JPH0896426A - Production of stamper for optical recording medium - Google Patents

Abstract

PURPOSE: To produce a stamper on which remaining of stamper films does not exist by producing the stamper in such a manner that the stress characteristics of metallic sputtered films vary in a thickness direction. CONSTITUTION: Microspheres of a prescribed average particle size are dispersed as spacer into a photosetting resin and this resin is dispensed by a dispenser to the outer peripheral part of a square original mold 1 of 300×300mm having a pattern area of, for example, 250×250mm and a glass substrate 2 having an injection port 5' is superposed on this original mold. A cell 4 is cured by irradiation with UV. Next, the photosetting resin 2P is encapsulated into a cavity 17. Next, the air in the chamber is exhaused and the pressure in the cavity 17 is held at, for example, 0.1Torr and is held for, for example, about 30 minutes to defoam the 2P. Next, a solenoid valve 15 is opened to drop the 2P to a funnel 14 and air is leaked into a chamber 6 to maintain the atm. pressure in the chamber. In such a case, the 2P is injected into the cell 4, by which the flocculation force of the films is intensified and the existence of the film remaining is averted.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stamper for manufacturing a substrate for an information recording medium for optically recording / reproducing information.

[0002]

2. Description of the Related Art Conventionally, as a typical method of manufacturing a substrate for an optical recording medium, a stamper is prepared by an electroforming method, and the stamper is used to perform a compression method and 2P molding using a photocurable resin. The substrate is created by the method, extrusion molding method, or the like.

An optical recording medium substrate for optically recording / reproducing information is engraved with irregularities of a guide groove for tracking and fine preformat patterns such as address information pits. Conventionally, as a method of forming a substrate having these preformat patterns, the injection molding method and the compression molding method are known as described above. A roller grooving method by extrusion molding is known as a method for molding a substrate having a preformat pattern at a high speed and in a large amount. This is a thermoplastic resin that is heated and melted by an extruder and extruded from a T-die, passed between a mirror roll and a stamper roll, made into a sheet, and at the same time, the pre-formatted concavo-convex pattern is transferred to the resin surface, and then an optical disk or optical card. , A method for continuously molding a substrate for an optical information recording medium such as an optical tape. As a method of manufacturing a stamper roll used for this, as described in JP-A No. 2-110841, there is a method in which a roller is closely exposed using a paper-like glass mask and a roll-shaped stamper is directly stamped. Are known.

However, in the above-described method, a predetermined pattern (a spiral groove, a concentric circle or a stripe pattern such as tracking grooves and information pits) of a plurality of information recording media is formed on one roll stamper. Therefore, for example, if a defect or the like occurs in one or a plurality of patterns, the entire stamper roll will be replaced, and the utilization efficiency will be very poor.

In order to solve such a drawback, a method of producing a sheet-shaped flexible stamper by electroforming and fixing it to a roller has been proposed in JP-A-2-132661 and JP-A-2-217234.

FIG. 5 is a schematic view of the flexible stamper. Reference numeral 1 is a stamper, 2 is a preformat pattern for an information recording medium, and 3 is a fixture for fixing the stamper to a roller.

According to the above method, the stamper can be mounted in an extremely short time. Further, by preparing a plurality of stampers, if a specific stamper mounted on the surface of the roll base material has a defect, it is sufficient to replace only the stamper, so that the molding efficiency can be improved.

The stamper is an original type replica having a concave-convex pattern on its surface, that is, a stamper master, and an electroformed film is formed on the stamper master through a conductive sputtering film. The method of making it by peeling from is common.

Then, as a method of producing a replica type so-called replica from the original mold, an uncured photocurable resin [hereinafter referred to as 2P (photo pol
Yer) is added to the glass or plastic substrate, the mixture is spread, and then 2P is cured.

As another method, it is known that a photoresist is coated on a glass plate having excellent smoothness and a preformat pattern is directly formed on the photoresist by a laser beam to prepare a master for a stamper.

