JPH087699Y2 - Surface acoustic wave device - Google Patents
Surface acoustic wave deviceInfo
- Publication number
- JPH087699Y2 JPH087699Y2 JP12730689U JP12730689U JPH087699Y2 JP H087699 Y2 JPH087699 Y2 JP H087699Y2 JP 12730689 U JP12730689 U JP 12730689U JP 12730689 U JP12730689 U JP 12730689U JP H087699 Y2 JPH087699 Y2 JP H087699Y2
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- sealing case
- wave element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 本考案は、表面弾性波装置における表面弾性波素子の
固定手段の改善に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to an improvement in a fixing means of a surface acoustic wave element in a surface acoustic wave device.
〈従来の技術〉 第２図は従来の表面弾性波装置の内部を示す構成図で
ある。<Prior Art> FIG. 2 is a block diagram showing the inside of a conventional surface acoustic wave device.
第２図において、表面弾性波素子２は、接着剤を用い
て封止用ケース１に固定された後、ボンディングワイヤ
41、42を用いて、その素子電極21、22とリード端子31、
32の間が配線される。In FIG. 2, the surface acoustic wave element 2 is fixed to the sealing case 1 with an adhesive and then bonded with a bonding wire.
41 and 42, the element electrodes 21 and 22 and the lead terminal 31,
Between 32 is wired.
〈考案が解決しようとする課題〉 しかしながら、上記従来技術に示すような構成の表面
弾性波装置では、接着剤と素子との熱膨脹率の違いによ
る歪や接着剤のガス発生等が素子特性に悪影響を与える
という問題があった。<Problems to be Solved by the Invention> However, in the surface acoustic wave device having the configuration as shown in the above-mentioned prior art, distortion due to a difference in thermal expansion coefficient between the adhesive and the element, gas generation of the adhesive, or the like adversely affects the element characteristics. There was a problem of giving.
本考案は上記のような課題を解決するためになさたも
のであり、簡単な構成で長期的に安定した特性が得られ
る表面弾性波装置を提供することを目的としたものであ
る。The present invention has been made to solve the above problems, and an object of the present invention is to provide a surface acoustic wave device capable of obtaining stable characteristics over a long period of time with a simple structure.
〈課題を解決するための手段〉 上記課題を解決するための本考案の構成は、封止用ケ
ースと、この封止用ケースに置かれた表面弾性波素子
と、前記封止用ケースに取付けられその一端が配線によ
り前記表面弾性波素子の素子電極に接続された複数のリ
ード端子と、前記表面弾性波素子をその素子形状より僅
かに広く取り囲むように前記封止用ケースに取付けられ
た複数のピンと、このピンに差し込まれ前記表面弾性波
素子を僅かに隙間を設けて固定する複数のコネクタ圧接
子とから構成されたことを特徴とするものである。<Means for Solving the Problems> The structure of the present invention for solving the above problems is a case for encapsulation, a surface acoustic wave element placed in the case for encapsulation, and a mounting case for the encapsulation case. A plurality of lead terminals whose one end is connected to the element electrode of the surface acoustic wave element by wiring, and a plurality of lead terminals attached to the sealing case so as to surround the surface acoustic wave element slightly wider than the element shape. And a plurality of connector pressure contactors which are inserted into the pins and fix the surface acoustic wave device with a slight gap therebetween.
〈作用〉 本考案によると、表面弾性波素子を固定するためのピ
ンを表面弾性波素子の形状より僅かに広く取付けてお
り、温度変化により表面弾性波素子が膨脹しても表面弾
性波素子には歪が加わらず、又、接着剤を使用していな
いので、ガス発生等による影響も受けない。<Operation> According to the present invention, the pin for fixing the surface acoustic wave element is attached slightly wider than the shape of the surface acoustic wave element, and even if the surface acoustic wave element expands due to temperature change, Since no strain is applied and no adhesive is used, it is not affected by gas generation or the like.
〈実施例〉 以下、本考案を図面に基づいて説明する。<Example> Hereinafter, the present invention will be described with reference to the drawings.
第１図は本考案に係わる表面弾性波装置の一実施例を
示す要部構成図であり、封止用ケースの一部（キャッ
プ）を取り去った状態を示している。FIG. 1 is a main part configuration diagram showing an embodiment of a surface acoustic wave device according to the present invention, and shows a state in which a part (cap) of a sealing case is removed.
