JPH088826Y2 - Long thermal head - Google Patents
Long thermal headInfo
- Publication number
- JPH088826Y2 JPH088826Y2 JP7355388U JP7355388U JPH088826Y2 JP H088826 Y2 JPH088826 Y2 JP H088826Y2 JP 7355388 U JP7355388 U JP 7355388U JP 7355388 U JP7355388 U JP 7355388U JP H088826 Y2 JPH088826 Y2 JP H088826Y2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- resistor
- plate
- thermal head
- slit portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Electronic Switches (AREA)
Description
【考案の詳細な説明】 (産業上の利用分野) 本考案はファクシミリやプリンタなどで使用するサー
マルヘッドに関し、特に複数の抵抗体基板を長手方向に
配列して固定した長尺サーマルヘッドに関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a thermal head used in a facsimile, a printer, etc., and more particularly to a long thermal head having a plurality of resistor substrates arranged and fixed in the longitudinal direction. is there.
(従来の技術) 例えばA4サイズやB4サイズといった長尺サーマルヘッ
ドを1枚の長尺基板上に薄膜プロセスなどにより形成し
ようとすると、基板サイズが長くなるほど製造歩留りが
低下し、サーマルヘッドが高価なものになってしまう。
そこで、歩留りを向上させるために、短尺の抵抗体基板
を長手方向につなぎ合わせて長尺サーマルヘッドとする
方法がとられている。(Prior Art) For example, when a long thermal head of A4 size or B4 size is formed on one long substrate by a thin film process, the manufacturing yield decreases as the substrate size increases, and the thermal head becomes expensive. It becomes a thing.
Therefore, in order to improve the yield, there has been adopted a method of connecting short resistor substrates in the longitudinal direction to form a long thermal head.
(考案が解決しようとする課題) 表面に発熱抵抗体が形成された短尺の抵抗体基板を支
持板上に長手方向に配列して固定する際、抵抗体基板間
の接合部では抵抗体基板の厚みの差や支持板へ固定する
際の高さ調整の差により、段差が生じる。この段差は、
通常5μm以下に抑えることは困難である。(Problems to be solved by the invention) When a short resistor substrate having a heating resistor formed on its surface is arranged and fixed in the longitudinal direction on a support plate, the resistor substrate is bonded at the joint between the resistor substrates. A step is generated due to a difference in thickness and a difference in height adjustment when fixing the support plate. This step is
Usually, it is difficult to suppress the thickness to 5 μm or less.
抵抗体基板間の接合部で段差が生じると、その段差部
で感熱記録紙や熱転写紙などとの接触圧力に差異が生
じ、印字品質が劣化する問題がある。If a step is formed at the joint between the resistor substrates, there is a difference in contact pressure with the thermal recording paper or thermal transfer paper at the step, and there is a problem that print quality is deteriorated.
本考案は複数の抵抗体基板を支持板上で長手方向に配
列して固定した長尺サーマルヘッドの接合部の段差を少
なくする機構を備えた長尺サーマルヘッドを提供するこ
とを目的とするものである。An object of the present invention is to provide a long thermal head having a mechanism for reducing a step difference at a joint portion of a long thermal head in which a plurality of resistor substrates are arranged and fixed in a longitudinal direction on a support plate. Is.
(課題を解決するための手段) 本考案では、支持板の抵抗体基板接合部に支持板の表
面から裏面に貫通し、支持板の一端から幅方向に途中ま
で延び、抵抗体基板接合下に位置するスリット部を少な
くとも備えた溝を設け、固定板には前記スリット部を挾
む位置にスリット部で仕切られた単位ごとに支持板の高
さを調整する機構を設けた。(Means for Solving the Problems) In the present invention, the resistor substrate joint portion of the support plate penetrates from the front surface of the support plate to the back surface, extends from one end of the support plate to the middle in the width direction, and is connected under the resistor substrate joint. A groove having at least a slit portion to be positioned was provided, and the fixing plate was provided with a mechanism for adjusting the height of the support plate for each unit partitioned by the slit portion at a position sandwiching the slit portion.
