JPH0886812A - Laminate probe contact for very small pitch inspection - Google Patents

Laminate probe contact for very small pitch inspection

Info

Publication number
JPH0886812A
JPH0886812A JP7149789A JP14978995A JPH0886812A JP H0886812 A JPH0886812 A JP H0886812A JP 7149789 A JP7149789 A JP 7149789A JP 14978995 A JP14978995 A JP 14978995A JP H0886812 A JPH0886812 A JP H0886812A
Authority
JP
Japan
Prior art keywords
probe contact
probe
needle portion
contact
ultra
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7149789A
Other languages
Japanese (ja)
Other versions
JP2819452B2 (en
Inventor
Shigeo Kiyota
清田茂男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
KIYOTA SEISAKUSHO KK
Kiyota Manufacturing Co
Original Assignee
KIYOTA SEISAKUSHO KK
Kiyota Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KIYOTA SEISAKUSHO KK, Kiyota Manufacturing Co filed Critical KIYOTA SEISAKUSHO KK
Priority to JP7149789A priority Critical patent/JP2819452B2/en
Publication of JPH0886812A publication Critical patent/JPH0886812A/en
Priority to KR1019960017863A priority patent/KR100206093B1/en
Priority to US08/941,738 priority patent/US6034534A/en
Application granted granted Critical
Publication of JP2819452B2 publication Critical patent/JP2819452B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE: To provide a probe contact which can inspect a very small pitch- interval circuit such as highly integrated circuit a plurality of times without trouble. CONSTITUTION: The probe contacts are formed from a ultrathin sheet and covered with an insulating film excluding at least a contact part of needle parts 12 thereof. A cut 13 is formed on the sheet in the rear of the needle parts to make a long thin plate body 14 with the needle parts arranged successively. The needle parts are made movable elastically in the longitudinal direction of the cut. The probe contacts thus arranged are laminated in plurality in layers.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】この発明は、超微小なピッチ間隔
の半導体、液晶等の電極若しくはパタ−ン等の断線、シ
ョート等を精密にトライ検査することのできる超微小ピ
ッチ検査用積層プローブコンタクトに関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ultra-fine pitch inspection laminated layer capable of performing a precise tri-inspection for disconnection, short circuit, etc. of an electrode or pattern of a semiconductor or liquid crystal having an ultra-fine pitch interval. It relates to probe contacts.

【0002】[0002]

【従来の技術】微小なピッチ間隔の高集積回路、IC、
LSI等の回路検査には、従来主として、図5に示すよ
うに、高集積回路1の端子部2に当接するように、先端
を折曲した多数の微小なプロ−ブピン3を並設してなる
カ−ド式プロ−ブコンタクトが使用されている。しかし
て最近、エレクトロ業界の目覚ましい技術進歩に伴い、
ピッチ間隔が0.06mmという超微小な高集積回路等
が開発されてきたが、この従来のカ−ド式プロ−ブコン
タクトでは、この超微小な高集積回路等の検査に対応す
ることができなかった。0.06mmのピッチ間隔の高
集積回路等を検査するには、前記プロ−ブピン3の間隔
が0.06mm以下でなければならないが、従来のカ−
ド式プロ−ブコンタクトでは、隣接するプロ−ブピン3
は、絶縁体被覆をすることができなかったので、接触し
ないようにしなければならず、そのためある程度の間隔
が必要であり、0.12mmが限度であったからであ
る。
2. Description of the Related Art Highly integrated circuits, ICs, having a minute pitch interval
In the circuit inspection of an LSI or the like, conventionally, as shown in FIG. 5, a large number of minute probe pins 3 each having a bent tip are arranged in parallel so as to abut the terminal portion 2 of the highly integrated circuit 1. The following card type probe contacts are used. But recently, with the remarkable technological progress of the electro industry,
Although ultra-fine highly integrated circuits with a pitch interval of 0.06 mm have been developed, this conventional card-type probe contact must support inspection of these ultra-fine highly integrated circuits. I couldn't. In order to inspect a highly integrated circuit having a pitch interval of 0.06 mm, the interval between the probe pins 3 must be 0.06 mm or less.
In the case of a drive probe contact, the adjacent probe pin 3
Since the insulator coating could not be applied, it must be prevented from contacting, so that a certain distance is necessary, and the limit is 0.12 mm.

