JPH0892601A - Conductive flake powder - Google Patents
Conductive flake powderInfo
- Publication number
- JPH0892601A JPH0892601A JP6229235A JP22923594A JPH0892601A JP H0892601 A JPH0892601 A JP H0892601A JP 6229235 A JP6229235 A JP 6229235A JP 22923594 A JP22923594 A JP 22923594A JP H0892601 A JPH0892601 A JP H0892601A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- conductive
- flake powder
- paste
- flake
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000843 powder Substances 0.000 title claims abstract description 67
- 239000002245 particle Substances 0.000 claims abstract description 32
- 239000004020 conductor Substances 0.000 abstract description 15
- 239000003795 chemical substances by application Substances 0.000 abstract description 7
- 239000002904 solvent Substances 0.000 abstract description 7
- 239000000203 mixture Substances 0.000 abstract description 4
- 238000001033 granulometry Methods 0.000 abstract 1
- 235000011837 pasties Nutrition 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000013035 low temperature curing Methods 0.000 description 7
- 239000011521 glass Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、微細電子回路の製造に
用いる導電性ペースト用粉末に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a powder for a conductive paste used for manufacturing a fine electronic circuit.
【０００２】[0002]
【従来の技術】従来、ベアチップＩＣ、フリップチップ
ＩＣ等のチップオンボード（ＣＯＢ）実装、その他の微
細電子回路の製造に導電性ペーストを使用している。こ
の導電性ペーストは、金属粉末等の導電性微粉末にエポ
キシ樹脂等の固化剤とブチルカルビトールアセテート等
の溶剤とを加えてペースト状としたものである。印刷な
どの方法によって基板の上に前記導電性ペーストによる
回路パターンを形成し、さらにベアチップＩＣを装着す
るなどしてから加熱固化して電子回路とする。2. Description of the Related Art Conventionally, conductive paste has been used for chip-on-board (COB) mounting of bare chip ICs, flip chip ICs, etc., and for manufacturing other fine electronic circuits. This conductive paste is a paste in which a solidifying agent such as epoxy resin and a solvent such as butyl carbitol acetate are added to conductive fine powder such as metal powder. A circuit pattern made of the conductive paste is formed on the substrate by a method such as printing, and a bare chip IC is mounted, and then heated and solidified to form an electronic circuit.
【０００３】前記導電性ペーストを使用する電子回路の
製作において、高温で加熱固化を行い導電性ペースト中
の溶剤や固化剤を十分に取除いて残った導電性粉末を焼
結する場合には、導電性ペーストに用いる導電性粉末と
しては一般に充填性の良い球状粉末を用いる。液晶など
の耐熱温度の低いエレメントを実装する場合のように、
導電性粉末が焼結するほど十分に高温に加熱することが
できない場合には、比較的低い温度で加熱して導電性ペ
ースト中に加えた樹脂を重合固化する低温硬化法によっ
て導電体を形成する。低温硬化法の場合には、主に導電
性ペースト中に混合する導電性粉末粒子の接触によって
導電性が得られる。この導電性粉末としては、粉末を偏
平化してフレーク状とすることによって粉末粒子間の接
触面積を増加させ導電性を向上したフレーク粉末を用い
る。In manufacturing an electronic circuit using the above-mentioned conductive paste, when heating and solidifying at high temperature to sufficiently remove the solvent and solidifying agent in the conductive paste and sinter the remaining conductive powder, As the conductive powder used for the conductive paste, a spherical powder having a good filling property is generally used. As when mounting an element with a low heat resistant temperature such as liquid crystal,
If the conductive powder cannot be heated to a temperature high enough to sinter, a conductor is formed by a low temperature curing method in which the resin added to the conductive paste is polymerized and solidified by heating at a relatively low temperature. . In the case of the low temperature curing method, conductivity is obtained mainly by contact of the conductive powder particles mixed in the conductive paste. As the conductive powder, flake powder in which the contact area between the powder particles is increased by flattening the powder into flakes to improve the conductivity is used.
