JPH0832264A - Cooling structure for housing - Google Patents

Abstract

PURPOSE:To cool a housing forcibly with air at a moderate efficiency even if the heating value of an electronic apparatus mounted on the housing varies with time. CONSTITUTION:A housing 1 for mounting an electronic apparatus 5 is provided, on the opposite side faces with ducts 2. The duct 2 is provided with a several blades 3 on the side facing each electronic apparatus 5 and a fan 4 at the upper part. The blade 3 is made of a shape-memory material and secured, at the opposite ends to the wall of the duct 2 with some gap being provided between respective blades 3. The blade 3 takes a planar shape under low temperature and the gap is small and constant but the blade 3 is twisted under high temperature and the gap is widened as the temperature increases. The tan 4 regulates the air flow rate according to the temperature of air in the housing 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling structure for a casing for mounting electronic equipment, and more particularly to a forced air cooling structure for a casing provided with a fan and a duct.

[0002]

2. Description of the Related Art An example of a conventional cooling structure for a casing is, as shown in FIG. 3, connected to a plurality of electronic devices 17 directly from a suction fan 14 via a duct 12 provided on a side surface of a casing 11 of an electronic device 17. The cooling air flow is distributed and supplied (for example, Japanese Patent Laid-Open No. 4-5898). FIG.
A duct 12 is provided on a side surface of a housing 11 on which electronic devices 17 are mounted in multiple stages, a suction fan 14 is provided at a lower portion, and a discharge fan 15 is provided at an upper portion. Each floor of the electronic device 17 is diagonally and diagonally divided into upper and lower halves by a convection guide plate 13, and an upper half thereof serves as an air inlet of each floor facing the floor of the electronic device, and a lower half thereof. Is an air exhaust port that faces the ceiling surface of electronic equipment on each floor. At this time, the air guide 16 is provided in the duct 12 so as to project obliquely downward, so that the air inflow to the electronic device 17 on each floor can be made smooth, and at the same time, the protruding length of the air guide 16 can be changed to change the air inflow amount To change the structure.

Further, as another two examples of the conventional cooling structure for a casing, the following can be mentioned.

(1) A spring made of a shape memory alloy which changes the spring force by detecting the temperature inside the casing when opening or closing a natural exhaust or forced exhaust switching valve provided in the exhaust duct of an exhaust fan unit for exhausting the inside of the casing. The operating time of the exhaust fan is shortened, noise is reduced, and power is saved by a simple and inexpensive structure (Japanese Utility Model Laid-Open No. 64-24892).

(2) A ventilation duct extending from the lower part to the vicinity of the ceiling is provided inside the casing, and a fan is attached to the ventilation duct to increase the size of the side-mounted heat exchanger without increasing the size of the casing. The internal air can be cooled efficiently, and the temperature difference between the ceiling side and the bottom side inside the casing can be reduced (Japanese Utility Model Laid-Open No. 64-2490).

[0006]

In this conventional cooling structure for a casing, the distribution amount of the cooling air flow to each electronic device is adjusted by the length of the protruding amount of the air guide protruding into the duct. ing. Therefore, when the heat generation amount of an electronic device changes with time, for example, in a housing equipped with a device that has several types of operation modes or a device that operates only under specific conditions, adjust the maximum heat generation of each device. Therefore, it is necessary to set a plate for adjusting the distribution amount of the cooling air flow. Furthermore, there is also a drawback in that the fan unit that supplies the cool air must have a blowing capacity according to the maximum heat generation amount.

Therefore, the present invention aims to improve the conventional cooling structure for a casing so as to appropriately and efficiently perform forced air cooling even if the heat generation amount of each electronic device changes with the passage of time. Is.

