JPH0871898A - Double-end grinding device - Google Patents

Abstract

PURPOSE: To conduct stable, double-sided grinding between two grinding stones facing with each other even in the case of a film-like work. CONSTITUTION: A work 3, which is set in a holding hole 2 of a carrier 1 and then carried, is guided by upper and lower guides 4, 5 so as to be introduced into a space between a pair of (upper and lower) grinding stones 6 and 7 facing with each other for the sake of double-sided grinding. The film-like carrier 1 is held in a tense state by rigid-body holders 8a, 8b situated at an outer peripheral part and is supported via these rigid-body holders 8a, 8b in a rotatable manner. The work 3 is held by the holding hole 2, which is provided at the outer peripheral part of the carrier 1, and then carried.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided grinding machine, for example, for simultaneous double-sided grinding of plate-shaped or columnar materials such as ceramic parts represented by piezoelectric elements and gear parts of automobiles. The present invention relates to a double-sided grinding machine used.

[0002]

2. Description of the Related Art Recently, the thickness like a piezoelectric element is 0.5 m.
Ceramic parts having a size of m or less are formed into thin pieces using a slicing machine. The molded ceramic parts are double-sided processed so as to exhibit the required electrical characteristics.
Conventionally, a double-sided grinding machine a as shown in FIG. 3 has been used for this double-sided processing.

This double-sided grinding machine is, for example, shown in FIG.
As shown in FIG. 3, the work b supplied from the parts feeder a is received in the holding hole k as shown in FIG. 3B provided in the through feeder c stretched like a endless belt by the guide roller r, Under the guidance of the upper and lower guides d and e, it is introduced between a pair of vertically facing grindstones f and g to be subjected to double-sided processing, and the work b after the upper and lower grindstones f and g is processed.
Is further conveyed by a predetermined distance on the basis of the guides of the upper and lower guides h and i, and when it is removed from the upper and lower guides h and i, it is naturally dropped into the container j and collected.

This makes it possible to simultaneously perform double-sided grinding of various thin-film and columnar materials. In addition,
When the work b has a thin thickness of about 0.1 mm to 0.2 mm, a metal belt or the like is used for the through feeder c, and the work b has a thickness smaller than that of the work b so that both sides of the work b can be ground. Is set.

[0005]

However, the through feeder c stretched by the guide roller r as described above is
Shaking or sagging due to the accumulation of minute expansion and contraction at each part is likely to occur, the upper and lower grindstones f and g come into contact with each other, and wear is shortened, and the work b is stably conveyed. There is a problem that it is difficult to perform double-sided processing with f and g and sufficient processing accuracy cannot be obtained. Moreover, the work b
Is removed from the holding hole k of the through-feeder c and is sandwiched between the through-feeder c and the grindstone f or the grindstone g, so that it is not properly machined, and in some cases, the upper and lower grindstones f and g are separated from each other. The work b and the grindstones f and g may be damaged when trying to force them through. Especially, lower grindstone g
3B is worn from the state of the imaginary line shown in FIG. 3B to the state of the solid line, a step s is formed between the lower guide e and the lower grindstone g, and the through feeder c and the lower grindstone g are formed. Since the gap between the two is widened, the workpiece b from the lower guide e to the lower grindstone g.
When the workpiece is transferred, the work b easily comes out of the holding hole k and easily falls between the through feeder c and the lower grindstone g, so that the above-mentioned problem frequently occurs.

An object of the present invention is to solve the above-mentioned problems of the prior art, and it is a main object of the present invention to provide a double-sided grinding machine capable of stably performing double-sided processing between grindstones facing each other even in a thin film-like work. It is intended.

[0007]

In order to achieve the above-mentioned object, the double-sided grinding machine of the present invention guides a work, which is inserted into a holding hole of a carrier and conveyed, by upper and lower guides, In a double-headed grinding machine that is introduced between a pair of vertically facing grindstones for double-sided processing, a thin plate-shaped carrier can be held in a stretched state by a rigid holder on the outer peripheral part and rotated through this rigid holder. The main feature is that the work is held in a holding hole provided on the outer peripheral portion of the carrier for carrying the work.

In this case, it is preferable to provide a grindstone / guide position adjusting means for adjusting the level of the guide corresponding to the grindstone to the level of the grindstone.

