JPH083754A - Production of piping - Google Patents

Abstract

PURPOSE:To keep the cooling efficiency in piping to a certain one over a long term. CONSTITUTION:In a stage 16, a cooling water pare 12 is filled with sulfuric acid (H2SO4) 19, and a DC power source 21 is connected thereto with a vacuum vessel 11 made of aluminum as the anode and lead (Pb) 20 as the cathode. Thus, the surface of the cooling water pore 12 of the vacuum vessel 11 is anodically oxidized to form a porous type alumina film 13. But, the porous type alumina film 13 just formed is in an active stage, and for changing its state into an inert and stable one, sealing treatment is executed in a stage 17. At the time of filling the cooling water pore 12 with boiling water 22 in the stage 17, the sealing treatment progresses to form the alumina film 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pipe manufacturing method.

[0002]

2. Description of the Related Art In recent years, aluminum and aluminum-based alloys have been adopted as a vacuum container for semiconductor manufacturing equipment.

An example of a conventional vacuum container will be described below with reference to the drawings. FIG. 5 is a sectional view of a conventional vacuum container. In FIG. 5, 1 is a vacuum container made of aluminum, 2 is a cooling water hole, and 3 is a pipe made of copper. Here, the vacuum vessel 1 is cooled by flowing cooling water into the cooling water hole 2 inside the copper pipe 3.

Aluminum is used as a material for the vacuum container 1 because it has excellent heat conduction. However, when cooling water is kept flowing for a long period of time, alumina (alumina) is formed on the surface of the cooling water hole 2 of the aluminum vacuum container 1. Al ₂ O ₃ ) is formed,
It caused the clogging of the cooling water piping.

Therefore, conventionally, a structure has been adopted in which a cooling water hole 2 is opened in an aluminum vacuum container 1 and a copper pipe 3 is embedded therein.

[0006]

However, in the above structure, when the copper pipe 3 is embedded in the vacuum container 1 made of aluminum, when the surface of the vacuum container 1 is a curved surface or the cooling water hole 2 is bent. In this case, it was difficult to use the copper pipe 3 as the cooling water pipe 3. Therefore, if the cooling water is kept flowing for a long time without using the copper pipe 3, the aluminum and the cooling water react with each other on the surface of the cooling water hole 2 to form an alumina film. If this alumina film is formed inside the cooling water pipe 3, there is a problem that the cooling water flow rate is reduced and the cooling efficiency of the vacuum container 1 is reduced.

Therefore, an object of the present invention is to solve the above problems and to provide a vacuum container capable of keeping the cooling efficiency constant for a long period of time.

[0008]

In order to achieve the above object, the pipe manufacturing method of the present invention comprises forming a porous aluminum oxide film on the surface of a cooling water hole of an aluminum vacuum container by an anodic oxidation method, A sealing process is performed on the aluminum oxide film.

Further, a copper, nickel, and zinc thin film is formed on the surface of the cooling water hole of the aluminum vacuum container by electroless plating.

[0010]

According to the pipe manufacturing method of the present invention, it is possible to easily and easily form an alumina film having strong corrosion resistance uniformly on the surface of the meandering cooling water hole in a short time by the anodic oxidation method and the sealing treatment. .

Further, according to the method for manufacturing a pipe of the present invention,
By the electroless plating method, a copper, nickel, and zinc thin film can be easily and uniformly formed on the surface of the meandering cooling water hole in a short time.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a sectional view of the vacuum container in this embodiment. In FIG. 1, 11 is a vacuum container made of aluminum, 12 is a cooling water hole, and 13 is alumina (A
1 ₂ O ₃ ) film.

FIG. 2 is a diagram for explaining a method of forming an alumina film 13 on the surface of the cooling water hole 12 of the vacuum container 11 by the anodizing method in this embodiment.

In FIG. 2, reference numeral 15 is a process of opening the cooling water hole 12 in the vacuum container 11, 16 is a process of forming a porous type alumina film 13 on the surface of the cooling water hole 12, and 17 is a porous type alumina film 13. And 18 is a process of cutting the vacuum container 11. In each process, the state of the contact surface between the vacuum container 11 and the embedded cooling water hole 12 is shown on the right side of the figure showing the same process.

