JPH0860330A - Cooler of hot dip coated wire - Google Patents

Abstract

PURPOSE: To easily cool a hot dip coated wire with high cooling efficiency at a low cost by slowly cooling this hot dip coated wire with an air cooling layer, then introducing the hot dip coated wire into a cooling liquid container internally arranged with a spherical sealing body from an introducing part of its recessed base. CONSTITUTION: The wire W1 to be hot dip coated is passed through a hot dip metal coating bath vessel 11 and is subjected to hot dip coating; thereafter, the hot dip coating liquid is wrung by a drawing die 13 and the wire is taken out. The hot dip coated wire W2 obtd. in such a manner is slowly cooled with the air cooling layer A and is then passed through the cooling liquid container 2 in which the cooling liquid 3 is circulated and stored, by which the wire is rapidly cooled. The cooling liquid sticking to the wire is dropped in a space part 5 and the wire is taken out as the coated wire W3 free from roughening of the coating surface. The cooling liquid container 2 of the cooler 1 described above has a coated wire introducing hole 6 disposed in the bottom of the recessed surface and a coated wire leading out port 7 at the top. The spherical sealing body 4 having the outside diameter larger than the outside diameter of the coated wire introducing hole and the sp.gr. larger than the sp.gr. of the cooling liquid 3 is arranged in this container to prevent the leakage of the cooling liquid 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot-dip galvanizing wire cooling device for cooling and solidifying a hot-dip galvanized wire drawn upward from a hot-dipped metal bath.

[0002]

2. Description of the Related Art In the process of manufacturing a molten metal plating wire, there is a process of cooling and solidifying an unsolidified metal plating layer on the surface of a wire which has passed through a molten metal plating bath. Natural cooling is common. However, as the production line speed of the hot-dip galvanized wire increases, natural cooling by the atmosphere requires a long cooling span, so that the plating layer is rapidly cooled and solidified at short intervals, for example, the peripheral wall of the gas container is Various cooling means such as means for cooling and solidifying the plating layer by cooling with a refrigerant and running a hot dip coating wire in this cooling gas atmosphere container, or means for running the hot dip coating wire in a spray droplet container to cool and solidify the plating layer A device has been proposed.

However, none of the above cooling devices is sufficient in terms of cooling capacity when the linear velocity of the hot dip galvanized wire is increased. That is, the cooling device using the gas cooled by the former refrigerant is performed by utilizing the heat transfer between the so-called solid (plating wire) and gas (cooling gas), in which the plating wire is cooled in the cooling gas. Therefore, the heat transfer efficiency is poor and the cooling efficiency is inferior, and there is a limit in increasing the plating line speed. Further, the cooling device using the latter spray droplets described above has a higher heat transfer efficiency with the plating wire than the former one using the cooling gas in that the spray droplets cool the plating wire. Although it was high and the cooling efficiency was improved, it was still insufficient to cope with the high plating line speed.

Therefore, the present inventors proposed a cooling device capable of highly efficiently cooling and solidifying a hot-dip galvanized wire at a cooling interval as short as possible, and disclosed in Japanese Laid-Open Patent Publication No. 6-81107, manufacturing hot-dip galvanized wire. The linear velocity was increased. This cooling device will be described with reference to FIG.

The cooling device 50 includes a cooling container 51 for running an unsolidified plated wire W2 plated in a hot dip bath (not shown), and a cooling liquid storage tank for supplying the cooling liquid CL to the cooling container 51. 60 and a cooling liquid storage tank 60
The cooling liquid CL circulates between the cooling container 51 and the cooling container 51. The cooling container 51 is provided with an introduction hole 52 and a lead-out hole 53 through which the plated wire W2 passes on the bottom surface and the top surface, respectively.
2 is formed with a hole diameter sufficiently larger than the outer diameter of the plated wire W2, and the lead-out hole 53 is formed with a diameter smaller than or substantially the same as the outer diameter of the plated wire W2. An inlet 54 and an outlet 55 for the cooling liquid CL are provided. Further, the cooling liquid storage tank 60 is returned to the delivery port 61 for delivering the cooling liquid CL to the cooling container 51 near the bottom surface and the delivery port 62 for inflowing the cooling liquid CL returned from the cooling container 51 near the top surface. Further, an air vent 63 for discharging the air contained in the cooling liquid CL to the outside is provided, and a heat exchanger 64 for cooling / cooling the cooling liquid CL to a predetermined temperature is further provided. The cooling liquid outlet 61 of the cooling liquid storage tank 60 and the cooling liquid inlet 54 of the cooling container 51 are connected by a cooling liquid forward pipe 68 via a liquid pump 65, an opening / closing valve 66 and a flow meter 67, and cooled. The cooling liquid outlet 55 of the container 51 and the cooling liquid inlet 62 of the cooling liquid storage tank 60 are connected by a cooling liquid return pipe 69 to form a cooling liquid circulation path between the cooling container 51 and the cooling liquid storage tank 60, and to cool the cooling liquid. The liquid CL is configured to circulate between the cooling liquid storage tank 60 and the cooling container 51 at a constant flow rate by the liquid feed pump 65.