Further, based on the measurement information from the measuring means for measuring the thickness of the work after machining, the minute cutting mechanism for performing minute cutting of the grindstone, and the working information of the measuring means, the working thickness of the work is worked. It is preferable to include a control means for controlling the control of No. 2 and adjusting the position of the minute cutting portion of the grindstone of the guide corresponding to the grindstone whose cutting is controlled.

[0010]

In the above-mentioned structure, which is the main feature of the double-sided grinding machine of the present invention, the work which is inserted into the holding hole of the carrier and conveyed is guided by the upper and lower guides and introduced between a pair of vertically facing grindstones. When used for processing, since the thin plate-shaped carrier is held in a stretched state by the rigid holder at the outer peripheral portion, there is no swaying or sagging due to the expansion and contraction of each part, and particularly high rigidity is exhibited at the outer peripheral part. By holding and transporting the work by holding holes in the outer periphery, the effect of shaking and sagging of the thin plate-shaped carrier can be eliminated in the transport by the holding hole, and the rotation of the carrier is also stabilized by the support via the rigid holder. Therefore, even when using a thin plate carrier to convey a thin film work, there is no trouble such as dropping between the upper and lower grindstones of the work or being pinched between the carrier and the grindstone. Subjected to machining are transported by a truly and stable state, it is possible to make the processing is achieved stably with high accuracy. Further, since the outer peripheral portion, which is the work transfer portion of the carrier, has a particularly high rigidity and is stable without swaying or sagging, it is possible to prevent the carrier from contacting the upper and lower grindstones and wearing each other.

In this case, in the construction provided with the grindstone / guide position adjusting means for adjusting the level of the guide corresponding to the grindstone to the level of the grindstone, the position adjusting means corresponds to the grindstone to the level of the grindstone. Since the level of the guide can be adjusted, even if the level of the grindstone changes due to wear or the like, it is possible to prevent a step from being formed between this and the grindstone. It can be securely prevented from being caught between the grindstone.

Further, a fine cutting mechanism for making a fine cut in the grindstone, a measuring means for measuring the thickness of the work after processing, and a working thickness of the work by operating the fine cutting mechanism on the basis of the measurement information from this measuring means. In the configuration provided with the control means for controlling the position of the grindstone minute cut portion of the guide corresponding to the grindstone to be controlled for cutting, the control means, the measurement information by the measuring means regarding the thickness of the workpiece after processing. The fine cutting mechanism of the grindstone is used as a base, and the level of the grindstone is finely adjusted according to the wear of the grindstone so that the work thickness of the work becomes the predetermined thickness, so that the predetermined working thickness of the work is always secured. In addition to this, the control means further adjusts the height of the guide corresponding to the grindstone finely adjusted based on the measurement information, so that the predetermined processing thickness is secured. It is possible to prevent the can step between the guide corresponding thereto by micro cut adjustment because of the grinding wheel, to ensure and a stable supply and precision by which machining of the workpiece.

[0013]

EXAMPLES The double-sided grinding machine of the present invention will be specifically described below by showing some examples.

FIG. 1 shows a double-sided grinding machine as a first embodiment of the present invention. As shown in the figure, this device guides a work 3 which is fitted into a holding hole 2 of a carrier 1 and conveyed by upper and lower guides 4 and 5, and is introduced between a pair of vertically facing grindstones 6 and 7. We are going to process both sides.

The carrier 1 is in the form of a thin plate, and is held by being sandwiched between, for example, a pair of upper and lower annular rigid body holders 8a and 8b arranged on the outer peripheral portion thereof in a state of being stretched in the centrifugal direction like drum leather. There is. A mounting ring 8c is coupled to the lower surface of the lower rigid holder 8b, and a rotation support mechanism 9 using, for example, a cross roller bearing 10 is provided between the mounting ring 8c and the support ring 22 fixed on the substrate 21. Then, the carrier 1 is rotatably supported via the rigid holders 8a and 8b, and the drive gear 25 directly connected to the motor 24 is engaged with the gear 23 provided on the lower outer periphery of the mounting ring 8c. 1 can be driven to rotate, and the work 3 is inserted into the holding hole 2 provided on the outer peripheral portion of the carrier 1.
And the carrier 1 is rotated to carry the carrier.
The upper and lower guides 4 and 5 are usually provided in a range excluding a portion where the grindstones 6 and 7 of the carrier 1 are located and a portion where the work 3 is supplied and taken out from above and below.

