JPH08319574A - Metallizing method of resin molding surface - Google Patents
Metallizing method of resin molding surfaceInfo
- Publication number
- JPH08319574A JPH08319574A JP12657195A JP12657195A JPH08319574A JP H08319574 A JPH08319574 A JP H08319574A JP 12657195 A JP12657195 A JP 12657195A JP 12657195 A JP12657195 A JP 12657195A JP H08319574 A JPH08319574 A JP H08319574A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- chemical etching
- molded body
- etching
- resin molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Application Of Or Painting With Fluid Materials (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱硬化性性樹脂や熱可
塑性樹脂よりなる樹脂成形体の表面をメタライズする方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for metallizing the surface of a resin molding made of a thermosetting resin or a thermoplastic resin.
【０００２】[0002]
【従来の技術】熱硬化性性樹脂又は熱可塑性樹脂よりな
る樹脂成形体の表面にめっき等の方法で金属層を形成す
ることが、電気用途、自動車用途等の部品を製造する際
に広く行われている。電気用途においては、この金属層
を電気回路パターンとして利用することが多く、金属層
の密着強度が高いことが要求される。そこで、密着強度
の高い金属層を得る方法として、従来から熱硬化性樹脂
や熱可塑性樹脂よりなる樹脂成形体の表面を、ケミカル
エッチングで粗化した後、金属層を形成することが行わ
れている。このケミカルエッチングの方法としては、膨
潤剤を用いて膨潤処理を行った後に、過マンガン酸カリ
ウム溶液等の酸化分解剤を用いて酸化分解処理を行う２
段階処理の方法等が知られている。しかし、このように
して得られる金属層の密着強度は十分でなく、さらなる
改良が求められている。2. Description of the Related Art Forming a metal layer on the surface of a resin molding made of a thermosetting resin or a thermoplastic resin by a method such as plating is widely used in the production of parts for electric applications, automobile applications, etc. It is being appreciated. In electrical applications, this metal layer is often used as an electric circuit pattern, and high adhesion strength of the metal layer is required. Therefore, as a method for obtaining a metal layer having high adhesion strength, conventionally, the surface of a resin molded body made of a thermosetting resin or a thermoplastic resin is roughened by chemical etching, and then the metal layer is formed. There is. As a method of this chemical etching, after performing a swelling treatment using a swelling agent, an oxidative decomposition treatment is performed using an oxidative decomposing agent such as a potassium permanganate solution.
A method of stepwise treatment is known. However, the adhesion strength of the metal layer thus obtained is not sufficient, and further improvement is required.
【０００３】[0003]
【発明が解決しようとする課題】本発明は上記のような
事情に鑑みてなされたものであって、その目的とすると
ころは、密着強度の高い金属層を、熱硬化性性樹脂又は
熱可塑性樹脂よりなる樹脂成形体の表面に形成すること
ができる方法を提供することにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a metal layer having high adhesion strength with a thermosetting resin or a thermoplastic resin. It is an object of the present invention to provide a method capable of forming on a surface of a resin molded body made of a resin.
【０００４】[0004]
【課題を解決するための手段】請求項１に係る発明の樹
脂成形体表面のメタライズ方法は、樹脂成形体の表面
を、膨潤処理後に酸化分解処理を行うケミカルエッチン
グにより粗化した後、得られた粗化面に金属膜を形成す
る樹脂成形体表面のメタライズ方法において、ケミカル
エッチングを２回繰り返して行い、かつ、第１回目のケ
ミカルエッチングによる成形体の消失量（Ｗ1 ｍｇ／ｃ
ｍ2 ）及び第２回目のケミカルエッチングによる成形体
の消失量（Ｗ2 ｍｇ／ｃｍ2 ）がそれぞれ０．００５ｍ
ｇ／ｃｍ2以上であることを特徴とする。The method for metallizing the surface of a resin molded product according to the invention of claim 1 is obtained after roughening the surface of the resin molded product by chemical etching in which swelling treatment is followed by oxidative decomposition treatment. In the method for metallizing the surface of a resin molded body, in which a metal film is formed on the roughened surface, chemical etching is repeated twice, and the amount of disappearance of the molded body by the first chemical etching (W 1 mg / c
m 2 ) and the amount of disappearance (W 2 mg / cm 2 ) of the molded body by the second chemical etching are 0.005 m, respectively.
