JPH0897267A - Ic package feed preparatory device - Google Patents

Abstract

PURPOSE: To enable the interval of a set of feed preparatory IC packages to be altered by a method wherein one container is shifted by a specific interval to the other container in respective pairs of containers individually containing IC packages comprising a pair set. CONSTITUTION: A shrinkage rod 95a of a pitch shift part 84 protrudes to make the front end of the shrinkage rod 95a abut against a roller 92 of a movable container part 89 to be horizontally shifted by a specific distance from the fixed containing part 87. Accordingly, the pitch between a pair of IC packages 30, 30 of a container part 82 is altered from the pitch on a film substrate to the pitch for a tray so that a pair of IC packages 30, 30 may be smoothly shifted at one time by the second carrier system. Through these procedures, the pitch of a pair of the feed preparatory IC packages can be altered furthermore the carrier systems can be connected smoothly.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention separates a portion of each IC module as an IC package from a film substrate on which a plurality of IC modules are mounted, and each IC package separated in the IC package separating step is predetermined by a carrier device. And an IC package supply preparation device prepared for the IC package mounting step of mounting the IC package in the recess of the IC card substrate in the next step.

[0002]

2. Description of the Related Art An IC card manufacturing apparatus generally includes a film substrate forming step including a film base material supplying step, a pattern forming step, and an IC module forming step, and an IC.
Card base forming step, and separating IC package from film substrate and mounting in IC card base recess I
It consists of a C package mounting process.

That is, as shown in FIG. 7, in the film base material supplying step, for example, a belt-shaped film made of glass / epoxy resin is cut and supplied at predetermined intervals.

Next, in a pattern forming step, a predetermined pattern is formed on the film base material. In FIG. 8, the film substrate 1 has a copper foil 3 adhered onto one side surface 2 of the substrate, and then masked and etched to form predetermined patterns 4 and 4, and further formed on the copper foil 3. Conductive plating 5 (usually gold plating) is applied, and thereafter, a plurality of holes 6 and 6 for feeding the film are formed in the film substrate 1 at an equal pitch.

Then, in the film substrate 1 formed as described above, in the IC module forming step, an IC (not shown) is placed on each of the patterns 4 and 4 and bonded to form the IC. Connect with each pattern. Thereby, the film substrate 10 is formed.

After that, each IC module 31, 31
The IC module is separated from the film substrate together with the film substrate on which the IC module is placed (IC package separating step). This film base and IC module form a set of I
The C package 30 is configured.

On the other hand, the IC card substrate 4 is manufactured by the injection molding method.
0 is formed (IC card base material forming step), and each IC
The package 30 is mounted in the recess 43 of the IC card substrate 40 (IC package mounting step) to form an IC card.

By the way, in the IC package separating step, as described above, a portion of each IC module is separated as an IC package from the film substrate on which a plurality of IC modules are mounted. Then, each IC package separated in this IC package separation step is prepared by the IC package supply preparation device in the next step of IC package mounting step (step of mounting the IC package in the recess of the IC card base material). The IC package supply preparation device collects the separated IC packages on a predetermined tray by a carrying device.

Conventionally, this IC package supply preparation device is a device that separates two IC module parts from the film substrate into a set of two IC packages, and a set of separated IC packages that are sequentially collected to cut powder. And a device for accumulating the collected IC packages one by one on a predetermined tray by a carrying device.

[0010]

In the conventional IC package supply preparation device, a set of two separated IC packages is generally transferred to the stage by a transfer device equipped with a suction device. The one that conveys each set of collected IC packages to a predetermined tray is also made by a conveying device having an adsorption device, and
The distance between the sets of IC packages stacked on the tray was the same as the distance between the first set of IC packages.

Therefore, since the tray is constrained to the space between the initial set of IC packages, the tray and the preparation structure for the next process are naturally restricted. On the other hand, it was also considered to incorporate a mechanism for changing the pitch at the tip portion of the transfer arm during transfer, but the transfer arm is required to be as light as possible so that the transfer device can be driven at high speed. Therefore, it is not preferable to provide the arm with a pitch changing mechanism.

