is, in the image pickup device assembly 10, the IC mounted on this wiring board from the holding surface side of the CCD solid-state image pickup device 12
It is formed so that the CCD solid-state imaging device 12 is inserted into the socket, the wiring board is pressed, and then the wiring board is screwed to the protrusions 34 to be assembled. As a result, the image pickup device assembly 10 is formed so that the wiring substrate can be connected and fixed easily and surely from the same surface side as the mounting surface side of the CCD solid-state image pickup device 12.

The positioning member 11 has an optical system holding surface formed on the back surface of the above-mentioned image pickup element holding surface, and is held by the optical system of this image pickup apparatus by this optical system holding surface. FIG.
FIG. 3 is an exploded perspective view showing a state in which the image pickup element assembly 10 is attached to an optical system, in which a positioning member 11 has a through hole 14;
A cylindrical wall surface 35 is formed along the optical axis, and the optical axis is positioned with respect to the optical system by the cylindrical wall surface 35.

That is, in this embodiment, the optical system has the holding member 36 on the end surface on the image pickup device assembly 10 side, and the through hole 38 is formed in the holding member 36 about the optical axis. Has been done. The cylindrical wall surface 35 of the positioning member 11 is formed by cutting so as to be inserted in close contact with the inner peripheral surface of the through hole 38, so that the wall surface 35 is formed in the through hole 38 in the imaging element assembly 10. The optical axis can be easily adjusted just by inserting it.

Further, the positioning member 11 has the through hole 1
4, convex portions 39a and 39b are formed at both end portions in a diagonal direction with 4 in between. This convex portion 39
a and 39b are convex portions 15a and 15a of the image sensor holding surface.
The image pickup element assembly 10 is formed by cutting so that the height of the end face becomes a prescribed height with respect to the upper end face of b.
When the is attached to the holding member 36, the end surface of the holding member 36 comes into contact with the prescribed reference surface of the holding member 36. As a result, the image pickup device assembly 10 can be easily positioned in the direction along the optical axis of the optical system.

The positioning member 11 has arcuate through grooves 40a and 40b formed in the convex portions 39a and 39b. The through grooves 40a and 40b are formed in an arc shape with the center of the through hole 14 as a reference and corresponding to the mounting screw holes 41a and 41b of the holding member 36.
As a result, the image sensor assembly 10 is formed so that it can be fixed to the optical system by a simple operation of inserting the screw 42 into the through hole 14 and screwing it into the mounting screw holes 41a and 41b. By loosening it, the tilt of the optical system can be adjusted.

Further, the positioning member 11 has a recess 44 formed in the optical system holding surface, and a screw hole 45 is formed in the recess 44.
Is formed. The concave portion 44 has an L-shaped connecting fitting 46.
In order to be able to position the connection fitting 46 when the is arranged, it is formed corresponding to the outer shape of the L-shaped connection fitting 46. On the other hand, the connection fitting 46 has a through hole 47, and is screwed into the screw hole 45 via the through hole 47 by the screw 48. Due to these, the positioning member 11 is configured so that the recessed portion 44 causes the connection fitting 4 to move.
After positioning 6, the connection fitting 4 can be easily
It is formed so that 6 can be fixed.

When the connection fitting 46 is fixed to the positioning member 11, a screw hole 50 is formed on the end surface which rises vertically from the optical system holding surface of the positioning member 11. As a result, in the image sensor assembly 10, the screw hole 50 can be used to easily finely adjust the tilt about the optical axis.

That is, the holding member 36 is cut out so as to avoid the connecting fitting 46, and the plate-like member 51 is provided on one side surface parallel to the vertically rising end surface of the connecting fitting 46.
Hold. The plate-shaped member 51 is fixed to this side surface by a screw 52, and in this state, the tip of the plate-shaped member 51 extends and projects from the one end surface, and a through hole 54 corresponding to the screw hole 50 is formed at the projecting tip. It is designed to be.
A screw 55 is inserted into the through hole 54, and the screw 55
The tip of the is screwed into the screw hole 50. Thereby, in the image sensor assembly 10, the screw 55 can be rotated to easily adjust the tilt.

In the above-described structure, the image pickup device assembly 10 (FIG. 1) has a central portion with the light receiving surface side of the CCD solid-state image pickup device 12 facing the positioning member 11 side from the image pickup device holding surface side of the positioning member 11. The CCD solid-state image pickup device 12 is mounted in the area AR1, so that the protrusion 16 surrounding the through hole 14 causes C in the direction orthogonal to the terminal arrangement direction.
The CD solid-state image sensor 12 is positioned. Further, with respect to the terminal arrangement direction, the CCD solid-state image pickup device 12 is roughly positioned by the protrusions 17a and 17b.

