JPH09111203A - Heat-sensitive tacky material - Google Patents
Heat-sensitive tacky materialInfo
- Publication number
- JPH09111203A JPH09111203A JP7271086A JP27108695A JPH09111203A JP H09111203 A JPH09111203 A JP H09111203A JP 7271086 A JP7271086 A JP 7271086A JP 27108695 A JP27108695 A JP 27108695A JP H09111203 A JPH09111203 A JP H09111203A
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- layer
- pressure
- heat
- adhesive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F19/00—Advertising or display means not otherwise provided for
- G09F19/22—Advertising or display means on roads, walls or similar surfaces, e.g. illuminated
- G09F19/228—Ground signs, i.e. display signs fixed on the ground
Landscapes
- Business, Economics & Management (AREA)
- Accounting & Taxation (AREA)
- Marketing (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、加熱により粘着性
が付与される感熱性粘着材に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat-sensitive adhesive material to which tackiness is imparted by heating.
【０００２】[0002]
【従来の技術】従来の粘着材としては、合成樹脂を不揮
発性溶剤にて溶解して粘着性を付与した粘着性付与樹脂
を用いた一般的な感圧性粘着材がある。2. Description of the Related Art As a conventional pressure-sensitive adhesive material, there is a general pressure-sensitive pressure-sensitive adhesive material using a tackifying resin obtained by dissolving a synthetic resin in a non-volatile solvent to impart tackiness.
【０００３】また高分子材料と、加熱により活性化され
て粘着性を増強する粘着付与剤と、常温では固体で融点
以上に加熱すると溶融して高分子材料や粘着付与剤を膨
潤・溶解して粘・接着性を発現させる固体可塑剤とによ
り構成され、加熱により一旦溶融した後は、結晶化し難
くなって長時間の粘着性が付与される感熱性粘着材があ
る。Further, a polymeric material, a tackifier that is activated by heating to enhance the tackiness, and is solid at room temperature and melts when heated above the melting point to swell and dissolve the polymeric material and the tackifier. There is a heat-sensitive adhesive material that is composed of a solid plasticizer that exhibits viscous / adhesive properties, and that once melted by heating, it becomes difficult to crystallize and the tackiness is imparted for a long time.
【０００４】[0004]
【発明が解決しようとする課題】上記感圧性粘着材は、
図３（ａ）に示すように、所定の基材シート１１上に上
記感圧性粘着材を塗布して感圧粘着材層２を設けること
により、感圧性粘着シートとして利用されているが、そ
の粘着材層２は、常に粘着性（タック）を持っているた
めに取り扱い難く、そのため、シリコーン樹脂、パラフ
ィンなどの離型剤をシート上に塗布して得られる剥離シ
ート１２（セパレータ）を、前記粘着材層２の粘着性表
面に一時的に仮接着して、使用する際には、図３（ｂ）
に示すように、前記剥離シート１２を粘着材層２の表面
より剥離して使用することによって扱い易くしている。The above pressure-sensitive adhesive material is
As shown in FIG. 3 (a), the pressure-sensitive adhesive material is applied onto a predetermined base material sheet 11 to provide the pressure-sensitive adhesive layer 2, which is used as a pressure-sensitive adhesive sheet. The pressure-sensitive adhesive layer 2 is difficult to handle because it always has tackiness. Therefore, the release sheet 12 (separator) obtained by applying a release agent such as silicone resin or paraffin onto the sheet is When used by temporarily temporarily adhering to the adhesive surface of the adhesive layer 2 as shown in FIG.
As shown in (3), the release sheet 12 is peeled from the surface of the pressure-sensitive adhesive layer 2 to be used for easy handling.
【０００５】このように従来の感圧性粘着材を用いた粘
着シートは、取り扱い易さの点から剥離シートを必要と
するため、剥離シートの原価が余分に掛かるだけでな
く、この感圧性粘着シートを各種の産業上において多量
に使用する場合、かなりの量の剥離シートが産業廃棄物
として焼却処理などの廃棄処理を必要としている。As described above, the pressure-sensitive adhesive sheet using the conventional pressure-sensitive adhesive material requires a release sheet from the viewpoint of easy handling. Therefore, not only is the release sheet cost extra, but also this pressure-sensitive adhesive sheet. When a large amount of is used in various industries, a considerable amount of release sheets require disposal such as incineration as industrial waste.