Further, the conventional IC package supply preparation device is a device for separating the parts of each IC module from the above-mentioned film substrate into a set of two IC packages, and a set of separated IC packages. Between a stage for performing processing such as removal of cutting powder and a device for accumulating the collected IC packages one by one on a predetermined tray by a conveying device, two IC packages each have a one-to-one correspondence. And it takes time to coordinate the movements. That is, when a set of IC packages transferred from the separation device is transferred to the stage, the set of IC packages is transferred to the tray after the arm of the transfer device is detached. However, the subsequent transport device cannot be driven until the transport is completed, and its improvement has been desired.

Therefore, the present invention is to provide a supply preparation device capable of changing the interval (pitch) of a set of IC packages prepared for supply and capable of smoothly linking the conveying devices. Has an aim.

[0014]

SUMMARY OF THE INVENTION According to the present invention, a portion of each IC module is separated as an IC package from a film substrate on which a plurality of IC modules are mounted, and each IC package separated in the IC package separating step is conveyed by a transfer device. In the IC package supply preparing device, which is integrated in a predetermined tray by the above, and is mounted in the IC package mounting step of mounting the IC package in the recess of the IC card substrate in the next step, two IC packages separated in the IC package separating step are provided. A first transfer device for transferring one set, a turntable on which a plurality of sets of two IC packages are placed, and two sets of IC packages on the turntable.
The turntable includes a second transport device that transports the IC packages transported by the second transport device, and a tray that collects the IC packages transported by the second transport device.
It has a pair of storage tools for individually storing C packages,
At least one of the pair of storage tools is provided so as to be movable with respect to the other storage tool by a predetermined distance, and the turntable is provided with a drive mechanism for moving the one storage tool. It is a preparation device.

[0015]

According to the present invention, since a set of IC packages that have been separated and conveyed are stored in the storage device on the turntable, the first and second transfer devices are used to rotate the turntable except the first time. Accordingly, they can be driven simultaneously.
Further, each of the pair of storage tools has a pair of storage tools for individually storing the one set of two IC packages. At the same time, since the turntable is provided with a drive mechanism for moving the one storage device,
Here, the pitch of each set of IC packages can be changed.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on the embodiments shown in FIGS. As shown in FIGS. 1 to 3, the IC package supply preparation device 51 of this embodiment includes a film substrate supply unit 52 for supplying the film substrate 10 on which the IC module 30 is manufactured, and a transport rail 54 for conveying the film substrate 10. The film substrate introducing section 53 to be introduced above, the IC package separating section 55 provided on the transport rail 54 for cutting and separating the set of IC packages 30 from the film substrate 10, and the separated IC package 3
The defective packages 30 are selected from the first transfer device 56 that transfers 0 to the storage part of the turntable part 57 and the turntable part 57 that performs processing such as removing the cutting powder of the IC package 30 and the tray is selected. The second transport device 58 is arranged and stored in A.

The film substrate 10 that has been tested in advance
Are transferred one by one from the film substrate supply unit 52 to the film substrate introducing unit 53, are introduced onto the transport rail 54 by the introducing unit 53, and move on the transport rail 54. Next, the film substrate 10 is used as the IC package separating unit 5
When it reaches 5, the IC packages 30 are cut out and separated by two sets, and the separated two IC packages 30 are turned by the first transfer device 56 by the turntable unit 5.
Transferred to 7. Further, in the turntable portion 57, the cutting powder of each IC package 30 is removed,
Next, the pitch between the IC packages 30 is set to the film substrate 1
The pitch on the tray 0 is changed to the pitch for the tray, and the trays are arranged and stored in the trays A, A, ...