Subsequently, the image pickup device assembly 10 is
The protrusion 24 of the leaf spring 13 is inserted into the cylindrical protrusion 20 from the rear surface side of the CCD solid-state image sensor 12, and the leaf spring 1
3 is placed, and thereby the leaf spring 13 is positioned. Subsequently, in the image sensor assembly 10, the screw 25 is screwed into the protrusion 19 of the positioning member 11 through the through hole 23, and the protrusion 24 of the leaf spring 13 is inserted into the cylindrical protrusion 20 at this time. Since the protrusion 26 is formed on the straight line connecting the through holes 23, the leaf spring 13 is held so as not to be displaced even if the leaf spring 13 is bent, and thus the leaf spring 13 can be easily screwed.

By this screwing, the image pickup device assembly 10 can be assembled by a simple work by holding the CCD solid-state image pickup device 12 against the positioning member 11 by the plate spring 13. Further, at this time, the CCD solid-state image sensor 12 is pressed, and the light-receiving surface of the CCD solid-state image sensor 12 comes into contact with the reference surfaces of the convex portions 15a and 15b formed on the positioning member 11 so as to face each other. For, the CCD solid-state image sensor 12 is positioned.

Further, the leaf spring 13 presses the CCD solid-state image pickup device 12 through the projection 26 formed on the leaf spring 13 so as to correspond to the convex portions 15a and 15b, whereby the leaf spring 13 is bent and the CCD When the solid-state image sensor 12 is pressed, the CCD solid-state image sensor 12 can be surely pressed. Also, after bending and extending at both ends of the CCD solid-state image pickup device 12, a large pressing force can be generated by screwing the leaf spring 13 on the outside of the terminals of the CCD solid-state image pickup device 12. On the other hand, even if the projection 26 having a small pressing surface is used, it can be surely pressed and held with a large force. Further, since the protrusion 26 is arranged at a position corresponding to the convex portions 15a and 15b, it is possible to effectively avoid the shearing force on the CCD solid-state image sensor 12.

Furthermore, after bending the CCD solid-state image pickup device 12 at both ends to extend the plate spring 13, the plate spring 13 is screwed outside the terminals of the CCD solid-state image pickup device 12, whereby the CCD solid-state image pickup device 12 can be secured. The shape can be reduced in the terminal arrangement direction.

In this way, the image pickup device assembly 10
When completed, the image pickup device assembly 10 is connected to the optical system (FIG. 4). Here, in the image pickup device assembly 10, the positioning member 11 is used in the assembly process before the CCD solid-state image pickup device 12 is mounted.
The L-shaped connecting fitting 46 is previously arranged on the optical system holding surface.

That is, in the image pickup device assembly 10, after the connection fitting 46 is placed and positioned in the recess 44 formed in the optical system holding surface, it is screwed by the screw 48, so that the predetermined position can be easily and surely provided. Fixed to. On the other hand, in the optical system, in advance, in the holding member 36 that forms the end surface on the image pickup device assembly 10 side,
The plate member 51 is screwed and fixed to one side surface of the holding member 36.

In the image pickup device assembly 10, the cylindrical wall surface 35 formed at the center is inserted into the through hole 38 of the holding member 36, and the optical axis is thereby aligned. In this state, the image pickup device assembly 10 includes the positioning member 1
A screw 42 is inserted into the arc-shaped through-grooves 40a and 40b formed in No. 1, and the screw 42 is screwed into the screw holes 41a and 41b of the holding member 36 and attached to the holding member 36. Further, a screw 55 is inserted into the through hole 54 of the plate-shaped member 51, and the tip of the screw 55 is connected to the connection fitting 4
6 is screwed into the screw hole 50, and the assembling work with the optical system is completed.

As a result, in the subsequent assembly process of the image pickup device assembly 10 (FIG. 1), the wiring substrate is brought from the image pickup device holding surface side, and the CCD solid-state image pickup device 12 is inserted into the socket of the wiring substrate and pressed, The wiring board is screwed using the projections 34, and the assembly work with the wiring board is completed.