第１図において、１は封止用ケース、2aは封止用ケー
ス１に置かれた表面弾性波素子、31、32は封止用ケース
１に取付けられたリード端子、41、42は表面弾性波素子
2aの素子電極とリード端子31、32をそれぞれ配線するボ
ンディングワイヤ、51〜56は表面弾性波素子2aをその素
子形状より僅かに広く取り囲むように封止用ケース１に
取付けられた６個のピン、61〜64は順にピン52、53、5
5、56にそれぞれ差し込まれて表面弾性波素子を僅かに
隙間を持たせて固定するコネクタ圧接子である。In FIG. 1, 1 is a sealing case, 2a is a surface acoustic wave device placed in the sealing case 1, 31 and 32 are lead terminals attached to the sealing case 1, and 41 and 42 are surface elastic. Wave element
Bonding wires for wiring the element electrode of 2a and the lead terminals 31 and 32, and 51 to 56 are six pins attached to the sealing case 1 so as to surround the surface acoustic wave element 2a slightly wider than the element shape. , 61 to 64 are pins 52, 53, 5 in order
A connector pressure contactor which is inserted into each of 5 and 56 to fix the surface acoustic wave device with a slight gap.
上記のような構成の表面弾性波装置において、リード
端子31から入った電気信号は、ボンディングワイヤ41を
通して表面弾性波素子2aの素子電極に伝わり、表面弾性
波素子2aを動作させて、表面弾性波素子2aの素子電極か
ら再びボンディングワイヤ42を通してリード端子32へと
戻ってゆく。In the surface acoustic wave device having the above-described configuration, the electric signal input from the lead terminal 31 is transmitted to the element electrode of the surface acoustic wave element 2a through the bonding wire 41, and the surface acoustic wave element 2a is operated to generate the surface acoustic wave. The element electrode of the element 2a returns to the lead terminal 32 through the bonding wire 42 again.
このような構成の表面弾性波装置によれば、表面弾性
波素子が温度変化により膨脹しても、表面弾性波素子を
取り囲むピン及び表面弾性波素子を固定するコネクタ圧
接子と表面弾性波素子との間に僅かだが隙間を持たせて
いるため、基板には歪が加わらず、素子の特性に悪影響
を及ぼさない。又、接着剤のガスによる影響も生じな
い。更に、素子の固定位置を常に一定にすることができ
るため、ボンディングワイヤの長さのばらつきを抑えら
れ安定した特性を得られる。According to the surface acoustic wave device having such a configuration, even if the surface acoustic wave element expands due to a temperature change, the pin surrounding the surface acoustic wave element and the connector pressure contactor for fixing the surface acoustic wave element and the surface acoustic wave element are provided. Since a slight gap is provided between the substrate and the substrate, no strain is applied to the substrate and the characteristics of the element are not adversely affected. Further, the influence of the adhesive gas does not occur. Furthermore, since the fixing position of the element can be made constant at all times, variations in the length of the bonding wire can be suppressed and stable characteristics can be obtained.
なお、上記実施例において、ピン及びコネクタ圧接子
の個数は実施例に示した個数に限るものではなく、固定
する素子の大きさや形状により自由に用いて良い。又、
素子の厚さ方向の歪には表面弾性波素子の影響が少ない
ため、コネクタ圧接子が表面弾性波素子に触れていても
問題にはならない。更に、本考案によれば、表面弾性波
素子に限らず基板に歪の掛かることを避けたい各種圧電
基板を利用した素子や、素子の固定に接着剤を使用した
くない装置等にも利用できる。In the above embodiment, the numbers of pins and connector pressure contactors are not limited to those shown in the embodiments, and may be freely used depending on the size and shape of the element to be fixed. or,
Since the surface acoustic wave element has little influence on the strain in the thickness direction of the element, there is no problem even if the connector pressure contactor touches the surface acoustic wave element. Further, according to the present invention, not only the surface acoustic wave element, but also an element using various piezoelectric substrates for which it is desired to avoid strain on the substrate, or an apparatus in which an adhesive is not used for fixing the element can be used. .