[0008]

According to the present invention, in order to solve the above-mentioned problems, in a casing for mounting an electronic device, a ventilation duct is provided on a side surface of the casing, and the duct faces the electronic device. It has a blade formed of a shape memory material on the surface, has a fin on the upper part, and the gap formed by the blade between the electronic device and the duct is narrow at low temperature, and depending on the rise in temperature. The fan adopts a cooling structure for the casing, which becomes wider due to the deformation of the blades, and the fan blows up and down according to the rise and fall of the air temperature in the casing.

[0009]

Embodiments of the present invention will now be described with reference to the drawings.

FIGS. 1A and 1B are a perspective view and a vertical sectional view of a casing showing an embodiment of the present invention. In FIG. 1, ducts 2 are provided on both side surfaces of a casing 1 on which an electronic device 5 is mounted, and each duct 2 includes one electronic device 5
Several blades 3 are provided on the surface facing each other, and three fans 4 are provided on each side at the upper part. The blades 3 are formed of a shape memory material, both ends of the blades 3 are fixed to the wall of the duct 2, and some gaps are provided between the blades 3. The blade 3 takes on the brand-name shape of a window in a building, in a familiar example.

The blade 3 has a flat plate shape as shown in FIG. 2 (A) at low temperature, and the gap between the blades 3 is constant and narrow, but at high temperature, as shown in FIG. 2 (B). The blade gradually twists from both ends to the center, and has a shape twisted by 90 degrees at the center, and the gap between the blades 3 becomes wider as the temperature rises.

Although the number of the blades 3 is one for one electronic device 5 in the above-described embodiment, the number of blades 3 can be increased or decreased even if the number is one. Further, the fan 4 has a function of increasing the rotation speed as the temperature inside the duct rises.

Next, cooling according to one embodiment of the present invention will be described. The temperature of the surrounding air rises due to the heat generation of the electronic device 5, and the blade 3 at a portion which has reached the deformation temperature of the blade 3 or higher is deformed as shown in FIG. The air in the portion where the blade 3 is deformed is exhausted to the outside of the casing 1 by the fan 4 through the duct 2. At this time, since the heat generated by the electronic device 5 is small and the opposing blades 3 have not reached the deformation temperature, the air is not taken into the duct 2, so that the fan 4 operates efficiently. Further, since the fan 4 has a function of increasing the rotation speed as the temperature rises,
When the amount of heat exhausted from the electronic device 5 into the duct 2 increases, the number of rotations of the fan 4 also increases, and the amount of heat dissipation to the outside of the casing 1 also increases.

[0014]

As described above, according to the present invention, since the blade formed of the shape memory material is provided on the surface of the duct on the side surface of the housing facing the electronic device, the heat generation amount of each electronic device is reduced. Even if the temperature changes, it can be cooled efficiently. Further, since the fan provided in the upper part of the duct has a different blowing ability depending on the temperature of the air in the duct, it has the effect of efficiently dissipating heat from the duct to the outside of the casing.

[Brief description of drawings]

FIG. 1 is an overall view of an embodiment of the present invention, (A) is a perspective view, and (B) is a vertical sectional view.

FIG. 2 is a perspective view showing the shape of a blade in one embodiment of the present invention, (A) at a low temperature and (B) at a high temperature.

FIG. 3 is a vertical sectional view of a conventional cooling structure for a casing.

[Explanation of symbols]

 1 Case 2 Duct 3 Blade 4 Fan 5 Electronic Device 11 Case 12 Duct 13 Convection Guide Plate 14 Suction Fan 15 Discharge Fan 16 Air Guide 17 Electronic Device

Claims (2)

[Claims] 1. A housing for mounting an electronic device,
A ventilation duct is provided on the side surface of the casing, the surface of the duct facing the electronic device has a blade formed of a shape memory material, and the upper part has a fan. A cooling structure for a casing, wherein a gap formed by the blade therebetween is narrow at a low temperature and widens due to the deformation of the blade as the temperature rises. 2. The fan increases or decreases the amount of air blown according to the rise and fall of the air temperature in the housing.
Cooling structure of the described body.