JPH08340194A - Method of measuring dimension of part and chip mounter - Google Patents

Abstract

PURPOSE: To provide a method of automatically, accurately, and quickly measuring the external dimensions of a part to be mounted, the number of leads, and part parameters such as a pitch and the like and a chip mounter for mounting an electronic part on a board. CONSTITUTION: The images of the leads 20 to 23 of a part are successively scanned both in a longitudinal and a lateral direction for each row and column from each side of the part toward the center, and when the tops 20a to 23a of the leads located at the sides are detected by a scanning line, the coordinates of them are stored. In succession, the images are divided in both a longitudinal and a lateral direction, and the image in each region is successively scanned along each side. When the other top 20b to 23b of the leads located at the sides are detected by a scanning line, the coordinates of them are stored for each side, straight lines are drawn between points designated by the coordinates of each side obtained before and after the image is divided to obtain the outline of the part, and the dimensions H, V, and θ of the part are measured based on the above outline. The leads are scanned along the outline of the part, whereby the number of the leads and part parameters such as pitch and the like can be measured.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is necessary for mounting a component such as a method of measuring a component shape and a chip mounter, and more specifically, the outer size of a surface mount component, the presence / absence of lead portions, the number of lead portions, the length of lead portions, etc. The present invention relates to a component shape measuring method for automatically measuring various component parameters and a chip mounter for mounting components on a board.

[0002]

2. Description of the Related Art Conventionally, a component such as an electronic component supplied from a component supply unit is sucked by a suction nozzle mounted on a suction head, and the XY robot conveys the component to a predetermined position on a circuit board for mounting. A component mounting device (chip mounter) is known. In that case, since the suction nozzle does not always pick up the component in the correct posture, normally C
The pickup position is measured by a CD camera to obtain the angular deviation of the component with respect to the reference line or the positional deviation between the suction center and the center of the component, and the position of the component is corrected based on the amount of these deviations, and then the position on the circuit board is adjusted. It is installed.

Further, in such a component mounting apparatus, in order to perform accurate component mounting, for each component mounted on the circuit board, the outer size of the component and the presence or absence of lead portions provided on each side of the component. It is necessary to send the component parameters such as the lead pitch, the lead length, and the number of leads to the component mounting apparatus from the data sheet of the component or based on the visual inspection of the component.

[0004]

In the past, these component parameters have been automated in operation, such as creating a database for each component and managing them. However, regarding the component parameters of new components, manual measurement and I had to rely on input. However, in recent years, surface mount components have become smaller and finer in pitch, and the number of lead parts has been increased, so that much labor and time are required to manually measure and input these component parameters. Therefore, automatic measurement of the component shape has been desired from the viewpoint of eliminating the measurement error of the component parameter due to the measurement error of the number of leads and the input error and improving the measurement accuracy of the component parameter.

The present invention has been made in view of the above circumstances, and it is possible to automatically and accurately measure the component parameters such as the outer size of the component to be mounted, the number of lead portions, and the pitch at high speed. It is an object of the present invention to provide a method for measuring a component shape and a chip mounter for mounting an electronic component on a substrate.

[0006]

In order to solve this problem, the present invention provides a method for measuring the shape of a component having a plurality of lead portions on at least one side based on the image, in which the image is lined. When the scanning line detects the tip of the lead portion, the coordinate value is obtained, and the image is divided into a first area including the detected tip of the lead portion and a second area not including the detected tip, The image of the second area is scanned line by line, and when the scanning line detects the tip of the lead portion in the second area, the coordinate value thereof is obtained, and a line connecting the points of each coordinate value obtained before and after the division is formed. Based on this, we adopted a configuration that measures the shape of parts.

Further, in order to solve this problem, in the present invention, in a chip mounter for mounting an electronic component on a substrate, a suction nozzle capable of sucking a component and moving in the X, Y, Z and θ directions, It has an image pickup means for picking up an image of the electronic component sucked by the suction nozzle, and an image processing means for processing the image signal obtained by the image pickup means. Presence or absence of parts,
The electronic component parameter of any one of the numbers of leads is automatically measured based on the image from the image pickup means.