It is characterized in that it is g / cm 2 or more.
【０００５】請求項２に係る発明の樹脂成形体表面のメ
タライズ方法は、請求項１記載のメタライズ方法におい
て、樹脂成型体が熱硬化性樹脂よりなる樹脂成形体であ
って、第１回目のケミカルエッチングによる成形体の消
失量（Ｗ1 ｍｇ／ｃｍ2 ）と第２回目のケミカルエッチ
ングによる成形体の消失量（Ｗ2 ｍｇ／ｃｍ2 ）が下式
及びを満足することを特徴とする。According to a second aspect of the present invention, there is provided a method for metallizing a surface of a resin molded body according to the first aspect, wherein the resin molded body is a resin molded body made of a thermosetting resin, and the first chemical is used. The amount of disappearance of the molded body by etching (W 1 mg / cm 2 ) and the amount of disappearance of the molded body by the second chemical etching (W 2 mg / cm 2 ) satisfy the following expressions and.
【０００６】 Ｗ1 ／１００≦Ｗ2 ≦Ｗ1 ／２ −−−−− ０．１≦Ｗ1 ≦２．０ −−−−− 請求項３に係る発明の樹脂成形体表面のメタライズ方法
は、請求項１記載のメタライズ方法において、樹脂成型
体が熱可塑性樹脂よりなる樹脂成形体であって、第１回
目のケミカルエッチングによる成形体の消失量（Ｗ1 ｍ
ｇ／ｃｍ2 ）と第２回目のケミカルエッチングによる成
形体の消失量（Ｗ2 ｍｇ／ｃｍ2 ）が下式及びを満
足することを特徴とする。[0006] metallization process of W 1/100 ≦ W 2 ≦ W 1/2 ----- 0.1 ≦ W 1 ≦ 2.0 ----- surface of the resin molded body of the invention according to claim 3, The metallization method according to claim 1, wherein the resin molded body is a resin molded body made of a thermoplastic resin, and the amount of disappearance of the molded body by the first chemical etching (W 1 m
g / cm 2 ) and the disappearance amount (W 2 mg / cm 2 ) of the molded body by the second chemical etching satisfy the following expressions and.
【０００７】 Ｗ2 ／２０≦Ｗ1 ≦Ｗ2 ／２ −−−−− ０．００５≦Ｗ1 ≦０．１ −−−−− 以下、本発明を詳細に説明する。[0007] W 2/20 ≦ W 1 ≦ W 2/2 ----- 0.005 ≦ W 1 ≦ 0.1 ----- The present invention will be described in detail.
【０００８】本発明における樹脂成形体は、エポキシ樹
脂やポリイミド樹脂等の熱硬化性樹脂又はＡＢＳ樹脂等
の熱可塑性樹脂等からなる成形体であって、無機充填材
等の成分を含有していてもよい。本発明におけるケミカ
ルエッチングは、膨潤剤を用いて膨潤処理を行った後
に、過マンガン酸カリウム溶液等の酸化分解剤を用いて
酸化分解処理を行う２段階処理の方法を指している。こ
のケミカルエッチングの温度条件については特に限定は
ないが、処理時間の短縮のために５０℃〜９０℃程度の
温度で行うことが好ましい。また、金属膜を形成する方
法としては、特に限定するものではないが、無電解めっ
きにより厚みが薄い膜を形成した後、さらに電気めっき
を施す方法が所望の膜厚の金属膜を効率よく得ることが
できるので望ましい。The resin molded product in the present invention is a molded product made of a thermosetting resin such as an epoxy resin or a polyimide resin or a thermoplastic resin such as an ABS resin, and contains components such as an inorganic filler. Good. The chemical etching in the present invention refers to a two-step treatment method in which after performing a swelling treatment using a swelling agent, an oxidative degradation treatment is performed using an oxidative degradation agent such as a potassium permanganate solution. The temperature condition of this chemical etching is not particularly limited, but it is preferably performed at a temperature of about 50 ° C. to 90 ° C. in order to shorten the processing time. The method for forming the metal film is not particularly limited, but a method of forming a thin film by electroless plating and then performing electroplating can efficiently obtain a metal film having a desired film thickness. It is desirable because it can.