【0003】このような問題点を解決するため、本出願
人は、プロ−ブコンタクトを超薄板で形成したプローブ
コンタクトを開発し、先に特許出願した。しかして、こ
のコンタクトプロ−ブは、超薄板の厚さを0.06mm
以下とすることができることと、絶縁体被覆も容易に形
成することができることから、0.06mm以下という
超微小な高集積回路等の検査に十分対応することができ
るものであったが、弾性移動のバネ性耐久力が弱かった
ので、数十万回という多数回の検査に対応することがで
きない問題があった。
In order to solve such a problem, the present applicant has developed a probe contact in which the probe contact is made of an ultrathin plate, and has previously filed a patent application. This contact probe has an ultra-thin plate thickness of 0.06 mm.
Since the following can be done and the insulator coating can be easily formed, it can sufficiently cope with the inspection of an ultra-fine highly integrated circuit of 0.06 mm or less, Since the durability of the spring property of movement was weak, there was a problem that it was not possible to support a large number of inspections of hundreds of thousands of times.

【0004】[0004]

【発明が解決しようとする課題】この発明は、このよう
な問題点を解決しようとするものであり、0.06mm
という超微小なピッチ間隔の高集積回路等の回路検査を
数十万回という多数回支障なく行うことができるプロー
ブコンタクトを提供することを目的とする。
DISCLOSURE OF THE INVENTION The present invention is intended to solve such a problem, and is 0.06 mm.
It is an object of the present invention to provide a probe contact that can perform circuit inspection of a highly integrated circuit or the like having an ultra-fine pitch interval hundreds of thousands of times without trouble.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するた
め、本発明者は鋭意研究の結果、プロ−ブコンタクトを
超薄板に形成し、該プロ−ブコンタクトのニ−ドル部の
後方の前記薄板に切り込みを形成し、該ニ−ドル部を切
り込み方向の前後方向に弾性移動し得るように構成する
ことによって、数十万回という多数回の検査を支障なく
行うことができることを見いだし、本発明に到達した。
In order to achieve the above object, the present inventor, as a result of diligent research, formed a probe contact in an ultra-thin plate, and provided the probe contact at the rear of the needle portion. By forming a notch in the thin plate, and by configuring the needle portion so as to be elastically movable in the front-rear direction of the notch, it is found that a large number of inspections of hundreds of thousands of times can be performed without hindrance. The present invention has been reached.

【0006】即ち、本発明は、プロ−ブコンタクトを超
薄板で形成し、該プロ−ブコンタクトは、ニ−ドル部の
少なくとも接触部を除いて絶縁体被膜で被覆し、該ニ−
ドル部の後方の前記薄板に切り込みを形成してニ−ドル
部を連設した細長い板体とし、ニ−ドル部を該切り込み
方向の前後方向に弾性移動し得るように構成してなるプ
ロ−ブコンタクトを、多数枚積層したことを特徴とす
る。しかして従来、ニ−ドル部の後方に切り込みを形成
することも、プロ−ブコンタクトを薄板で形成すること
も、プロ−ブコンタクト同士を接触させて積層すること
も全く知られていない。
That is, according to the present invention, the probe contact is formed of an ultra-thin plate, and the probe contact is covered with an insulating film except at least the contact portion of the needle portion, and the needle contact is formed.
A thin plate at the rear of the dollar portion is formed with a slit to form an elongated plate body in which the needle portion is continuously provided, and the needle portion can be elastically moved in the front-rear direction of the slit. It is characterized in that a large number of contact layers are laminated. In the past, however, it has not been known at all to form a notch at the rear of the needle portion, to form the probe contact with a thin plate, or to stack the probe contacts in contact with each other.

【0007】[0007]

【実施例】次に、本発明の実施例を図面に基づいて説明
する。図1は、本発明の実施例を示す側面図であり、プ
ロ−ブコンタクト11を厚さ0.06mm以下の超薄板
に形成し、ニ−ドル部12を菱形の枠体に形成し、ニ−
ドル部12の後方に切り込み13を形成した例を示す。
ニ−ドル部12は、図1の矢印で示すように、前後方向
に弾性移動し得るようになっている。尚、図中15は、
リ−ド線取付用の端子部である。
Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a side view showing an embodiment of the present invention, in which the probe contact 11 is formed in an ultrathin plate having a thickness of 0.06 mm or less, and the needle portion 12 is formed in a diamond-shaped frame. Nee
An example in which the notch 13 is formed behind the dollar portion 12 is shown.
The needle portion 12 can be elastically moved in the front-rear direction as shown by the arrow in FIG. In the figure, 15 is
It is a terminal portion for attaching a lead wire.