FIG. 6 shows a conventional stamper manufacturing method. In FIG. 6, the left side (A) shows the respective steps of forming the stamper when the 2P resin is used and the right side (B) is the case where the photoresist is used.

According to the conventional method, a metal sputtered film is provided on the patterned replica 2P or the photoresist for conductive treatment. Next, a metal plating film is provided on this metal sputtered film by electroforming. Then, the metal layer is polished to make the thickness of the stamper constant. Finally, the stamper is peeled off from the replica, that is, the stamper master.

In the layer structure of metal plating film / metal sputtered film (conductive film) / replica 2P or photoresist, the adhesion force between the respective layers must be sufficient to withstand the stress during the polishing process in order to perform the polishing process. I won't.

However, in the case of the final peeling, as shown in FIG.
Must be completely peeled off at either the interface A of the electroconductive sputtered film / replica 2P or the photoresist or the interface B of the metal plating film / electroconductive sputtered film shown in FIG.

[0015]

Conventionally, a single conductive sputtered film has been formed under the film forming conditions so as to improve the adhesion to the replica 2P or the photoresist surface. As a result, when the metal plating film is peeled from the replica 2P due to a slight change in the film forming conditions of the metal plating film and the degree of the presence of an oxide film on the surface of the metal sputter film, a part of the conductive sputtering film is on the replica 2P. However, as a result, a defect occurs in the pattern portion of the stamper, which is a problem.

In order to solve the above problems, the surface of the electroconductive sputtered film on which the electroformed layer is formed is treated with alkali to improve the adhesion between the electroconductive sputtered film and the electroformed film (metal plated film). However, the number of processes is increased and the cost is increased. Further, the waste liquid treatment of the alkaline treatment liquid becomes an environmental problem.

In order to improve the problem that a part of the conductive sputtered film remains on the replica 2P surface, it is considered that the adhesiveness between the conductive sputtered film and the replica 2P or the photoresist is lowered. The stress of the conductive sputtered film increases under the film forming condition of the sputter film, which deteriorates the conductivity, and the stress of the sputtered film itself causes the conductive sputtered film to become the replica 2P or the photoresist during the electroforming process or polishing process. Not only will it be peeled off from the surface, it will not be possible to polish it accurately, but polishing liquid etc. will enter the surface of the preformat pattern, or electroforming liquid etc. will enter, making it impossible to transfer the preformat pattern accurately. There was a flaw.

The present invention aims to solve the above problems.

[0019]

In order to solve the above problems, as a first method of the present invention, in a stamper manufacturing method of an optical information recording medium, a pre-format of a replica resin of a master master is used. There is provided a stamper manufacturing method characterized in that stress characteristics of a conductive sputtered film formed on a formation surface are different in a thickness direction of the conductive sputtered film.

The physical properties of the electroconductive sputtered film of the present invention are adjusted so as to be in close contact with the surface of the resist or the 2P replica, to be firmly in contact with the metal plating film, and to reduce the stress of the film.

As a result of the research and development by the present inventors, the cause of the conductive sputtered film remaining on the surface of the 2P replica resin or the photoresist is (1) the adhesion of the conductive sputtered film to the surface of the 2P replica resin or the photoresist is too good. (2) The cohesive force of the electroconductive sputtered film is low. (3) Part of the surface of the electroconductive sputtered film is oxidized before the metal plating step, and the metal plated film is less likely to adhere to the oxidized electroconductive sputtered film. Factors such as were discovered. The present invention was made based on the analysis results of the above (1) to (3).

The present invention will be described in detail with reference to FIG. 1 is an enlarged view of 2P replica resin / conductive sputtered film /
It is a diagram schematically showing the interface of the metal plating film.

