JPH0871777A - Method for cutting high polymer thin film laminated substrate - Google Patents

Abstract

PURPOSE: To provide a method for cutting a high polymer thin film laminated substrate characterized by extremely excellent surface smoothness, high electro- optical effect, high measurement sensitivity, excellent operability and practicability. CONSTITUTION: High polymer thin films 3 including org. nonlinear optical materials are formed on a first substrate 2 and the org. nonlinear optical materials polymers are subjected to a polarization treatment by applying a high electric field thereto. A second substrate 7 is then laminated on the high polymer thin film side of the laminate and the first substrate 2 is peeled. The high polymer thin films 3 are cut to a desired size by using a laser beam 8 and further, the second substrate 7 is cut by a cutting machine without using an optical means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a polymer thin film laminated substrate.

[0002]

2. Description of the Related Art When the electrical or optical function of a polymer thin film is utilized to make it into a component, it is preferable to use a laminate in which the polymer thin film is laminated on a substrate such as an inorganic crystal material or glass. is important. For example, it has been proposed that when a polymer thin film has an electro-optical effect, it can be used as an electric field sensor (JP-A-6-118107).
issue). When cutting a laminated body of such a polymer thin film and a substrate such as glass or Si wafer, as a cutting means, a method using a normal cutter such as a metal blade or a precision cutting machine such as a diamond saw is known. There is.

[0003]

With these cutting means,
When the laminate of the polymer thin film and the substrate is cut,
Peeling of the polymer thin film from the substrate occurred, and no component that could be used as a component was obtained. In particular, when a glass substrate or a quartz substrate was used as the substrate, peeling from the polymer thin film was remarkable, and it could not be used at all.

[0004]

In order to solve these problems, the method for cutting a polymer thin film laminated substrate of the present invention has the following features. A first invention is, in a method for cutting a polymer thin film laminated substrate, a first step of cutting the polymer thin film by using a laser beam, and a second step of cutting the substrate without using optical means. It consists of A second aspect of the invention is to cut the polymer thin film by using a laser beam after the organic nonlinear optical material contained in the polymer thin film in the first aspect of the invention is polarized. Third
Of the invention firstly provides a polymer thin film containing an organic nonlinear optical material.
First step of laminating on the substrate, a second step of applying an electric field to the polymer thin film to perform polarization treatment, and a second substrate on the side of the polymer thin film not in contact with the first substrate. A third step of laminating, a fourth step of peeling the first substrate from the polymer thin film, a fifth step of cutting the polymer thin film with a laser beam, and without using an optical means. And a sixth step of cutting the second substrate.

Further, the present invention will be described in detail below.

The polymer thin film laminated substrate used in the present invention is
A substrate in which polymer thin films are laminated, and as the polymer thin film, one having an optical function such as a nonlinear optical effect, photochromism, photorefractive, photocontactive, or the like is applicable. Further, those having electrical conductivity, piezoelectricity, pyroelectricity, etc. correspond to the electrical function. The substrate is not particularly limited, but a hard substrate, a plate made of glass, an inorganic crystal or the like is preferable. In addition, when utilizing an optical function, it is often desirable to use a transparent substrate.

When cutting a polymer thin film laminated substrate,
First, the polymer thin film is cut into a desired size, and laser light is used for this cutting. As for this laser light,
Various types of laser light can be used, but excimer laser light is particularly desirable. The excimer laser is a rare gas excimer laser, a rare gas-oxygen excimer laser, a mercury halide excimer laser, a rare gas-halide excimer laser, or the like which is excited by electron beam excitation or discharge excitation. Examples of the rare gas excimer laser include those using Xe ₂ , Kr ₂ , and Ar ₂ gas, and examples of the rare gas-oxygen excimer laser include:
Examples include those using XeO, KrO, and ArO gas,
For mercury halide excimer laser, HgBr, H
Examples thereof include those using gCl and HgI gas, and rare gas-halide excimer lasers include KrF and XeC.
l, XeBr, XeF, ArF, KrCl, ArCl,
Examples include those using Xe ₂ Cl and Kr ₂ F gas.
Examples of preferable excimer lasers used in the present invention include lasers using KrF, XeF, and ArF gases. More preferably, KrF or ArF
An excimer laser using gas is used. Further, a buffer gas (He, Ne) can be used for oscillation of the excimer laser, if necessary. The energy density of the excimer laser is 0.1 to 10 J / cm ²
Is preferred. When there is an adhesive layer between the polymer thin film and the substrate, it is desirable to cut the adhesive layer with laser light. It is desirable that the cutting margin with the laser light be the same as the cutting margin with the cutting machine described later.