【０００６】一方、従来の感熱性粘着材は、図４（ａ）
に示すように、所定の基材シート１１上に、高分子材料
と粘着付与剤とによる樹脂成分２２中に固体可塑剤２３
を分散混合した感熱性粘着材を塗布して感熱粘着材層２
１を設けることにより、感熱性粘着シートとして利用さ
れるが、基材シート１１に熱収縮性のフィルムを用いた
場合は、図４（ｂ）に示すように、感熱性粘着材層２１
の加熱（ｈ）により固体可塑剤２３が溶融して、感熱性
粘着材層２１に粘着性が付与されるものの、加熱による
流動性が大きく、基材シート１１の収縮応力に負けて、
粘着材層２１が被着体に対してずれを生じたり剥がれた
りする場合があった。On the other hand, the conventional heat-sensitive adhesive material is shown in FIG.
As shown in FIG. 3, a solid plasticizer 23 is contained in a resin component 22 composed of a polymer material and a tackifier on a predetermined base material sheet 11.
Heat-sensitive adhesive layer 2 by applying a heat-sensitive adhesive material in which
1 is used as a heat-sensitive adhesive sheet, but when a heat-shrinkable film is used for the base material sheet 11, as shown in FIG.
Although the solid plasticizer 23 is melted by the heating (h) and the tackiness is imparted to the heat-sensitive adhesive material layer 21, the fluidity due to heating is large and the contraction stress of the base sheet 11 is lost.
In some cases, the adhesive layer 21 may be displaced or peeled off from the adherend.
【０００７】また、従来の感熱性粘着材は、耐熱性が低
いために耐ブロッキング性が悪く、輸送、保管、あるい
は粘着シートに対する印刷加工など後工程において、ブ
ロッキングを起こす恐れが大きい。Further, the conventional heat-sensitive adhesive material has low heat resistance and thus has poor blocking resistance, and there is a high possibility that blocking will occur in the post-process such as transportation, storage, or printing on an adhesive sheet.
【０００８】本発明は、粘着材層の表面に対する剥離シ
ート（セパレータ）を不要とするとともに、粘着材層の
耐熱性を高めることによって、熱収縮性の基材シートを
用いた場合における粘着材層の被着体からのずれや剥が
の発生を無くし、ブロッキングの発生を解消することに
ある。The present invention eliminates the need for a release sheet (separator) for the surface of the pressure-sensitive adhesive layer and enhances the heat resistance of the pressure-sensitive adhesive layer, so that the pressure-sensitive adhesive layer when a heat-shrinkable base sheet is used. It is to eliminate the occurrence of blocking and the occurrence of displacement and peeling from the adherend.
【０００９】[0009]
【課題を解決するための手段】本発明は、基材１上に感
圧粘着剤層２が設けられ、該粘着材層２の粘着表面にそ
の粘着性を阻止する加熱易破壊性のマイクロカプセル層
３が被覆され、該マイクロカプセル層３を加熱破壊する
ことにより前記感圧粘着剤層２の粘着表面を露呈させて
粘着性を付与することを特徴とする感熱性粘着材であ
る。According to the present invention, a pressure-sensitive adhesive layer 2 is provided on a substrate 1, and a heat-destructible microcapsule for preventing the adhesive property on the adhesive surface of the adhesive layer 2. A heat-sensitive adhesive material, which is characterized by being covered with a layer 3 and exposing the adhesive surface of the pressure-sensitive adhesive layer 2 by heating and destroying the microcapsule layer 3 to impart adhesiveness.
【００１０】[0010]
【実施の形態】本発明の感熱性粘着材は、図１の側面図
に示すように、基材シート１上に感圧粘着材層２が設け
られ、該感圧粘着材層２の粘着表面を被覆するように、
マイクロカプセル層３が施されている。BEST MODE FOR CARRYING OUT THE INVENTION The heat-sensitive adhesive material of the present invention comprises a pressure-sensitive adhesive material layer 2 provided on a base sheet 1 as shown in the side view of FIG. 1, and the pressure-sensitive adhesive material layer 2 has an adhesive surface. To cover
A microcapsule layer 3 is applied.