【０００９】[0009]
【作用】請求項１に係る発明において、ケミカルエッチ
ングを２回繰り返して行い、かつ、第１回目のケミカル
エッチングによる成形体の消失量（Ｗ1 ｍｇ／ｃｍ2 ）
及び第２回目のケミカルエッチングによる成形体の消失
量（Ｗ2 ｍｇ／ｃｍ2 ）がそれぞれ０．００５ｍｇ／ｃ
ｍ2 以上であるとすることは、単に１回のケミカルエッ
チングしか行わない従来法に比べて、得られる金属層の
密着強度を向上させる作用がある。In the invention according to claim 1, the chemical etching is repeated twice, and the amount of disappearance of the molded product by the first chemical etching (W 1 mg / cm 2 )
And the amount of disappearance of the molded body (W 2 mg / cm 2 ) by the second chemical etching is 0.005 mg / c, respectively.
When it is m 2 or more, it has an effect of improving the adhesion strength of the obtained metal layer as compared with the conventional method in which only one chemical etching is performed.
【００１０】請求項２に係る発明において、樹脂成型体
が熱硬化性樹脂よりなる樹脂成形体であって、第１回目
のケミカルエッチングによる成形体の消失量（Ｗ1 ｍｇ
／ｃｍ2 ）と第２回目のケミカルエッチングによる成形
体の消失量（Ｗ2 ｍｇ／ｃｍ 2 ）が前記式及びを満
足することは、熱硬化性樹脂よりなる樹脂成形体の表面
酸化層を第１回目のケミカルエッチングにより除去でき
るので、得られる金属層の密着強度をより確実に向上さ
せる作用がある。なぜなら、熱硬化性樹脂よりなる樹脂
成形体の表面酸化層は、一般的に熱可塑性樹脂よりなる
樹脂成形体の表面酸化層より厚みが厚い傾向があるから
である。In the invention according to claim 2, a resin molded body
Is a resin molded body made of a thermosetting resin,
Loss of molded body due to chemical etching (W1mg
/ Cm2) And molding by the second chemical etching
Body loss (W2mg / cm 2) Satisfies the above equations and
What is needed is the surface of the resin molding made of thermosetting resin.
The oxide layer can be removed by the first chemical etching
Therefore, the adhesion strength of the obtained metal layer can be improved more reliably.
There is an action to make. Because it is a resin made of thermosetting resin
The surface oxide layer of the molded body is generally made of a thermoplastic resin.
The thickness tends to be thicker than the surface oxide layer of the resin molding
Is.
【００１１】請求項３に係る発明において、樹脂成型体
が熱可塑性樹脂よりなる樹脂成形体であって、第１回目
のケミカルエッチングによる成形体の消失量（Ｗ1 ｍｇ
／ｃｍ2 ）と第２回目のケミカルエッチングによる成形
体の消失量（Ｗ2 ｍｇ／ｃｍ 2 ）が前記式及びを満
足することは、表面酸化層が一般的に薄い熱可塑性樹脂
よりなる樹脂成形体について、得られる金属層の密着強
度を向上させるための処理時間を必要な時間で終わらせ
る作用がある。すなわち、前記式及びの範囲内とな
るケミカルエッチングさえ行えば、得られる金属層の密
着強度を向上させることができる。In the invention according to claim 3, a resin molded body
Is a resin molded body made of a thermoplastic resin,
Loss of molded body due to chemical etching (W1mg
/ Cm2) And molding by the second chemical etching
Body loss (W2mg / cm 2) Satisfies the above equations and
A thermoplastic resin with a generally thin surface oxide layer
Of the resin molded product made of
End the processing time to improve
Function. That is, within the above formula and
If only chemical etching is performed, the denseness of the resulting metal layer
The wearing strength can be improved.
【００１２】[0012]
【実施例】以下、本発明を実施例及び比較例に基づいて
説明する。EXAMPLES The present invention will be described below based on Examples and Comparative Examples.
