JPH0837071A - Ic socket pin for inspecting bag package - Google Patents
Ic socket pin for inspecting bag packageInfo
- Publication number
- JPH0837071A JPH0837071A JP6191951A JP19195194A JPH0837071A JP H0837071 A JPH0837071 A JP H0837071A JP 6191951 A JP6191951 A JP 6191951A JP 19195194 A JP19195194 A JP 19195194A JP H0837071 A JPH0837071 A JP H0837071A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- solder ball
- spring
- socket
- bga package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
Landscapes
- Physics & Mathematics (AREA)
- Geometry (AREA)
- General Physics & Mathematics (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、ＢＧＡ（ボール ゲー
ト アレイ）パッケージの実装前の検査として電気的パ
ラメータ等を確認する場合に用いられるＩＣソケットの
ビン構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bin structure of an IC socket used for confirming electrical parameters and the like as an inspection before mounting a BGA (ball gate array) package.
【０００２】[0002]
【従来の技術】従来、この種ソケットピンとしては、図
４に示されている板バネ構造のものが一般的であった。
即ち、一枚の金属板が折り曲げられて接触孔２を有する
水平接触片部１と垂直片部３、倒Ｕ字状バネ片部４およ
び垂直コンタクト片部５が形成され、該ピンがＩＣソケ
ット本体に多数装着され、これら各ピンにＢＧＡパッケ
ージ６のはんだボール７が接触せられて実装前の検査が
なされていた。2. Description of the Related Art Conventionally, a socket spring of the type shown in FIG. 4 has been generally used as this type of socket pin.
That is, a single metal plate is bent to form a horizontal contact piece 1 having a contact hole 2, a vertical piece 3, an inverted U-shaped spring piece 4 and a vertical contact piece 5, and the pins are IC sockets. A large number of them are mounted on the main body, and the solder balls 7 of the BGA package 6 are brought into contact with each of these pins to perform an inspection before mounting.
【０００３】[0003]
【発明が解決しようとする問題点】ところで、従来のソ
ケットピンは、接触片部１の接触孔２にはんだボール７
が単に接触する構造であるから、例えば、はんだボール
７の面にフラックス等が付着している場合には、接触不
良を起こして検査不能になるという問題点があり、ま
た、接触片部１に対するはんだボール７の接触力（押圧
力）を調整するためのバネ性を付与するため、倒Ｕ字状
バネ片部４を不可欠としているので、全体の長さが長く
なって、電気的特性（インダクタンス）に劣るばかり
か、ノイズ等の影響を受け易くて信頼性にも劣り、高い
電気的特性が要求される、例えば、インダクタンス２ナ
ノヘンリー以下という高周波用製品については検査が全
く不可能であった。By the way, in the conventional socket pin, the solder ball 7 is provided in the contact hole 2 of the contact piece portion 1.
Is in contact with each other, there is a problem in that, for example, when flux or the like is attached to the surface of the solder ball 7, contact failure occurs and inspection becomes impossible. Since the inverted U-shaped spring piece portion 4 is indispensable in order to impart the spring property for adjusting the contact force (pressing force) of the solder ball 7, the entire length becomes long and the electrical characteristics (inductance ), Is easily affected by noise, etc. and is also inferior in reliability, and requires high electrical characteristics. For example, high-frequency products with an inductance of 2 nanohenries or less could not be inspected at all. .
【０００４】本発明は、このような従来の問題点に鑑み
なされたもので、その目的とするところは、ＢＧＡパッ
ケージのはんだボールとの接触安定性に優れると共に、
全体の長さが短くて済み、したがって、電気的特性を充
分に発揮することができて、高周波用製品について検査
可能なＢＧＡパッケージ検査用のＩＣソケットピンを提
供することにある。The present invention has been made in view of such conventional problems, and an object thereof is to provide excellent contact stability with solder balls of a BGA package, and
It is an object of the present invention to provide an IC socket pin for inspecting a BGA package capable of inspecting a high-frequency product, which has a short overall length and can sufficiently exhibit electrical characteristics.