【００１１】前記感圧粘着材層２の粘着表面は、粘着性
の無いマイクロカプセル層３によって被覆されており、
表面に露呈していない。The pressure-sensitive adhesive layer 2 has an adhesive surface coated with a non-adhesive microcapsule layer 3,
Not exposed on the surface.
【００１２】前記感圧粘着材層２としては、例えば天然
ゴム又は／及び、ブタジエン−スチレンゴム、アクリル
ゴム等の合成ゴムを主成分とするゴム系粘着剤、アク
リル酸、アクリル酸ブチル、アクリル酸２エチルヘキシ
ル等を主成分とするアクリル系粘着剤などの感圧粘着剤
であり、具体的には、オリバインＢＰＷ４６５５（水性
溶媒分散型アクリル系エマルジョン型粘着剤；東洋イン
キ製造（株）製）などがある。The pressure-sensitive adhesive layer 2 is, for example, a rubber-based adhesive containing, as a main component, natural rubber or / and synthetic rubber such as butadiene-styrene rubber or acrylic rubber, acrylic acid, butyl acrylate, acrylic acid. 2 A pressure-sensitive adhesive such as an acrylic adhesive mainly containing ethylhexyl and the like. Specifically, Olibain BPW4655 (aqueous solvent dispersion type acrylic emulsion type adhesive; manufactured by Toyo Ink Mfg. Co., Ltd.) is there.
【００１３】前記マイクロカプセル層３としては、加熱
により溶融破壊する中空の合成樹脂製の粘着性のないマ
イクロカプセルが使用され、例えば、油性溶剤にて溶解
可能であって、融点が１００℃以上の合成樹脂（共重合
体樹脂）若しくは複合の合成樹脂により形成された中空
のマイクロカプセルが使用される。As the microcapsule layer 3, hollow non-sticky microcapsules made of synthetic resin, which are melted and destroyed by heating, are used. For example, the microcapsules can be dissolved in an oily solvent and have a melting point of 100 ° C. or more. Hollow microcapsules made of synthetic resin (copolymer resin) or composite synthetic resin are used.
【００１４】前記マイクロカプセル層３として使用され
る中空マイクロカプセルは、例えば１００〜１８０℃程
度の融点を有するものが使用できるが、本発明において
は特に限定されない。The hollow microcapsules used as the microcapsule layer 3 may have a melting point of, for example, about 100 to 180 ° C., but are not particularly limited in the present invention.
【００１５】本発明の感熱性粘着材は、感圧性粘着材層
２の表面に、マイクロカプセルが該粘着材層２の粘着表
面に付着した状態、又は該粘着材層２の粘着表面に該マ
イクロカプセル周面の一部分が埋設した状態で、ほぼ単
層状態に積層されている。The heat-sensitive adhesive material of the present invention has the microcapsules on the surface of the pressure-sensitive adhesive material layer 2 attached to the adhesive surface of the adhesive material layer 2, or on the adhesive surface of the adhesive material layer 2. The capsules are laminated in a substantially single layer state with a part of the peripheral surface buried.
【００１６】上記本発明の感熱性粘着材のマイクロカプ
セル層３は、図２（ａ）に示すように、その融点近くま
で加熱（ｈ）することにより、各カプセルは溶融破壊し
て、図２（ｂ）に示すように、各カプセルの中空容積が
縮小するとともに、カプセルとしての中空状態が消失し
て、各カプセルの間に粘着材層２の粘着表面２ａが部分
的に露呈して、該粘着材層２の粘着表面２ａにより粘着
性が付与されるものである。As shown in FIG. 2A, the microcapsule layer 3 of the heat-sensitive adhesive material of the present invention is heated (h) to near its melting point, so that each capsule melts and breaks, and the microcapsule layer 3 shown in FIG. As shown in (b), as the hollow volume of each capsule is reduced, the hollow state as a capsule disappears, and the adhesive surface 2a of the adhesive layer 2 is partially exposed between the capsules. Adhesiveness is imparted by the adhesive surface 2a of the adhesive layer 2.
【００１７】[0017]
【実施例】本発明の感熱性粘着材を、具体的実施例に従
って以下に詳細に説明する。EXAMPLES The heat-sensitive adhesive material of the present invention will be described in detail below with reference to specific examples.