(作用) 抵抗体基板と支持板の間、及び支持板と固定板の間を
固定してサーマルヘッドを組み立てた後、抵抗体基板の
接合部の段差を測定器によって測定しながら又は印字を
行ないながら、高さ調整機構によって支持板を溝部分で
変位させて抵抗体基板の接合部の段差を小さくする。(Operation) After assembling the thermal head by fixing the resistor board and the support plate, and between the support plate and the fixed plate, while measuring the step of the joint part of the resistor board with a measuring instrument or printing, The support mechanism is displaced in the groove portion by the adjusting mechanism to reduce the step difference at the joint portion of the resistor substrate.
(実施例) 第1図は一実施例における支持板を表わしている。(Embodiment) FIG. 1 shows a support plate in one embodiment.
支持板1にはその上に接着されて固定される抵抗体基
板の接合部が位置するところに溝2が設けられている。
溝2は支持板1の表面から裏面に貫通する溝であり、T
字型をしている。2aはその溝2のスリット部であり、ス
リット部2aは支持板1の一端から幅方向に途中まで延び
ている。スリット部2aの一端は支持板1の長手方向に延
びる溝部2bにつながっている。A groove 2 is provided in the support plate 1 at a position where a joint portion of a resistor substrate which is adhered and fixed thereon is located.
The groove 2 is a groove that penetrates from the front surface to the back surface of the support plate 1,
It has a character shape. Reference numeral 2a is a slit portion of the groove 2, and the slit portion 2a extends from one end of the support plate 1 partway in the width direction. One end of the slit portion 2a is connected to the groove portion 2b extending in the longitudinal direction of the support plate 1.
この溝2により、スリット部2aを挾む部分3a,3bが支
持板1の表面と垂直な方向に変位することができる。With this groove 2, the portions 3a and 3b sandwiching the slit portion 2a can be displaced in a direction perpendicular to the surface of the support plate 1.
第2図はこの支持板1上に2枚の抵抗体基板4a,4bを
接着し固定した状態を表わしている。FIG. 2 shows a state in which two resistor substrates 4a and 4b are adhered and fixed on the support plate 1.
2枚の抵抗体基板4a,4bの端辺の接合部5が溝2のス
リット部2a上にくるように、抵抗体基板4a,4bと支持板
1を位置決めをする。The resistor substrates 4a and 4b and the support plate 1 are positioned so that the joints 5 at the end sides of the two resistor substrates 4a and 4b are on the slits 2a of the groove 2.
第3図は第2図の要部の正面図である。 FIG. 3 is a front view of the main part of FIG.
抵抗体基板4aと抵抗体基板4bに厚みの差があり、例え
ば抵抗体基板4bの方が厚いものとする。支持板1上に抵
抗体基板4a,4bを接着した状態では、接合部5で抵抗体
基板4a,4bの厚みの差による段差が生じる。There is a difference in thickness between the resistor substrate 4a and the resistor substrate 4b, and for example, the resistor substrate 4b is thicker. In the state where the resistor substrates 4a and 4b are adhered to the support plate 1, a step due to the difference in thickness of the resistor substrates 4a and 4b occurs at the joint portion 5.
第4図は抵抗体基板4a,4bが接着された支持板1を固
定板6に固定ねじ(図示略)によって固定し、抵抗体基
板4a,4bの表面の高さを調整した状態を表わしている。FIG. 4 shows a state in which the support plate 1 to which the resistor substrates 4a and 4b are adhered is fixed to the fixing plate 6 with a fixing screw (not shown), and the height of the surface of the resistor substrates 4a and 4b is adjusted. There is.