【０００４】[0004]
【発明が解決しようとする課題】しかし、電子材料とし
て一般に使用されているフレーク粉末、例えばＡｇのフ
レーク粉末はタップ密度が２〜２．５ｇ／ｃｍ3 （真密
度の１９〜２４％）と低いので、ペースト化にあたって
粉末粒子間の空間を埋める樹脂成分を多く必要とする。
そのため、導電性粉末として従来のフレーク粉末を用い
た場合には比抵抗が１０-2〜１０-3Ωｃｍ程度と大きい
値となり、電極間のファインピッチ化の要求に適応し得
るほどに断面積の小さい導体膜とするために必要な比抵
抗５×１０ -4Ωｃｍ以下の導体膜を得ることは困難であ
った。However, as an electronic material,
Commonly used flake powders such as Ag flakes
Lake powder has a tap density of 2 to 2.5 g / cm3(Closeness
Since it is as low as 19 to 24%), when making it into a paste
Many resin components are required to fill the space between the powder particles.
Therefore, use conventional flake powder as the conductive powder.
If the resistance is 10-2-10-3Ωcm and large
Value, which can meet the demand for fine pitch between electrodes
The specific resistance required to obtain a conductor film with a smaller cross-sectional area
Anti 5 × 10 -FourIt is difficult to obtain a conductor film of Ωcm or less
It was.
【０００５】以上の現状に鑑みて、本発明が解決しよう
とする課題は、低温硬化法によって比抵抗が小さい導体
膜を形成することができる低温硬化用導電性ペーストに
用いる導電性フレーク粉末を提供することにある。In view of the above circumstances, the problem to be solved by the present invention is to provide a conductive flake powder used for a low temperature curing conductive paste capable of forming a conductor film having a small specific resistance by a low temperature curing method. To do.
【０００６】[0006]
【課題を解決するための手段】前記目的を達成するため
の本発明による導電性フレーク粉末は、導電性を有する
フレーク粉末において、前記フレーク粉末の粉末粒子の
長径（ｌ）と厚み（ｔ）の比ｌ／ｔ≧１０であり、前記
フレーク粉末の平均粒子径が粒ゲージで測定して２〜５
μｍであり、前記フレーク粉末のタップ密度が真密度の
３０％以上であることを特徴とする。The conductive flake powder according to the present invention for achieving the above-mentioned object is a conductive flake powder having a major axis (l) and a thickness (t) of powder particles of the flake powder. The ratio 1 / t ≧ 10, and the average particle diameter of the flake powder is 2 to 5 as measured by a particle gauge.
μm, and the tap density of the flake powder is 30% or more of the true density.
【０００７】本発明の導電性フレーク粉末は、低温硬化
用導電性ペーストに用いる。すなわち、前記導電性フレ
ーク粉末を固化剤および溶剤と混合してペースト状と
し、前記ペースト状組成物によって回路パターンを形成
し、加熱して溶剤を除去するとともに固化剤を硬化して
導電体を形成する。この状態において、前記導電性フレ
ーク粉末の各粒子は互に接触することによって導電性を
発揮する。前記フレーク粉末の製造は例えば原料粉をボ
ールミル等によって押しつぶし、所定形状のフレーク状
に調整することによって得られる。The conductive flake powder of the present invention is used in a low temperature curing conductive paste. That is, the conductive flake powder is mixed with a solidifying agent and a solvent to form a paste, a circuit pattern is formed by the paste composition, the solvent is removed by heating and the solidifying agent is hardened to form a conductor. To do. In this state, the particles of the conductive flake powder exhibit conductivity by contacting each other. The flake powder can be produced, for example, by crushing the raw material powder with a ball mill or the like and adjusting it into flakes having a predetermined shape.
【０００８】ここで、フレーク粉末粒子の長径と厚みの
比が１０未満では形成する前記導電体の比抵抗が大きく
なるため、微細電子回路用として十分に比抵抗の小さい
導体膜を得るためには長径と厚みの比を１０以上とする
ことが必要である。フレーク粉末の平均粒子径が小さい
と、ペーストの流動性が劣化して回路パターンを形成す
る際の作業性が悪くなる。従って、ペーストの流動性を
保持するためにペーストに多量の固化剤を添加すること
が必要となり、形成した導電体の比抵抗が大きくなる。
このため、フレーク粉末の平均粒子径の下限は２μｍと
する。If the ratio of the major axis of the flake powder particles to the thickness is less than 10, the specific resistance of the conductor to be formed becomes large. Therefore, in order to obtain a conductor film having a sufficiently small specific resistance for a fine electronic circuit. It is necessary to set the ratio of major axis to thickness to 10 or more. When the average particle diameter of the flake powder is small, the fluidity of the paste is deteriorated and the workability in forming a circuit pattern is deteriorated. Therefore, it is necessary to add a large amount of a solidifying agent to the paste in order to maintain the fluidity of the paste, and the specific resistance of the formed conductor increases.
