JPH083274A - Resin for solder resist - Google Patents

Abstract

PURPOSE:To produce a photocurable liquid solder resist resin which is an alkali development type ink having improved stability in viscosity and is developable over an extended period after application and drying, and from which an insoluble matter can be easily and completely removed after synthesis. CONSTITUTION:This solder resist resin is obtained by contacting an epoxy resin (I) having two or more epoxy groups per molecule with an unsaturated monobasic acid (II) in the presence of an inorganic chromium salt as an esterification catalyst to react the carboxyl group of the acid (II) with an epoxy group of the resin (I), and reacting the hydroxyl group resulting from that reaction with an acid anhydride (III).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid solder resist resin.

[0002]

2. Description of the Related Art Epoxy acrylate resins have hitherto been widely used as solder resists for printed wiring boards because of their excellent photocurability, adhesion to adherends, heat resistance and chemical resistance. In particular, recently, the resist forming method has been changed to a solder resist using a photo printing method as the printed circuit board becomes higher in density and finer.

At present, liquid solder resists for which the coating method is not limited are in the spotlight, and among them, the alkaline liquid developing type is becoming the mainstream in terms of cost and solvent pollution problems.

The alkali developing type solder resist is mainly composed of an acid pendant type epoxy acrylate resin obtained by reacting an acid anhydride with a hydroxyl group of an epoxy acrylate resin, and a method for producing this resin and an ink using the same. The composition is already known. As an ink composition, compound an epoxy resin to block carboxyl groups in the ink for the purpose of improving the water resistance and electrical properties of the solder resist cured film, and crosslink by post-irradiating with ultraviolet light or by post-heating at 120-150 ° C. A method of increasing the density and forming a tough film has been adopted.

However, when an epoxy resin is blended with the above acid pendant type epoxy acrylate resin to be used as an ink composition, the reaction between a carboxyl group and an epoxy group tends to increase the viscosity over time and, in some cases, cause gelation. In view of the stability of the ink, the method of blending immediately before use is adopted.

In addition, the ink usually added contains a solvent from the viewpoint of workability. The ink applied before patterning with a negative film is heated at 70 to 80 ° C. to volatilize and remove the solvent, and then exposed. Although the step of patterning by is taken, if the reaction between the carboxyl group and the epoxy group partially proceeds in this step, the development after exposure becomes insufficient,
There is a problem in that there are many restrictions on the temperature and time for compounding and solvent removal.

As a method for solving such a problem, for example, Japanese Patent Application Laid-Open No. 03-14817 discloses a method for producing an acid pendant type epoxy acrylate resin using an organic acid salt of a metal. According to this method, the stability of ink and the controllability of developability are improved as compared with the case of using conventionally used amine-based or phosphorus-based catalysts. However, the resin obtained by this method is difficult to completely remove insoluble matter by filtration. When used as an ink composition with insufficient removal of this insoluble matter,
There is a risk of causing poor electrical continuity of the circuit and insulation failure due to peeling of the solder mask, which may be a fatal defect for the circuit of recent high-density fine pattern.

[0008]

In view of the above situation, the present inventors have improved the viscosity stability of an alkali-development type solder-resist ink constituted by using the resin, and have a developable dry property after coating. An esterification catalyst is selected in the epoxy acrylate resin synthesis step for the purpose of providing a photocurable liquid solder-resist resin capable of achieving time extension and easily removing insolubles completely after the synthesis process. As a result of repeated studies, the present invention has been achieved.

[0009]

Means for Solving the Problems The present invention provides an unsaturated monobasic acid (II) containing an epoxy resin (I) having two or more epoxy groups in one molecule and an unsaturated monobasic acid (II). When an epoxy acrylate resin is obtained by the reaction of the carboxyl group of the above with the epoxy group in the resin (I), an inorganic salt of chromium is used as an esterification catalyst, and a hydroxyl group produced by the reaction between the carboxyl group and the epoxy group. To
Further, the present invention relates to a photocurable liquid solder resist resin obtained by reacting an acid anhydride (III).

The epoxy resin (I) having two or more epoxy groups in one molecule used in the present invention is
Examples thereof include novolac type epoxy resin, bisphenol type epoxy resin, biphenyl type epoxy resin, alicyclic epoxy resin and the like, and preferably novolac type epoxy resin. Examples of the novolac type epoxy resin include phenol novolac type epoxy resin, brominated phenol novolac type epoxy resin, and cresol novolac type epoxy resin, which are obtained by reacting each novolac resin with epichlorohydrin by a conventional method. is there. Generally, it can be represented by the following structural formula.