固定板6には支持板1の溝のスリット部2aを挾む位置
にねじ孔7a,7bが設けられている。ねじ孔7a,7bには固定
板6の下側から高さ調整用の調整ねじ8a,8bがそれぞれ
ねじ込まれ、調整ねじ8a,8bの先端が支持板1の部分3a,
3bに当接することによって抵抗体基板4a,4bの表面の高
さを調整することができるようになっている。ねじ孔7
a,7bと調整ねじ8a,8bは高さ調整機構を構成している。The fixed plate 6 is provided with screw holes 7a and 7b at positions where it sandwiches the slit portion 2a of the groove of the support plate 1. Adjustment screws 8a and 8b for height adjustment are respectively screwed into the screw holes 7a and 7b from the lower side of the fixed plate 6, and the tips of the adjustment screws 8a and 8b are the portions 3a of the support plate 1.
By making contact with 3b, the height of the surfaces of the resistor substrates 4a, 4b can be adjusted. Screw hole 7
The a and 7b and the adjusting screws 8a and 8b form a height adjusting mechanism.
抵抗体基板4a,4bの表面の高さは、抵抗体基板4a,4bと
支持板1の間を接着固定し、支持板1と固定板6の間を
固定ねじによって固定した後、抵抗体基板4a,4bの表面
を表面粗さ計で測定しながら調整し、又は印字動作を行
ないながら調整する。The height of the surfaces of the resistor substrates 4a and 4b is determined by adhesively fixing the resistor substrates 4a and 4b and the supporting plate 1 and fixing the supporting plate 1 and the fixing plate 6 with a fixing screw. Adjust while measuring the surface of 4a, 4b with a surface roughness meter, or while performing printing operation.
第5図及び第6図は支持板1の溝2の他の形状の例を
表わしている。5 and 6 show examples of other shapes of the groove 2 of the support plate 1.
第5図は溝2がスリット部のみを備えているもの、第
6図はスリット部の一端に円形の孔が設けられたもので
ある。接合部での高さの調整は数μmというようにごく
僅かであるので、第5図又は第6図の溝2でも目的を達
成することができる。FIG. 5 shows that the groove 2 has only a slit portion, and FIG. 6 shows that the circular hole is provided at one end of the slit portion. Since the height adjustment at the joint is very small, such as several μm, the purpose can be achieved even with the groove 2 shown in FIG. 5 or FIG.
各部材の材質の例を示すと、支持板1としてはアルミ
ニウム板やステンレス板などを使用することができ、抵
抗体基板4a,4bとしてはアルミナセラミックスなどを使
用することができ、固定板6としてはアルミニウム板や
ステンレス板などを使用することができる。As an example of the material of each member, an aluminum plate or a stainless plate can be used as the support plate 1, alumina ceramics or the like can be used as the resistor substrates 4a and 4b, and the fixing plate 6 can be used. Can be an aluminum plate or a stainless plate.
第2図の実施例では2枚の抵抗体基板4a,4bをつなぎ
合わせたサーマルヘッドの例を示しているが、3枚以上
の抵抗体基板をつなぎ合わせる場合も同様であり、支持
板1の抵抗体基板接合部に第1図、第5図、第6図など
に示されるような溝2を設け、各溝2のスリット部を挟
んで調整ねじ8a,8bを取りつけ、抵抗体基板表面の高さ
を接合部ごとに調整するようにすればよい。The embodiment of FIG. 2 shows an example of a thermal head in which two resistor substrates 4a and 4b are joined together, but the same is true when three or more resistor substrates are joined together. The groove 2 as shown in FIG. 1, FIG. 5 and FIG. 6 is provided in the resistor substrate joint, and the adjusting screws 8a and 8b are attached with the slit portion of each groove 2 sandwiched between the resistor substrate surface. The height may be adjusted for each joint.