The tray A is composed of a plurality of trays A,
Tray A is supplied one by one onto the tray transport rail 61 from the tray supply unit 60 in which A, ... Are stacked, and moves on the tray transport rail 61 in the left direction in the drawing. Then, the tray A has a tray transport rail 61.
Positioned at the upper IC package storage position and stopped,
The second transfer device 58 transfers two sets of the IC packages 30 on the turntable unit 57, and stores a predetermined number of the IC packages 30. After storing,
Again, the tray transport rail 61 is moved leftward and stacked on the tray stacking unit 62. In addition, the tray A is formed to have a size such that 8 × 8 IC packages 30 can be aligned and arranged, and the IC packages 30 are mounted on the tray A.
However, the IC packages 30 on the film substrate 10 are set and housed at intervals different from the distance between the IC packages 30.

The film substrate supply section 52 is supplied with the film substrate 10 from a film substrate magazine 64 in which the film substrates 10, 10, ... Are stacked by a pickup transfer device 65 having a suction head 65a.
That is, the film substrates 10 are placed one by one at a predetermined position on the stage 67 of the introduction section 53, and the pickup transfer device 65 is provided.
Are transferred and supplied.

The introduction section 53 is composed of an introduction stage 67 continuous to the introduction port 54a of the transport rail 54, a pusher device 68, and a substrate detection sensor (not shown).

The introduction stage 67 is formed of a flat plate whose upper surface is continuous with the introduction port 54a of the transport rail 54.
It is installed horizontally. In addition, the pusher device 68 is
An air cylinder (not shown) is provided inside the stage 67 at a position facing the inlet 54a of the transport rail 54, and a push member 68a is fixed to the telescopic rod of the air cylinder. The air cylinder is electrically connected to a control circuit section (not shown), and the control circuit section controls the operation of the air cylinder. The push member 68a is formed as a plate-shaped member wider than the width of the film substrate 10, and is provided so as to be movable toward the introduction port 54a by the operation of the air cylinder. Further, when the telescopic rod of the air cylinder is retracted, the distance between the push member 68a on the stage 67 and the introduction port 54a is determined by the film substrate 1
This stage 67 is set larger than the length of 0.
A sufficient space is secured to transfer and set the film substrate 10 to the. Therefore, the film substrate 10 picked up and transferred to the predetermined position of the stage 67 is pushed at the rear end in the introduction direction by the pusher device 68 of the introduction part 53, and the leading end is introduced into the introduction port 54 a of the transport rail 54. .

Further, a substrate detecting sensor (not shown) is provided at a predetermined position of the transport rail 54, and a non-contact type optical fiber sensor is used as the substrate detecting sensor. Further, this substrate sensor is connected to the control circuit unit, and the leading end of the film substrate 10 on the introduction side is conveyed by the transport rail 5.
The arrival of the transport mechanism of No. 4 is detected and the control circuit unit is notified. Then, based on this detection signal, the control circuit unit determines that the film substrate 10 has reached the transport mechanism provided on the transport rail 54, stops the introduction operation of the pusher device 68, and restores the initial state. The film substrate 10 to be set is provided so that it can be set on the stage 67 and introduced into the transport rail 54.

Further, a defective IC package detection sensor (not shown) is provided at a predetermined position of the transport rail 54, and a non-contact type optical fiber sensor is used as this detection sensor. That is, before processing by this IC package supply preparation device, an electrical operation test of each IC package 30 is executed by the test device while the IC package 30 is mounted on the film substrate in advance. Then, the defective IC package 30 is provided with a punch hole indicating a defective product at a predetermined portion of the film substrate, and the defective IC package detection sensor detects the punch hole and notifies the control circuit unit of the defective hole. The IC package 30 is identified, and the defective IC package 30 is sorted and discarded at the time of transfer by the second transfer device 58 described later.

The transport rail 54 is arranged horizontally,
The inner cross-sectional shape is composed of upper and lower rails formed according to the cross-sectional shape of the film substrate 10. A substrate discharge section 71 is provided on the rear end side (right side in FIGS. 1 and 3) of the transport rail 54, and the film substrate 10 from which the IC package 30 is separated is placed in a basket (not shown). It is designed to be collected and discarded.

The IC package separating section 55 is provided in the middle of the carrying rail 54, and the pitch sending section 73 is provided.
And a punching section 74 (see FIG. 3).
Therefore, the pitch feed unit 73 feeds the conveyed film substrate 10 to the pitch width between the IC packages 30 in the substrate longitudinal direction on the conveyance rail 54, and the punching unit 7 is used.
Predetermined positioning is performed on 4. And punching section 74
Thus, the two IC packages 30 manufactured on this substrate are separated by punching at the same time.