As a result of the research and development by the present inventors, the 2P replica resin or the photoresist (in the interface A in FIG.
A layer of a conductive sputtered film that functions as an adhesion adjusting layer. The adhesion of the adhesion adjusting layer to the 2P replica resin or the photoresist is adjusted so that the adhesion can be relatively easily peeled off by external stress after the polishing step. The conditions for forming the conductive sputter film for adjusting adhesion are performed with relatively low energy. The stress of the electroconductive sputtered film of the adhesion adjusting layer is formed so as to exhibit tensile stress. The thickness of the adhesion control layer is preferably 50-500Å. No effect is observed when the thickness of the adhesion control layer is 50 Å or less. On the other hand, when it is 500 Å or more, the stress of the film becomes too large and the film is peeled off in the electroplating process or the polishing process. The conditions for forming the electroconductive sputtered film are as follows: pressure of sputter gas (mainly argon gas is used) in the sputter system (hereinafter abbreviated as P), flow rate of the sputter gas into the system (hereinafter abbreviated as F). , And discharge power (hereinafter abbreviated as W). The deposition energy (hereinafter abbreviated as E) is E = W /
Expressed as FP. When the power supply of the sputter is DC (direct current) and the conductive sputter film is Ni (nickel), P is 0.
5-0.8 (Pa), F is 20-50 (SCCM), W
Is set to 1000-1500 (W). A suitable value of E is 80-50 (W / (Pa * SCCM)), but the value varies depending on the device. Of the above film forming conditions, the pressure P in the system is particularly dominant, and the pressure in the system is 0.
By forming the film at 5 Pa or more, it becomes possible to have the function of the adhesion-controlled conductive sputtered film.

When the sputter power supply is a high frequency power supply, only the discharge power is significantly different and the power becomes 300-1000W. Therefore, an appropriate value of E is 60-40 (W / (Pa
* SCCM)).

Next, the film forming conditions are continuously changed on the adhesion adjusting conductive sputter film to form a low stress high density conductive sputter film. The adhesion-controlled conductive sputter film and the low-stress high-density conductive sputter film are continuously formed without stopping discharge of the sputter. Therefore, at the boundary between the contact adjusting conductive sputter film and the low-stress high-density conductive sputter film, the stress of the sputter film gradually changes and becomes smaller. The conditions for forming the low stress high density conductive sputtered film are N for the conductive sputtered film.
i (nickel), when the sputter gas is argon,
P is 0.2-0.4 (Pa), F is 20-50 (SCC
M) and W are set to 1000-1500 (W). E
A suitable value of is preferably 80 (W / (Pa * SCCM)) or more. In particular, it is a necessary condition to form a film at a system pressure P of 0.2-0.4 Pa. The system pressure is 0.2-
By forming the film at 0.4 Pa, the stress of the electroconductive sputtered film becomes small. As a result, in the electroplating (electroforming) step and the polishing step after forming the electroconductive sputtered film, the peeling of the film due to the large stress of the electroconductive sputtered film was improved. In addition, since the film-forming energy is large, the cohesive force of the film becomes large, so that the low-stress high-density conductive sputtered film is less likely to be oxidized even when exposed to air. The electrical resistance of the low-stress high-density conductive sputtered film is stabilized in-plane, and the adhesion with the metal plating film (electroformed film) is improved. By imparting different stress characteristics as described above in the thickness direction of the electroconductive sputtered film, an adhesion force that can withstand the electroforming step and the polishing step is obtained, and after the polishing step, stress is applied from the outside to make the conductive In the case of peeling the conductive sputtered film from the replica 2P or the resist master, the existence of the adhesion-adjusting conductive sputtered film enables easy peeling.

A second method of the present invention is a method of manufacturing a stamper for an optical information recording medium, which is a pattern of a mother stamper when a stamper for an optical information recording medium having an uneven preformat pattern is duplicated from the mother stamper. In a method of manufacturing a stamper, in which a conductive film is formed on the metal stamper, and a metal stamper is manufactured by electroforming, a contact adjustment made of a different material from the conductive film is provided between the conductive film and the mother stamper. It is characterized in that a single conductive film is provided.

