JPH0899479A - Mount for heat-sensitive screen base paper - Google Patents

Abstract

PURPOSE: To process a heat-sensitive screen base paper of small width sheet- shape by a line type thermal head in a good manner. CONSTITUTION: Adhesive mass layers 4, 14, 24 and 34 are formed respectively on the surfaces of mounts 3, 13, 23 and 33. Sheet-shaped heat-sensitive screen base papers of same outer shape as the adhesive mass layers.are retained on the adhesive mass layers. The papers are put between the line type thermal head and a platen roller and processed therein. Even when the width of the heat-sensitive screen base papers is smaller than the width of the line type thermal head, the heat-sensitive screen base papers are carried together with the mounts without trouble, and processed in a good manner.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mount used for making a heat-sensitive stencil sheet in a thermal recording apparatus, and more particularly to a heat-sensitive stencil sheet in a thermal recording apparatus such as a printer or a facsimile equipped with a line type thermal head. The present invention relates to a mount used to hold a heat-sensitive stencil sheet during plate making.

[0002]

2. Description of the Related Art A simple printing method is known in which a heat-sensitive stencil sheet is prepared by various methods and used for printing. As a method for making a heat-sensitive stencil sheet, there are the following methods.
First, there is a plate making method in which a document and a heat-sensitive stencil sheet are superposed on each other, and an image of the document is heated by a heat generating means such as a flash lamp or an infrared lamp to form a perforated image corresponding to the image of the document on the heat-sensitive stencil sheet. Further, the character image information converted into an electric signal is given to the thermal head to selectively heat the dot-shaped heat generating portion of the thermal head,
There is a plate making method in which the thermal head and the heat-sensitive stencil sheet are relatively moved while being in contact with each other to form a perforated image on the heat-sensitive stencil sheet.

Conventionally, when a heat-sensitive stencil sheet is made by a thermal head and the width of the heat-sensitive stencil sheet is almost equal to the feed width of the thermal recording apparatus, the heat-sensitive stencil sheet is either roll-shaped or sheet-shaped. Even if the thermal head of the thermal recording apparatus is either a line type thermal head or a serial type thermal head, it was possible to carry out plate making of the heat-sensitive stencil sheet without any trouble.

Further, when a sheet-shaped heat-sensitive stencil sheet having a width narrower than the paper feed width of the thermal recording apparatus is to be produced by the thermal recording apparatus of the serial type thermal head, the head can be scanned by the width of the original sheet without trouble. I was able to do it.

However, when a sheet-shaped heat-sensitive stencil sheet having a width narrower than the paper feed width of the thermal recording apparatus is made by the line type thermal head, pressing the heat-sensitive stencil sheet by the platen roller against the thermal head causes the heat-sensitive stencil sheet to be pressed. There are problems in that the heat-sensitive stencil sheet becomes ununiform in the width direction, the heat-sensitive stencil sheet is not conveyed well, and the plate making is insufficient. Further, as described above, when the width of the heat-sensitive stencil sheet is smaller than the paper feeding width of the thermal recording device, the paper detection sensor provided in the thermal recording device does not operate and a signal is not sent to the thermal head. Sometimes plate making was not done.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art and to provide a heat-sensitive stencil sheet mount capable of making a sheet-shaped heat-sensitive stencil sheet having a small width with a line type thermal head. To do.

[0007]

The mount for a heat-sensitive stencil sheet according to claim 1 is a mount for a heat-sensitive stencil sheet used when making a heat-sensitive stencil sheet in a thermal recording apparatus having a line type thermal head. It is characterized in that an adhesive layer for temporarily fixing the heat-sensitive stencil sheet is provided on at least one surface.

The heat-sensitive stencil sheet according to claim 2 is the heat-sensitive stencil sheet according to claim 1, wherein the outer shape of the adhesive layer is substantially the same as the heat-sensitive stencil sheet. Is characterized by.

The heat-sensitive stencil sheet according to claim 3 is the heat-sensitive stencil sheet according to claim 2, wherein the area of the adhesive layer is substantially the same as the area of the heat-sensitive stencil sheet. Is characterized by.

The mount of the heat-sensitive stencil sheet according to claim 4 is characterized in that in the mount of the heat-sensitive stencil sheet according to claim 2, the pressure-sensitive adhesive layer has a frame shape.

The mount of the heat-sensitive stencil sheet according to claim 5 is the mount of the heat-sensitive stencil sheet according to claim 2, characterized in that the mount is substantially opaque.