The first transfer device 56 is composed of a swing arm 76 having a pair of suction heads at its tip, and a swing drive section for swinging the arm 76 downward. The IC package separation section 55 separates the swing arm 76. A set of two
Each IC package 30 is suction-held by the suction head at the tip of the arm 76, and a pair of IC packages 3 separated by one swing operation of this arm 76.
0 and 30 are provided so as to be transferred to the storage portion of the turntable portion 57.

The turntable unit 57 includes a turntable body 80 which is horizontally rotatably installed, a rotary drive unit 81 which rotates the turntable body 80 by 1/4 rotation, and an outer circumference of the turntable body 80. From the accommodating portion 82 of the IC package 30, the cutting powder removing portion 83 installed at the first rotation position below the outer circumference of the turntable body 80, and the pitch shift portion 84 installed at the third rotation position. It is configured.

The cutting powder removing portion 83 is provided below the first rotation position of the turntable main body 80, and the dust collecting device 8 is provided.
6 air ducts 86a are connected. Therefore, air of a predetermined suction pressure is supplied from the dust collector 86,
By this air pressure, the cutting powder can be removed from each of the IC packages 30, 30 placed in the storage portion 82.

The turntable body 80 is further shown in FIG.
As shown in FIGS. 6A and 6B, the upper surface is formed into a flat disk shape, and a storage portion 82 for mounting a set of IC packages 30 is provided at a quadrant of the outer circumference of the upper surface. In addition, the turntable main body 80 has a lower rotary drive unit 8
1, the rotation is driven by 1/4 rotation.

The accommodating portion 82 is the turntable body 8
It is composed of a fixed storage part 87 whose base end is fixed to 0 and a movable storage part 89 which is attached to the fixed storage part 87 via a slide shaft 88.

That is, recesses 87a and 89a corresponding to the outer shape of the IC package 30 are provided on the upper surfaces of the fixed storage portion 87 and the movable storage portion 89, so that the IC package 30 can be mounted securely. ing. Further, slide holes 87b and 89c are horizontally penetrating the both storage portions 87 and 89, and the slide shaft 8 having a length penetrating the both storage portions 87 and 89 is inserted into the slide holes 87b and 89b.
8 is inserted. Further, retaining washers 87c and 89c are fixed to both ends of the slide shaft 88, and the protruding portion of the slide shaft 88 on the fixed storage portion 87 side is
The elastic spring 90 is contracted so that the movable storage portion 89 is constantly pressed against the fixed storage portion 87 by the spring 90.

Further, the movable storage 89 has a plan view L.
A character-shaped shift guide member 91 is provided, and a rotary roller 92 is provided at the tip of this guide member 91. Further, a large diameter rod hole 93 is vertically provided in the turntable main body 80 below the rotary roller 92 in accordance with a protruding position of a shift rod 96 of a pitch shift portion 84 described later. Therefore, the turntable body 8
When the storage section 82 reaches the third rotation position by rotating 0, the tip end of the shift rod 96 moves into the rod hole 93.
It is provided so that it can pass through and come into contact with the rotating roller 92.

The pitch shift section 84 is composed of a shift drive section 95 provided below the third rotation position of the turntable body 80, and a shift rod 96 fixed to the telescopic rod 95a of the drive section 95. ing.

That is, the shift driving unit 95 is vertically fixed to the apparatus side below the third rotation position of the turntable main body 80, and is electrically connected to a control circuit unit (not shown). The operation of the shift drive unit 95 is controlled by the control circuit unit. In addition, the shift drive unit 95 has a telescopic rod 95a protruding from the upper surface. Further, a shift rod 96 is vertically fixed to the tip of the telescopic rod 95a via a substrate 95b. A taper surface 96a is provided at the tip of the shift rod 96. Therefore, the turntable body 80 rotates,
When the storage portion 82 reaches the third rotation position, the shift rod 96 projects, and the tip of the shift rod 96 passes through the rod hole 93 and contacts the rotating roller 92 of the movable storage portion 89. The tapered surface 96a at the tip presses the rotating roller 92 to move the entire movable storage portion 89 to the left in FIG. 6 (the direction away from the fixed storage portion 87).