Further, according to the method for manufacturing a stamper for an optical information recording medium of the present invention, the conductive film made of a material different from the conductive film is a single substance such as chromium, titanium, zirconium, molybdenum, vanadium, niobium or the like. Alternatively, it is a metal film made of nitride or oxide for adjusting adhesion.

Further, according to the method for manufacturing a stamper for an optical information recording medium of the present invention, the thickness of the adhesion adjusting conductive film of the different material is 20 to 200 angstrom.

Materials for the conductive film include platinum, gold, silver,
It is possible to use simple substances, alloys, and their nitrides or oxides of metals generally used in vapor deposition or sputtering such as copper and nickel.

As materials for the adhesion adjusting conductive film, chromium, titanium, zirconium, molybdenum, vanadium,
A simple substance such as niobium, or a nitride or an oxide is preferable,
It is not limited to these.

Conventionally, when these metals were used to form a film on a glass plate, it was possible to form a film with good adhesion to the glass surface. However, if these metals are formed alone, the adhesion will be strong. Therefore, the present invention was completed because the glass surface and the film formation surface could not be peeled off well. According to the method of the present invention, it was possible to obtain an adhesive force that can withstand polishing and to obtain a stamper that completely peels from the mother stamper.

[0032]

【Example】

(Example 1) This example illustrates the first means and method of the present invention.

A photocurable resin (made by Denki Kagaku Kogyo Co., Ltd.) is used as a spacer on the outer periphery of a 300 × 300 mm square original die having a pattern area of 250 × 250 mm.
Hard Rock OP4515) with an average particle size of 40 μm Microspheres (Nippon Ferrite, Expancel D)
Disperse U) in an amount of 5% by weight and dispense on the outer periphery of the original mold with a dispenser, and then 340 × 3
As shown in FIG. 2, 40 mm glass substrates having an injection port were overlapped with each other, and the photocurable resin was irradiated with UV to be cured to form a cell. The effective area of the cell is 270 x 270
mm. The pattern formed in the original pattern area was a pattern corresponding to a stripe-shaped optical card pre-groove having a width of 3 μm, a pitch of 12 μm, and a depth of 3000 Å.

Next, a photocurable resin (2P) was filled in the cavity 17 by the apparatus and method shown in FIG. First, as shown in FIG. 3A, the injection port 5 of the cell was connected to the funnel 14 with a Teflon (registered trademark) tube 13 and placed in a vacuum chamber. Furthermore, 2P (Nippon Kayaku
The funnel 14 'is separately arranged so that the INC 118) can be dropped into the funnel 14, and the funnel 14' is connected to the solenoid valve 1
The opening and closing operation can be performed from the outside of the chamber by the method 5.

Next, the air in the chamber was evacuated, the pressure inside the cavity 17 was adjusted to 0.1 Torr, the vacuum degree was maintained for 30 minutes, and 2P was degassed. Next, FIG.
As shown in (b), open the solenoid valve 15 and connect 2P to the funnel 1
After dripping in 4, the air was gradually leaked into the chamber 6. Eight hours after the start of the leak, the pressure in the chamber became atmospheric pressure, and 2P was injected into the cell. Further, as a result of visual inspection, no bubbles were found in the cells.

In this example, as 2P, an acrylic UV curable resin having a viscosity of 700 cps in an uncured state and a volume shrinkage rate of 3% after curing was used.

Then, the Teflon tube was removed from the cell inlet and UV light was irradiated from the glass substrate side to cure 2P. As a result of the visual inspection, "lifting" having a maximum width of 10 mm was generated in the peripheral portion of the spacer material, but "sink" was not recognized. When the original mold and the glass substrate were peeled off, the original mold concavo-convex pattern was faithfully transferred to the glass substrate 250 x 250 mm
A stamper master for an optical card having a replica 2P of was obtained.