The mount of the heat-sensitive stencil sheet according to claim 6 is the mount of the heat-sensitive stencil sheet according to claim 2, wherein a heat-sensitive color former layer is provided on the surface of the mount on which the adhesive layer is provided. It is characterized by

The mount of the heat-sensitive stencil sheet according to claim 7 is the mount of the heat-sensitive stencil sheet according to claim 2, wherein a release sheet having a release layer is attached to the upper portion of the adhesive layer of the mount. It is characterized by being

A heat-sensitive stencil sheet according to claim 8 is the heat-sensitive stencil sheet according to claim 2, wherein a heat-sensitive stencil sheet and an adhesive layer are provided on a portion other than the pressure-sensitive adhesive layer of the board. It is characterized in that a sheet member having a thickness equivalent to the laminated thickness is provided.

The heat-sensitive stencil sheet according to claim 9 is the heat-sensitive stencil sheet according to claim 8, wherein the coefficient of friction of the surface of the sheet member is not provided with the sheet member. Is smaller than the friction coefficient of the other surface of the.

[0016]

According to the above construction, since the heat-sensitive stencil sheet is temporarily fixed to the backing sheet by the adhesive layer, it is possible to carry out plate making by the thermal recording apparatus equipped with the line type thermal head.

[0017]

An embodiment of the present invention will be described with reference to the drawings.
FIG. 1A shows an example of a heat-sensitive stencil sheet. The heat-sensitive stencil sheet 1 is a thermoplastic resin film 11 that is melted and perforated by heat.
And a porous support 12 bonded to the thermoplastic resin film 11. FIG. 1B shows an example in which a heat-sensitive stencil sheet 1 is attached to a frame 2 for reinforcement. Figure 1
FIG. 3C is a sectional view of the heat-sensitive stencil sheet 1 attached to the frame 2. The thermoplastic resin film 11 alone can be used as the heat-sensitive stencil sheet, and the heat-sensitive stencil sheet 1 can be used without the frame 2.

2 (a), (b), (c) and (d),
The mounts of different examples are shown in FIG. 3 and FIG.
Sectional drawing in each cutting line shown in each of (d) is shown. The mount 3 in FIG. 2A is rectangular, and an adhesive layer 4 is provided in the vicinity of one corner of one surface of the mount 3. The outer shape and area of the pressure-sensitive adhesive layer 4 are substantially the same as the outer shape and area of the heat-sensitive stencil sheet 1 having the frame 2 described above. Therefore,
The entire surface of the heat-sensitive stencil sheet 1 having the frame 2 shown in FIG. 1B can be temporarily and reliably held on the surface of the mount 3 by the adhesive layer 4. The adhesive layer 4 is
The shape may correspond to only the frame 2, and in that case, the shape of the pressure-sensitive adhesive layer 4 is substantially the same as that of the frame 2.

FIG. 2B shows a mount 13 for holding a rectangular heat-sensitive stencil sheet 1 without a frame 2. The shape of the adhesive layer 14 of the mount 13 is substantially the same as that of the heat-sensitive stencil sheet 1.
That is, the outer shape and area of the pressure-sensitive adhesive layer 14 are substantially the same as the outer shape and area of the heat-sensitive stencil sheet 1. Therefore, FIG.
The entire surface of the heat-sensitive stencil sheet 1 shown in (a) can be temporarily and reliably held on the surface of the mount 13 by the adhesive layer 14.

FIG. 2C shows a mount 23 that holds the rectangular heat-sensitive stencil sheet 1 without the frame 2. The adhesive layer 24 of the mount 23 has a frame shape having an outer shape substantially the same as the outer shape of the heat-sensitive stencil sheet 1, and its area is smaller than the area of the heat-sensitive stencil sheet 1. Therefore, the adhesive layer 24 cannot hold the entire surface of the heat-sensitive stencil sheet 1 on the surface of the mount 13, but can temporarily and surely hold the peripheral portion of the heat-sensitive stencil sheet 1 on the surface of the mount 13. .

FIG. 2D shows a mount 33 that holds the rectangular heat-sensitive stencil sheet 1 without the frame 2. The mount 33 is a roll-shaped strip-shaped mount, and has adhesive layers 34 having substantially the same shape as the heat-sensitive stencil sheet 1 at a plurality of locations.