【００１３】（実施例１〜実施例４及び比較例１、比較
例２）エポキシ樹脂としてビスフェノールＡ型エポキシ
樹脂を用い、硬化剤としてジシアンジアミドを用いて硬
化させて得られた樹脂成型体に対して、下記の処理を施
して、粗化面に銅膜を形成すると共に、得られた銅膜の
密着強度を評価した。(Examples 1 to 4 and Comparative Examples 1 and 2) Resin molded articles obtained by curing bisphenol A type epoxy resin as an epoxy resin and dicyandiamide as a curing agent. The following treatment was performed to form a copper film on the roughened surface, and the adhesion strength of the obtained copper film was evaluated.
【００１４】（１）ケミカルエッチング：ジエチレング
リコールモノブチルエーテルを含有するシップレイ社の
膨潤剤（品番ＭＬＢ２１１）と、過マンガン酸カリウム
を含有するシップレイ社の酸化分解剤（品番ＭＬＢ２１
３）を用い、膨潤処理後に酸化分解処理を行うケミカル
エッチングを実施例では２回繰り返して行い、比較例で
は１回だけ行った。膨潤処理及び酸化分解処理の液温度
はそれぞれ８０℃とし、各処理時間は表１に示した時間
とした。このようにして得られた、表面粗化した樹脂成
型体について、ケミカルエッチングによる消失量の評価
を行い、その結果を表１に示した。なお、消失量の評価
は、ケミカルエッチング前後の樹脂成型体を１２０℃で
１２０分間乾燥した後、それぞれ重量を測定しその変化
量から算出した。(1) Chemical etching: Shipley's swelling agent (Product No. MLB211) containing diethylene glycol monobutyl ether and Shipley's oxidative decomposing agent (Product No. MLB21) containing potassium permanganate.
Using 3), chemical etching in which swelling treatment and then oxidative decomposition treatment were repeated twice in the examples, and only once in the comparative examples. The liquid temperature for the swelling treatment and the oxidative decomposition treatment was 80 ° C., and the treatment time was the time shown in Table 1. The surface-roughened resin molded body thus obtained was evaluated for the amount lost by chemical etching, and the results are shown in Table 1. The amount of disappearance was evaluated by drying the resin molded body before and after chemical etching at 120 ° C. for 120 minutes, measuring each weight, and calculating from the amount of change.
【００１５】（２）銅めっき：上記のケミカルエッチン
グを終えて表面を粗化した樹脂成型体に対し、無電解銅
めっきを施して、厚みが約０．５μｍの銅膜を形成した
後、さらに電気銅めっきを施して、トータル厚みが約２
０μｍの銅膜を形成した。この銅膜を形成した樹脂成型
体について、銅膜の密着強度（引き剥がし強さ）を、Ｊ
ＩＳ規格 Ｃ−６４８１に準じて測定し、その結果を表
１に示した。(2) Copper plating: Electroless copper plating is applied to the resin molded body whose surface has been roughened after the above chemical etching to form a copper film having a thickness of about 0.5 μm, and then further. The total thickness is about 2 after electrolytic copper plating.
A 0 μm copper film was formed. Regarding the resin molded body on which this copper film is formed, the adhesion strength (peeling strength) of the copper film is J
The measurement was performed according to IS Standard C-6481, and the results are shown in Table 1.
【００１６】表１の結果から、比較例に比べ実施例の方
が銅膜の密着強度が高いことが確認された。From the results shown in Table 1, it was confirmed that the adhesion strength of the copper film was higher in Examples than in Comparative Examples.
【００１７】[0017]
【表１】 [Table 1]
【００１８】（実施例５〜実施例８及び比較例３、比較
例４）ＡＢＳ樹脂を用いて成形した樹脂成型体に対し
て、下記の処理を施して、粗化面に銅膜を形成すると共
に、得られた銅膜の密着強度を評価した。(Examples 5 to 8 and Comparative Examples 3 and 4) The resin moldings molded from ABS resin are subjected to the following treatments to form a copper film on the roughened surface. At the same time, the adhesion strength of the obtained copper film was evaluated.