Next, the stamper master thus obtained is set in a high frequency magnetron sputtering apparatus 10CP manufactured by Tokuda Seisakusho, and after evacuating to a predetermined pressure (4 × 10 ^-4 Pa), a preformat forming surface of the stamper master is set. above,
1 at Argon pressure of 0.55Pa and discharge power of 750W
For a minute, a Ni layer is formed as a contact adjusting conductive sputter film by a high frequency magnetron sputtering method. Then, the discharge was continued for 3 minutes while lowering the system pressure to 0.30 Pa, and finally the discharge was continued for 4 minutes at a system pressure of 0.30 Pa and a discharge power of 750 W to produce a low stress, high density Ni sputtered film. Was formed.

The stress of the film formed at 0.55 Pa and a discharge power of 750 W for 1 minute was tensile stress, which was 15 (N / m). The stress of the film formed for 4 minutes at a discharge power of 750 W at 0.30 Pa becomes almost zero, and the stress value is about 2 (N
/ M). The thickness of the whole Ni sputtered film is about 13
It was from 00Å to 1500Å. An electroformed film having a thickness of 200 μm was formed on the sputtered film in a nickel sulfanilate bath, and after polishing processing, the film was peeled from the stamper master, and no film residue of the sputtered film was observed.

(Example 2) A stamper master made of resist 2P was prepared in the same manner as in Example 1. Next, the stamper master thus obtained was set in a DC (direct current) power supply sputtering device manufactured by Vacuum Riko Co., Ltd., and at a predetermined pressure of 1.5 × 10 ^−4.
After evacuating to a vacuum of Pa, argon pressure in the system is 0.6 Pa on the preformat forming surface of the stamper master.
Argon flow rate 35 SCCM, discharge power 2.5 A, 500
A Ni sputter film was formed for 30 seconds under the condition of V to obtain a conductive sputter film for adjusting adhesion. The film thickness was 200Å. Next, only the condition of the argon pressure in the system was successively reduced to 0.4 Pa over 1 minute and 30 seconds. Next, a low-stress, high-density conductive Ni film was formed by sputtering for 2 minutes at 0.4 Pa. The total thickness of the electroconductive sputtered film was 2000 to 2500Å. An electroformed film of 200 μm was formed on the sputtered film in a nickel sulfanylate bath, and after polishing processing, the film was peeled off from the stamper master. No peeling of the sputtered film from the stamper master was observed due to the stress of the sputtered film during the formation of the electroformed film and the polishing process.

Comparative Example 1 Among the film forming conditions for the nickel sputtered film of Example 2, the pressure inside the argon system was kept constant at 0.4 Pa and the film was sputtered for 4 minutes to obtain a conductive sputtered film. A stamper was prepared by electroforming and polishing in the same manner as in 2.

Comparative Example 2 A stamper was prepared in the same manner as in Example 2 except that the pressure in the argon system of Comparative Example 1 was kept constant at 0.6 Pa. The results are shown in Table 1.

[0043] Note: Argon flow rate: 35 SCCM constant DC discharge power: 2.5 A, 500 V constant (Example 3) This example illustrates the second means and method of the present invention.

FIG. 4 shows the steps of manufacturing the stamper according to the method of the present invention.

First, as shown in FIG. 4A, a photoresist layer was formed on a substrate 104 such as soda lime glass (length 34 cm × width 30 cm). The photoresist 105 is WA
Using YCOAT HPR204 (manufactured by Fuji Hunt Electronics Technology Co., Ltd.), this was dropped on the substrate 104 and applied with a spinner to a film thickness of 3000 angstrom. Then, prebaking was performed under conditions of 100 ° C. and 20 minutes.

Next, a laser exposure device [mirror projector mask aligner. An exposure device such as MPA-1500 (manufactured by Canon Inc.) was used to expose predetermined patterns (stripes) on a plurality of information recording media.