【０００５】[0005]
【問題点を解決するための手段】この目的のため、本発
明は、ＳＧＡパッケージのはんだボールの外周面と適合
する球状接触凹面と、該球状接触凹面と一体の盲孔を有
し、かつ該盲孔下端までに亘って割溝が形成された弾性
復元力を有するバネ性受座部と、該バネ性受座部の下端
に一体に形成されたＩＣソケット本体上面に係止せられ
る係止つば部と、該係止つば部の下端に一体にして、か
つ前記バネ性受座部と同心状に形成された前記ＩＣソケ
ット本体に挿入されるコンタクト部とを含む構成を特徴
とするものである。To this end, the present invention comprises a spherical contact concave surface which matches the outer peripheral surface of a solder ball of an SGA package, and a blind hole integral with the spherical contact concave surface. A spring-type seat having elastic restoring force in which a split groove is formed up to the lower end of the blind hole, and a locking collar that is integrally formed on the lower end of the spring-type seat and is locked to the upper surface of the IC socket body. And a contact portion that is integrated with the lower end of the locking collar portion and that is inserted into the IC socket body that is formed concentrically with the spring seat portion. .
【０００６】[0006]
【実施例】実施例について図面を参照し、その作用と共
に説明する。図１は本発明に係るＩＣソケットピンの一
例での縦断面図、図２は平面図、図３は図２のＡ−Ａ線
に沿った断面図である。これら図において、本ＩＣソケ
ットピンは、好ましくは、全体がベリリュウム−銅合金
材にて形成されている。更に説明すると、本ＩＣソケッ
トピンは、ＢＧＡパッケージ６のはんだボール７の外周
面と適合する外方に拡開した球状接触凹面１１と、該球
状接触凹面１１と一体の縦盲孔１２を有し、かつ上端開
口部から縦盲孔１２の下端までに亘って割溝１３が十字
状に形成された弾性復元力を有するバネ性受座部１０
と、該バネ性受座部１０の下端に一体に形成されたＩＣ
ソケット本体９上面に係止せられる円形係止つば部１４
と、該係止つば部１４の下端に一体にして、かつバネ性
受座部１０と同心状に形成されたＩＣソケット本体９の
装着孔に挿入される横断面円形のコンタクト部１５とを
含んでいる。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to the drawings and its operation. 1 is a vertical sectional view of an example of an IC socket pin according to the present invention, FIG. 2 is a plan view, and FIG. 3 is a sectional view taken along line AA of FIG. In these figures, the present IC socket pin is preferably entirely formed of beryllium-copper alloy material. To further explain, the present IC socket pin has a spherical contact concave surface 11 that expands outward to match the outer peripheral surface of the solder ball 7 of the BGA package 6, and a vertical blind hole 12 integrated with the spherical contact concave surface 11. A spring-type seat portion 10 having an elastic restoring force in which a split groove 13 is formed in a cross shape from the upper end opening to the lower end of the vertical blind hole 12.
And an IC formed integrally with the lower end of the spring-type seat portion 10.
Circular locking collar 14 that is locked to the upper surface of the socket body 9
And a contact portion 15 which is integrated with the lower end of the locking collar portion 14 and which is inserted into a mounting hole of the IC socket body 9 formed concentrically with the spring seat portion 10 and having a circular cross section. I'm out.
【０００７】本ＩＣソケットピンは以上の構成であっ
て、該ソケットピンは、ＩＣソケット本体９に多数規則
的に配列装着される。そして、これによるＢＧＡパッケ
ージの検査は、上方よりＢＧＡパッケージ６の各はんだ
ボール７が各ソケットピンに電気的接触せられると共
に、ソケットピンと測定手段とが導通せられ、ＢＧＡパ
ッケージの検査がなされる。この場合において、上方よ
りの垂直押圧力によりはんだボール７がソケットピンに
おける球状接触凹面１１に接触すると、バネ性受座部１
０は十字状割溝１３により弾性復元力が付与せられてい
るため、はんだボール７は球状接触凹面１１を図１に示
されている実線矢印Ｂ方向（横方向）に押し広げながら
摺接し、かつ異物その他の物質を取り除き接触するとい
う所謂ワイピング動作により、仮にはんだボール７にフ
ラックス等が付着していたとしても、摺接によりその被
膜は破られて接触するため確実なる電気的接触がなされ
る。The present IC socket pin is constructed as described above, and a large number of the socket pins are regularly arranged and mounted on the IC socket body 9. Then, in the inspection of the BGA package by this, the solder balls 7 of the BGA package 6 are electrically contacted with the respective socket pins from above, and the socket pins and the measuring means are electrically connected to each other to inspect the BGA package. In this case, when the solder ball 7 comes into contact with the spherical contact concave surface 11 of the socket pin by the vertical pressing force from above, the spring seat portion 1
Since 0 is given an elastic restoring force by the cross-shaped split groove 13, the solder ball 7 slides while pushing the spherical contact concave surface 11 in the direction of the solid arrow B (lateral direction) shown in FIG. Further, even if flux or the like is attached to the solder balls 7 by the so-called wiping operation of removing foreign substances and other substances and making contact, the coating is broken by the sliding contact and comes into contact, so that reliable electrical contact is made. .