【００１９】（１）ケミカルエッチング：前記の実施例
１又は比較例１と同様の、膨潤処理後に酸化分解処理を
行うケミカルエッチングを実施例５〜８では２回繰り返
して行い、比較例３、４では１回だけ行った。なお、各
処理時間は表２に示した時間とした。このようにして得
られた、表面粗化した樹脂成型体について、ケミカルエ
ッチングによる消失量の評価を前記の実施例１又は比較
例１と同様にして行い、その結果を表２に示した。(1) Chemical etching: The same chemical etching as in Example 1 or Comparative Example 1 in which oxidative decomposition treatment is performed after swelling treatment is repeated twice in Examples 5 to 8 and Comparative Examples 3 and 4 are performed. So I went there only once. In addition, each processing time was set to the time shown in Table 2. The surface-roughened resin molded body thus obtained was evaluated for the amount lost by chemical etching in the same manner as in Example 1 or Comparative Example 1, and the results are shown in Table 2.
【００２０】（２）銅めっき：上記のケミカルエッチン
グを終えて表面を粗化した樹脂成型体に対し、実施例１
と同様に無電解銅めっき及び電気銅めっきを施して、ト
ータル厚みが約２０μｍの銅膜を形成した。この銅膜を
形成した樹脂成型体について、銅膜の密着強度（引き剥
がし強さ）を、ＪＩＳ規格 Ｃ−６４８１に準じて測定
し、その結果を表２に示した。(2) Copper plating: Example 1 was applied to the resin molding whose surface was roughened after the above chemical etching.
Electroless copper plating and electrolytic copper plating were performed in the same manner as in 1. to form a copper film having a total thickness of about 20 μm. The adhesive strength (peeling strength) of the copper film of the resin molded product having the copper film formed thereon was measured according to JIS C-6481, and the results are shown in Table 2.
【００２１】表２の結果から、比較例に比べ実施例の方
が銅膜の密着強度が高いことが確認された。From the results shown in Table 2, it was confirmed that the adhesion strength of the copper film was higher in Examples than in Comparative Examples.
【００２２】[0022]
【表２】 [Table 2]
【００２３】[0023]
【発明の効果】請求項１〜請求項３に係る発明の樹脂成
形体表面のメタライズ方法によれば、単に１回のケミカ
ルエッチングしか行わない従来法に比べて、得られる金
属層の密着強度を向上させることができる。According to the method of metallizing the surface of the resin molding of the present invention according to claims 1 to 3, the adhesion strength of the obtained metal layer can be improved as compared with the conventional method in which only one chemical etching is performed. Can be improved.
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成７年６月１４日[Submission date] June 14, 1995
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００１７[Correction target item name] 0017
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００１７】[0017]
【表１】 [Table 1]
【手続補正２】[Procedure Amendment 2]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】００２２[Name of item to be corrected] 0022
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【００２２】[0022]
【表２】 [Table 2]
フロントページの続き (72)発明者 前田 修二 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 斉藤 英一郎 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 池谷 晋一 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 藤原 弘明 大阪府門真市大字門真1048番地松下電工株 式会社内 (72)発明者 杉山 肇 大阪府門真市大字門真1048番地松下電工株 式会社内Front page continued (72) Inventor Shuji Maeda 1048 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor, Eiichiro Saito, 1048 Kadoma, Kadoma City, Osaka Matsushita Electric Works Co., Ltd. (72) Invention Person Shinichi Iketani 1048, Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Inventor Hiroaki Fujiwara 1048, Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Works Co., Ltd. (72) Hajime Sugiyama Kadoma, Osaka Prefecture 1048 Kadoma Matsushita Electric Works Co., Ltd.
Claims (3)
分解処理を行うケミカルエッチングにより粗化した後、
得られた粗化面に金属膜を形成する樹脂成形体表面のメ
タライズ方法において、ケミカルエッチングを２回繰り
返して行い、かつ、第１回目のケミカルエッチングによ
る成形体の消失量（Ｗ1 ｍｇ／ｃｍ2）及び第２回目の
ケミカルエッチングによる成形体の消失量（Ｗ2 ｍｇ／
ｃｍ2）がそれぞれ０．００５ｍｇ／ｃｍ2 以上である
ことを特徴とする樹脂成形体表面のメタライズ方法。1. A surface of a resin molding is roughened by chemical etching in which swelling treatment is followed by oxidative decomposition treatment,
In the method for metallizing the surface of a resin molded product, which forms a metal film on the obtained roughened surface, chemical etching is repeated twice, and the amount of disappearance of the molded product by the first chemical etching (W 1 mg / cm 2 ) and the amount of disappearance of the molded body due to the second chemical etching (W 2 mg /
cm 2 ) is 0.005 mg / cm 2 or more, respectively, and a method for metallizing the surface of a resin molded product.