【0008】ニ−ドル部12を連設した細長い板体14
の長さ(切り込み13の長さと同じ)を選択することに
よって、弾性移動する弾性力(バネ圧)を所望の値に設
定することができる。また、切り込み13の厚さを選択
することによって、先端ニ−ドル部12の弾性移動する
ストロ-クを調整することができる。図2の実施例に於
いては、切り込み13の厚みが図1に比べて、1/3の
厚さになっている。更に微細なバネ圧に調整するには、
図2に示すように、細長い板体14の上端に凹状のカッ
ト部18を形成すると良い。切り込み13の長さと凹状
のカット部18の大きさとを選択することによって、所
望の微細なバネ圧に調整することができる。本発明のプ
ロ−ブコンタクト11には、ニ−ドル部12を除いて、
フッ素樹脂(テフロン)の絶縁体被膜が形成されてい
る。絶縁体被膜は、ニ−ドル部12の電極若しくはパタ
−ン等との接触部以外は、全て形成しても差し支えな
い。また、良好な絶縁性が得られるなら、4弗化樹脂
(テフロン)以外の絶縁材であっても差し支えない。
A slender plate body 14 in which a needle portion 12 is connected in series.
By selecting the length (the same as the length of the notch 13), it is possible to set the elastic force (spring pressure) that elastically moves to a desired value. Further, by selecting the thickness of the notch 13, it is possible to adjust the stroke of elastic movement of the tip needle portion 12. In the embodiment of FIG. 2, the thickness of the notch 13 is 1/3 of that of FIG. To adjust to a finer spring pressure,
As shown in FIG. 2, a concave cut portion 18 may be formed on the upper end of the elongated plate body 14. By selecting the length of the notch 13 and the size of the concave cut portion 18, it is possible to adjust to a desired fine spring pressure. In the probe contact 11 of the present invention, except for the needle portion 12,
An insulating film of fluororesin (Teflon) is formed. The insulator coating may be formed entirely except for the contact portion of the needle portion 12 with the electrode or pattern. Further, an insulating material other than tetrafluororesin (Teflon) may be used as long as good insulating properties can be obtained.

【0009】プロ−ブコンタクト11に絶縁体被膜を形
成するには、蒸着法または静電被覆法によって、フッ素
樹脂微粉末を被覆すれば良い。本発明のプロ−ブコンタ
クトは、鋼、銅合金、タングステンまたは焼入れ帯鋼板
から形成するのが好ましい。このような材質から形成す
ると、0.02mmという超薄板に容易に形成すること
ができる。プロ−ブコンタクト11には、それぞれ4個
の貫通孔16が形成されている。上記貫通孔に、それぞ
れ積層用ガイドピンを嵌挿し、ガイドピンの両端は、積
層したプロ−ブコンタクト11を収容する枠体に固定す
ることによって、本発明の積層プロ−ブコンタクトとす
ることができる。プロ−ブコンタクト11に形成する貫
通孔16の個数は、複数であれば特に限定されない。ま
た、同形状の厚さ0.06mm以下に形成したプロ−ブ
コンタクト11を単に一列に多数積層すれば良いので、
貫通孔16は必ずしも必要ではない。
In order to form the insulator film on the probe contact 11, it is sufficient to coat the fluororesin fine powder by a vapor deposition method or an electrostatic coating method. The probe contacts of the present invention are preferably formed from steel, copper alloys, tungsten or hardened steel strip. If formed from such a material, it can be easily formed into an ultra-thin plate of 0.02 mm. Each of the probe contacts 11 is formed with four through holes 16. The laminated guide pins are inserted into the through holes, and both ends of the guide pins are fixed to the frame body for accommodating the laminated probe contacts 11, thereby forming the laminated probe contact of the present invention. it can. The number of through holes 16 formed in the probe contact 11 is not particularly limited as long as it is plural. Further, since the probe contacts 11 having the same shape and a thickness of 0.06 mm or less may be simply stacked in a row,
The through hole 16 is not always necessary.