【００１８】＜実施例１＞基材シートとして厚さ５０μ
ｍのポリエチレンテレフタレートフィルム上に、水性エ
マルジョンタイプのアクリル系粘着剤を、ナイフコータ
ーを用いて塗布して、厚さ２０μｍの感圧性粘着材層を
形成した。次に、スチレン系樹脂による粒径０．４〜
０．５μｍの中空マイクロカプセル（芯材無しのマイク
ロカプセル）をアクリル系樹脂による水性エマルジョン
液に分散させた粘着阻害剤を、水性溶剤（水、又はアル
コール）にて希釈し、該希釈した粘着阻害剤を、前記感
圧性粘着材層上に均一に塗布して、０．３〜１μｍの層
厚のマイクロカプセル層を形成して、前記感圧性粘着材
層の粘着表面に、マイクロカプセル層による非粘着性層
を形成し、本発明の感熱性粘着材を作成した。<Example 1> A substrate sheet having a thickness of 50 μm
m aqueous polyethylene terephthalate film, an aqueous emulsion type acrylic pressure-sensitive adhesive was applied using a knife coater to form a pressure-sensitive pressure-sensitive adhesive layer having a thickness of 20 μm. Next, a particle size of 0.4-
The adhesion inhibitor obtained by dispersing 0.5 μm hollow microcapsules (microcapsules without core material) in an aqueous emulsion of an acrylic resin is diluted with an aqueous solvent (water or alcohol), The diluted adhesion inhibitor is uniformly applied on the pressure-sensitive adhesive material layer to form a microcapsule layer having a layer thickness of 0.3 to 1 μm, and the pressure-sensitive adhesive material layer has an adhesive surface with a microscopic layer. A non-adhesive layer consisting of a capsule layer was formed to prepare the heat-sensitive adhesive material of the present invention.
【００１９】＜比較試験１＞上記実施例１により得られ
た本発明の感熱性粘着材と、従来のアクリル系の感圧性
粘着材と、従来の感熱性粘着材のそれぞれ各環境温度で
の耐熱性についてそれぞれ比較評価した結果を下記表１
に示す。<Comparative Test 1> Heat resistance of each of the heat-sensitive adhesive material of the present invention obtained in Example 1 above, a conventional acrylic pressure-sensitive adhesive material, and a conventional heat-sensitive adhesive material at respective environmental temperatures. The results of comparative evaluation of sex are shown in Table 1 below.
Shown in
【００２０】 各環境温度での耐熱性テスト条件； 使用した基材シート；ポリエチレンテレフタレートフィルム（厚さ５０μｍ） 被着体；ステンレス金属板（ＳＵＳ板） 従来感熱性粘着材；公知のディレイドタック感熱性粘着材を使用 従来感圧性粘着材；実施例１にて用いた感熱性粘着材を使用 粘着性付与のための加熱温度；実施例１の粘着材１８０℃にて１０秒間 ；従来感熱性粘着材１２０℃にて２０秒間 貼着圧力；実施例１の粘着材層と従来感熱性粘着材層及び従来感圧性粘着材層の それぞれ粘着表面をステンレス金属板（ＳＵＳ板）に２ｋｇ／ｍ（線 圧）の荷重にて加圧ロールにより押圧して貼着した。 貼着後の放置時間；上記各環境温度下にて２４時間放置した。 粘着力の測定；２５ｍｍ幅のサンプルを３００ｍｍ／分の速度で１８０°剥離を 行い、その時の剥離抵抗（ｋｇ）を測定した。Heat resistance test conditions at each environmental temperature; Base material sheet used; Polyethylene terephthalate film (thickness 50 μm) Adherent; Stainless metal plate (SUS plate) Conventional heat-sensitive adhesive material; Known delayed tack heat-sensitivity Adhesive material used Conventional pressure-sensitive adhesive material; Heat-sensitive adhesive material used in Example 1 was used Heating temperature for imparting tackiness; Adhesive material of Example 1 180 ° C. for 10 seconds; Conventional heat-sensitive adhesive material Adhesion pressure at 120 ° C. for 20 seconds; the pressure-sensitive adhesive layer of Example 1, the conventional heat-sensitive pressure-sensitive adhesive layer and the conventional pressure-sensitive pressure-sensitive adhesive layer were each adhered to a stainless metal plate (SUS plate) at 2 kg / m (linear pressure). ) Was pressed by a pressure roll with a load of (1) to attach. Leaving time after application: 24 hours at each of the above environmental temperatures. Measurement of adhesive strength: A sample having a width of 25 mm was peeled by 180 ° at a speed of 300 mm / min, and the peel resistance (kg) at that time was measured.