Here, the work 3 fitted into the holding hole 2 of the carrier 1 and conveyed is guided by the upper and lower guides 4 and 5, and is introduced between a pair of vertically facing grindstones 6 and 7 for double-sided processing. In addition, since the thin plate-shaped carrier 1 is held in the stretched state by the rigid body holders 8a and 8b at the outer peripheral portion, expansion and contraction of each portion does not cause swaying or sagging, and particularly high rigidity at the outer peripheral portion. As shown, by providing the holding hole 2 in the outer peripheral portion and holding and transporting the work 3, it is possible to eliminate the influence of shaking and sagging of the thin plate-shaped carrier 1 in the transport by the holding hole 2 and the rotation of the carrier 1 Rigid body holder 8a,
Since it becomes stable by being supported via 8b, even when the thin film-shaped work 3 is conveyed by using the thin plate-shaped carrier 1, the work 3 falls off between the upper and lower grindstones 6 and 7 and the carrier 1. The grindstones 6 and 7 can be conveyed and processed in a reliable and stable state without any trouble such as being caught between the grindstones 6 and 7, and the processing can be stably achieved with high accuracy.
Further, since the outer periphery of the carrier 1, which is the work transfer part, has a high rigidity and is stable without swaying or sagging, it is possible to prevent the carrier 1 from contacting the upper and lower grindstones 6 and 7 and wearing each other. However, the durability is improved and the highly accurate processing can be guaranteed for a long period of time.

However, the concrete structure of the rigid holder for holding the carrier 1 in the stretched state at the outer peripheral portion, the rotation support structure of the carrier 1 via this rigid holder, and the rotary drive mechanism of the carrier 1 are limited to this embodiment. It is not a thing but various designs can be made.

The upper and lower grindstones 6 and 7 are provided at the tips of the spindles 12 and 13 that are driven to rotate, and the mutual distance can be set in accordance with the processing thickness of the work piece 3 by a vertical position adjusting mechanism (not shown) as in the conventional case. Is being done.
Therefore, the work 3 can be processed into a desired processing thickness.
In the present embodiment, the type in which both the upper and lower grindstones 6 and 7 are adjusted in height is adopted, but the present invention is also applicable to the one in which only the upper grindstone 6 is adjusted in height.

Further, in this embodiment, level changes due to the wear state of the respective grindstones 6 and 7 are detected by the level sensors 31 and 32 installed corresponding to the respective grindstones 6 and 7.
A grindstone / guide position adjusting means 33 for manually adjusting the levels of the upper and lower guides 4 and 5 corresponding to the level 7 according to the level detection information from the level sensors 31 and 32 is provided.

Even if the whetstone / guide position adjusting means 33 is manually operated, the operation of the whetstone / guide position adjusting means 33 brings the whetstones 6 and 7 to the level.
By adjusting the levels of the guides 4 and 5 corresponding to the grindstones 6 and 7, it is possible to prevent a step from being formed between the grindstones 6 and 7 even if the levels of the grindstones 6 and 7 change due to wear or the like. , Work 3 is carrier 1 due to such steps
It is possible to securely prevent the carrier 1 from falling off from the holding hole 2 and being caught between the carrier 1 and the grindstones 6 and 7.

In the case of the present embodiment, the grindstone / guide position adjusting means 33 has a guided shaft 35 for the lower guide 5.
Is supported by a slide bearing 34 provided on the base plate 21 so as to be vertically slidable, and a spring 36 for urging the guided shaft 35 between the base shaft 21 and the base plate 21 is actuated at the lower end of the guided shaft 35. The position regulating protrusion 37a of the attached micrometer head 37 abuts the lower surface of the substrate 21, and the height level of the lower guide 5 via the guided shaft 35 is adjusted to be small by the micrometer system of the position regulating protrusion 37a. Fine adjustment is possible by adjusting the amount of protrusion. Regarding the upper guide 4, a slide arm 38 attached to the upper guide 4 is supported by a precision linear guide 39 containing a ball so that it can slide up and down, and the slide arm 38 is supported by a position regulating protrusion 41a of another micrometer head 41. The level of the upper guide 4 is received from below, and the level of the upper guide 4 can be finely set by finely adjusting the protrusion amount of the position regulating protrusion 41a by the micrometer method.

Therefore, the level adjustment of the upper and lower guides 4, 5 based on the detection level information of the level sensors 31, 32 is performed by the respective micrometer heads 37, 41.
The position control protrusions 37a and 41a can be finely and precisely adjusted by finely adjusting the protrusion amounts, so that the levels of the guides 4 and 5 corresponding to the whetstones 6 and 7 whose levels change minutely due to wear can be accurately adjusted. Can be matched.