As a cutting machine used for cutting the substrate, a means not using optical means such as a normal cutter such as a metal blade or a precision cutting machine such as a diamond saw is used. It is desirable that the cutting by the cutting machine be performed with the same cutting margin so as to be continuous with the cutting position by the laser beam.
This enables cutting without peeling.

As described above, the polymer thin film laminated substrate used in the present invention is a substrate in which polymer thin films are laminated. The polymer thin film contains an organic nonlinear optical material and is subjected to polarization treatment. It is desirable to apply. This will be described below as a second invention. Examples of the organic nonlinear optical material used in the present invention include polydiacetylene derivatives, polyphenylene biphenylene derivatives, polythiophene derivatives,
It is possible to use one or more of various known materials having a generally known nonlinear optical effect, such as polydiyne derivatives, polypyrrole derivatives, and phthalocyanine derivatives. It is preferable to use one or more compounds in which a plurality of π-electron conjugated ring bodies are linked while maintaining a conjugated system, and those having an electron-withdrawing group and an electron-donating group are preferable. Examples of this compound include compounds represented by the following general formula [1] or derivatives thereof.

[0010]

Embedded image

Π _{1 to} π ₃ in the above formula are π-electron conjugated ring bodies, and this is not limited to the benzene ring shown in the above formula, and may be a heterocyclic system, a condensed ring system or the like. Examples thereof include a thiazole ring, a benzothiazole ring, a naphthalene ring (which may have these substituents), and the like. In the above formula, each of X and Y constituting the connector is one selected from CH, N or N → O, and the connector -X = Y- is -CH = CH-, -CH = N-,-N = N-,
Examples include -CH = (N → O)-, -N = (N → O)-, and the like. The linking elements can be used in an appropriate combination in one molecule. In the above formula, n is an integer of 0 or more,
D is an electron donating group such as a dialkylamino group, A is an electron withdrawing group such as a nitro group, a dicyanovinyl group and a tricyanovinyl group, and R _{1 to} R ₁₂ are each a hydrogen atom, a halogen or an alkyl group. Examples of the compound represented by the general formula [1] include 4- (N- (2-hydroxyethyl)-
N-ethyl) -amino-4′-nitroazobenzene,
Examples include 1'-octadecyl-3 ', 3'-dimethyl-6-nitro-8- [docosaylmethyl] spiro [2H-1-benzopyran-2,2'-indoline].

Polymer materials that can be used together with the organic nonlinear optical material include acrylic polymers such as polymethylmethacrylate, polystyrene, poly (4-methylstyrene), poly (2-methylstyrene), poly (4-acetylstyrene), Styrene-based polymers such as poly (4-chlorostyrene), polyester-based polymers such as polycarbonate, polyethylene terephthalate, polyethylene adipate, polydiethoxycarbonylethylene, and polyether-based polymers such as polyoxymethylene, polyoxy-2,6-dimethyl-1,4-phenylene , Nylon 6, nylon 66, nylon 3, nylon 46, nylon 56, nylon 6-12 and other polyamide polymers, polyethylene, polypropylene, polyisoprene, polybuta Olefin polymers such as ene, ethyl cellulose, cellulose diacetate, cellulose polymers such as cellulose triacetate, polyvinyl alcohol, polyvinyl butyral, polysiloxane, polyimide, polyvinyl acetate, polyvinyl chloride,
Mention may be made of polyvinylidene chloride, polyglucidyl methacrylate and polycarbazole, their blocks, random copolymers and mixtures thereof. Among the above polymers, polymethyl methacrylate, polycarbonate, polyvinyl alcohol, polyvinyl butyral, and polyvinyl acetate, which have excellent transparency, are preferable.