【0010】本発明のプロ−ブコンタクト取付枠体は、
通常絶縁材料を用いるが、特に剛性を必要とする場合
は、特殊合金等の金属を用いることができる。この場
合、金属は、絶縁被覆しなくとも、接触するプロ−ブコ
ンタクトが絶縁被覆されているので差し支えない。図1
に示す実施例に於いては、ニ−ドル部12は、菱形の枠
体に形成されている。このように形成すると、ニ−ドル
部12自体も屈曲するので、プロ−ブコンタクト11の
バネ性が向上する。しかしながら、図3に示すように、
先端ニ−ドル部は、細長い板体14に突起12′を形成
したものであっても、図4に示すように、略S字形1
2′′に形成したものであっても差し支えない。また、
図2に示すように、菱形の枠体の先端に突起17を形成
しても良い。
The probe contact mounting frame of the present invention comprises:
Although an insulating material is usually used, a metal such as a special alloy can be used particularly when rigidity is required. In this case, even if the metal is not insulation-coated, there is no problem because the probe contact to be contacted is insulation-coated. FIG.
In the embodiment shown in (1), the needle portion 12 is formed in a diamond-shaped frame. If formed in this way, the needle portion 12 itself also bends, so that the spring property of the probe contact 11 is improved. However, as shown in FIG.
As shown in FIG. 4, the tip needle portion has a substantially S-shaped shape 1 even if the elongated plate body 14 is formed with the projection 12 '.
It does not matter if it is formed in 2 ″. Also,
As shown in FIG. 2, the protrusion 17 may be formed at the tip of the diamond-shaped frame.

【0011】[0011]

【作用】本発明によれば、プロ−ブコンタクトを絶縁体
被覆した薄板に形成しているので、重ね合わせて一列に
積層することによって、0.04mmという超微小なピ
ッチ間隔の高集積回路等でも支障なく検査することがで
きる。また、二列,三列と複数列にずらして積層するこ
とによって、ニ−ドル部は、薄板の1/2,1/3の間
隔で千鳥状に配設されるので、プロ−ブコンタクトの薄
板の1/2,1/3の厚さのピッチ間隔の高集積回路等
でも支障なく検査することができる。本発明のプロ−ブ
コンタクトのニ−ドル先端部は、絶縁体被覆されていな
いが、隣接するニ−ドル先端部とは、絶縁体被覆層の厚
さだけ離れているので、接触する恐れはない。ニ−ドル
部は、電極若しくはパタ−ン等との接触部以外であるな
ら絶縁体被覆しても差し支えなく、また隣接するニ−ド
ル先端部と接触する恐れのない部分は、絶縁体被覆しな
くとも差し支えない。
According to the present invention, since the probe contact is formed on a thin plate covered with an insulator, the probe contacts are stacked and stacked in a row, whereby a highly integrated circuit with an ultra-fine pitch interval of 0.04 mm. It can be inspected even without problems. Also, by stacking the rows in a plurality of rows such as two rows and three rows, the needle portions are arranged in a zigzag pattern at intervals of 1/2 and 1/3 of the thin plate. It is possible to inspect even high-integrated circuits with a pitch interval of 1/2 or 1/3 of the thin plate without any trouble. Although the needle tip of the probe contact of the present invention is not covered with an insulator, it is separated from the adjacent needle tip by the thickness of the insulator coating layer, and therefore there is no possibility of contact. Absent. The needle portion may be covered with an insulator as long as it is not a contact portion with an electrode or a pattern, and the portion which is unlikely to come into contact with the adjacent needle tip portion is covered with an insulator. It doesn't matter.

【0012】ベリリウム銅から板厚50ミクロン、絶縁
被膜5ミクロン(表面と裏面とを合わせて10ミクロ
ン)、基準ストロ−ク100ミクロンの図1に示す本発
明のプロ−ブコンタクトを作った。このプロ−ブコンタ
クトを多数枚一列に積層して積層プロ−ブコンタクトと
し、弾性移動のバネ性耐久力を測定した。ストロ−ク2
0ミクロン及び60ミクロンで次表1に示す針圧の3種
の積層プロ−ブコンタクトを作った。
A probe contact of the present invention shown in FIG. 1 was prepared from beryllium copper having a plate thickness of 50 μm, an insulating film of 5 μm (total of the front and back surfaces was 10 μm), and a standard stroke of 100 μm. A large number of the probe contacts were laminated in a row to form a laminated probe contact, and the elastic durability of elastic movement was measured. Stroke 2
Three types of laminated probe contacts with needle pressures of 0 micron and 60 micron shown in Table 1 below were made.