Next, when development is carried out with an LSI developer (manufactured by Fuji Hunt Electronics Technology Co., Ltd.), the photoresist in the area exposed to the ultraviolet light flows away, the resist in the area not exposed remains, and the surface outside the pattern is roughened. And a glass master 1 for an optical card on which a fine pattern of irregularities such as tracking grooves and information pits is formed.
06 was obtained. (FIG. 4 (b)) Using this glass master 106, a unit for cast molding as shown in FIG. 4 (c) is assembled, and an ultraviolet curable resin (I
NC-118 (Nippon Kayaku Co., Ltd.) 108 is injected under reduced pressure, and then ultraviolet rays are irradiated to solidify the resin, and the cured resin is released from the master 106, as shown in FIG. A mother stamper 110 of an ultraviolet curable resin was obtained.

Further, as shown in FIG. 6E, as a pretreatment for forming a metal film by electroforming, a conductive film 111 is formed by sputtering on the preformat surface side of a mother stamper made of an ultraviolet curable resin. Filmed

As for the sputtering conditions, the same apparatus as in Example 1 was used, the degree of vacuum in the system was set to 4 × 10 ⁻⁴ Pa, the system argon pressure was set to 0.27 Pa, and the discharge power was set to 750 W. For 2 minutes.

Next, titanium was sputtered for 30 seconds at an argon pressure of 0.6 Pa in the system, and then nickel was sputtered for 8 minutes at an argon pressure of 0.25 Pa in the system to form a nickel film on the titanium film. .

The film thickness of titanium is 100 Å,
The nickel film thickness was 1500 Å.
The stress of the nickel film was almost zero.

Next, as shown in FIG. 3F, the conductive film 1
A metal film 112 is formed on the mother stamper 110 provided with 11 by electroforming.

First, the nickel stamper in the electroforming tank is used as the + side electrode, and the mother stamper 110 provided with the conductive film 111.
Was set on the negative electrode. At this time, it is preferable to use an outer peripheral electrode plate as the electrode plate. This is because the outer electrode plate has a better film thickness distribution than the inner electrode plate.
Also, if the outer peripheral electrode plate is made rectangular along the shape of the stamper, electric lines of force may concentrate on the edge part of the electrode plate, and the film thickness distribution may be extremely deteriorated. I was there.

Next, a glass master having a conductive film applied thereto was put in a nickel sulfamate electroforming solution at 20 to 30 rpm.
Time integrated value of energizing current 17-34A while rotating at
Under the condition of H (ampere hour), 100 to 200 μm of nickel metal was deposited to form the metal film 111.

The electroforming liquid used here is nickel sulfamate tetrahydrate [Ni (NH ₂ SO ₃ ) ₂ 4H ₂
O] 500 g / l, boric acid [H ₃ BO ₃ ] 35-38 g
/ L, pit inhibitor 2.5 ml / l.

Next, the obtained electroformed film was put on a polishing machine for each mother stamper, and the electroformed film was polished to make the film thickness uniform. At this time, the adhesion between the mother stamper and the titanium / nickel film was good, and the film was not peeled off during polishing due to the stress of the film.

Finally, as shown in FIG. 7G, the two-layer conductive film 111 and the metal film 112 were integrally peeled from the mother stamper 110. At this time, there was no residual sputtered film on the UV-curable resin surface of the mother stamper, and transfer was complete.

Finally, by cutting the outer periphery into a rectangle of 300 × 200 mm, a flexible stamper 101 having a linear tracking track pattern for an optical card having a width of 3 μm and a pitch of 12 μm was obtained.

Comparative Examples 3 and 4 Stampers were manufactured by the same manufacturing method as in Example 3 except for the film forming conditions of sputtering.

The sputtering conditions are shown in Table 2, and a titanium film and a nickel film were sequentially formed on the master stamper.

[0061] As a result, in all of Example 3, Comparative Example 3 and Comparative Example 4, the adhesion was good and no film peeling occurred during polishing.

Table 3 shows the thicknesses of the titanium and nickel films at this time.

