JPH0846882A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE:To provide a solid-state image pickup device capable of easily connecting to a circuit board even when the external electrode pitch of a solid- state image pickup element is formed narrowly. CONSTITUTION:The circuit board 29 on which circuit components 28 are loaded is inserted to the recessed part 23 of the solid-state image pickup element 27, and after the aligning of the electrode pad 30 of the circuit board 29 and the electrode pad 31 of the solid-state image pickup element 27 is completed, both pads are connected to each other with solder 33, and the signal line 10 of a camera cable 3 is connected to electrode pads 32 formed on the surface of the circuit board 39 with the solder 33, respectively.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device having a circuit board and a solid-state image pickup element used in FA equipment.

[0002]

2. Description of the Related Art In recent years, in the field of industrial television cameras, various camera head separation type television cameras in which an image pickup section and a control section are separated and both are connected by a cable have been proposed. This camera is generally used for FA and special surveillance, and a small camera head is required as an imaging unit. At present, a solid-state image sensor having a 1/3 inch size and a camera head having a diameter of 12 mm and a length of about 30 mm is sold. In this type of camera head, the size of the solid-state image pickup device, the scale of the peripheral circuit, and the mounting structure thereof are particularly important, which has been a major factor in determining the size of the camera head.

The structure of a camera head using a conventional solid-state image sensor and the mounting structure inside the camera head will be described below. FIG. 7 is a schematic structural part of a conventional camera head. In FIG. 7, 1 is a lens, 2 is an exterior chassis,
Reference numeral 3 is a camera cable, and 4 is a control unit. The camera head unit 5 which is an image pickup unit includes a lens 1 and an exterior chassis 2, and is connected to the control unit 4 via a camera cable 3.

8 and 9 are views showing a mounting structure inside the camera head portion 5, FIG. 8 is a plan view, and FIG. 9 is a front view of FIG. The solid-state image pickup device 6 that houses the solid-state image pickup chip and the flexible substrate 8 on which the circuit component 7 is mounted are both connected by the external leads 9 of the solid-state image pickup device 6 and are electrically connected.
In addition, the signal line 10 of the camera cable 3 has a structure to be soldered to a portion provided at the end of the flexible substrate 8.

10 and 11 are views showing the details of the solid-state image pickup device 6, FIG. 10 is a front view, and FIG. 11 is A of FIG.
It is a -A 'sectional view. The solid-state imaging chip 11 is adhesively fixed to the ceramic package 12, the metal thin wires 13 are connected to the electrode pads (not shown) of both the solid-state imaging chip 11 and the ceramic package 12, and the optical glass 16 for hermetic sealing is made of ceramic. It is adhesively fixed to the package 12. In addition, the arrangement of the external leads 14 will be described using an example of a solid-state image sensor having a size of 1/3 inch.
This group consists of 2 rows of counties, the distance between the 2 rows of counties is about 8 mm, and the lead arrangement of each 14 external leads is 1.27.
It is manufactured with a mm pitch. The external lead 14 is joined to the electrode pad 15 by silver brazing,
The pitch of 1.27 mm is also the smallest pitch that can be manufactured at present due to restrictions such as assembly accuracy and joining strength.

[0006]

However, in the above-mentioned conventional structure, the solid-state image pickup chip is downsized to 1/4 or 1/5 inch, and the ceramic package as the storage container is downsized. The problem here is the arrangement of the external leads. The layout of the external leads influences the structure of the circuit board connected to the external leads and largely contributes to the size of the camera head. For example, since the width of a 1/4 inch solid-state image sensor is equivalent to 7.5 mm and it is physically impossible to arrange eight external leads at a pitch of 1.27 mm, it is necessary to arrange them in three rows or in a circle. I can't. Therefore, a mounting structure equivalent to 1/3 inch cannot be obtained.

The present invention solves such a conventional problem, and an object of the present invention is to provide a solid-state image pickup device capable of easily connecting circuit boards even if the external electrode pitch of the solid-state image pickup device is narrow. Is.

[0008]

In order to achieve the above-mentioned object, the present invention provides a solid-state image sensor having at least one recessed portion in the vicinity of an electrode pad to which a circuit board can be directly connected,
And a circuit board that can be vertically connected to the recess of the solid-state imaging device.

[0009]

The present invention has the following effects due to the above configuration. That is, by providing the electrode pad of the solid-state image sensor and the concave portion in the vicinity thereof to connect the circuit board, the external lead, which has been conventionally required, is unnecessary, the restriction of silver brazing of the lead is eliminated, and the electrode pad The pitch can be narrowed. In addition, the assembling work is facilitated because the recess serves as an insertion guide for the circuit board.

[0010]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1, 2, 3 and 4 are views showing the structure of the solid-state image pickup device according to the present invention. 1 is a front view,
2 is a right side view of FIG. 1, FIG. 3 is a bottom view of FIG. 1, and FIG. 4 is a sectional view taken along the line AA ′ of FIG. In these figures, 11
Is a solid-state imaging chip, 17 is a package, 18 is a transparent plate, 19
Is an adhesive, 20 is a lead terminal, 21 is an internal wiring, 22 is a side surface electrode, 23 is a recess, 24 is a connecting substrate, 25 is an electrode pad, 26 is a sealant, and 27 is a light receiving portion.

The solid-state image pickup chip 11 has a lead terminal 20 bonded to an electrode pad (not shown) formed on the surface thereof by a method such as thermocompression bonding or ultrasonic wave, and the transparent plate 18 in a state where the lead terminal 20 is interposed therebetween. The solid-state imaging chip 11 is adhered and fixed to a portion of the solid-state imaging chip 11 excluding the surface of the light-receiving section 27 with an adhesive 19 such as an ultraviolet curing type or a thermosetting type.