【0013】[0013]

【表1】 [Table 1]

【0014】上記3種の積層プロ−ブコンタクトについ
て、弾性移動のバネ性耐久力を測定したところ、本発明
のプロ−ブコンタクト1〜3は、いずれも100万回の
ショット数にも耐えるバネ性耐久力を示した。これに対
し、切り込み13を形成しない以外は、同様にして作っ
たプロ−ブコンタクトは、2万回のショット数で使用で
きなくなった。
When the spring durability of elastic movement was measured for the above-mentioned three types of laminated probe contacts, all of the probe contacts 1 to 3 of the present invention were springs capable of withstanding 1 million shots. It showed good durability. On the other hand, the probe contact made in the same manner except that the notch 13 was not formed could not be used after 20,000 shots.

【0015】[0015]

【効果】以上述べたごとく、本発明によれば、プロ−ブ
コンタクトを超薄板で形成し、ニ−ドル部の後方に切り
込みを形成することによって、弾性移動のバネ性耐久力
が格段に向上し、その結果0.06mm以下という超微
小なピッチ間隔の高集積回路等の検査を多数回支障なく
行えることができると共に、薄板を積層するだけなの
で、組み立てが極めて容易となり、安価に製造できる
等、この種従来のプロ−ブコンタクトには全く見られな
い極めて画期的且つ絶大な効果を奏する。
As described above, according to the present invention, the probe contact is formed of an ultra-thin plate and the notch is formed at the rear of the needle portion, so that the spring durability of elastic movement is remarkably increased. As a result, inspection of highly integrated circuits with ultra-fine pitches of 0.06 mm or less can be performed many times without any trouble, and since only thin plates are stacked, assembly is extremely easy and manufacturing is inexpensive. As a result, it has an extremely epoch-making and tremendous effect which is not seen in the conventional probe contact of this kind.

【0016】[0016]

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明のプロ−ブコンタクトを示す側面図であ
る。
FIG. 1 is a side view showing a probe contact of the present invention.

【図2】本発明のプロ−ブコンタクトの他の実施例を示
す側面図である。
FIG. 2 is a side view showing another embodiment of the probe contact of the present invention.

【図3】本発明のプロ−ブコンタクトの他の実施例を示
す一部側面図である。
FIG. 3 is a partial side view showing another embodiment of the probe contact of the present invention.

【図4】本発明のプロ−ブコンタクトの他の実施例を示
す一部側面図である。
FIG. 4 is a partial side view showing another embodiment of the probe contact of the present invention.

【図5】従来のカ−ド式プロ−ブコンタクトの斜視図で
ある。
FIG. 5 is a perspective view of a conventional card type probe contact.

【符号の説明】[Explanation of symbols]

11 プロ−ブコンタクト 12,12′,12′′ ニ−ドル部 18 凹状のカット部 11 probe contact 12, 12 ', 12 "needle part 18 concave cut part