The mounts 3, 13, 2 of each embodiment shown in FIG.
According to 3, 33, the heat-sensitive stencil sheet 1 can be temporarily held by the adhesive layers 4, 14, 24, 34.
Since at least the outer shape of the pressure-sensitive adhesive layers 4, 14, 24, 34 is substantially the same as the outer shape of the heat-sensitive stencil sheet 1, the heat-sensitive stencil sheet 1 held by such pressure-sensitive adhesive layers 4, 14, 24, 34 is The peripheral edge does not peel off from the mount. Therefore, the mounts 3, 13, 23, 33 holding the heat-sensitive stencil sheet 1 by the adhesive layers 4, 14, 24, 34
Is conveyed by the line type thermal head and platen roller of the thermal recording device without any trouble, and a good perforated image is formed on the heat-sensitive stencil sheet 1.

The mounts 3, 13, 23, 33 of the above-mentioned respective embodiments
Is substantially opaque because it needs to be detected by a paper detection sensor provided in the thermal recording device. These mounts can be made of, for example, colored paper or film.

In each of the above embodiments, the mounts 3, 13, 2
It is also possible to provide a heat-sensitive coloring agent on the surface of the heat-sensitive stencil sheet 3, 33 to which the heat-sensitive stencil sheet 1 is fixed, so that an image can be recorded in a predetermined color also on the side of the mount by the thermal head. With this configuration, when the heat-sensitive stencil sheet is removed from the mount after plate making, the same image as the punched image formed on the heat-sensitive stencil sheet appears in a predetermined color on the mount side. When a full-color original image is color-separated into three primary colors and a plate is created for each primary color, a thermosensitive coloring agent that develops in the same color as the color of the plate to be formed is provided on the mount, and the plate is made after platemaking. By comparing the appearing image of the predetermined color with the punched image of the plate-made heat-sensitive stencil sheet removed from the mount, it is possible to easily identify what color plate the plate-made heat-sensitive stencil sheet is.

The mounts 3, 13, 23, 33 of the above respective embodiments
Examples of the pressure-sensitive adhesive of the pressure-sensitive adhesive layers 4, 14, 24, 34 used in the above can include pressure-sensitive adhesives that are commonly used, for example, pressure-sensitive adhesives such as acrylic resin, polybutadiene, natural rubber, and urethane rubber.

FIG. 4 shows each mount 3 shown in FIGS. 2 and 3.
In 13, 23, 33, each adhesive layer 4, 14, 2
It is sectional drawing which shows the state which attached the release sheet 5 on 4,34. As shown in FIG. 5, the release sheet 5 is removed when the heat-sensitive stencil sheet 1 is fixed to the mount sheets 3, 13, 23 and 33. The release sheet 5 includes a sheet-shaped support 15 and a release layer 16. Adhesive layers 4, 14, 2 on the mounts 3, 13, 23, 33 of the above-mentioned respective examples
Since the sheets 4 and 34 need to function only when the heat-sensitive stencil sheet 1 is fixed, it is convenient to cover the pressure-sensitive adhesive layer with the release sheet 5 in this way when the sheet is not used.

FIG. 6 shows the mounts 3, 13, 2 shown in FIG.
It is sectional drawing which shows the state which provided the sheet member 6 in the parts other than the adhesive layer 4,14,24,34 of 3,33. The thickness of the sheet member 6 is the adhesive layers 4, 14, 24, 3
4 and the thickness of the heat-sensitive stencil sheet 1 are the same.
Here, the thickness of the release sheet 5 is the same as that of the heat-sensitive stencil sheet 1. As shown in FIG. 7, the release sheet 5 is removed when the heat-sensitive stencil sheet 1 is fixed to the mount sheets 3, 13, 23, 33. The heat-sensitive stencil sheet 1 has the pressure-sensitive adhesive layers 4, 14, 2 exposed inside the holes 6 a of the sheet member 6.
4,34. According to the above configuration, when the heat-sensitive stencil sheet 1 is held on the mount sheets 3, 13, 23, 33, the thickness of the mount sheet is
The other parts are substantially the same. Therefore, when the heat-sensitive stencil sheet 1 is temporarily fixed to the pressure-sensitive adhesive layers 4, 14, 24, 34 of the mounts 3, 13, 23, 33 and the plate is made by the thermal recording device, the mount is reliably transported and the thermal Adhesion between the head and the heat-sensitive stencil sheet becomes more reliable, and plate making is performed satisfactorily.