In the case of this cooling device 50, since the plated wire W2 runs through the plated wire introducing hole 52 having a hole diameter sufficiently larger than the outer diameter, a large gap is generated between the plated wire introducing hole 52 and the plated wire W2. ing. However, the cooling liquid CL in the cooling container 51 is forcibly circulated and circulated from the cooling liquid inflow port 54 of the cooling container 51 to the cooling liquid outflow port 55 by the liquid feed pump 65, and the plating wire lead-out hole 53 is formed. Since the state is sealed by the cooled and solidified plating wire W3, the cooling liquid CL does not leak from the gap between the plating wire introduction hole 52 and the plating wire W2, and on the contrary, the atmosphere is sucked and cooled through the gap. The cooling liquid CL becomes a gas-liquid multiphase flow and is entrained as bubbles BL in the working liquid CL, and the plating wire W2
It further enhances the cooling effect and the effect of cleaning the surface of the plated wire. S is a turn sheave of the cooling solidified plating wire W3.

[0007]

The above-mentioned cooling device 50.
Was extremely high in cooling efficiency of the hot-dip galvanized wire and was able to sufficiently cope with high speed of the galvanized wire. However, the only drawback was that the device was complicated and expensive. Therefore, an object of the present invention is to provide a cooling device for a hot-dip galvanized wire, which does not impair the cooling efficiency of the hot-dip galvanized wire, is low in cost, is easy to install, and has no leakage of the cooling liquid from the galvanized wire introduction hole. It is in.

[0008]

Therefore, in the apparatus for cooling a hot-dip galvanized wire according to the present invention, a cooling liquid container having a hot-dip galvanized wire introduction hole on the bottom surface and a hot-dip galvanized wire outlet on the upper surface is provided above the hot-dip galvanizing bath. In a cooling device for a hot-dip galvanized wire which is placed in a cooling bath for cooling and solidifying the hot-dip galvanized wire drawn upward from the hot-dip galvanizing bath, an air cooling layer for gradually cooling the hot-dip galvanized wire is provided in front of the cooling liquid container, and the cooling The bottom surface of the liquid container is formed in a concave shape, and a spherical sealing body having an outer diameter larger than the diameter of the hot-dip coating wire introduction hole and a specific gravity larger than that of the cooling liquid in the cooling liquid container is arranged in the cooling liquid container. It

[0009]

In the cooling apparatus of the present invention, the hot-dip galvanized wire drawn out from the hot-dip galvanizing bath is first cooled and solidified once in the air-cooled layer on the surface of the hot-dipped galvanized wire, and then in the cooling liquid container. It is rapidly cooled in time and completely cooled and solidified. In this cooling liquid container, the plating wire introduction hole of the cooling liquid container is sealed by the traveling plating wire while the hot dip coating wire is running, and the cooling liquid also moves along with the running plating wire. Will never leak out. Further, even if the traveling plating wire and the spherical sealing body are in contact with each other in the cooling liquid container, the plating layer is once solidified in the air-cooling layer, and the cooling liquid is separated from the traveling plating wire and the spherical sealing body. Since it acts as a lubricating layer, it does not cause a trouble such as rubbing on the surface of the traveling plated wire.

Further, when the traveling plated wire is in a state of being removed from the plated wire introduction hole of the cooling liquid container due to disconnection or the like, the spherical sealing body arranged in the cooling liquid container immediately seals the plated wire introduction hole. Since it is stopped, the cooling liquid does not leak from the plated wire introduction hole.

Furthermore, since the plating layer is gradually cooled and solidified in the air-cooled layer and then rapidly cooled in the cooling liquid container, the plating surface is prevented from being roughened.

[0012]

Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 is a schematic diagram of a hot dip coating system to which a cooling device according to an embodiment of the present invention is applied.

The wire to be plated W1 introduced into the hot-dip galvanizing bath 11 containing the hot-dip galvanized metal 12 turns upward through the turn-sheave S1 in the bath 11 and is provided on the liquid surface of the bath 11. After the excess molten metal is handled by the squeezing tool 13 and adjusted to a predetermined thickness of the molten metal plating, it is led out vertically upward from the plating bath 11. The derived unsolidified plated wire W2 is gradually cooled and solidified in the air-cooled layer A, then introduced into the cooling liquid container 2, and the plating layer is rapidly solidified by the cooling liquid 3 filled in the cooling liquid container 2, The plated wire W3 is taken up by a take-up device (not shown) through the upper turn sheave S2.