【００２１】その結果、表１に示すように、実施例１の
感熱性粘着材は、従来の感熱性粘着材に比較して、常温
環境下での粘着性は良好であり、また４０℃〜６０℃の
環境下においても、従来の感熱性粘着材に比較して、良
好な粘着力を示した。As a result, as shown in Table 1, the heat-sensitive adhesive material of Example 1 has better adhesiveness in a normal temperature environment than the conventional heat-sensitive adhesive material, and at 40 ° C to 40 ° C. Even in the environment of 60 ° C., the adhesive strength was better than that of the conventional heat-sensitive adhesive material.
【００２２】[0022]
【表１】 [Table 1]
【００２３】＜比較試験２＞中空マイクロカプセルを用
いて非粘着性層を形成した上記実施例１により得られた
本発明の感熱性粘着材と、従来の感熱粘着材の各加熱温
度における粘着材層のブロッキング発生の有無を比較評
価し、その結果を下記表２に示す。<Comparative Test 2> The heat-sensitive adhesive of the present invention obtained by the above-mentioned Example 1 in which a non-adhesive layer was formed by using hollow microcapsules, and the conventional heat-sensitive adhesive at various heating temperatures. The presence or absence of blocking in the layers was comparatively evaluated, and the results are shown in Table 2 below.
【００２４】ブロッキングテスト条件；粘着材層の粘着
表面をステンレス金属板（ＳＵＳ板）に１ｋｇ／ｃｍ2
の荷重にて押圧して１時間加熱し、その時のブロッキン
グの発生の有無を調べた。Blocking test conditions: The pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer was placed on a stainless metal plate (SUS plate) at 1 kg / cm 2.
The sample was pressed under a load of 1 and heated for 1 hour, and the presence or absence of blocking at that time was examined.
【００２５】その結果、表２に示すように、実施例１の
感熱性粘着材は、従来の感熱性粘着材に比較して、８０
℃程度の加熱まではブロッキングの発生がなく、良好な
耐ブロッキング性を示した。As a result, as shown in Table 2, the heat-sensitive adhesive material of Example 1 was 80% more than the conventional heat-sensitive adhesive material.
No blocking occurred until heating up to about 0 ° C, and good blocking resistance was exhibited.
【００２６】[0026]
【表２】 [Table 2]
【００２７】[0027]
【作用】本発明の感熱性粘着材は、基材１上に感圧粘着
剤層２が設けられ、該粘着材層２の粘着表面に、その粘
着性を阻止する加熱易破壊性のマイクロカプセル層３が
被覆され、該マイクロカプセル層３を加熱破壊すること
により前記感圧粘着剤層２の粘着表面２ａを露呈させて
粘着性を付与するようにしたものである。In the heat-sensitive adhesive material of the present invention, the pressure-sensitive adhesive layer 2 is provided on the base material 1, and the pressure-sensitive adhesive surface of the adhesive material layer 2 is a heat-destructible microcapsule which prevents the adhesive property. The layer 3 is coated, and the microcapsule layer 3 is destroyed by heating to expose the adhesive surface 2a of the pressure-sensitive adhesive layer 2 to impart tackiness.
【００２８】本発明の感熱性粘着材は、感圧性粘着材層
２の表面に粘着性の無いマイクロカプセルが該粘着材層
２の粘着表面に付着した状態、又は該粘着材層２の粘着
表面に該マイクロカプセル周面の一部分が埋設した状態
で、ほぼ単層状態に積層されているので、加熱操作以前
における常温若しくは加熱操作温度以下においては、表
面のマイクロカプセル層３が感圧性粘着材層２の粘着性
を阻害して非粘着性を呈している。The heat-sensitive adhesive material of the present invention has a state in which microcapsules having no adhesiveness adhere to the surface of the pressure-sensitive adhesive material layer 2, or the adhesive surface of the adhesive material layer 2. Since a part of the peripheral surface of the microcapsule is embedded in the microcapsule, the microcapsule layer 3 on the surface is a pressure-sensitive adhesive layer at room temperature or below the heating operation temperature before the heating operation. It is non-tacky by inhibiting the tackiness of No. 2.