In a polymer containing an organic nonlinear optical material, it is desirable that the organic nonlinear optical material is in a dissolved or dispersed state in the polymer or in a state of being bound (including coordinated) with the polymer. It is desirable to be in a bound state with the chain. When the organic nonlinear optical material is bound to the main chain or a part of the side chain of the polymer, the content of the organic nonlinear optical material increases, and a material having a large electro-optical effect can be obtained.

The content of the organic nonlinear optical material with respect to the polymer is not particularly limited, but is preferably 0.2 to 50% by weight. When the organic nonlinear optical material and the polymer are in a bound state, the content of the organic nonlinear optical material is preferably 20 to 80% by weight. Examples of preferred polymers that are in a bonded state with the organic nonlinear optical material include acrylate-based, polyester-based, polyimide-based, and polyurethane-based polymers. A light stabilizer such as benzotriazole, benzophenone, or salicylate may be added to the polymer containing the organic nonlinear optical material. Generally, the content of these additives is, relative to the organic nonlinear optical material,
0.5 to 15% by weight, of which 0.5 to 10%
Weight percent is preferred. At this time, the film thickness of the thin film of the polymer material including the organic nonlinear optical material is not particularly limited, but is 0 in order to obtain a film having a good electro-optical effect,
The thickness is preferably 1 μm to 50 μm, and more preferably 5 to 30 μm.

The substrate used here is not particularly limited, but a hard substrate, a plate made of glass, an inorganic crystal or the like is preferable. In addition, when utilizing an optical function, it is often desirable to use a transparent substrate. A high voltage is applied to a laminate of a polymer thin film containing an organic nonlinear optical material and a substrate to polarize the molecules of the organic nonlinear optical material (orient in a certain direction). Corona poling using the corona discharge generated by heating the above and applying a high voltage between the thin metal wire electrode or metal plate electrode and the polymer thin film, or the polymer thin film and the substrate between the two electrodes. It is possible to use a contact poling method in which a laminated body of and is sandwiched and a high voltage is applied. In addition, the LB method, the vapor deposition method with controlled orientation, or the like can be used. In particular, it is preferable to use contact poling, which is easy to operate, causes little damage to the surface of the polymer thin film, and has a good applied voltage uniformity.

The polymer thin film laminated substrate, which is not cut into a desired size and is well cut by the above method, is used by directly adhering it to an object to be measured such as an integrated circuit, or by using it on an object to be measured such as an integrated circuit. Can be attached to the tip of an optical probe capable of scanning and used as an electric field sensor or the like.

Further, in the third invention, the case where the polymer thin film of the second invention contains the organic nonlinear optical material and the polarization treatment is applied to the production of the electric field sensor will be described below. To do.

The polymer thin film containing the organic nonlinear optical material is as described in the second invention, and the first substrate for forming the thin film is a polished silicon wafer,
A substrate having excellent surface smoothness such as metal, glass coated with a conductive film, or ceramic can be used. In particular, it is preferable to use a mirror-polished silicon wafer which has excellent surface smoothness and can be easily obtained. Further, the surface roughness of the silicon wafer is preferably 50 nm or less.

To form a polymer thin film containing an organic nonlinear optical material on a first substrate, spin coating, casting, dip coating, melt pressing, vapor deposition, LB
A known technique such as a method or an epitaxial method can be used. Among these methods, the surface property of the obtained film,
The spin coating method is superior in terms of workability. When the film is formed by the spin coating method, the casting method, or the dip coating method, an organic nonlinear optical material and a polymeric material or a polymeric material in which the organic nonlinear optical material is bonded are acetone, methyl ethyl ketone, chloroform, chlorobenzene, methylene chloride, It is dissolved in an organic solvent such as dioxane, DMF, DMA, pyridine, toluene, ethyl acetate, and this solution is applied onto a substrate having excellent surface smoothness. Of the above solvents, chloroform, chlorobenzene and methylene chloride are preferred.