After that, the back surface of the solid-state image pickup chip 11 is adhesively fixed to the connecting board 24, and the unconnected side of the lead terminal 20 is soldered to the side surface electrode 22 formed at the board end portion of the connecting board 24. Thereby, the solid-state imaging chip 11
The electrode pad 25 and the electrode pad 25 are electrically connected by the internal wiring 21 formed inside the connection substrate 24.

Further, in order to ensure the quality reliability of the solid-state image pickup chip, the outer periphery except the surface of the transparent plate 18 and the surface of the electrode pad 25 is surrounded by the outer package 17, and the sealant 26 is enclosed and cured. It is hermetically sealed with. The package 17 may be omitted depending on the required reliability. Further, the connection board 24 is provided with the recesses 23 for connecting the circuit board between the electrode pads arranged in two rows. This recess 2
3 is formed by cutting, a mold, etc., and the width, depth, and shape are adjusted according to the thickness and type of the substrate to be connected.

FIG. 5 is a plan view of the solid-state image pickup device of the present invention, and FIG. 6 is a front view of FIG. In these figures, the circuit board 29 to which the circuit component 28 is adhered is inserted into the recess 23 of the solid-state imaging device 27, and the electrode pad 30 of the circuit board 29 is inserted.
After aligning with the electrode pad 31 of the solid-state image sensor 27, both pads are connected by solder 33, and the signal line 10 of the camera cable 3 is respectively connected to the electrode pad 32 formed on the surface of the circuit board 29. Connected with solder 33. As a result, the solid-state image sensor 11, the circuit board 29, and the camera cable 3 are electrically connected, and the input / output signals can be exchanged with the control unit of the camera head.

As described above, according to the above-described embodiment, the solid-state image pickup device 27 having the recess to which the circuit board 29 can be directly connected is provided.
By using, the alignment of the solid-state imaging device and the circuit board 29 is easy, and the arrangement pitch of the electrode pads 31 can be narrowed, so that the mounting design of the solid-state imaging device is facilitated.

The circuit board 29 of the above embodiment may be a flexible board, a glass epoxy board, a ceramic board or the like. Further, the solid-state image pickup device can be used by applying a structure similar to that of the above-described embodiment to a conventional ceramic package type package.

[0018]

According to the present invention, as is apparent from the above-described embodiment, by providing a recess in which a circuit board can be mounted in the vicinity of the electrode pad of the solid-state image pickup device, the external lead, which has been conventionally required, becomes unnecessary. There is an effect that the arrangement pitch is not restricted and the pitch between the electrode pads of the solid-state imaging device can be 0.5 mm or less. Further, it is possible to provide a solid-state imaging device useful for downsizing the camera head of the camera head separated type camera.

[Brief description of drawings]

FIG. 1 is a front view of a solid-state image sensor according to an embodiment of the present invention.

FIG. 2 is a right side view of the solid-state image sensor according to the embodiment of the present invention.

FIG. 3 is a bottom view of the solid-state image sensor according to the embodiment of the present invention.

FIG. 4 is a sectional view of a solid-state image sensor according to an embodiment of the present invention.

FIG. 5 is a plan view of a solid-state imaging device according to an embodiment of the present invention.

FIG. 6 is a front view of the solid-state imaging device according to the embodiment of the present invention.

FIG. 7 is a block diagram of a conventional camera head separated type camera.

FIG. 8 is a plan view of a conventional solid-state imaging device.

FIG. 9 is a front view of a conventional solid-state imaging device.

FIG. 10 is a front view of a conventional solid-state image sensor.

FIG. 11 is a sectional view of a conventional solid-state image sensor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 lens 2 exterior chassis 3 camera cable 4 control section 5 camera head section 6 solid-state imaging device 7 circuit component 8 flexible substrate 9 external lead 10 signal line 11 solid-state imaging chip 12 ceramic package 13 metal thin wire 14 external lead 15 electrode pad 16 optical glass 17 Exterior Package 18 Transparent Plate 19 Adhesive 20 Lead Terminal 21 Internal Wiring 22 Side Electrode 23 Recess 24 Connection Board 25 Electrode Pad 26 Sealant 27 Solid-state Image Sensor 28 Circuit Component 29 Circuit Board 30 Electrode Pad 31 Electrode Pad 32 Electrode Pad 33 Solder

Claims (3)

[Claims] 1. A solid-state image pickup chip, a connection substrate to which the solid-state image pickup chip is fixed, lead terminals for connecting an electrode pad of the solid-state image pickup chip and side electrodes provided on a side surface of the connection substrate, and a light-receiving portion of the solid-state image pickup chip. A solid-state image sensor including a transparent plate that protects the surface and an outer package, and a circuit board on which circuit components that drive the solid-state image sensor are mounted. A recess into which the circuit board is inserted and an external electrode in the vicinity thereof. A solid-state imaging device comprising: a connection board having pads arranged thereon; and a structure formed by vertically inserting and connecting the circuit board into a recess of the connection board. 2. The connection substrate is made of ceramic or glass epoxy, the transparent plate is made of optical glass or an optical filter, and the exterior package is made of resin or metal. 1. The solid-state imaging device according to 1. 3. The solid-state imaging device according to claim 1, wherein the solid-state imaging device is a structure having a solid-state imaging chip, a thin metal wire, a ceramic package, and a sealing glass.