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】プロ−ブコンタクトを超薄板で形成し、該
プロ−ブコンタクトは、ニ−ドル部の少なくとも接触部
を除いて絶縁体被膜で被覆し、該ニ−ドル部の後方の前
記薄板に切り込みを形成してニ−ドル部を連設した細長
い板体とし、ニ−ドル部を該切り込み方向の前後方向に
弾性移動し得るように構成してなるプロ−ブコンタクト
を、多数積層したことを特徴とする超微小ピッチ検査用
積層プローブコンタクト。
1. A probe contact is formed of an ultra-thin plate, and the probe contact is covered with an insulating film except at least the contact portion of the needle portion, and the probe contact is formed on the rear portion of the needle portion. A large number of probe contacts are formed so that a slit is formed in the thin plate to form an elongated plate body in which a needle portion is continuously provided, and the needle portion is elastically movable in the front-back direction of the slit direction. Laminated probe contact for ultra-fine pitch inspection characterized by being laminated.
【請求項2】前記超薄板を、鋼、銅合金、タングステン
または焼入れ帯鋼板から形成してなる請求項1に記載の
プローブコンタクト。
2. The probe contact according to claim 1, wherein the ultra-thin plate is formed of steel, copper alloy, tungsten or hardened steel plate.
【請求項3】前記超薄板の厚さが、0.12mm以下で
ある請求項1に記載のプローブコンタクト。
3. The probe contact according to claim 1, wherein the ultrathin plate has a thickness of 0.12 mm or less.
【請求項4】前記積層したプロ−ブコンタクトに開口を
形成し、該開口にガイドピンを嵌合し、該ガイドピンを
プロ−ブコンタクトを収容する枠体に固定することによ
り、前記積層したプロ−ブコンタクトを固定してなる請
求項1に記載のプローブコンタクト。
4. The laminate is formed by forming an opening in the laminated probe contact, fitting a guide pin into the opening, and fixing the guide pin to a frame body for accommodating the probe contact. The probe contact according to claim 1, wherein the probe contact is fixed.
【請求項5】前記絶縁体被膜を、蒸着法によって形成し
てなる請求項1に記載のプローブコンタクト。
5. The probe contact according to claim 1, wherein the insulator film is formed by a vapor deposition method.
【請求項6】前記ニ−ドル部を連設した細長い板体の上
端を凹状にカットして、ニ−ドル部のバネ圧をコントロ
−ルしてなる請求項1に記載のプローブコンタクト。
6. The probe contact according to claim 1, wherein the upper end of the elongated plate body having the needle portion connected thereto is cut into a concave shape to control the spring pressure of the needle portion.
JP7149789A 1994-07-21 1995-05-25 Multi-layer probe contact for ultra-fine pitch inspection Expired - Fee Related JP2819452B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP7149789A JP2819452B2 (en) 1994-07-21 1995-05-25 Multi-layer probe contact for ultra-fine pitch inspection
KR1019960017863A KR100206093B1 (en) 1995-05-25 1996-05-25 Laminate probe contact for very small pitch inspection
US08/941,738 US6034534A (en) 1995-05-25 1997-10-01 Laminated contact probe for inspection of ultra-microscopic pitch

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP6-190135 1994-07-21
JP19013594 1994-07-21
JP7149789A JP2819452B2 (en) 1994-07-21 1995-05-25 Multi-layer probe contact for ultra-fine pitch inspection

Publications (2)

Publication Number Publication Date
JPH0886812A true JPH0886812A (en) 1996-04-02
JP2819452B2 JP2819452B2 (en) 1998-10-30

Family

ID=26479562

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7149789A Expired - Fee Related JP2819452B2 (en) 1994-07-21 1995-05-25 Multi-layer probe contact for ultra-fine pitch inspection

Country Status (1)

Country Link
JP (1) JP2819452B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1090302A (en) * 1996-09-11 1998-04-10 Kiyota Seisakusho:Kk Probe formed of metallic sheet
JPH10115636A (en) * 1996-09-11 1998-05-06 Kiyota Seisakusho:Kk Probe for millimeter-wave device
JPH11102742A (en) * 1997-09-29 1999-04-13 Kiyota Seisakusho:Kk Connector or probe structure
JP2007303969A (en) * 2006-05-11 2007-11-22 Micronics Japan Co Ltd Probe and probe assembly
JP2020197413A (en) * 2019-05-31 2020-12-10 共進電機株式会社 Probe and measuring device for solar cell

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01314970A (en) * 1988-06-15 1989-12-20 Nec Corp Probe card
JPH0447689A (en) * 1990-06-13 1992-02-17 Sansei Denshi Japan Kk Socket for ic tab
JPH06174750A (en) * 1992-12-09 1994-06-24 Sharp Corp Prober for inspecting liquid crystal panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01314970A (en) * 1988-06-15 1989-12-20 Nec Corp Probe card
JPH0447689A (en) * 1990-06-13 1992-02-17 Sansei Denshi Japan Kk Socket for ic tab
JPH06174750A (en) * 1992-12-09 1994-06-24 Sharp Corp Prober for inspecting liquid crystal panel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1090302A (en) * 1996-09-11 1998-04-10 Kiyota Seisakusho:Kk Probe formed of metallic sheet
JPH10115636A (en) * 1996-09-11 1998-05-06 Kiyota Seisakusho:Kk Probe for millimeter-wave device
JPH11102742A (en) * 1997-09-29 1999-04-13 Kiyota Seisakusho:Kk Connector or probe structure
JP2007303969A (en) * 2006-05-11 2007-11-22 Micronics Japan Co Ltd Probe and probe assembly
JP2020197413A (en) * 2019-05-31 2020-12-10 共進電機株式会社 Probe and measuring device for solar cell

Also Published As

Publication number Publication date
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