【００２９】上記本発明の感熱性粘着材のマイクロカプ
セル層３に対して、カプセル溶融温度以上（例えば１０
０℃以上）にて加熱操作することにより、各マイクロカ
プセルは溶融破壊を生じ、カプセルとしての中空状態を
消失するとともに、各カプセルの間に粘着材層２の粘着
表面２ａが露呈して、該粘着材層２による粘着性を呈す
るものである。For the microcapsule layer 3 of the heat-sensitive adhesive material of the present invention, the capsule melting temperature or higher (eg 10
By heating at 0 ° C. or higher), each microcapsule melts and fractures, the hollow state as a capsule disappears, and the adhesive surface 2a of the adhesive layer 2 is exposed between the capsules. The adhesive layer 2 exhibits adhesiveness.
【００３０】[0030]
【発明の効果】本発明の感熱性粘着材は、加熱操作以前
においては、マイクロカプセル層によって、常に粘着性
を呈していないため、粘着材層の表面に対する剥離シー
ト（セパレータ）を不要とする効果がある。EFFECTS OF THE INVENTION The heat-sensitive adhesive of the present invention does not always exhibit adhesiveness due to the microcapsule layer before the heating operation, so that the release sheet (separator) for the surface of the adhesive layer is unnecessary. There is.
【００３１】また、マイクロカプセル層の下層に耐熱性
のある感圧性粘着材を用いているために、マイクロカプ
セル層に用いるマイクロカプセルの耐熱性を確保するだ
けで粘着材層の耐熱性を高めることができ、加熱により
粘着材層の被着体からのずれや剥がれの発生が無く、積
載、移送、保管都議におけるブロッキングの発生も解消
できる効果がある。Further, since the pressure-sensitive adhesive material having heat resistance is used as the lower layer of the microcapsule layer, the heat resistance of the adhesive material layer can be increased only by ensuring the heat resistance of the microcapsules used for the microcapsule layer. Therefore, there is an effect that the adhesive layer is not displaced or peeled from the adherend due to heating, and the occurrence of blocking in the loading, transfer and storage metropolitan areas can be eliminated.
【図１】本発明の感熱性粘着材の側断面図である。FIG. 1 is a side sectional view of a heat-sensitive adhesive material of the present invention.
【図２】（ａ）〜（ｂ）は本発明の感熱性粘着材の粘着
性付与操作を説明する側断面図である。2 (a) and 2 (b) are side sectional views for explaining an operation of giving tackiness of the heat-sensitive adhesive material of the present invention.
【図３】（ａ）〜（ｂ）は剥離シートを用いた従来の感
圧性粘着材を説明する側断面図である。3A and 3B are side sectional views illustrating a conventional pressure-sensitive adhesive material using a release sheet.
【図４】（ａ）〜（ｂ）は従来の感熱性粘着材の粘着性
付与操作を説明する側断面図である。4 (a) and 4 (b) are side cross-sectional views for explaining a tackifying operation of a conventional heat-sensitive adhesive material.
１…基材 ２…感圧性粘着材層 ２ａ…粘着性表面 ３…中空マイクロカプセル層 ３ａ…溶融破壊したマイ
クロカプセル層 １１…基材 １２…剥離シート ２１…感熱性粘着材層 ２２…DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Pressure-sensitive adhesive layer 2a ... Adhesive surface 3 ... Hollow microcapsule layer 3a ... Melt-disrupted microcapsule layer 11 ... Substrate 12 ... Release sheet 21 ... Heat-sensitive adhesive layer 22 ...