[0011]

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(In the formula, R ¹ is a hydrogen atom or a methyl group, and R ² is a hydrogen atom, a halogen atom or an alkyl group.) Further, the novolac type epoxy resin represented by the above structural formula and polybasic acid Also included are those which are chain-extended by reaction with a polyhydric phenol, a polyfunctional amino compound or a polyhydric thiol.

Examples of the unsaturated monobasic acid (II) include acrylic acid, methacrylic acid, and polyfunctional (meth) acrylate having one carboxyl group and two or more (meth) acryloyl groups.

Two epoxy groups are contained in one molecule in the present invention.
Epoxy resin (I) having more than one and unsaturated monobasic acid (I
The reaction with I) is already known, and can be directly used without the esterification catalyst. Usually, the carboxyl group in the unsaturated monobasic acid (II) is charged to 0.9 to 1.1 chemical equivalents relative to 1 chemical equivalent of the epoxy group in the epoxy resin (I), and the diluent described below is used. The epoxy acrylate resin is obtained by carrying out the reaction at 80 to 130 ° C. in the presence or absence of a polymerization inhibitor such as hydroquinone or oxygen.

In the conventional method, a tertiary amine such as triethylamine or the like, a quaternary ammonium salt such as triethylbenzylammonium chloride or the like as an esterification catalyst, 2-
Imidazole compounds such as ethyl-4-methylimidazole, phosphorus compounds such as triphenylphosphine, and organic acid salts of metals have been used.

In the present invention, an inorganic salt of chromium, for example, a chloride salt, a bromide salt or the like or a hydrate thereof is used in place of these esterification catalysts, and an ink using the resin obtained in the present invention is used. The composition has improved viscosity stability and controllability of developability. Furthermore, the synthetic reaction proceeds faster than when an organic acid salt of a metal is used, and insoluble matter can be removed by simple filtration after completion of the reaction. There are advantages.

The amount of the inorganic salt of chromium used is usually 0.001 to 10% by weight, preferably 0.1% by weight, based on the sum of the epoxy resin (I) and the unsaturated monobasic acid (II) used. 0
It is from 05 to 5% by weight. When the amount used is less than 0.001%, the reaction between the epoxy resin (I) and the unsaturated monobasic acid (II) does not proceed sufficiently, and when the amount exceeds 10% by weight,
The stability and developability control range of the ink composed of the obtained resin are reduced.

The resin for a solder resist of the present invention can be obtained by reacting the hydroxyl group in the epoxy acrylate resin obtained above with the acid anhydride (III).

As the acid anhydride (III), phthalic anhydride,
Succinic anhydride, maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, tetrabromophthalic anhydride, trimellitate Examples thereof include dibasic acid anhydrides such as acids, and tetrabasic acid dianhydrides such as aliphatic or aromatic tetracarboxylic acid dianhydrides, and one or more of these can be used.

The acid anhydride is used in an amount of 0.1 to 1 chemical equivalent of hydroxyl group in the epoxy acrylate resin.
1.1 A chemical equivalent is suitable, and the reaction can be carried out at 80 to 130 ° C. in the presence or absence of a diluent and in the presence of a polymerization inhibitor such as hydroquinone or oxygen. At this time, if necessary, an inorganic salt of another metal, such as lithium,
It is also possible to additionally use chloride salts, bromide salts and the like of metals such as zirconium, potassium, sodium, tin, zinc and lead, or hydrates thereof.

The resin for solder resist of the present invention may be used as a diluent at the time of synthesis, or may be used as a mixture of two or more solvents.

Examples of the solvent include hydrocarbons such as toluene and xylene; cellosolves such as cellosolve and butyl cellosolve; carbitols such as carbitol and butyl carbitol; esters such as cellosolve acetate and carbitol acetate; methyl ethyl ketone and the like. Ketones; ethers such as diethylene glycol dimethyl ether, and the like.

The amount of the solvent to be used is preferably 5 to 500 parts by weight based on 100 parts by weight of the resin for solder resist in accordance with the optimum viscosity of each coating method.

[0024]

EXAMPLES The present invention will be described below with reference to examples, but these are merely examples and the present invention is not limited thereto. The parts and% in the examples are based on weight.

(Synthesis Example 1) 100 parts of cresol novolac type epoxy resin YDCN-703 (manufactured by Tohto Kasei Co., Ltd., epoxy equivalent: 200), 36.9 parts of acrylic acid, 36.9 parts of ethyl carbitol acetate, 36.9 of toluene.
Parts, 0.14 parts of chromium (II) chloride hexahydrate and 0.11 parts of methylhydroquinone were added and reacted at 110 ° C. for 3 hours, and it was confirmed that the acid value of the reaction product became 2.5. Next, tetrahydrophthalic anhydride (45.6 parts), ethylcarbitol acetate (8 parts), toluene (8 parts) and anhydrous lithium chloride (0.14 parts) were added and reacted at 100 ° C. for 3 hours to obtain a solder resist resin having an acid value of 95% by 67%. A mixture (1) containing ethyl carbitol acetate and toluene was obtained.