Of course, the position adjusting member of the grindstone / guide position adjusting means 33 such as a micrometer head is connected to the automatic driving means such as a motor, and the automatic driving means is operated according to the detection level information of the level sensors 31 and 32. Since the above control is performed, the levels of the upper and lower guides 4 and 5 can be automatically matched with the levels of the corresponding grindstones 6 and 7. Further, the work 3 can be double-sided processed to a predetermined processing thickness by adjusting the positions of only one of the upper and lower grindstones 6 and 7 closer to the other side, and this case also belongs to the category of the present invention.

Further, the concrete method of detecting the level of the grindstones 6 and 7 and the vertical position adjusting mechanism of the vertical guides 4 and 5 are not limited to those of the present embodiment, but can be variously designed.

FIG. 2 shows a double-sided grinding machine as a second embodiment of the present invention. The apparatus of the present embodiment, as shown in the figure, has a fine cutting mechanism 51 for finely cutting the grindstones 6 and 7 only for the upper grindstone 6, a measuring means 52 for measuring the thickness of the work 3 after processing, and this measurement. Based on the measurement information of the means 52, the control of the working thickness of the work 3 which operates the minute cutting mechanism 51, and the grindstone / guide position adjusting means 33 of the grindstone minute cut of the guide 4 corresponding to the grindstone 6 to be cut controlled. This is different from the first embodiment in that a control means 64 for performing position adjustment via the is provided.

Only the different points will be described below, and the description overlapping with the first embodiment will be omitted. Micro-cutting mechanism 51
Causes the slope cam 54 to be screwed onto the ball screw 53 driven by the motor 50, and the slope 54 of the slope cam 54
The cam follower 55 provided on the spindle 12 is received at a, and the gradient cam 54 is moved backward by a minute amount by the ball screw 53 which is appropriately driven by the motor 50, so that the spindle 12 is moved down by a minute amount and the upper grindstone 6 moves. It is designed so that minute cuts can be made freely.

Unlike the case of the first embodiment, the grindstone / guide position adjusting means 33 is provided only for the upper guide 4, and the ball screw 57 driven by the motor 56,
By screwing the slide arm 38 attached to the upper guide 4 and moving the slide arm 38 downward by a minute amount by the ball screw 57 that is appropriately driven by the motor 56, the upper guide 4 is moved downward by a minute amount. The upper grindstone 6 which is moved down by the minute cut amount of the grindstone 6 to control the minute cut
The level of the upper guide 4 can be always matched with the level of.

The work 3 after processing is picked up and taken out from the carrier 1 by an unloader 58 using a suction nozzle or the like, transferred to a transfer conveyor 59 and transferred to a predetermined position for processing. The measuring means 52 is provided in the middle of the transport conveyor 59.
The measuring means 52 measures the processing thickness of the processed work 3 by the separation distance or the like when the processed work 3 conveyed by the conveyor 59 passes between the pair of upper and lower sensors 52a and 52b. There is. However, it goes without saying that this measurement may be performed by any method.

The control means 64 uses a microcomputer or the like so that the measurement information from the measurement means 52 can be confirmed by the meter 61, and the operation of the two motors 50, 56 is controlled based on the measurement information. , The above whetstone 6
And the position adjustment of the upper guide 4 accompanying this.

As described above, the control means 64 activates the minute cutting mechanism 51 of the grindstone 6 based on the measurement information by the measurement means 52 on the thickness of the work 3 after processing, and the work 3
Since the level of the grindstone 6 is finely adjusted in accordance with abrasion of the grindstone 6 so that the processed thickness of the workpiece 3 becomes a predetermined value, a predetermined processed thickness of the work 3 can be always ensured and the control means 64 is also provided. Further adjusts the height of the guide 4 corresponding to the grindstone 6 finely adjusted based on the measurement information. Therefore, the guide 4 corresponding to this is adjusted by the fine cut adjustment of the grindstone 6 to secure the predetermined processing thickness. It is possible to prevent a step from being formed between the workpiece and the workpiece, and to ensure the stable supply of the work 3 and the highly accurate processing thereby.

The adjustment of the minute cutting amount of the grindstone and the position adjusting function of the guide corresponding thereto can be applied to the lower grindstone 7 and the lower guide 5, and the upper and lower grindstones 6,
7 and the upper and lower guides 4, 5 can be applied simultaneously.

