JPH0883968A - Base for electronic component - Google Patents
Base for electronic componentInfo
- Publication number
- JPH0883968A JPH0883968A JP21851094A JP21851094A JPH0883968A JP H0883968 A JPH0883968 A JP H0883968A JP 21851094 A JP21851094 A JP 21851094A JP 21851094 A JP21851094 A JP 21851094A JP H0883968 A JPH0883968 A JP H0883968A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base
- lead wire
- electronic
- surface portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板のスルー
ホール穴に電子部品のリード線を通し半田付けする電子
部品とプリント基板間に設ける電子部品用ベースに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component base provided between an electronic component for soldering a lead wire of the electronic component through a through hole of a printed circuit board and soldering the printed circuit board.
【０００２】[0002]
【従来の技術】図５を用いて従来の電子部品の実装につ
いて説明する。電子部品１のリード線をプリント基板３
の導体部４にあるスルーホール穴５に通し、電子部品１
が実装しているプリント基板３の反対側で導体部４とリ
ード線２を半田付けしている。ところが、電子部品１を
プリント基板３に実装した後、図６に示す様に移動や組
立作業のとき電子部品１に外部より力が加わるとリード
線２が曲がり、これが反復的に繰り返されるとリード線
２が折れ電子部品１の機能が異常または停止し、それが
起因となり電子部品１が搭載されている装置が異常とな
る。また、電子部品１のリード線２が折れる以前であっ
ても電子部品１の近隣に実装されている他の電子部品６
またはプリント基板３の導体部４に電子部品１が接触し
電子部品１と電子部品６間または電子部品１と導体部４
が絶縁破壊を起こして短絡し電子部品が異常または停止
し、上記と同様に装置が異常となる等の問題があった。2. Description of the Related Art Conventional mounting of electronic components will be described with reference to FIG. Connect the lead wires of the electronic component 1 to the printed circuit board 3
Through the through hole 5 in the conductor part 4 of the electronic component 1
The conductor portion 4 and the lead wire 2 are soldered on the opposite side of the printed circuit board 3 on which is mounted. However, after the electronic component 1 is mounted on the printed circuit board 3, the lead wire 2 bends when an external force is applied to the electronic component 1 during movement or assembly work as shown in FIG. The line 2 is broken and the function of the electronic component 1 is abnormal or stopped, which causes the device in which the electronic component 1 is mounted to be abnormal. Further, even before the lead wire 2 of the electronic component 1 is broken, another electronic component 6 mounted near the electronic component 1
Alternatively, the electronic component 1 comes into contact with the conductor portion 4 of the printed circuit board 3 and the space between the electronic component 1 and the electronic component 6 or the electronic component 1 and the conductor portion 4
Causes a dielectric breakdown and short-circuits, causing an abnormality or stoppage of the electronic component, which causes a problem that the device becomes abnormal as in the above.
【０００３】[0003]
【発明が解決しようとする課題】以上、説明した通り、
電子部品をプリント基板に実装した後、外部より力が加
わっても電子部品のリード線が容易に曲がらず、リード
線の折れおよび近隣との接触による電子部品の故障を防
止し、プリント基板実装後の電子部品の信頼性を向上さ
せる電子部品用ベースを提供することを目的とする。As described above,
After mounting the electronic parts on the printed circuit board, the lead wires of the electronic parts are not easily bent even if force is applied from the outside, preventing breakage of the lead parts and failure of the electronic parts due to contact with the neighborhood, and after mounting the printed circuit board. It is an object of the present invention to provide a base for electronic parts that improves the reliability of the electronic parts.
【０００４】[0004]
【課題を解決するための手段】本発明の電子部品用ベー
スを図１および図２を用いて説明する。電子部品用ベー
ス７は、側面部11、底面部12および突起部10からなる。
そして、側面部11は電子部品１が基板３に実装後傾かな
いよう固定するための電子部品固定溝８を有する。底面
部12は電子部品の入出力用ピン２を通すためのリード線
挿入穴９を有する。突起部10は側面部あるいは底面部か
ら突起し当該電子部品１を基板に固定する際に当該ベー
ス７本体を基板３に支持するとともに半田ブリッジを防
止するものである。また、側面部と前記底面部の形状
を、断面がコの字状に形成するものである。また、リー
ド線挿入穴９に電子部品の入出力用ピン２を差し込むソ
ケットピン13を設ける電子部品用ベースである。A base for electronic parts of the present invention will be described with reference to FIGS. The electronic component base 7 includes a side surface portion 11, a bottom surface portion 12, and a protrusion 10.