As a method for applying a high voltage to a laminate of a polymer thin film containing an organic nonlinear optical material and a first substrate to polarize molecules of the organic nonlinear optical material (orient in a certain direction), a polymer is used. A thin film is heated above its glass transition temperature, a high voltage is applied between a thin metal wire electrode or metal plate electrode and a polymer thin film, and corona poling using corona discharge generated at that time, or between two electrodes It is possible to use a contact poling method in which a laminate of a polymer thin film and a smooth substrate is sandwiched between and a high voltage is applied.
In addition, the LB method, the vapor deposition method with controlled orientation, or the like can be used. In particular, it is preferable to use contact poling, which is easy to operate, causes little damage to the surface of the polymer thin film, and has a good applied voltage uniformity. When contact poling is performed, by inserting a polymer film between the polymer film and the electrode, damage to the polymer film surface can be further reduced. This polymer film can be removed from the polymer thin film after the completion of contact poling. As the polymer film, polyester type,
Generally used films such as acrylic, polyimide, polyurethane, polyfluorocarbon, polyamide, polypropylene, polyethylene and polyvinyl alcohol can be used. Further, the thickness of the polymer film is preferably 5 μm or more in order to obtain a good function of preventing damage to the polymer film. Further, in order to prevent the polymer film from being scratched, smoothness of the film surface is also required, and the root mean square roughness value measured by three-dimensional surface roughness measurement is 0.5 μm or less, preferably 0.1 μm or less. Is suitable. Further, the electric resistance in the film thickness direction of the polymer film is preferably lower than the electric resistance in the film thickness direction of the polymer thin film, and particularly, one having an electric resistance lower by one digit or more is preferable. An example of the polymer film is a polypropylene film having a thickness of 25 to 100 μm in which an antistatic agent is mixed.

As the second substrate to be laminated on the polymer thin film side of the laminate having the polymer thin film in which the molecules of the organic nonlinear optical material are polarized (oriented in a certain direction) by a high voltage, an ordinary glass substrate or quartz is used. A transparent inorganic substrate such as a substrate, a Pyrex substrate, or a sapphire substrate, or a transparent resin substrate having excellent transparency such as a polycarbonate type, an epoxy type, or an acrylate type is used. The thickness of the substrate is not particularly limited, but considering the hardness of the second substrate, handling, etc., it is 20 μm or more, preferably 10 μm or more.
It is preferably 0 μm or more. An antireflection film may be formed on the second substrate, if necessary.

The polymer thin film containing the organic nonlinear optical material and the second substrate may be laminated via an adhesive layer, if necessary. As such an adhesive layer, a general adhesive such as an acrylic adhesive, an epoxy adhesive, an isocyanate adhesive, a urethane adhesive, or a silicone adhesive can be used.
Of these adhesives, if a heat-curable adhesive is used, the molecules of the organic nonlinear optical material relax the polarization state (orientation relaxation) due to the high heat generated during the heat curing of the adhesive. Epoxy adhesive having or acrylic having transparency that cures by ultraviolet irradiation,
Adhesives such as epoxy type, isocyanate type and urethane type are desirable. Further, in order to improve the adhesiveness, additives such as a silane coupling agent can be mixed. The film thickness of these adhesive layers is determined in consideration of adhesiveness, and is not particularly limited, but it is desirable that the film thickness is 5 μm or more in order to exhibit the required adhesiveness. Since the adhesive strength of these adhesives varies depending on the characteristics of the materials of the first substrate and the polymer thin film to be bonded, the type of adhesive can be selected according to each case. Further, the adhesive layer may be composed of two or more layers if necessary.

When the second substrate is a transparent resin substrate, the substrate forming transparent resin is directly spin-coated on the polymer thin film or the transparent adhesive layer without forming the substrate in advance. , Casting method, dip coating method,
The substrate may be formed by using another method of forming a resin film.

After adhesion of the polymer thin film and the second substrate, the first
As the method for peeling the substrate, the polymer thin film and the second substrate may be mechanically peeled from the first substrate, or a method of immersing and peeling the polymer thin film in a solution that does not dissolve the polymer thin film may be used. Good. Further, the method of peeling by applying an appropriate temperature, a method of applying ultrasonic waves in a solution is not particularly limited, but a method of peeling by dipping in a solution that does not damage the polymer thin film is preferable. .