Therefore, the lower limit of the average particle size of the flake powder is 2 μm.
【０００９】フレーク粉末の平均粒子径が大き過ぎる
と、ペーストとしたときにペーストの延びがわるく、回
路パターンを印刷によって形成するときに印刷むらを生
じるなどの不都合を生じる。このため、フレーク粉末の
平均粒子径の上限は５μｍとする。なお、平均粒子径
は、通常この種のペースト状組成物の平均粒子径の測定
に用いられる粒ゲージ法によって測定する。If the average particle size of the flake powder is too large, the paste does not spread well when formed into a paste, and printing irregularities occur when a circuit pattern is formed by printing. Therefore, the upper limit of the average particle size of the flake powder is 5 μm. The average particle size is usually measured by the particle gauge method used for measuring the average particle size of this type of paste composition.
【００１０】フレーク粉末のタップ密度が低いと、形成
する前記導電体の比抵抗が大きくなる。前記導電体の比
抵抗を十分に小さくするためには、フレーク粉末のタッ
プ密度を真密度の３０％以上とする必要がある。If the tap density of the flake powder is low, the specific resistance of the conductor formed will be high. In order to sufficiently reduce the specific resistance of the conductor, the tap density of the flake powder needs to be 30% or more of the true density.
【００１１】[0011]
【実施例】以下、本発明の実施例を詳細に説明する。化
学的液相還元法によって作成した粒子径およそ１μｍの
金属粉末を遊星ボールミルで処理してフレーク粉末を得
た。これらのフレーク粉末について、粉末粒子の長径と
厚みの比、平均粒径、タップ密度を測定した。それぞれ
の測定方法は次の通りである。EXAMPLES Examples of the present invention will be described in detail below. Flake powder was obtained by treating a metal powder having a particle diameter of about 1 μm prepared by a chemical liquid phase reduction method with a planetary ball mill. With respect to these flake powders, the ratio of the long diameter to the thickness of the powder particles, the average particle diameter, and the tap density were measured. Each measuring method is as follows.
【００１２】粉末粒子の長径と厚み：粉末試料にエポキ
シ樹脂、ブチルカルビトールアセテートを加えてペース
ト化し、これをガラス基板に厚さ５μｍに印刷し、温度
１２０℃で１時間加熱してエポキシ樹脂を硬化し、ガラ
ス基板上に導体膜を作成した。前記導体膜をガラス基板
とともに破折し、導体膜破面に現れた粉末粒子の破面を
走査型電子顕微鏡で観察し粉末粒子の長径と厚みを測定
した。Major axis and thickness of powder particles: Epoxy resin and butyl carbitol acetate were added to a powder sample to form a paste, which was printed on a glass substrate to a thickness of 5 μm and heated at a temperature of 120 ° C. for 1 hour to form an epoxy resin. After curing, a conductor film was formed on the glass substrate. The conductor film was fractured together with the glass substrate, and the fracture surface of the powder particles appearing on the fracture surface of the conductor film was observed with a scanning electron microscope to measure the major axis and thickness of the powder particles.
【００１３】平均粒径：前記と同様にして作成したペー
ストを、粒ゲージ法によって測定した。粒ゲージ法はテ
ーパーゲージ上にペーストを載せてスクレーパで引いた
とき、ペースト面にかき疵が現れるところを測定する方
法であり、ペーストが５０％かき取られたところの粒径
を平均粒径とした。 タップ密度：日本粉末冶金工業会規格 ＪＰＭＡ Ｐ−
０８（金属粉のタップ密度試験方法）によって測定し
た。Average particle size: The paste prepared as described above was measured by the particle gauge method. The grain gauge method is a method in which when a paste is placed on a taper gauge and pulled by a scraper, the scratches appearing on the paste surface appear, and the particle size at which 50% of the paste is scraped off is the average particle size. did. Tap Density: Japan Powder Metallurgical Industry Association Standard JPMA P-
08 (metal powder tap density test method).