The side surface portion 11 has an electronic component fixing groove 8 for fixing the electronic component 1 on the substrate 3 so as not to tilt after mounting. The bottom surface portion 12 has a lead wire insertion hole 9 for inserting the input / output pin 2 of the electronic component. The projecting portion 10 projects from the side surface portion or the bottom surface portion to support the main body of the base 7 on the substrate 3 and prevent a solder bridge when fixing the electronic component 1 to the substrate. Further, the side surface portion and the bottom surface portion are formed in a U-shaped cross section. Further, the electronic component base is provided with socket pins 13 for inserting the input / output pins 2 of the electronic component into the lead wire insertion holes 9.
【０００５】[0005]
【作用】電子部品用ベース７を電子部品１に装着した後
に、プリント基板３のスルーホール穴に電子部品のリー
ド線を挿入し半田付けする。電子部品１をプリント基板
３に実装後、外部より力が加わっても電子部品用ベース
７により電子部品１が固定され電子部品１の入出力用の
リード線２が曲がらないため、リード線２の折れおよび
リード線２が曲がることにより発生する近隣との接触に
よる絶縁破壊が無くなり電子部品１の故障、および電子
部品１を搭載した装置の異常を防止できる。After mounting the electronic component base 7 on the electronic component 1, the lead wire of the electronic component is inserted into the through hole of the printed circuit board 3 and soldered. After mounting the electronic component 1 on the printed circuit board 3, the electronic component 1 is fixed by the electronic component base 7 and the input / output lead wire 2 of the electronic component 1 is not bent even if a force is applied from the outside. It is possible to prevent breakdown of the electronic component 1 due to contact with the neighborhood caused by bending and bending of the lead wire 2, and to prevent malfunction of the electronic component 1 and abnormality of the device on which the electronic component 1 is mounted.
【０００６】[0006]
【実施例】本発明の実施例を図１〜図３を用いて説明す
る。図１は電子部品用ベース７を電子部品１に装着後、
電子部品１をプリント基板３に半田付けした状態を示
す。プリント基板３の運搬またはプリント基板３を装置
に取り付ける際等に電子部品１に外部より力が加わると
電子部品１のリード線２が曲がろうとするが、リード線
２が曲がる前に電子部品用ベース７がストッパーとな
り、リード線２が曲がらず電子部品１はプリント基板３
に半田付けされた初期状態を保つ。これによりリード線
２が折れることがなく、またリード線２が曲がることに
より近隣と接触し発生する絶縁破壊による短絡がなくな
り電子部品１の故障を防止することができる。Embodiments of the present invention will be described with reference to FIGS. FIG. 1 shows that after mounting the electronic component base 7 on the electronic component 1,
The state where the electronic component 1 is soldered to the printed circuit board 3 is shown. When a force is applied to the electronic component 1 from the outside when the printed circuit board 3 is transported or the printed circuit board 3 is attached to a device, the lead wire 2 of the electronic component 1 tries to bend. The base 7 serves as a stopper, the lead wire 2 is not bent, and the electronic component 1 is the printed circuit board 3
Keep the initial state soldered to. As a result, the lead wire 2 is not broken, and the bending of the lead wire 2 prevents a short circuit due to dielectric breakdown that occurs when the lead wire 2 comes into contact with the neighborhood, and the failure of the electronic component 1 can be prevented.
【０００７】図２に電子部品用ベースの実施例を示す。
電子部品を固定するための電子部品固定溝８を有する側
面部11と、電子部品の入出力用ピンを通すためのリード
線挿入穴９を設けた底面部12と、半田付け時に半田ブリ
ッジを防止するための突起部10とから構成されている。
電子部品を電子部品固定溝８の側から差し入れ、そのリ
ード線をリード線挿入穴９に挿入した状態でプリント基
板のスルーホール穴にリード線を挿入し半田付けする。
電子部品は電子部品用ベースの電子部品固定溝８により
固定され、外部より力が加わっても電子部品用ベースが
プリント基板に当たりリード線が曲がらず電子部品は固
定される。半田付けの際、突起部10によりプリント基板
と電子部品用ベース間に隙間ができるため半田ブリッジ
を防止することができる。また、電子部品用ベースは電
子部品を半田付けすることにより電子部品とプリント基
板に挟まれる状態で固定されるため電子部品をプリント
基板から取り外さない限り取れない構成となっている。FIG. 2 shows an embodiment of the electronic component base.