[0063] After electroforming and polishing, the completed stamper was peeled off from the mother stamper. In Comparative Examples 3 and 4, the titanium film remained on the mother stamper, resulting in poor transfer. When the titanium film has a thickness of 200 Å or more, the titanium film does not have an island structure sufficiently, and the cohesive force of the film becomes strong, and the glass plate,
Alternatively, it is considered that a film residue occurs due to strong adhesion to the replica 2P surface.

From the above, it became clear that it is necessary to adjust the titanium film to about 20 to 200 angstroms.

[0065]

According to the first means and method of the present invention, it is possible to form a stamper in which no film residue of a sputter (conductive film) exists even if the pretreatment of the electroforming process is simplified. became.

Further, when the conductive film is formed on the pattern of the mother stamper by the second means and method, the conductive film and the mother stamper are adhered to each other by a different material from the conductive film. By providing a single conductive film for adjusting the force, it is possible to improve the adhesion between the mother stamper and the conductive film forming surface, and prevent film peeling in the subsequent steps. In addition, when the obtained stamper was peeled from the mother stamper, there was no film remaining of the conductive film, so that the stamper for optical information recording medium could be manufactured with high accuracy and high productivity.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a sputtered film according to a first method of the present invention.

FIG. 2 is a plan view and a cross-sectional view illustrating a method for manufacturing a 2P resin replica. (A) Plan view (b) Sectional drawing by the BB line of (a)

FIG. 3 is a schematic diagram illustrating a method of injecting 2P resin into a cell. (A) Status before injection (b) Status during injection

FIG. 4 is a cross-sectional view illustrating a step of manufacturing a stamper according to a second method of the present invention.

FIG. 5 is a schematic diagram illustrating a flexible stamper.

FIG. 6 is a schematic cross-sectional view illustrating a conventional stamper manufacturing method. (A) Using 2P resin (B) Using photoresist

[Explanation of symbols]

 1 Original type 1'Concavo-convex pattern 2 Glass substrate 3 Spacer material 4 Cell 5, 5'Inlet port 6 Chamber 7 Exhaust port 8 Inlet port 9 Unhardened 2P 10 Hardened 2P 11 Fixed plate 12 UV light 13 Teflon tube 14, 14 'funnel 15 Solenoid Valve 16 Protrusion 17 Cavity 22 Electroformed Film 23 Sputtered Film (Conductive Film) 24 Pregroove 101 Stamper 102 Preformat Pattern Area 103 Stamper Fixture 104 Glass Substrate 105 Photoresist 106 Glass Master 107 Glass Substrate 108 Ultraviolet Curing Resin 109 Casting unit sealing member 110 Mother stamper 111 Conductive film 112 Electroformed film

Claims (4)

[Claims] 1. A metal sputtering film is provided on a preformat pattern surface of a replica resin of a master master of a stamper for forming a preformat of an optical recording medium, and (2) a metal electroformed layer is formed on the metal sputtering film. In the manufacturing process described above, the method for manufacturing a stamper for an optical recording medium, wherein the metal sputtered film is formed so that its stress characteristics differ in the thickness direction at a constant rate. 2. When a stamper for an optical information recording medium having a concavo-convex preformat pattern is duplicated from a mother stamper, a conductive film is formed on the pattern of the mother stamper, and a metal stamper is formed by electroforming. In the method for manufacturing a stamper to be produced, one layer of a conductive film made of a material different from that of the conductive film is provided between the conductive film and the mother stamper. Production method. 3. A metal film for adjusting adhesion, wherein the conductive film made of a material different from that of the conductive film is a simple substance such as chromium, titanium, zirconium, molybdenum, vanadium, niobium, or a nitride or an oxide. 3. The method for manufacturing a stamper for an optical information recording medium according to claim 2. 4. The thickness of the conductive film of the different material is 20 to 20.
The method for manufacturing a stamper for an optical information recording medium according to claim 2, which has a thickness of 200 Å.