[0008]

In this structure, the image of the part is scanned,
When the tip of the lead portion is detected, its coordinate value is obtained. Subsequently, the image is divided, and the same scanning is performed in the image area that does not include the point of the coordinate value. When the tip of the lead portion is detected in the scanning, the coordinate value is similarly obtained. By connecting the points of the coordinate values obtained before and after this division, the contour line corresponding to the tip of the lead portion of the component can be obtained.

By scanning the lead portions along the outline, it becomes possible to measure the number of lead portions, the pitch, or the presence or absence thereof.

A window including at least one lead portion is set on the basis of the point of the coordinate value thus obtained, and scanning is performed from the side opposite to the point of the coordinate value in this window. When the other end of the lead portion is detected by this scanning, its coordinate value is obtained, and the length of the lead portion can be obtained from both coordinate values of the tip and the other end of the lead portion.

Further, by performing the same processing for each side of the component, it is possible to obtain the outlines of the other sides of the component, and to obtain the width, length and inclination of the component with respect to the reference line from these outlines. You can

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in detail below based on the embodiments shown in the drawings.

FIG. 1 and FIG. 2 show a schematic configuration for measuring a component in a component mounting apparatus. In the component mounting apparatus, an electronic component (hereinafter simply referred to as component) 3 having a large number of lead portions 3a mounted on a circuit board is
It is sucked by a suction nozzle 1 that can move in X, Y, Z, and θ, and the CCD is placed under the illumination of an illumination device (not shown in FIG. 1) 4.
An image is picked up by an image pickup means such as the camera 2 and an image of the component is acquired. This image is an A / D of the image processing unit 10.
After being converted into a digital value by the converter 11, it is stored as binary data in the image memory 12 in the form of a bit map. The image data stored in this memory is stored in the CPU 1
Image processing is performed by 3 and component parameters are measured.
Further, this image data can be displayed on the television monitor 14 via the D / A converter 16 or can be used in an external device via the external interface 15.

The image data of the parts on the image memory 12 is C
According to the program of PU13, as described in detail below,
The lead portion of the component is detected, analyzed, converted into a component parameter, and sent to the component mounting apparatus or the host CPU for production management via the external interface 15. If this device is the component mounting device itself, it is stored as a component parameter in a predetermined area of the database.

First, a method of measuring the external size of a component will be described with reference to FIGS. 3 and 4.

As shown in steps S1 and S2 of FIG. 3, the image of the component 3 is picked up by the CCD camera 2, and the image data is stored in the image memory 12. The image data of the lead parts 20 to 23 on each side of the stored parts are shown in FIG. 4 (other than the lead part is not shown). It is assumed that the image data of the respective lead parts of the stored components are stored as bright data (signal level “1”).

Next, in step S3, as shown in FIG. 4A, the upper side of the component is sequentially scanned line by line from the outermost side to the inner side (image data at each address is read). . It is determined whether the image data at the tip of the lead portion 20 on the upper side is detected by scanning from the line 30 (step S4), and if not detected, the scanning is repeated inward for each line. Since the tip 20a of the lead portion is detected on the line 30a, the scanning of that side is ended at that time, and the coordinate value 20a (x, y) of the detected image data of the tip of the lead portion is stored (step S5). ).

Subsequently, in step S6, it is determined whether or not the other side is also scanned. If not, in step S7, the scanning is switched to the other side, for example, the left side, and steps S3 to S3. Repeat S6.
Thus, the left lead portion 21 and the lower lead portion 2
2. Coordinate values 21a (x, y), 22a (x, y), 23a (x, of the tips 21a, 22a, 23a of the lead portions initially detected by scanning the right lead portion 23.
y) is stored.

Next, as shown in FIG. 4 (B), four circumscribing lines 31 to 34 circumscribing the part are obtained based on the respective coordinate values, and the region surrounded by the circumscribing lines thus obtained is lined in the vertical direction 35. And along the line 36 in the horizontal direction (step S8). Then, for example, scanning is performed from the upper left region toward the inside from the tangent line 31 in the same manner as in step S3,
If the tip 20b of the lead portion is detected, its coordinate value 20b
(X, y) is stored and the scanning of this area ends (steps S9 to S10).