A side part 11 having an electronic part fixing groove 8 for fixing an electronic part, a bottom part 12 having a lead wire insertion hole 9 for passing an input / output pin of the electronic part, and a solder bridge during soldering are prevented. And a protrusion 10 for
An electronic component is inserted from the electronic component fixing groove 8 side, and with the lead wire inserted in the lead wire insertion hole 9, the lead wire is inserted into the through hole of the printed circuit board and soldered.
The electronic component is fixed by the electronic component fixing groove 8 of the electronic component base, and even if a force is applied from the outside, the electronic component base hits the printed circuit board and the lead wire is not bent, so that the electronic component is fixed. At the time of soldering, a gap is formed between the printed circuit board and the electronic component base by the protrusion 10, so that a solder bridge can be prevented. Further, since the electronic component base is fixed in a state of being sandwiched between the electronic component and the printed board by soldering the electronic component, the electronic component base cannot be removed unless the electronic component is removed from the printed board.
【０００８】図３に電子部品用ベースの他の実施例を示
す。電子部品を固定するための電子部品固定溝８と電子
部品のリード線を通すためのリード線挿入穴９と半田付
け時に半田ブリッジを防止するための突起部10とから構
成されている。リード線挿入穴９は溝状に空けられてお
り、電子部品のリード線のピン間距離に制約がない。FIG. 3 shows another embodiment of the electronic component base. It is composed of an electronic component fixing groove 8 for fixing an electronic component, a lead wire insertion hole 9 for passing a lead wire of the electronic component, and a protrusion 10 for preventing a solder bridge during soldering. The lead wire insertion hole 9 is formed in a groove shape, and there is no restriction on the distance between the pins of the lead wire of the electronic component.
【０００９】本実施例においても、先の実施例と同様の
効果を奏する。図４に電子部品用ベースの更に他の実施
例を示す。電子部品を固定するための電子部品固定溝８
を有する側面部11と、電子部品用ベース７をプリント基
板の導体部に半田付けするための導通部11と、電子部品
のリード線を電子部品用ベースの導通部11に挿入するた
めのリード線挿入穴９を設けた底面部12と、半田付け時
に半田ブリッジを防止するための突起部10とから構成さ
れている。電子部品用ベース７のソケットピン（導通
部）13をプリント基板のスルーホール穴に挿入し半田付
けし電子部品を電子部品固定溝８の側からリード線をリ
ード線挿入穴９に挿入する。電子部品は電子部品用ベー
スの電子部品固定溝８により固定され、外部より力が加
わっても電子部品用ベースがプリント基板に当たりリー
ド線が曲がらず電子部品は固定される。半田付けの際、
突起部10によりプリント基板と電子部品用ベース間に隙
間ができるため半田ブリッジを防止することができる。
また、電子部品を半田付けする必要がなく電子部品の挿
抜が可能となるため、容易に電子部品を交換することが
できる。Also in this embodiment, the same effect as that of the previous embodiment is obtained. FIG. 4 shows still another embodiment of the electronic component base. Electronic component fixing groove 8 for fixing electronic components
A side part 11 having a conductive part 11 for soldering the electronic part base 7 to a conductor part of a printed circuit board, and a lead wire for inserting a lead wire of the electronic part into the conductive part 11 of the electronic part base. It is composed of a bottom surface portion 12 having an insertion hole 9 and a projection portion 10 for preventing a solder bridge during soldering. The socket pin (conduction part) 13 of the electronic component base 7 is inserted into the through hole of the printed board and soldered, and the electronic component is inserted into the lead wire insertion hole 9 from the electronic component fixing groove 8 side. The electronic component is fixed by the electronic component fixing groove 8 of the electronic component base, and even if a force is applied from the outside, the electronic component base hits the printed circuit board and the lead wire is not bent, so that the electronic component is fixed. When soldering
Since the projection 10 forms a gap between the printed circuit board and the electronic component base, solder bridge can be prevented.
Further, since it is possible to insert and remove the electronic component without having to solder the electronic component, the electronic component can be easily replaced.
【００１０】[0010]
【発明の効果】本発明の電子部品用ベースによれば、電
子部品の傾きを側面部で防ぎ、電子部品の入出力用ピン
を底面部の挿入穴で自在に通し、半田ブリッジを突起部
で防ぐ形状とするので、実装後電子部品に外力が加わっ
てもリード線が曲がらず故障、絶縁破壊を防止すること
ができる。According to the electronic component base of the present invention, the inclination of the electronic component is prevented at the side surface portion, the input / output pin of the electronic component is freely passed through the insertion hole at the bottom surface, and the solder bridge is formed at the protruding portion. Since the shape prevents the lead wires from being bent even when an external force is applied to the electronic component after mounting, it is possible to prevent a failure or a dielectric breakdown.