(Synthesis Example 2) 100 parts of phenol novolac type epoxy resin EPPN-201 (manufactured by Nippon Kayaku, epoxy equivalent 187), acrylic acid 37.2 parts, tetrabromobisphenol A 8.4 parts, ethyl carbitol acetate 39 .2 parts, toluene 39.2 parts, anhydrous chromic bromide 0.15 parts and methylhydroquinone 0.12
Then, it was confirmed that the reaction product had an acid value of 2.9. Next, succinic anhydride 2
9.4 parts, ethyl carbitol acetate 3.9 parts and toluene 3.9 parts are added and reacted at 100 ° C. for 5 hours, and a mixture of ethyl carbitol acetate and toluene containing 67% of a solder resist resin having an acid value of 98. (2) was obtained.

COMPARATIVE SYNTHESIS EXAMPLE 1 100 parts of the cresol novolac type epoxy resin used in Synthesis Example 1 was mixed with 36.9 parts of acrylic acid and 3 parts of ethylcarbitol acetate.
6.9 parts, 36.9 parts of toluene, 0.41 part of triphenylphosphine and 0.11 part of methylhydroquinone were added and reacted at 110 ° C. for 9 hours, and the acid value of the reaction product was 3.
It was confirmed that it became 9. Next, 45.6 parts of tetrahydrophthalic anhydride, 8 parts of ethyl carbitol acetate and 8 parts of toluene were added and reacted at 100 ° C. for 6 hours to obtain ethyl carbitol acetate and toluene containing 67% of a comparative solder resist resin having an acid value of 98. A comparative mixture (3) was obtained.

COMPARATIVE SYNTHESIS EXAMPLE 2 100 parts of the cresol novolac type epoxy resin used in Synthesis Example 1 was mixed with 36.9 parts of acrylic acid and 3 parts of ethylcarbitol acetate.
6.9 parts, toluene 36.9 parts, chromium naphthenate (metal content 3%) 0.9 parts and methylhydroquinone 0.11
Then, it was confirmed that the reaction product had an acid value of 2.9. Next, 45.6 parts of tetrahydrophthalic anhydride and 8 parts of ethyl carbitol acetate
Parts and 8 parts of toluene were added and reacted at 100 ° C. for 9 hours,
A comparative mixture (4) containing 67% of a resin for comparative solder resist having an acid value of 90 and ethyl carbitol acetate and toluene was obtained.

(Examples and Comparative Examples) The respective mixtures thus obtained or the photocurable liquid solder resist ink compositions having the formulations shown in Table 1 were evaluated by the following methods. Table 2 shows the results.

<Evaluation of Filterability> After synthesizing each mixture, the mixture was cooled to 60 ° C., and the filterability of 300 mesh stainless wire mesh was compared.

<Evaluation of Viscosity Stability of Ink Composition> A photocurable liquid solder resist ink composition was put in a φ18 mm Pyrex test tube and kept in an oil bath at 80 ° C. using an E-type viscometer. Viscosity change tracking was performed.

<Evaluation of developability of ink composition> A photocurable liquid solder resist ink composition was applied on a degreased and washed 1.6 mm-thick copper clad laminate to a thickness of 20 to 30 μm and circulated with hot air. A coating film was obtained by drying at 80 ° C. in a dry oven. Then use 1% Na ₂ CO ₃ aqueous solution at 30 ° C.
Under a pressure of 2.1 kg / cm ² for 80 seconds, and the residual resin was visually evaluated.

[0033]

[Table 1]

[0034]

[Table 2]

[0035]

As described above, according to the method of the present invention, the solder resist resin synthesizing step is shortened as compared with the conventional method, and the post-treatment is also simple. In addition, the alkali-developable ink that is composed of the obtained solder resist resin has better viscosity stability than conventional ones, and has a long range of developability control, which is superior in process control and tack-free property. In particular, it is useful for solder resist applications related to electronic parts where the performance of a cured coating film is required.

Claims (1)

[Claims] 1. From an epoxy resin (I) having two or more epoxy groups in one molecule and an unsaturated monobasic acid (II), a carboxyl group in the unsaturated monobasic acid (II) and the resin (I )
When an epoxy acrylate resin is obtained by the reaction with the epoxy group in it, an inorganic salt of chromium is used as an esterification catalyst, and the hydroxyl group generated by the reaction between the carboxyl group and the epoxy group is further mixed with an acid anhydride (III). A photocurable liquid solder resist resin obtained by reacting with.