As described above, when the entire movable storage portion 89 moves and is separated from the fixed storage portion 87, the distance between the recess 87a of the fixed storage portion 87 and the recess 89a of the movable storage portion 89 is the same as that of the tray A. It becomes equal to the alignment pitch. When the shift rod 96 moves backward (falls) and the tip of the shift rod 96 moves away from the rotary roller 92, the entire movable storage section 89 moves to the left as shown in FIG.

The second transfer device 58 has a horizontal X and Y
The robot arm 98 movable in the direction is provided with a set of suction heads 98a at the tip thereof, and its operation is controlled by a control unit 99 equipped with a dedicated microcomputer. The distance between the suction heads 98a at the tip of the arm 98 is set according to the above-mentioned arrangement interval of the tray A. Therefore, a set of two IC packages 30, 30 is transferred from the storage portion 82 in which the pitch of the turntable portion 57 is changed and can be sequentially stored in the tray A.

Incidentally, 100 is one IC package 30.
Is a mounting plate for temporarily mounting the IC chip, and below this is a throw-in slot 1 for discarding the defective IC package 30.
01 is provided so that the defective IC package 30 can be discarded at the same time when the IC package 30 is transferred from the turntable unit 57 to the tray A. That is, if one of the two IC packages 30 is defective, the IC package 30 is a good product.
Is mounted on this mounting plate, while the defective IC package 30 is discarded at the input port. Then, when one pair of IC packages 30 is normally conveyed again after one set of two is defective, the defective product is discarded, and two defective packages are placed together with the mounted non-defective package. Of I
The C package 30 is provided so as to be set on the tray A.

Next, the operation of the pitch shift section 84 provided in the turntable section 57 of this apparatus will be described with reference to FIGS. 4 and 6.

First, in the initial state shown in FIG. 4, the telescopic rod 85a of the pitch shift portion 84 is retracted (the movable storage portion 89 is pressed against the fixed storage portion 87 by the spring 90), and the turntable portion 57 is placed above. The pitch between the two IC packages 30 accommodated in the accommodating portion 82 of the IC modules 31 and 3 on the film substrate 10 is
It has the same pitch as 1.

Then, when the turntable performs a predetermined rotation operation and the storage section 82 reaches the transfer position to the tray A, the IC packages 30, placed on the storage section 82,
The pitch between the 30 is changed from the pitch on the film substrate to the pitch for the tray.

That is, as shown in FIG. 6, the telescopic rod 85a of the pitch shift portion 84 projects, and the telescopic rod 11
The tip of a is a roller portion (rotating roller 9) of the movable storage portion 89.
2), the movable storage portion 89 is horizontally moved from the fixed storage portion 87 by a predetermined distance. Therefore, the storage portion 82
The pitch between the two IC packages 30 and 30 is changed to the arrangement pitch of the tray A, and the two IC packages 30 and 30 can be smoothly transferred at one time by the second transfer device 58.

Then, the IC package 3 is received from the storage portion 82.
When 0 is transferred by the second transport device 58, the telescopic rod 95a of the pitch shift section 84 retracts, the initial state shown in FIG. 4 is restored, and the pitch equal to the pitch on the film substrate from the separation section 55. After that, the IC packages 30, 30 separated from each other can be placed.

[0043]

As described above, according to the present invention, since a set of IC packages which have been separated and transported are stored in a storage tool on a turntable, the first and second transfer devices except the first time. Can be driven simultaneously with the rotation of the turntable. Therefore, the first and second transfer devices are smoothly linked.

Further, each of the pair of storage tools has a pair of storage tools for individually storing the set of two IC packages, and at least one of the storage tools is moved by a predetermined distance with respect to the other storage tool. Since the turntable is provided with a drive mechanism for moving the one storage tool, the pitch of each set of IC packages can be changed. Therefore, the original IC
It is possible to obtain a highly flexible device that is not restricted by the package pitch.