Scanning of such divided image areas is continuously performed on the lower left, lower right, and upper right areas, and the processing of steps S9 to S13 is repeated until all areas are scanned. The coordinate values 20b (x, x, respectively detected on the lead portions on the respective sides by the scanning of the divided images
y), 21b (x, y), 22b (x, y), 23b
(X, y) is required.

Next, in step S14 of FIG. 5 branching from FIG. 3A, the outlines 40 to 43 of the component obtained by connecting the points of the coordinate values of the respective sides are shown in FIG. 4C. Component width H, component length V, and reference line 4
The inclination θ with respect to 4 can be obtained.

Further, at this stage, as shown in step S15, it becomes possible to detect the number of lead portions, the lead pitch, or the presence / absence of leads.

First, the number of lead portions is measured as follows. The tip of the lead portion on each side is scanned along the contour line in consideration of the component inclination θ measured at the time of the component contour size in step S14. For example, in FIG.
Detected coordinate values 20a (x, y), 20b (x, y)
The image data on the upper side is scanned by the scanning line U along the outline connecting the points. The data at this time is shown in FIG. 6B, and by separating the lead portion and the background portion according to the brightness, the individual lead portion position and the number of lead portions can be detected. In the figure, ◯ ... bright point, × ... dark point, ↓ ... lead portion center position are shown respectively, and the lead portion rising and falling midpoints are the lead portion positions.

The above is the lead portion on the upper side,
Similarly, by setting the scanning line D on the lower side, the scanning line L on the left side, and the scanning line R on the right side, the number of lead portions on each side can be measured.

Further, the distance between adjacent lead portions is calculated from the individual lead portion positions on each side obtained when measuring the number of lead portions, and the average value, the intermediate value, or the median value of the obtained distances is calculated. It is possible to measure the pitch of the lead portions by setting the lead portion pitch of the component.

Further, since there is no lead portion on the side where the bright point cannot be detected, the presence or absence of the lead portion can be determined.

Further, when step S5 of FIG. 3 is completed, the length of the lead portion can be obtained by branching to FIG. 5B. This state is shown in FIG. For example, the detection coordinate 20a of the lead portion on the upper side
A detection window having a width w and a length l is set on the basis of (x, y) so that at least one lead portion falls within this window (step S16). Next, the scanning is started from the lower part of the window toward the peripheral part, and the scanning is continued until the image data corresponding to the other end of the lead part is detected (steps S17 and S18). When the other end 20c of the lead portion is detected, the coordinate value 20c (x, y) is stored, and the difference in the length direction between the coordinate values 20a (x, y) and 20c (x, y) is calculated. By calculating, it becomes possible to measure the length of the lead portion.

In the above-described embodiment, the image data of the lead portion is binarized and stored, and the lead portion is detected by detecting this binary image data.
You may make it detect a lead part using a G filter.

Further, in step S8, the image is equally divided into four, but the present invention is not limited to this, and for example, dividing lines may be set within a predetermined distance from coordinate points to be detected and stored. Good. The larger the predetermined distance is, the larger the distance between the second detected coordinate point and the first detected coordinate point is, so the accuracy of the outlines 40 to 43 obtained by connecting the coordinate points is improved. Since the detection accuracy of the second coordinate point decreases, the two-division line as shown in FIG. 4B is a preferable division line that compromises both.

Further, when the length of the lead portion shown in FIG. 7 is obtained, the window is set on the basis of the coordinate points obtained before the division, but the window is set on the basis of the coordinate points after the division. May be.

[0031]

As described above, according to the present invention, an image of a lead portion of a component is analyzed and component parameters such as the component outer size, the presence or absence of the lead portion, the length of the lead portion, the number of lead portions, and the pitch of the lead portion are analyzed. Since the measurement is performed automatically, it is possible to reduce troubles and input errors due to manual data input and obtain highly reliable component parameters.