Next, the polymer thin film of the laminate of the polymer thin film and the second substrate is cut into a desired size of several millimeters square by using laser light. The laser light used in the present invention is as follows. Various laser beams can be used, but it is particularly preferable to use an excimer laser. here,
The excimer laser is as described above. It is desirable that the cutting margin with the laser light be the same as the cutting margin with the cutting machine described later.

As a cutting machine used for cutting the second substrate, a means that does not use optical means such as a normal cutter such as a metal blade or a precision cutting machine such as a diamond saw is used. It is desirable that the cutting by the cutting machine be performed with the same cutting margin so as to be continuous with the cutting position by the laser beam.

According to the above-mentioned method, the electric field sensor is obtained without being peeled to a desired size and can be satisfactorily cut to obtain an electric field sensor, which is directly attached to a measurement object such as an integrated circuit for use, or used for an integrated circuit or the like. The measurement object can be attached to the tip of an optical probe capable of scanning and used.

[0028]

In the present invention, the polymer thin film of the polymer thin film laminated substrate is cut into a desired size by using a laser, and further the substrate is cut without using an optical means.
It became possible to cut the polymer thin film and the substrate without peeling, and as a result, it was possible to obtain a polymer thin film laminated substrate having very excellent surface smoothness. Further, in the present invention, the polymer thin film of the polymer thin film laminated substrate is allowed to contain an organic nonlinear optical material, and a high electric field is applied thereto to polarize the molecules of the organic nonlinear optical material. The size of the substrate is cut with a laser and the substrate is cut without using any optical means, so that the polymer thin film and the substrate do not peel, and the surface is very smooth and the electro-optical effect is large. It is now possible to create a practical electric field sensor for circuit testing, which has high measurement sensitivity and excellent operability. Further, in the present invention, a thin film of a polymer material containing an organic nonlinear optical material and a first substrate are laminated, and a high electric field is applied to polarize molecules of the organic nonlinear optical material (orient in a certain direction), After stacking the second substrate on the polymer thin film side of the obtained laminate having the polymer thin film,
The polymer thin film of the laminated body of the polymer thin film obtained by peeling the substrate and the second substrate is cut into a desired size by using a laser, and the second substrate is further cut by an optical means. By cutting with a cutting machine without peeling, the polymer thin film and the second substrate do not peel, and the surface smoothness is very excellent.
It has become possible to create a practical electric field sensor for circuit testing that has a large electro-optic effect, high measurement sensitivity, and excellent operability.

[0029]

EXAMPLES The present invention will be described in detail below with reference to examples. Example 1 3 with n-type, plane orientation (100), and specific resistance of 0.5 to 5 Ωcm
On a inch silicon wafer, polymethylmethacrylate (PMMA) and 4- (N- (2-hydroxyethyl))
A chloroform solution prepared by dissolving -N-ethyl) -amino-4'-nitroazobenzene (DR1) at a weight ratio of 100: 20 was applied by a spin coating method to form a polymer thin film. When this film thickness was measured by a stylus type film thickness meter (Dektack 3030 manufactured by Sloan), 1
It was 3 μm. As shown in FIG. 1, a 50 μm polypropylene film (manufactured by Toyobo Co., Ltd.) 4 is placed on a polymer thin film 3 formed on a silicon wafer 2, a 15 mmφ SUS electrode 5 is placed thereon, and the temperature is set to 150 ° C. It was placed on the SUS table 1 in the set constant temperature bath. 5 between the lower SUS table 1 and the upper SUS electrode 5
A voltage of kV was applied to perform DR1 orientation treatment (polarization treatment, contact poling). After that, leave it at 30 ° C, stop applying voltage, and remove from the constant temperature bath.
The SUS electrodes 1 and 5 and the polypropylene film 4 were removed. Next, a UV curable adhesive (manufactured by San-Yu-Resin Co., Ltd.) is applied on the polymer thin film by a spin coating method so as to have a thickness of 14 μm, and a 15 mm square quartz substrate (thickness 150 μm) is pasted on it. , 50 on the quartz substrate surface
The adhesive was cured by exposing it to a 0 W high-pressure mercury lamp for 5 minutes to form a three-layer laminate. Then, this laminate was immersed in a 3% ethylenediamine aqueous solution, and the silicon wafer was peeled off at the interface with the polymer thin film to obtain a laminate of the polymer thin film and the quartz substrate.