【０００８】[0008]
【発明の効果】しかして、本発明によれば、全体が従来
のような板バネ構造ではなく、ピン構造とし、かつＢＧ
Ａパッケージ６のはんだボール７の垂直方向よりの接触
力（押圧力）調整のためのバネ性は、十字状割溝１３を
形成することにより付与せしめているから、全体の長さ
が短くて済み、したがって、電気的特性（インダクタン
ス）を２ナノヘンリー以下に保持することができ、従来
のＩＣソケットピンでは全く検査不能であった高い電気
的特性が要求される高周波用製品についても検査可能と
なった。According to the present invention, however, the entire structure is not the conventional leaf spring structure, but the pin structure and the BG.
Since the spring property for adjusting the contact force (pressing force) of the solder ball 7 of the A package 6 from the vertical direction is imparted by forming the cross-shaped split groove 13, the entire length can be short. Therefore, the electrical characteristics (inductance) can be maintained at 2 nanohenries or less, and it becomes possible to inspect high-frequency products that require high electrical characteristics, which cannot be inspected by conventional IC socket pins. It was
【０００９】また、ＢＧＡパッケージ６のはんだボール
７の球状接触凹面１１は、十字状割溝１３により弾性復
元力（バネ性）が付与せられているから、上方垂直方向
よりの押圧接触時において、はんだボール７の摺接によ
る所謂ワイピング効果により接触が確実であって接触安
定性に優れるものである。Further, since the spherical contact concave surface 11 of the solder ball 7 of the BGA package 6 is provided with an elastic restoring force (spring property) by the cross-shaped dividing groove 13, when the pressing contact is made in the upward vertical direction, Due to the so-called wiping effect of the sliding contact of the solder balls 7, the contact is reliable and the contact stability is excellent.
【００１０】また、全体が垂直なピン構造にして、従来
のような折曲部分を有しないから、はんだボール７との
接触電流は真下に落され、したがって、ノイズの影響が
なく、前記全体の短形構造と相俟って充分なる優れた電
気的特性を発揮することができる。Further, since the entire pin structure is vertical and does not have a bent portion as in the prior art, the contact current with the solder ball 7 is dropped directly below, so that there is no influence of noise and the whole of In combination with the short structure, it is possible to exhibit sufficiently excellent electrical characteristics.
【００１１】更にまた、従来のような折曲部分を有しな
いから、耐久性に優れると共に、その構造簡単であるか
ら、量産的にして、安価に製作することができ、経済性
にも優れる等多大な効果を有するものである。Further, since it does not have a bent portion as in the prior art, it is excellent in durability, and because of its simple structure, it can be mass-produced and manufactured at low cost, and it is also economical. It has a great effect.
【図１】本発明に係るＩＣソケットピンの一例での縦断
面図である。FIG. 1 is a vertical sectional view of an example of an IC socket pin according to the present invention.
【図２】本発明に係るＩＣソケットピンの一例での平面
図である。FIG. 2 is a plan view of an example of an IC socket pin according to the present invention.
【図３】図２のＡ−Ａ線に沿った断面図である。3 is a cross-sectional view taken along the line AA of FIG.
【図４】従来例を示す縦断面図であるFIG. 4 is a vertical sectional view showing a conventional example.