(考案の効果) 本考案のサーマルヘッドでは、支持板には抵抗体基板
接合部に支持板の表面から裏面に貫通し、支持板の一端
から幅方向に途中まで延び、抵抗体基板接合下に位置す
るスリット部を少なくとも備えた溝を設け、固定板には
前記スリット部を挾む位置にスリット部で仕切られた単
位ごとに支持板の高さを調整する機構を設けて、抵抗体
基板の接合部での表面高さを調整することができるよう
にしたので、段差量を5μm以下に調整することが容易
となる。(Effect of the Invention) In the thermal head of the present invention, the support plate penetrates from the front surface of the support plate to the back surface of the support plate, extends from one end of the support plate to the middle in the width direction, and under the resistance substrate connection. A groove having at least a slit portion located is provided, and a fixing plate is provided with a mechanism for adjusting the height of the support plate for each unit partitioned by the slit portion at a position sandwiching the slit portion, and Since the surface height at the joint can be adjusted, it becomes easy to adjust the step amount to 5 μm or less.
第1図は一実施例の支持板の要部を示す斜視図、第2図
は一実施例で支持板上に2枚の抵抗体基板を接着した状
態を示す斜視図、第3図は第2図の要部正面図、第4図
は一実施例の要部断面図、第5図及び第6図はそれぞれ
他の実施例における支持板の溝形状を示す要部平面図で
ある。 1……支持板、2……溝、2a……スリット部、4a,4b…
…抵抗体基板、5……接合部、6……固定板、7a,7b…
…ねじ孔、8a,8b……調整ねじ。FIG. 1 is a perspective view showing a main part of a support plate of one embodiment, FIG. 2 is a perspective view showing a state where two resistor substrates are bonded on the support plate in one embodiment, and FIG. 2 is a front view of an essential part of FIG. 2, FIG. 4 is a cross-sectional view of the essential part of one embodiment, and FIGS. 5 and 6 are plan views of the essential parts showing the groove shapes of the supporting plate in another embodiment. 1 ... Support plate, 2 ... Groove, 2a ... Slit part, 4a, 4b ...
... resistor substrate, 5 ... joint, 6 ... fixing plate, 7a, 7b ...
… Screw holes, 8a, 8b …… Adjusting screws.
Claims (1)
熱抵抗体が形成された複数の抵抗体基板を長手方向に配
列して固定した長尺サーマルヘッドにおいて、 前記支持板には前記抵抗体基板接合部に支持板の表面か
ら裏面に貫通し、支持板の一端から幅方向に途中まで延
び、前記抵抗体基板接合部下に位置するスリット部を少
なくとも備えた溝を設け、前記固定板には前記スリット
部を挾む位置に前記スリット部で仕切られた単位ごとに
支持板の高さを調整する機構を設けたことを特徴とする
サーマルヘッド。1. A long thermal head comprising a support plate fixed to a fixed plate, and a plurality of resistor substrates having heating resistors formed on the surface thereof arranged in the longitudinal direction and fixed, wherein: The resistor substrate joint portion is provided with a groove penetrating from the front surface to the back surface of the support plate, extending from one end of the support plate to the middle in the width direction, and having at least a slit portion located below the resistor substrate joint portion, and the fixing. The plate is provided with a mechanism for adjusting the height of the support plate for each unit partitioned by the slit portion at a position sandwiching the slit portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7355388U JPH088826Y2 (en) | 1988-05-31 | 1988-05-31 | Long thermal head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7355388U JPH088826Y2 (en) | 1988-05-31 | 1988-05-31 | Long thermal head |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01175828U JPH01175828U (en) | 1989-12-14 |
JPH088826Y2 true JPH088826Y2 (en) | 1996-03-13 |
Family
ID=31298691
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7355388U Expired - Lifetime JPH088826Y2 (en) | 1988-05-31 | 1988-05-31 | Long thermal head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH088826Y2 (en) |
-
1988
- 1988-05-31 JP JP7355388U patent/JPH088826Y2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01175828U (en) | 1989-12-14 |
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