【００１４】前記フレーク粉末に、エポキシ樹脂および
溶剤としてブチルカルビトールアセテートのそれぞれ所
定量を加えて、乳鉢でよく混合してペーストとした。前
記ペーストを用いてガラス基板に幅３ｍｍ、長さ６０ｍ
ｍ、厚さ２０μｍの厚膜パターンを印刷し、これを温度
１２０℃で１時間加熱して前記厚膜パターンを硬化して
試験体とした。前記試験体について４探子法によって電
気抵抗を測定し、比抵抗の値を算出した。それらの結果
を表１に示す。A predetermined amount of each of epoxy resin and butyl carbitol acetate as a solvent was added to the flake powder and mixed well in a mortar to form a paste. Width 3mm, length 60m on the glass substrate using the paste
A thick film pattern having a thickness of m and a thickness of 20 μm was printed, and this was heated at a temperature of 120 ° C. for 1 hour to cure the thick film pattern to obtain a test body. The electrical resistance of the test body was measured by the 4-probe method, and the specific resistance value was calculated. The results are shown in Table 1.
【００１５】印刷むら：ガラスパターンに厚膜を印刷
し、肉眼で印刷面のかすれ、むら等を観察した。Print unevenness: A thick film was printed on a glass pattern, and the print surface was visually observed for blurring, unevenness, and the like.
【００１６】[0016]
【表１】 [Table 1]
【００１７】表１から判るように、本発明の導電性フレ
ーク粉末を用いることによって、ベアチップＩＣの高密
度実装等に必要な５×１０-4Ωｃｍ以下の低い比抵抗を
有する導電膜が得られる。以上、本発明の実施例として
金属微粉末を用いた導電性フレーク粉末について例示し
たが、本発明の導電性フレーク粉末としては導電性を有
し、かつ、フレーク状にすることができる微粉末、例え
ばグラファイト粉末を用いることができることは言うま
でもない。As can be seen from Table 1, by using the conductive flake powder of the present invention, a conductive film having a low specific resistance of 5 × 10 −4 Ωcm or less necessary for high-density mounting of bare chip ICs can be obtained. . As mentioned above, the conductive flake powder using the fine metal powder as an example of the present invention is illustrated, but the conductive flake powder of the present invention has conductivity, and a fine powder that can be made into a flake shape, Needless to say, for example, graphite powder can be used.
【００１８】[0018]
【発明の効果】以上説明したように、本発明によると、
低温硬化法によって比抵抗が低い導体膜を形成すること
ができる低温硬化用導電性ペーストに用いる導電性フレ
ーク粉末を提供することができるという効果がある。As described above, according to the present invention,
There is an effect that it is possible to provide a conductive flake powder used for a low temperature curing conductive paste capable of forming a conductor film having a low specific resistance by the low temperature curing method.
Claims (1)
の比ｌ／ｔ≧１０であり、 前記フレーク粉末の平均粒子径が粒ゲージで測定して２
〜５μｍであり、 前記フレーク粉末のタップ密度が真密度の３０％以上で
あることを特徴とする導電性フレーク粉末。1. A flake powder having electrical conductivity, wherein the major axis (1) and the thickness (t) of the powder particles of the flake powder.
Is 1 / t ≧ 10, and the average particle size of the flake powder is 2 when measured with a particle gauge.
The conductive flake powder has a tap density of 30% or more of the true density.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6229235A JPH0892601A (en) | 1994-09-26 | 1994-09-26 | Conductive flake powder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6229235A JPH0892601A (en) | 1994-09-26 | 1994-09-26 | Conductive flake powder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0892601A true JPH0892601A (en) | 1996-04-09 |
Family
ID=16888951
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6229235A Pending JPH0892601A (en) | 1994-09-26 | 1994-09-26 | Conductive flake powder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0892601A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009105045A (en) * | 2007-10-12 | 2009-05-14 | Cheil Industries Inc | Electrode forming composition containing aluminum content of flake shape and electrode manufactured by using the composition |
| JP2011134630A (en) * | 2009-12-25 | 2011-07-07 | Jsr Corp | Conductive paste |
-
1994
- 1994-09-26 JP JP6229235A patent/JPH0892601A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009105045A (en) * | 2007-10-12 | 2009-05-14 | Cheil Industries Inc | Electrode forming composition containing aluminum content of flake shape and electrode manufactured by using the composition |
| JP2011134630A (en) * | 2009-12-25 | 2011-07-07 | Jsr Corp | Conductive paste |
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