６ ＢＧＡパッケージ ７ はんだボール １０ バネ性受座部 １１ 球状接触凹面 １２ 縦盲孔 １３ 割溝 １４ 係止つば部 １５ コンタクト部 6 BGA Package 7 Solder Ball 10 Spring Seating Part 11 Spherical Contact Concave Surface 12 Vertical Blind Hole 13 Split Groove 14 Locking Collar Part 15 Contact Part
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成６年９月２９日[Submission date] September 29, 1994
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】請求項１[Name of item to be corrected] Claim 1
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】０００５[Name of item to be corrected] 0005
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【０００５】[0005]
【問題点を解決するための手段】この目的のため、本発
明は、ＢＧＡパッケージのはんだボールの外周面と適合
する球状接触凹面と、該球状接触凹面と一体の盲孔を有
し、かつ該盲孔下端までに亘って割溝が形成された弾性
復元力を有するバネ性受座部と、該バネ性受座部の下端
に一体に形成されたＩＣソケット本体上面に係止せられ
る係止つば部と、該係止つば部の下端に一体にして、か
つ前記バネ性受座部と同心状に形成された前記ＩＣソケ
ット本体に挿入されるコンタクト部とを含む構成を特徴
とするものである。Means for Solving the Problems To this end, the present invention has the outer peripheral surface of the solder balls B GA package and the matching spherical contact concave, the spherical contact concave integral with blind holes, and A spring-like receiving portion having an elastic restoring force in which a split groove is formed up to the lower end of the blind hole, and an engagement that is engaged with the upper surface of the IC socket body integrally formed at the lower end of the spring-like receiving portion. And a contact portion which is integrally formed with a lower end of the locking collar portion and which is formed concentrically with the spring seat portion and is inserted into the IC socket body. is there.
Claims (1)
面と適合する球状接触凹面と、該球状接触凹面と一体の
盲孔を有し、かつ該盲孔下端までに亘って割溝が形成さ
れた弾性復元力を有するバネ性受座部と、該バネ性受座
部の下端に一体に形成されたＩＣソケット本体上面に係
止せられる係止つば部と、該係止つば部の下端に一体に
して、かつ前記バネ性受座部と同心状に形成された前記
ＩＣソケット本体に挿入されるコンタクト部とを含む構
成を特徴とするＢＧＡパッケージ検査用のＩＣソケット
ピ。1. Elasticity having a spherical contact concave surface that matches the outer peripheral surface of the solder ball of the SGA package, a blind hole integral with the spherical contact concave surface, and a split groove extending to the lower end of the blind hole. A spring-type seat having a restoring force, a locking collar that is integrally formed on the lower end of the spring-type seat and is locked to the upper surface of the IC socket body, and a lower end of the locking flange that are integrally formed. An IC socket pin for BGA package inspection, comprising: the spring seat portion and a contact portion formed concentrically and inserted into the IC socket body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6191951A JP2704362B2 (en) | 1994-07-22 | 1994-07-22 | IC socket pins for BGA package inspection |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6191951A JP2704362B2 (en) | 1994-07-22 | 1994-07-22 | IC socket pins for BGA package inspection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0837071A true JPH0837071A (en) | 1996-02-06 |
| JP2704362B2 JP2704362B2 (en) | 1998-01-26 |
Family
ID=16283174
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6191951A Expired - Lifetime JP2704362B2 (en) | 1994-07-22 | 1994-07-22 | IC socket pins for BGA package inspection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2704362B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100744997B1 (en) * | 2006-05-24 | 2007-08-02 | 김대수 | Socket terminal of bga(ball grid array) test socket |
| CN102207515A (en) * | 2010-03-29 | 2011-10-05 | 鸿富锦精密工业（深圳）有限公司 | Probe structure |
| CN106415278A (en) * | 2014-06-16 | 2017-02-15 | 欧姆龙株式会社 | Blast treatment method |
| KR20180016615A (en) * | 2016-06-17 | 2018-02-14 | 오므론 가부시키가이샤 | Probe pin |
-
1994
- 1994-07-22 JP JP6191951A patent/JP2704362B2/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100744997B1 (en) * | 2006-05-24 | 2007-08-02 | 김대수 | Socket terminal of bga(ball grid array) test socket |
| CN102207515A (en) * | 2010-03-29 | 2011-10-05 | 鸿富锦精密工业（深圳）有限公司 | Probe structure |
| CN106415278A (en) * | 2014-06-16 | 2017-02-15 | 欧姆龙株式会社 | Blast treatment method |
| EP3156806A4 (en) * | 2014-06-16 | 2018-01-24 | Omron Corporation | Probe pin |
| US10145862B2 (en) | 2014-06-16 | 2018-12-04 | Omron Corporation | Probe pin |
| KR20180016615A (en) * | 2016-06-17 | 2018-02-14 | 오므론 가부시키가이샤 | Probe pin |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2704362B2 (en) | 1998-01-26 |
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