FIG. 8 shows that the heat-sensitive stencil sheet 1 is fixed on the mount 3 on which the sheet member 6 is provided, and the heat-sensitive stencil sheet 1 is sandwiched between the line type thermal head 7 and the platen roller 8 in the thermal recording apparatus and conveyed. 6 is a diagram showing a state in which the line type thermal head 7 is pressed against the plate to make a plate. FIG. Here, the carrying force of the mount 3 to which the heat-sensitive stencil sheet 1 is fixed is determined by the frictional force between the mount 3 and the platen roller 8. That is, the friction coefficient of the friction generated between the mount 3 and the platen roller 8 must be larger than the friction coefficient of the friction generated between the sheet member 6 and the thermal stencil sheet 1 and the thermal head 7. If the coefficient of friction between the mount 3 and the platen roller 8 is smaller than the coefficient of friction between the sheet member 6 and the heat sensitive stencil sheet 1 and the thermal head 7, the sheet member 6 and the heat sensitive stencil sheet 1 stick to the thermal head 7, and the mount 3 Is slipped by the platen roller 8 and, as a result, cannot be conveyed.

Therefore, the mounts 3, 13, 2 of the above-mentioned respective embodiments
In order to reduce the coefficient of friction, for example, a silicone-treated or fluororesin-treated sheet may be attached to the surface of the sheet member 6 provided on the surfaces 33 and 33. The back surfaces of the mounts 3, 13, 23 and 33 may be subjected to mechanical embossing treatment or rough surface coating treatment in order to increase the coefficient of friction.

[0030]

The mount of the heat-sensitive stencil sheet according to the present invention has an adhesive layer capable of temporarily holding the heat-sensitive stencil sheet, so that it can be used in printers, facsimiles, etc. equipped with a line type thermal head. In the thermal recording apparatus, even a sheet-shaped heat-sensitive stencil sheet having a small size can be satisfactorily prepared.

[Brief description of drawings]

1A is a cross-sectional view of a heat-sensitive stencil sheet, FIG. 1B is a plan view of a heat-sensitive stencil sheet having a frame, and FIG. 1C is a cross-sectional view of a heat-sensitive stencil sheet having a frame.

2A, 2B, and 2C are plan views of a mount of each embodiment, and FIG. 2D is a perspective view of one embodiment.

FIG. 3 is a sectional view of each embodiment shown in FIG.

FIG. 4 is a cross-sectional view of an example mount having a release sheet.

FIG. 5 is a cross-sectional view of a backing sheet of an example in which the release sheet is peeled off from the backing sheet of FIG. 4 to hold the heat-sensitive stencil sheet on the adhesive layer.

FIG. 6 is a cross-sectional view of an embodiment mount having a release sheet and a sheet member.

FIG. 7 is a cross-sectional view of a backing sheet of an example in which the release sheet is peeled off to hold the heat-sensitive stencil sheet on the adhesive layer in the backing sheet of FIG.

FIG. 8 is a cross-sectional view and a perspective view showing a state in which a heat-sensitive stencil sheet fixed to a backing sheet is being made.

[Explanation of symbols]

 1 Heat-sensitive stencil base paper 2 Frame 3, 13, 23, 33 Mount paper 4, 14, 24, 34 Adhesive layer 5 Release sheet 6 Sheet member 7 Line type thermal head 8 Platen roller 11 Thermoplastic resin film 12 Porous support 15 Support Body 16 release layer

Claims (9)

[Claims] 1. A mount for a heat-sensitive stencil sheet used when making a heat-sensitive stencil sheet in a thermal recording apparatus having a line-type thermal head, wherein at least an adhesive layer for temporarily fixing the heat-sensitive stencil sheet is used. A heat-sensitive stencil mount that is provided on one surface. 2. The mount of the heat-sensitive stencil sheet according to claim 1, wherein the outer shape of the pressure-sensitive adhesive layer is substantially the same as the outer shape of the heat-sensitive stencil sheet. 3. The heat-sensitive stencil sheet mount according to claim 2, wherein the area of the pressure-sensitive adhesive layer is substantially the same as the area of the heat-sensitive stencil sheet. 4. The mount of the heat-sensitive stencil sheet according to claim 2, wherein the pressure-sensitive adhesive layer has a frame shape. 5. The mount for a heat-sensitive stencil sheet according to claim 2, wherein the mount is substantially opaque. 6. The heat-sensitive stencil board mount according to claim 2, wherein a thermosensitive color former layer is provided on the surface of the mount having the adhesive layer. 7. The mount for a heat-sensitive stencil sheet according to claim 2, wherein a release sheet having a release layer is attached to an upper portion of the adhesive layer of the mount. 8. The sheet member having a thickness equal to the thickness of the heat-sensitive stencil sheet and the pressure-sensitive adhesive layer stacked on each other except the pressure-sensitive adhesive layer of the mount. Mount of the heat-sensitive stencil base paper described. 9. The mount of the heat-sensitive stencil sheet according to claim 8, wherein the coefficient of friction of the surface of the sheet member is smaller than the coefficient of friction of the other surface of the mount which is not provided with the sheet member. .