Next, an ArF gas was used with an excimer laser device (L4500 manufactured by Hamamatsu Photonics KK), oscillation wavelength 193 nm, frequency 10 Hz, energy density 1.0 J.
As shown in FIG. 2, the polymer thin film and the UV curable adhesive layer were cut into 2 mm squares with a cutting margin of 0.35 mm width using a laser beam oscillated under the condition of / cm ² . Next, as shown in FIG. 3, using an automatic slicing machine (DAT-2H6T) manufactured by Disco Co., a width of 0.35 mm was used as a cutting allowance for the diamond saw 9, and the quartz substrate was cut into 2 mm square chips. An electric field sensor was obtained. By observing the cut end of the obtained electric field sensor with an optical microscope, there is no separation between the quartz substrate and the polymer thin film, there is no scratch on the polymer thin film surface, and the smoothness is excellent. It was confirmed that there was no wound.

The polymer thin film side of a 2 mm square chip-shaped electric field sensor was bonded onto a measuring integrated circuit in which wiring having a width of 5 μm was arranged at intervals of 10 μm. Since the chip-shaped electric field sensor has very excellent surface smoothness, it can be closely adhered to the integrated circuit for measurement, and its interval can be evenly adhered, and it can be used for measuring the voltage inside the integrated circuit.
Since the chip-shaped electric field sensor has a transparent substrate, it was excellent in handling. When the sensitivity of the electro-optic effect was measured, good and uniform results were obtained.

Comparative Example 1 In the same manner as in Example 1, a laminate of a polymer thin film, an adhesive layer and a quartz substrate was obtained. Next, using a disco auto match slicing machine DAT-2H6T, 0.3
5 mm was used as a cutting allowance for the diamond saw, and each layer of the laminate was cut at the same time to obtain a 2 mm square chip-shaped sensor. When this sensor was observed with an optical microscope, peeling of several hundred μm was observed at the end of the sensor, and it was confirmed that the polymer thin film was warped from the substrate. It was attempted to bond a 2 mm square chip-shaped sensor to the measurement integrated circuit in the same manner as in Example 1. However, since the edge of the sensor was peeled off and warped, the adhesion to the measurement integrated circuit was poor and the sensor was evenly bonded. I couldn't match. Further, when the sensitivity of the electro-optical effect was measured, it was found that the result was very poor and the variation was large.

Example 2 3 with n-type, plane orientation (100) and specific resistance of 0.5 to 5 Ωcm
On an inch silicon wafer, a solution prepared by dissolving an organic optical nonlinear material of m: n: l = 85: 5: 10 represented by the following general formula [2] in chloroform was applied by spin coating to give a film thickness of 20 μm. Thin film was formed.

[0034]

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Next, orientation treatment (polarization treatment) is performed in the same manner as in Example 1, and further room temperature curing epoxy resin (Okaka Shell Epoxy Co., Ltd., main agent 828, curing agent 3080) is applied to the location subjected to orientation treatment. Then, a 15 mm square soda glass substrate (thickness: 150 μm) was attached thereon, and left for one week to cure the epoxy resin to obtain a laminate. Then, the laminate was immersed in a 3% aqueous solution of ethylenediamine and peeled at the interface between the silicon wafer and the organic optical nonlinear material to obtain a laminate of the organic optical nonlinear material and the glass substrate. Next, the laminate was cut into a 2 mm square chip using an excimer laser and an automatic slicing machine in the same manner as in Example 1 to obtain a sensor. Observation by an optical microscope shows that the glass substrate and the organic optical nonlinear material are not separated at the edge of the chip-shaped sensor, the surface of the organic optical nonlinear material is not scratched, and the smoothness is excellent. It was confirmed that there was none. When the sensitivity of the electro-optical effect was measured, it was good,
Uniform results were obtained.