In step 16, the cooling water hole 12 is filled with sulfuric acid (H ₂ SO ₄ ) 19, and the DC power source 21 is connected so that the vacuum container 11 serves as a positive electrode and the lead (Pb) 20 serves as a negative electrode. Then, the surfaces of the cooling water holes 12 of the vacuum container 11 are anodized, and the porous alumina film 13 is formed. However, the just-formed porous alumina film 13 is in an active state, and a sealing treatment is performed in step 17 in order to make it inactive and stable.
In step 17, when the cooling water hole 12 is filled with the boiling water 22, the sealing process proceeds and the alumina film 13 is formed.

As described above, by the anodic oxidation and the sealing treatment, the alumina film 13 having uniform and strong corrosion resistance can be easily formed on the surface of the cooling water hole 12 of the vacuum container 11.
Therefore, it is possible to easily form the alumina film on the curved surface of the cooling water hole 12 in a short time.

Although the vacuum container 11 is made of aluminum, it may be made of aluminum alloy.

Although sulfuric acid is used as a chemical solution for anodic oxidation, any acidic aqueous solution containing a dibasic acid such as a hydrobromic acid or phosphoric acid solution may be used.

A second embodiment of the present invention will be described below with reference to FIG.
This will be described with reference to FIG. FIG. 3 is a sectional view of the vacuum container in this embodiment. In FIG. 3, 31 is an aluminum vacuum container, 32 is a cooling water hole, and 33 is copper (C
u) It is a thin film.

FIG. 4 is a view for explaining a method of forming a copper thin film 33 on the surface of the cooling water hole 32 of the vacuum container 31 by electroless plating in this embodiment. In FIG.
35 is a process of opening the cooling water hole 32 in the vacuum container 31;
6 is a process of forming the copper thin film 33 on the inner wall of the cooling water hole 32,
37 is a process of cutting the vacuum container 31, and the vacuum container 31 as shown in FIG. 3 is obtained. In step 36, when the cooling water hole 32 is filled with the copper sulfate (CuSO ₄ ) solution 34, aluminum is dissolved into ions due to the magnitude of the ionization tendency, and conversely copper ions are deposited as metallic copper on the aluminum surface.

As described above, by the electroless plating treatment,
The copper thin film 33 can be easily and uniformly formed on the surface of the cooling water hole 32 of the vacuum container 31. Therefore, the copper thin film can be easily formed in a short time on any curved surface of the cooling water hole 32.

Although the vacuum container 31 is made of aluminum, it may be made of aluminum alloy.

Although the copper thin film 33 is formed by electroless plating here, it may be a nickel or zinc thin film.

[0024]

EFFECTS OF THE INVENTION According to the vacuum container of the present invention, it is possible to easily form an alumina film having high corrosion resistance uniformly on the surface of the cooling water holes of the vacuum container by anodizing and sealing treatment. The alumina film can be easily formed in a short time even on the curved surface of the cooling water hole.

Further, according to the vacuum container, a copper thin film can be easily and uniformly formed on the surface of the cooling water hole of the vacuum container by the electroless plating method. Also in this case, the copper thin film can be easily formed in a short time.

[Brief description of drawings]

FIG. 1 is a sectional view of a vacuum container according to a first embodiment of the present invention.

FIG. 2 is a view for explaining a method of forming an alumina film on the surface of cooling water holes of a vacuum container by the anodizing method in the first embodiment of the present invention.

FIG. 3 is a sectional view of a vacuum container according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating a method of forming a copper thin film on the surface of a cooling water hole of a vacuum container by an electroless plating method according to a second embodiment of the present invention.

FIG. 5 is a sectional view of a conventional vacuum container.

[Explanation of symbols]

11 Aluminum Vacuum Container 12 Cooling Water Hole 13 Alumina Film 15 Process of Opening Cooling Water Hole 12 in Vacuum Container 11 16 Porous Alumina Film 1 on the Surface of Cooling Water Hole 12
Step 3 of forming 3 17 Step of sealing the porous alumina film 13 18 Step of cutting the vacuum container 11 19 Sulfuric acid 20 Lead 21 DC power source 22 Boiling water

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 21/316 T

Claims (2)

[Claims] 1. A method of manufacturing a pipe, characterized in that a porous aluminum oxide film is formed on a surface of a cooling water hole of an aluminum vacuum container by an anodic oxidation method, and the aluminum oxide film is sealed. . 2. A method of manufacturing a pipe, wherein a copper, nickel, and zinc thin film is formed on a surface of a cooling water hole of an aluminum vacuum container by an electroless plating method.