〈考案の効果〉 以上、実施例と共に具体的に説明したように、本考案
によれば、長期的に安定した特性が得られる表面弾性波
装置を簡単な構成で実現することができる。<Advantages of the Invention> As described above in detail with reference to the embodiments, according to the present invention, it is possible to realize a surface acoustic wave device having a stable characteristic in the long term with a simple configuration.
第１図は本考案に係わる表面弾性波装置の一実施例を示
す要部構成図、第２図は表面弾性波装置の従来例を示す
構成図である。 １…封止用ケース、2a…表面弾性波素子、31、32…リー
ド端子、41、42…ボンディングワイヤ、51〜56…ピン、
61〜64…コネクタ圧接子。FIG. 1 is a configuration diagram of a main part showing an embodiment of a surface acoustic wave device according to the present invention, and FIG. 2 is a configuration diagram showing a conventional example of the surface acoustic wave device. 1 ... Sealing case, 2a ... Surface acoustic wave device, 31, 32 ... Lead terminals, 41, 42 ... Bonding wires, 51-56 ... Pins,
61-64… Connector pressure contact.
Claims (1)
れた表面弾性波素子と、前記封止用ケースに取付けられ
その一端が配線により前記表面弾性波素子の素子電極に
接続された複数のリード端子と、前記表面弾性波素子を
その素子形状より僅かに広く取り囲むように前記封止用
ケースに取付けられた複数のピンと、このピンに差し込
まれ前記表面弾性波素子を僅かに隙間を設けて固定する
複数のコネクタ圧接子とから構成されたことを特徴とす
る表面弾性波装置。1. A sealing case, a surface acoustic wave device placed in this sealing case, and one end of which is attached to the device electrode of the surface acoustic wave device by being attached to the sealing case. A plurality of lead terminals, a plurality of pins attached to the sealing case so as to surround the surface acoustic wave element slightly wider than the element shape, and a small gap between the surface acoustic wave element inserted into the pins. A surface acoustic wave device comprising: a plurality of connector pressure contactors which are provided and fixed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12730689U JPH087699Y2 (en) | 1989-10-31 | 1989-10-31 | Surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12730689U JPH087699Y2 (en) | 1989-10-31 | 1989-10-31 | Surface acoustic wave device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0365323U JPH0365323U (en) | 1991-06-25 |
| JPH087699Y2 true JPH087699Y2 (en) | 1996-03-04 |
Family
ID=31675066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12730689U Expired - Lifetime JPH087699Y2 (en) | 1989-10-31 | 1989-10-31 | Surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087699Y2 (en) |
-
1989
- 1989-10-31 JP JP12730689U patent/JPH087699Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0365323U (en) | 1991-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4511821A (en) | Support structure for piezoelectric vibrator | |
| JPH087699Y2 (en) | Surface acoustic wave device | |
| JPH06300800A (en) | Potential sensor | |
| JPH0850142A (en) | Semiconductor acceleration sensor and its manufacture | |
| JPS594868B2 (en) | semiconductor equipment | |
| JPH05335878A (en) | Surface installation type surface acoustic wave element | |
| JP3273644B2 (en) | Open ultrasonic microphone | |
| JPS63177030A (en) | Semiconductive pressure sensor | |
| JPH04355509A (en) | Support structure for piezoelectric vibrator | |
| JPS5954311A (en) | Method for holding surface acoustic wave device | |
| JPH01210989A (en) | Liquid crystal display device | |
| JPS58158826A (en) | Multiple point temperature sensitive switch | |
| JPH0411440Y2 (en) | ||
| JP2968329B2 (en) | Semiconductor pressure sensor | |
| JPS6123867Y2 (en) | ||
| JPH0681136U (en) | Piezoelectric vibrator | |
| JPH10213505A (en) | Pressure sensor | |
| JPS61266931A (en) | Pressure sensor | |
| JPS5921540Y2 (en) | piezoelectric vibrator | |
| JPH01222599A (en) | Ultrasonic ceramic microphone | |
| JPH10274580A (en) | Semiconductor pressure sensor | |
| JPH0681138U (en) | Crystal oscillator | |
| JPS5877918U (en) | Vibration element mounting structure of the vibrator | |
| JPH0618549A (en) | Acceleration sensor | |
| JPH0832089A (en) | Electrostatic capacitance pressure sensor |