Subsequently, the image pickup device assembly 10 (FIG. 3) picks up the image of the prescribed test pattern in the adjusting step, and loosens the screw 42 screwed into the holding member 36 while monitoring the output of the wiring board. After that, the screw 55 is rotated, and thereby the inclination around the optical axis is finely adjusted with the cylindrical wall surface 35 as a reference. When this fine adjustment is completed, the loosened screw 42 is retightened and the image sensor assembly 10 is fixed to the optical system. At this time, in the convex portions 39a and 39b in which the through grooves 40a and 40b of the screw 42 are formed, the convex portion 39a
When the reference surfaces of a and 39b come into contact with the reference surface of the holding member 36, the CCD with respect to the optical system in the optical axis direction
The solid-state image sensor 12 is positioned and held.

Subsequently, the image pickup device assembly 10 (see FIG.
2), the eccentric driver 3 is provided in the through hole 30a or 30b.
When 1 is inserted and rotated, as shown by an arrow B, C in the terminal arrangement direction of the CCD solid-state imaging device 12
The mounting position of the CD solid-state imaging device 12 is finely adjusted, and a series of adjustment work is completed.

According to the above construction, the leaf spring 13 causes C
When the CD solid-state image sensor 12 is pressed and held, the leaf spring 13 is bent and extended at both ends of the CCD solid-state image sensor 12, and the leaf spring 13 is screwed outside the terminals of the CCD solid-state image sensor 12. As a result, the shape of the CCD solid-state image sensor 12 can be reduced in size in the terminal arrangement direction.

Further, the CCD solid-state image pickup device 12 can be pressed by a large pressing force to be held easily and surely. Further, even if the CCD solid-state imaging device 12 is pressed through the protrusion 26 of the leaf spring 13, it can be pressed by a large pressing force.

Further, through the protrusion 26 of the leaf spring 13, CC
By pressing the D solid-state image sensor 12, the leaf spring 13
Even if the plate bends, it can be pressed reliably.

By forming the reference surface corresponding to the projection 26 by the convex portions 15a and 15b, the CCD solid-state image pickup device 12 can be easily positioned and the shearing force can be effectively avoided.

Further, since the notch 27 is formed in the leaf spring 13 and the through holes 30a and 30b are formed, the position of the terminal arrangement direction can be easily adjusted by the eccentric driver.

Regarding the direction orthogonal to this direction,
By arranging the protrusion 16 so as to surround the through hole 14, the side surface of the protrusion 16 can be used for easy positioning.

Further, since the incident light from the optical system is guided through the through hole 14 and the cylindrical wall surface 35 is formed so as to surround the through hole 14, the optical axis is aligned with the wall surface 35 as a reference. You can

Furthermore, the work of attaching the CCD solid-state image pickup device 12, the work of attaching to the optical system, and the work of attaching the wiring board can be performed from the same surface side, whereby the work efficiency can be improved.

In the above embodiment, the case where the projection of the leaf spring 13 is inserted into the cylindrical projection 20 for positioning is described. However, the present invention is not limited to this, and the cylindrical projection 20 is used instead. Then, a cylindrical protrusion having a recess having a rectangular cross section in the center may be used, or a protrusion having a groove may be used.

Further, in the above-described embodiment, the case where the fixing portions for fixing to the positioning member 11 are formed at the four corners by screwing the four corners of the leaf spring 13 has been described, but the present invention is not limited to this. Alternatively, for example, the fixing portions may be formed by hooking a part of these four corners on a claw or the like rising from the positioning member 11.

Further, in the above-described embodiment, the case where the fixing portions are formed at the four corners of the leaf spring 13 has been described, but the present invention is not limited to this, and the fixing portions may be provided at two locations in the diagonal direction as necessary. It can be widely applied to the case of forming Also, in these cases, a portion of the rectangular area extending to the back surface of the integrated circuit is folded back only on one side,
The fixing portion may be formed, and the fixing portion may be omitted at the other end. Further, the leaf spring 13 may be divided and formed on the back surface of the integrated circuit having the shape shown in FIG.

Further, in the above-mentioned embodiment, the case where the leaf spring 13 is formed by bending the end face of the integrated circuit at an angle of approximately 90 degrees has been described. However, the present invention is not limited to this, and the back side can be formed. If there is a margin, it may be bent on the opposite side at an angle of about 90 degrees, and various angles can be selected within a practically sufficient range of this 90 degree angle.

In the above embodiment, the CCD
The case where the present invention is applied to an image pickup apparatus using a solid-state image pickup element has been described. However, the present invention is not limited to this, and an integrated circuit device that fixedly holds a line sensor and the like, and a parallel pair of side surfaces facing each other. The present invention can be widely applied to various integrated circuit devices that mount an integrated circuit in which terminals are arranged.