Claims (1)
粘着材層２の粘着表面に、その粘着性を阻止する加熱易
破壊性のマイクロカプセル層３が被覆され、該マイクロ
カプセル層３を加熱破壊することにより前記感圧粘着剤
層２の粘着表面を露呈させて粘着性を付与することを特
徴とする感熱性粘着材。1. A pressure-sensitive adhesive layer 2 is provided on a substrate 1, and an adhesive surface of the adhesive layer 2 is coated with a heat-destructible microcapsule layer 3 which prevents the adhesive property, A heat-sensitive adhesive material characterized by exposing the adhesive surface of the pressure-sensitive adhesive layer 2 to impart adhesiveness by heating and destroying the microcapsule layer 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7271086A JPH09111203A (en) | 1995-10-19 | 1995-10-19 | Heat-sensitive tacky material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7271086A JPH09111203A (en) | 1995-10-19 | 1995-10-19 | Heat-sensitive tacky material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH09111203A true JPH09111203A (en) | 1997-04-28 |
Family
ID=17495178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7271086A Pending JPH09111203A (en) | 1995-10-19 | 1995-10-19 | Heat-sensitive tacky material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH09111203A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2431963A2 (en) | 2010-09-16 | 2012-03-21 | Seiko Instruments Inc. | Adhesive Label and Apparatus for Producing the same |
| EP2442292A2 (en) | 2010-10-15 | 2012-04-18 | Seiko Instruments Inc. | Adhesive label, method of producing the same, and apparatus for producing the same |
| EP2498240A2 (en) | 2011-03-10 | 2012-09-12 | Seiko Instruments Inc. | Adhesive label and label issuing device |
| EP2500391A1 (en) | 2011-03-18 | 2012-09-19 | Seiko Instruments Inc. | Adhesive label and label issuing device |
| EP2562737A2 (en) | 2011-08-26 | 2013-02-27 | Seiko Instruments Inc. | Pressure-sensitive adhesive label and label issuing device |
| EP2633994A1 (en) | 2012-02-28 | 2013-09-04 | Seiko Instruments Inc. | Pressure-Sensitive Adhesive Label and Label Issuing Device |
| EP2634764A2 (en) | 2012-02-28 | 2013-09-04 | Seiko Instruments Inc. | Pressure-sensitive adhesive label and label issuing device |
-
1995
- 1995-10-19 JP JP7271086A patent/JPH09111203A/en active Pending
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8537186B2 (en) | 2010-09-16 | 2013-09-17 | Seiko Instruments Inc. | Adhesive label and apparatus for producing the same |
| JP2012063616A (en) * | 2010-09-16 | 2012-03-29 | Seiko Instruments Inc | Adhesive label and manufacturing apparatus thereof |
| EP2431963A2 (en) | 2010-09-16 | 2012-03-21 | Seiko Instruments Inc. | Adhesive Label and Apparatus for Producing the same |
| EP2442292A2 (en) | 2010-10-15 | 2012-04-18 | Seiko Instruments Inc. | Adhesive label, method of producing the same, and apparatus for producing the same |
| EP2498240A2 (en) | 2011-03-10 | 2012-09-12 | Seiko Instruments Inc. | Adhesive label and label issuing device |
| US8716179B2 (en) | 2011-03-10 | 2014-05-06 | Seiko Instruments Inc. | Adhesive label and label issuing device |
| EP2498240A3 (en) * | 2011-03-10 | 2013-03-06 | Seiko Instruments Inc. | Adhesive label and label issuing device |
| EP2500391A1 (en) | 2011-03-18 | 2012-09-19 | Seiko Instruments Inc. | Adhesive label and label issuing device |
| CN102956149A (en) * | 2011-08-26 | 2013-03-06 | 精工电子有限公司 | Pressure-sensitive adhesive label and label issuing device |
| EP2562737A3 (en) * | 2011-08-26 | 2013-10-16 | Seiko Instruments Inc. | Pressure-sensitive adhesive label and label issuing device |
| EP2562737A2 (en) | 2011-08-26 | 2013-02-27 | Seiko Instruments Inc. | Pressure-sensitive adhesive label and label issuing device |
| EP2634764A2 (en) | 2012-02-28 | 2013-09-04 | Seiko Instruments Inc. | Pressure-sensitive adhesive label and label issuing device |
| EP2633994A1 (en) | 2012-02-28 | 2013-09-04 | Seiko Instruments Inc. | Pressure-Sensitive Adhesive Label and Label Issuing Device |
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