Further, according to the present invention, it is possible to provide a high-performance chip mounter capable of mounting each component on the substrate based on such highly reliable component parameters.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration for acquiring image data of a component.

FIG. 2 is a block diagram showing a configuration for processing an acquired image.

FIG. 3 is a flowchart showing a flow of processing for determining a part shape.

FIG. 4 is an explanatory diagram showing scanning of image data and measurement of an outer size of a component.

FIG. 5 is a flowchart showing a flow of processing for obtaining each component parameter.

FIG. 6 is an explanatory diagram illustrating measurement of the number of lead portions.

FIG. 7 is an explanatory diagram illustrating measurement of the length of the lead portion.

[Explanation of symbols]

 1 suction nozzle 2 CCD camera 3 parts 12 image memory 13 CPU 14 monitor

Claims (9)

[Claims] 1. A component shape measuring method for measuring the shape of a component having a plurality of lead portions on at least one side based on an image, when an image is scanned line by line and a scanning line detects the tip of the lead portion. The coordinate value is obtained, the image is divided into a first region including the detected leading end of the lead portion and a second region not including the detected lead portion, the image in the second region is scanned line by line, and the scanning line When the tip of the lead portion is detected in the area of No. 2, the coordinate value is obtained, and the shape of the component is measured based on the line connecting the points of each coordinate value obtained before and after the division. Measuring method. 2. The component shape measuring method according to claim 1, wherein the lead portion is scanned along a line connecting the points of the coordinate values to measure the number of lead portions. 3. The component shape measuring method according to claim 1, wherein the lead portion is scanned along a line connecting the points of the coordinate values to measure the pitch of the lead portion. 4. The shape of the component according to claim 1, wherein the lead portion is scanned along a line connecting the points of the coordinate values to measure the presence or absence of the lead portion. Measurement method. 5. A window including at least one lead portion is set on the basis of the point of the coordinate value obtained before or after the division, and the lead portion is scanned by scanning from the opposite side of the window of the coordinate value. 5. The other end of the lead portion is detected, and the length of the lead portion is obtained from the detected coordinate value of the other end and the coordinate value obtained before or after the division. The method for measuring a part shape according to item 1. 6. A method for measuring a shape of a component having a plurality of lead portions on each side based on an image, wherein the image is sequentially scanned row-by-row and column-by-row from the upper, lower, left, and right sides toward the center. Then, when the scanning line detects the tip of the lead part on each side, the coordinate value is calculated for each side, and the image is generated so that the area including the point of the calculated coordinate value and the area not including the point occur on each side. Divide vertically and horizontally, scan the image sequentially in the direction along each side in each area that does not include the point of the coordinate value, and when the scanning line detects the tip of the lead part of each side, the coordinate value Is calculated for each side, and the shape of the part is measured based on the line connecting the points of the coordinate values of the sides obtained before and after the division. 7. The method for measuring the shape of a component according to claim 6, wherein the width, length and inclination of the component with respect to the reference line are obtained based on a line connecting the coordinate value points on each side. 8. A component shape measuring method for measuring a shape of a component having a plurality of lead portions on at least one side based on an image, wherein an image is scanned line by line, and a scanning line detects a tip of the lead portion. Obtain the coordinate values, set a window containing at least one lead based on the obtained point of the coordinate value, and scan from the opposite side of the point of the coordinate value in this window to scan the other end of the lead. Is detected and the length of the lead portion is obtained from the detected coordinate value of the other end and the coordinate value obtained first. 9. A chip mounter for mounting an electronic component on a substrate, a suction nozzle capable of sucking the component and moving in X, Y, Z, and θ directions, and an image of the electronic component sucked by the suction nozzle. And an image processing unit that processes the image signal obtained by the image capturing unit. The image processing unit uses any one of the electronic size of the electronic component, the presence / absence of a lead portion, and the number of leads. A chip mounter characterized by automatically measuring an electronic component parameter based on an image from an imaging means.