[0077]

As described above, according to the present invention, when the integrated circuit is pressed and held by the plate-shaped member, the terminal of the integrated circuit is bent after being bent at one end surface of the integrated circuit from the back surface of the integrated circuit. A plate-shaped member is formed so as to extend outward and be folded back, and the folded-back portion is fixed to a holding member,
By pressing the holding member from the back surface of the integrated circuit with the plate-shaped member, the overall shape can be reduced in the terminal arrangement direction of the integrated circuit with a simple configuration as a whole.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an image pickup device assembly according to a first embodiment of the present invention.

FIG. 2 is a side view of the image sensor assembly of FIG.

FIG. 3 is a sectional view showing a protrusion of the leaf spring of FIG.

FIG. 4 is an exploded perspective view showing a connection between the image pickup element assembly of FIG. 1 and an optical system.

FIG. 5 is a front view showing a conventional CCD solid-state imaging device.

FIG. 6 is a side view of the CCD solid-state image sensor of FIG.

FIG. 7 is a front view showing another conventional CCD solid-state imaging device.

8 is a side view of the CCD solid-state image sensor of FIG.

9 is an exploded perspective view showing a method of holding the CCD solid-state image sensor of FIG.

FIG. 10 is a perspective view showing a dual in-run type integrated circuit.

11 is a front view showing a peripheral region of the integrated circuit of FIG.

[Explanation of symbols]

1, 5, 12 C
CD solid-state image sensor 10 Image sensor assembly 11 Positioning member 13 Leaf spring 14, 23, 30, 38, 47, 54 Through hole 15a, 15b, 39a, 39b Convex portion 16, 17, 19, 20, 24, 26, 34 Projection 25, 42, 48, 52 screw 27 notch 35 wall surface 36 connection member 41a, 41b, 45, 50 screw hole 46 connection fitting

Claims (9)

[Claims] 1. An integrated circuit device in which an integrated circuit having terminals arranged in parallel on a pair of opposing side surfaces is mounted, and the integrated circuit is opposed to a prescribed holding member via a prescribed plate member. Holding, the plate-shaped member, on the back surface side of the surface facing the holding member of the integrated circuit, after extending in the arrangement direction of the terminals, at least one end surface of the integrated circuit, the holding member side or the Bending to the side opposite to the holding member, the bent portion extends in a direction orthogonal to the arrangement direction of the terminals, the extended tip bends, and the outer side of the terminals is substantially parallel to the back surface in parallel with the back surface. A fixing portion extending in the arrangement direction of the terminals of the circuit and fixed to the holding member is formed in the extended portion, and the integrated circuit is pressed against the holding member from the back surface side to hold the integrated circuit; Integrated circuit device according to claim. 2. The integrated circuit device according to claim 1, wherein the fixing portion is a screw hole. 3. The fixing portion has a protrusion formed by bending a part thereof toward the holding member at an angle of approximately 90 degrees, and the holding member has a cylindrical protrusion or groove into which the protrusion is inserted. The integrated circuit device according to claim 2, wherein a protrusion formed by the above is formed. 4. The integrated circuit according to claim 1, wherein the plate-shaped member is formed with a protrusion toward the integrated circuit from a surface on the back surface side, and the protrusion presses the integrated circuit. apparatus. 5. The plate-shaped member, at the one end surface,
The integrated circuit device according to claim 1, wherein the integrated circuit device has a notch extending to the surface on the back surface side, and the holding member has a positioning hole for an adjustment jig corresponding to the notch. 6. The integrated circuit according to claim 1, wherein the integrated circuit receives incident light from a surface side facing the holding member, and the holding member has a through hole for guiding the incident light. Integrated circuit device. 7. The holding member has a convex portion that forms a positioning reference surface on the surface facing the integrated circuit, and the holding surface of the integrated circuit faces the holding member on the reference surface. The integrated circuit device according to claim 1, wherein the integrated circuit device abuts. 8. The holding member has a convex portion that forms a positioning reference surface on a surface facing the integrated circuit, and the holding surface of the reference surface faces the holding member of the integrated circuit. The integrated circuit device according to claim 4, wherein the integrated circuit device is in contact with and the convex portion is arranged so as to face the protrusion. 9. The integrated device according to claim 6, wherein the mounting member has a cylindrical wall surface surrounding the through hole on a surface opposite to a surface facing the integrated circuit. Circuit device.