As described above, the cooling device 1 comprises the air cooling zone A and the cooling zone by the cooling liquid container 2. For example,
An example of the cooling device 1 in the case of applying a tin plating layer having a thickness of 1 to 2 μm to a copper wire having an outer diameter of 0.25 mm at a linear velocity of 50 m / min will be described. The air cooling layer A is set at an interval of 1200 mm from the bath surface of the molten metal plating bath 11. Coolant container 2
Is, for example, a cylindrical body having an inner diameter of 30 mm and a height of 300 mm, and has a conical bottom portion. A hot dip wire introduction hole 6 is provided at the top of the conical bottom, and the upper surface of the container 2 serves as a hot dip wire outlet 7. The diameter of the hot-dip galvanized wire introduction hole 6 is determined according to the diameter of the hot-dip galvanized wire W2, and is 0.3 mm in the case of the present embodiment. An inlet 8 and an outlet 9 for the cooling liquid 3 are provided on the upper peripheral wall and the lower peripheral wall of the cooling liquid container 2, respectively, and the inlet 8 and the outlet 9 are connected via a pump (not shown) to form the cooling liquid 3 Is circulated to maintain the amount of the cooling liquid 3 in the cooling liquid container 2 at a constant amount. The upper part of the cooling liquid container 2 is a space 5 for dropping the cooling liquid adhering to the traveling plating wire W2. A spherical sealing body 4 is arranged in the cooling liquid container 2. The spherical sealing body 4 is a glass ball or a stainless steel ball having an outer diameter of 0.6 mm, which has a specific gravity larger than that of the cooling liquid 3 and has an outer diameter larger than the hole diameter of the hot dip wire introducing hole 6. As the cooling liquid 3, ordinary water or an aqueous solution of a rust preventive agent or a lubricant is used.

As a result of running the plated wire using the cooling device 1, no dripping of the cooling liquid 3 from the hot-dip coating wire introduction hole 6 of the cooling liquid container 2 was observed during the running of the plated wire. . Further, in the case of disconnection of the plating wire, as soon as the plating wire W2 is broken, the spherical sealing body 4 immediately closes the hot-dip plating wire introduction hole 6 by the state shown in FIG. To prevent the coolant 3 from leaking.

Incidentally, the diameter of the hot-dip galvanized wire introduction hole 6 of the cooling liquid container 2 is set to be large so that the outer diameter of the commercial plated wire can be variously adjusted, and as shown in FIG. It is convenient for plating work if the plating wire introducing hole tool 10 that can be freely selected and replaced according to the outer diameter is installed at the conical bottom of the cooling liquid container 2.

When the temperature of the hot dip wire W2 is high or the diameter of the wire is large and the liquid temperature of the cooling liquid 3 rises to lower the cooling capacity, the cooling liquid in the cooling liquid container 2 is cooled. It is advisable to provide a cooling tool inside 3, or to provide a heat exchange tool on the outer wall of the cooling liquid container 2.

[0018]

EFFECTS OF THE INVENTION According to the present invention, hot-dip galvanizing having a high cooling efficiency without impairing the cooling efficiency of the hot-dip galvanized wire, low cost, easy installation, and no leakage of the cooling liquid from the hot-dip wire introducing hole. A wire cooling device can be provided.

[Brief description of drawings]

FIG. 1 is a schematic diagram of a hot dip coating system to which a cooling device according to an embodiment of the present invention is applied.

FIG. 2 is an operation explanatory view of the spherical sealing body of the cooling device of the present invention.

FIG. 3 is an explanatory view showing another embodiment of the cooling device of the present invention.

FIG. 4 is an explanatory diagram of a conventional cooling device.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Cooling device 2 Cooling liquid container 3 Cooling liquid 4 Spherical sealing body 5 Space part 6 Plating wire introduction hole 7 Plating wire outlet 8 Cooling liquid inlet 9 Cooling liquid outlet 10 Introducing tool mouth 11 Molten metal plating bath 12 Melting Metal plating bath 13 Handling die A Air cooling layer W1 Plated wire W2 Plated wire W3 Plated wire S1, S2 Turnsieves

Claims (1)

[Claims] 1. A hot-dip galvanized wire having a hot-dip galvanized wire introduction hole on the bottom surface and a hot-dip galvanized wire outlet on the top surface is disposed above the hot-dip galvanizing bath, and is drawn upward from the hot-dip galvanizing bath. In a cooling device for a hot-dip coating wire for cooling and solidifying an unsolidified plating layer, an air-cooling layer for gradually cooling the hot-dip coating wire is provided in front of the cooling liquid container,
The bottom surface of the cooling liquid container is formed in a concave shape, and a spherical sealing body having an outer diameter larger than the diameter of the hot-dip wire introduction hole and a specific gravity larger than that of the cooling liquid in the cooling liquid container is arranged in the cooling liquid container. A hot-dip wire cooling device.