【図１】本発明の電子部品用ベースを使用し電子部品を
基板に実装した外観図FIG. 1 is an external view of an electronic component mounted on a substrate using the electronic component base of the present invention.
【図２】本発明の電子部品用ベースの構造図FIG. 2 is a structural diagram of an electronic component base of the present invention.
【図３】本発明の他の実施例の電子部品用ベースの構造
図FIG. 3 is a structural diagram of a base for electronic parts according to another embodiment of the present invention.
【図４】本発明の他の実施例の電子部品用ベースの構造
図FIG. 4 is a structural diagram of a base for electronic parts according to another embodiment of the present invention.
【図５】従来の電子部品を基板に実装した図FIG. 5 is a diagram of a conventional electronic component mounted on a substrate.
【図６】従来の電子部品の故障、短絡の作用を示す構成
図FIG. 6 is a block diagram showing the action of a failure or short circuit of a conventional electronic component.
１…電子部品、２…リード線、３…基板、４…導体部、
５…スルーホール穴、６…他の電子部品、７…電子部品
用ベース、８…電子部品固定溝、９…リード線挿入穴、
10…突起部、11…側面部、12…底面部、13…ソケットピ
ン（導通部）。1 ... Electronic component, 2 ... Lead wire, 3 ... Substrate, 4 ... Conductor part,
5 ... Through hole hole, 6 ... Other electronic component, 7 ... Electronic component base, 8 ... Electronic component fixing groove, 9 ... Lead wire insertion hole,
10 ... Projection part, 11 ... Side part, 12 ... Bottom part, 13 ... Socket pin (conduction part).
───────────────────────────────────────────────────── フロントページの続き (72)発明者 野田 清志 東京都府中市東芝町１番地 株式会社東芝 府中工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kiyoshi Noda No. 1 Toshiba-cho, Fuchu-shi, Tokyo Toshiba Corporation Fuchu factory inside
Claims (3)
定するための電子部品固定溝を有する側面部と、電子部
品の入出力用ピンを通すためのリード線挿入穴を設けた
底面部と、前記側面部あるいは前記底面部から突起し当
該電子部品を基板に固定する際に当該ベース本体を基板
に支持するとともに半田ブリッジを防止する突起部とか
らなることを特徴とする電子部品用ベース。1. A side surface portion having an electronic component fixing groove for fixing the electronic component on the substrate so as not to tilt after mounting, and a bottom surface portion provided with a lead wire insertion hole for inserting an input / output pin of the electronic component. A base for an electronic component, comprising: a protrusion that protrudes from the side surface portion or the bottom portion to support the base body on the substrate when fixing the electronic component to the substrate and prevent a solder bridge.
面部の形状を、断面がコの字状に形成することを特徴と
する電子部品用ベース。2. The electronic component base according to claim 1, wherein the side surface portion and the bottom surface portion are formed in a U-shaped cross section.
に電子部品の入出力用ピンを差し込むソケットピンを設
けたことを特徴とする電子部品用ベース。3. The base for electronic parts according to claim 1, wherein socket pins for inserting input / output pins of electronic parts are provided in the lead wire insertion holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21851094A JPH0883968A (en) | 1994-09-13 | 1994-09-13 | Base for electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21851094A JPH0883968A (en) | 1994-09-13 | 1994-09-13 | Base for electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0883968A true JPH0883968A (en) | 1996-03-26 |
Family
ID=16721061
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21851094A Pending JPH0883968A (en) | 1994-09-13 | 1994-09-13 | Base for electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0883968A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123515A (en) * | 2005-10-27 | 2007-05-17 | Showa Denko Kk | Method for preventing warpage in jig for manufacturing capacitor |
| JP2009302422A (en) * | 2008-06-17 | 2009-12-24 | Fujitsu Telecom Networks Ltd | Fitting structure of semiconductor device |
-
1994
- 1994-09-13 JP JP21851094A patent/JPH0883968A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007123515A (en) * | 2005-10-27 | 2007-05-17 | Showa Denko Kk | Method for preventing warpage in jig for manufacturing capacitor |
| JP4627031B2 (en) * | 2005-10-27 | 2011-02-09 | 昭和電工株式会社 | Warping prevention method for jigs for manufacturing capacitors |
| JP2009302422A (en) * | 2008-06-17 | 2009-12-24 | Fujitsu Telecom Networks Ltd | Fitting structure of semiconductor device |
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