As described above, according to the present invention, it is possible to change the pitch of a set of IC packages prepared for supply, and moreover, it is possible to smoothly perform the linkage of the transfer device, which is simpler. Thus, it is possible to obtain a supply preparation device capable of speeding up.

[Brief description of drawings]

FIG. 1 is a schematic front view showing an overall configuration according to an embodiment of an IC package supply preparation device of the present invention.

FIG. 2 is a schematic side view showing the overall configuration of an IC package supply preparation device of this embodiment.

FIG. 3 is a schematic plan view showing the overall configuration of an IC package supply preparation device of this embodiment.

FIG. 4 is a top view of the pitch shift portion of the present embodiment, and FIG. 4 (b) is a schematic front view showing the overall configuration.

FIG. 5 is a schematic side view of the pitch shift unit of the present embodiment.

FIG. 6 shows an operating state of the pitch shift section of the present embodiment,
(A) is a top view, (b) is a schematic front view which shows the whole structure.

FIG. 7 is a diagram showing a process of manufacturing an IC card.

FIG. 8 is a plan view showing a film base material.

[Explanation of symbols]

 1 Film Base Material 10 Film Substrate 30 IC Package 31 IC Module 40 IC Card Base Material 43 Recess 51 IC Package Supply Preparation Device 52 Film Board Supply Section 53 Film Board Introducing Section 54 Conveying Rail 54a Conveying Rail Introducing 55 IC Package Separation Section 56 first transfer device 57 turntable part 58 second transfer device 60 tray transfer rail 61 tray supply part 62 tray stacking part 64 film substrate magazine 65 pickup transfer device 65a pickup head of pickup transfer device 67 introduction stage 68 pusher device 68a Push member of pusher device 71 Board discharge part 73 Pitch feed part 74 Punching part 76 Swing arm 77 Swing drive part 80 Turntable body 81 Rotation drive part 82 Storage part 83 Cutting Removal part 84 Pitch shift part 86 Dust collector 86a Dust collector air duct 87 Fixed storage part 87a Fixed storage part mounting recess 87b Fixed storage part slide hole 87c Fixed storage part retaining washer 88 Slide shaft 89 Movable storage part 89a Mounting recess of movable storage 89b Sliding hole of movable storage 89c Lock washer of movable storage 90 Spring 91 Shift guide member 92 Rotating roller 93 Rod hole 95 Shift drive 95a Telescopic rod 95b of shift drive shift drive Substrate 96 Shift rod 96a Shift rod tip taper surface 98 Robot arm 98a Robot arm suction head 99 Robot arm control unit 100 Temporary mounting board 101 Entry port for defective IC package discard chute

Claims (2)

[Claims] 1. A part of each IC module is separated as an IC package from a film substrate on which a plurality of IC modules are mounted, and each IC package separated in this IC package separating step is accumulated on a predetermined tray by a carrier device. In the IC package supply preparing device for the IC package mounting step of mounting the IC package in the recess of the IC card substrate in the next step, the IC packages separated in the IC package separating step are
A first transport device for transporting the individual I and a pair of the I
A turntable on which a plurality of sets of C packages are mounted, a second transfer device that transfers two sets of IC packages on the turntable, and an IC package transferred by the second transfer device The turntable has a pair of storage tools for individually storing the set of two IC packages, and the pair of storage tools has at least one storage tool on the other side. The IC package supply preparation device, wherein the turntable is provided so as to be movable by a predetermined distance, and the turntable is provided with a drive mechanism for moving the one storage device. 2. The one movably provided storage device is always elastically urged toward the other storage device by an elastic material, and the one storage device is further urged from the other storage device. A drive device for a rod that presses and urges in a separating direction is provided, and the distal end portion of the rod is driven to retract between the pair of storage tools by the drive device, and the interval between the pair of storage tools is made variable. The IC package supply preparation device according to claim 1, wherein the IC package supply preparation device is provided.