Comparative Example 2 In the same manner as in Example 2, a laminate of the organic nonlinear optical material thin film, the adhesive layer and the soda glass substrate was obtained. Next, using a carbon dioxide gas laser device (TOSHIBA, LAC-501),
0.35 mm was used as a cutting allowance for the diamond saw, and each layer of the laminate was cut at the same time to obtain a chip-shaped sensor of 2 mm square. When this sensor was observed with an optical microscope, peeling of several hundred μm was observed at the end of the sensor of 2 mm square, and it was confirmed that the organic optical nonlinear material thin film was warped from the substrate. Furthermore, dirt was found to be attached to the surrounding area, and the surface was quite dirty. In the same manner as in Example 1, a 2 mm square chip-shaped sensor was attempted to be bonded to the measurement integrated circuit. However, since the edge of the chip sensor was peeled off and warped, the adhesion to the measurement integrated circuit was poor, It was not possible to bond them evenly.
Also, when the sensitivity of the electro-optical effect was measured, it was very poor,
Moreover, a large variation was obtained.

[0037]

As is clear from the above description, according to the present invention, it is possible to produce a polymer thin film laminated substrate which does not peel off when it is cut and has very excellent surface smoothness. The polymer thin film laminated substrate obtained by using the present invention makes it possible to maximize the characteristics of the organic thin film material, and thus it is possible to provide excellent functional components. Furthermore, according to the present invention, it has become possible to produce a practical electric field sensor for circuit testing, which has excellent surface smoothness, a large electro-optical effect, a high measurement sensitivity, and an excellent operability. The electric field sensor for circuit test obtained in the present invention makes it possible to maximize the characteristics of the organic nonlinear optical material.
Sensitivity than conventional electric field sensors obtained from inorganic materials,
Excellent in circuit disturbance, light damage, and response speed. Therefore, it can be applied to not only LSIs and printed circuit boards but also diagnostics for ultra-high speed LSIs and the like.

[Brief description of drawings]

FIG. 1 is an explanatory diagram illustrating a treatment method for orienting an organic nonlinear optical material in a certain direction in Example 1.

FIG. 2 is an explanatory diagram illustrating a method of cutting an organic nonlinear optical material layer by laser light in Example 1.

FIG. 3 is an explanatory diagram illustrating a method of cutting a transparent substrate with a diamond saw in Example 1.

[Explanation of symbols]

 1 SUS heating table 2 Silicon wafer 3 Polymer thin film containing organic nonlinear optical material 4 Polypropylene film 5 SUS electrode 6 High voltage power supply device 7 Second substrate 8 Laser light 9 Diamond saw

Front Page Continuation (72) Inventor Kazuo Tai 23 Uji Kozakura, Uji City, Kyoto Prefecture Central Research Institute of Unitika Ltd. In-house (72) Inventor Michiyuki Amano 1-1-6 Uchisaiwai-cho, Chiyoda-ku, Tokyo Nihon Telegraph Telephone Co., Ltd. (72) Inventor Tadao Nagatsuma 1-1-6 Uchisai-cho, Chiyoda-ku, Tokyo Nippon Telegraph and Telephone Within the corporation

Claims (5)

[Claims] 1. A method of cutting a polymer thin film laminated substrate, comprising: a first step of cutting the polymer thin film with laser light; and a second step of cutting the substrate without using optical means. A method of cutting a polymer thin film laminated substrate, comprising: 2. The method for cutting a polymer thin film laminated substrate according to claim 1, wherein the polymer thin film contains an organic nonlinear optical material. 3. The method for cutting a polymer thin film laminated substrate according to claim 2, wherein the organic nonlinear optical material is polarized before the first step. 4. A first step of laminating a polymer thin film containing an organic nonlinear optical material on a first substrate, a second step of applying an electric field to the polymer thin film to perform polarization treatment.
A third step of stacking a second substrate on the side of the polymer thin film which is not in contact with the first substrate, a fourth step of peeling the first substrate from the polymer thin film, a laser A polymer thin film laminated substrate comprising: a fifth step of cutting the polymer thin film using light; and a sixth step of cutting the second substrate without using optical means. Cutting method. 5. The method for cutting a polymer thin film laminated substrate according to claim 1, wherein the laser light is an excimer laser light.