Moreover, such a mechanism of this embodiment can be used in combination with the first embodiment.

[0033]

According to the main feature of the double-sided grinding machine of the present invention, since the thin plate-shaped carrier is held in the stretched state by the rigid holder at the outer peripheral portion, expansion and contraction of each portion accumulates and shakes. There is no sagging, especially high rigidity in the outer peripheral part, and by holding a work hole in this outer peripheral part and holding and transporting the work, it is possible to eliminate the influence of swaying and sagging of the thin plate-like carrier in the carrying by the holding hole, Since the rotation of the carrier is also stabilized by the support via the rigid holder, even when the thin film carrier is used to carry a thin film-like work and to perform double-sided processing with a double-head grinding machine, It is possible to convey the material in a reliable and stable state for processing without troubles such as dropping between the grinding wheels or being pinched between the carrier and the grinding wheel, and to perform the processing with high accuracy and stability. In addition, since the outer peripheral part that is the work transfer part of the carrier is highly rigid and stable without swaying or sagging, it is eliminated that the carrier contacts the upper and lower grindstones and wears each other, and it is durable. Therefore, it is possible to guarantee the high-precision processing for a long period of time.

In this case, the level of each grindstone is detected,
According to the grindstone that adjusts the level of the guide corresponding to the grindstone to the detection level, and the configuration including the guide position adjusting means, by adjusting the level of the guide corresponding to the grindstone to the level of the grindstone, Even if the level changes due to wear or the like, it is possible to prevent a step from being formed between the whetstone and such a step, and such a step causes the work piece to fall out of the holding hole of the carrier or get caught between the carrier and the whetstone. It can be firmly prevented.

Further, a fine cutting mechanism for finely cutting the grindstone, a measuring means for measuring the thickness of the work after processing, and a machining thickness of the work for operating the fine cutting mechanism based on the measurement information by the measuring means. According to a configuration including a control means for performing position adjustment of the grindstone minute cut portion of the guide corresponding to the grindstone to be cut controlled, based on the measurement information on the thickness of the workpiece after processing,
Finely adjust the level of the grindstone according to the wear of the grindstone so that the work thickness of the work is as specified, and at the same time to always secure the predetermined work thickness of the work, fine cut adjustment based on the above measurement information By adjusting the height of the guide corresponding to the grindstone, it is possible to prevent a step from being formed between the guide and the corresponding fine adjustment of the grindstone to secure the predetermined processing thickness, and stabilize the work. It is possible to guarantee the supply and the highly accurate processing by this.

[Brief description of drawings]

FIG. 1 is a sectional view showing the main configuration of a double-sided grinding machine as a first embodiment of the present invention.

FIG. 2 is a sectional view showing an essential part of a double-sided grinding machine as a second embodiment of the present invention.

FIG. 3 is a cross-sectional view showing the main configuration of a conventional double-headed grinding machine.

[Explanation of symbols]

 1 Carrier 2 Holding Hole 3 Work 4, 5 Guide 6, 7 Grinding Stones 8a, 8b Rigid Holder 9 Rotation Support Mechanism 21 Substrate 24 Motor 31, 32 Level Sensor 33 Grindstone / Guide Position Adjusting Means 51 Micro Cutting Mechanism 52 Measuring Means 64 Controlling Means

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masayuki Takahashi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (3)

[Claims] 1. A double-headed grinding machine in which a workpiece, which is inserted into a holding hole of a carrier and conveyed, is guided by upper and lower guides and is introduced between a pair of vertically facing grindstones for double-sided processing. The thin plate-shaped carrier is held in a stretched state by a rigid body holder on the outer peripheral part, and is supported so as to be rotatable via this rigid body holder, and the workpiece is held in a holding hole provided on the outer peripheral part of the carrier to carry the carrier. A double-sided grinding machine characterized by being performed. 2. The double-sided grinding machine according to claim 1, further comprising a grindstone / guide position adjusting means for adjusting a level of a guide corresponding to the grindstone to a level of the grindstone. 3. A micro-cutting mechanism for micro-cutting a grindstone, and a measuring means for measuring the thickness of a work after processing,
Based on the measurement information by this measuring means, the control means for controlling the machining thickness of the work that operates the minute cutting mechanism and adjusting the position of the minute cutting portion of the grindstone of the guide corresponding to the grindstone whose cutting is controlled are provided. The double-sided grinding device according to claim 1.