成形体であって、第１回目のケミカルエッチングによる
成形体の消失量（Ｗ1 ｍｇ／ｃｍ2 ）と第２回目のケミ
カルエッチングによる成形体の消失量（Ｗ2 ｍｇ／ｃｍ
2 ）が下式及びを満足することを特徴とする請求項
１記載の樹脂成形体表面のメタライズ方法。 Ｗ1 ／１００≦Ｗ2 ≦Ｗ1 ／２ −−−−− ０．１≦Ｗ1 ≦２．０ −−−−− 2. The resin molded body is a resin molded body made of a thermosetting resin, the amount of the molded body disappeared by the first chemical etching (W 1 mg / cm 2 ) and the second chemical etching. Loss of molded body (W 2 mg / cm
2. The method for metallizing the surface of a resin molded article according to claim 1, wherein 2 ) satisfies the following equations. W 1/100 ≦ W 2 ≦ W 1/2 ----- 0.1 ≦ W 1 ≦ 2.0 -----
成形体であって、第１回目のケミカルエッチングによる
成形体の消失量（Ｗ1 ｍｇ／ｃｍ2 ）と第２回目のケミ
カルエッチングによる成形体の消失量（Ｗ2 ｍｇ／ｃｍ
2 ）が下式及びを満足することを特徴とする請求項
１記載の樹脂成形体表面のメタライズ方法。 Ｗ2 ／２０≦Ｗ1 ≦Ｗ2 ／２ −−−−− ０．００５≦Ｗ1 ≦０．１ −−−−− 3. The resin molded body is a resin molded body made of a thermoplastic resin, the amount of disappearance of the molded body (W 1 mg / cm 2 ) by the first chemical etching and the molding by the second chemical etching. Body loss (W 2 mg / cm
2. The method for metallizing the surface of a resin molded article according to claim 1, wherein 2 ) satisfies the following equations. W 2/20 ≦ W 1 ≦ W 2/2 ----- 0.005 ≦ W 1 ≦ 0.1 -----
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07126571A JP3100866B2 (en) | 1995-05-25 | 1995-05-25 | Metallization method for resin molded body surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP07126571A JP3100866B2 (en) | 1995-05-25 | 1995-05-25 | Metallization method for resin molded body surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08319574A true JPH08319574A (en) | 1996-12-03 |
| JP3100866B2 JP3100866B2 (en) | 2000-10-23 |
Family
ID=14938466
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP07126571A Expired - Fee Related JP3100866B2 (en) | 1995-05-25 | 1995-05-25 | Metallization method for resin molded body surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3100866B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007254878A (en) * | 2006-03-24 | 2007-10-04 | Saito Takumi | Method for manufacturing hexavalent iron ion solution, etching treatment agent for nonconductive member, and method for etching nonconductive member |
| WO2018220946A1 (en) * | 2017-06-01 | 2018-12-06 | 株式会社Ｊｃｕ | Multi-stage resin surface etching method, and plating method on resin using same |
| JP2019535907A (en) * | 2016-11-22 | 2019-12-12 | マクダーミッド エンソン ゲーエムベーハー | Chrome-free plastic plating etching |
| CN112831775A (en) * | 2021-01-22 | 2021-05-25 | 镇江阿尔法特种镀膜科技有限公司 | Surface metallization roughening process and equipment for carbon fiber reinforced epoxy resin composite material |
-
1995
- 1995-05-25 JP JP07126571A patent/JP3100866B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007254878A (en) * | 2006-03-24 | 2007-10-04 | Saito Takumi | Method for manufacturing hexavalent iron ion solution, etching treatment agent for nonconductive member, and method for etching nonconductive member |
| JP2019535907A (en) * | 2016-11-22 | 2019-12-12 | マクダーミッド エンソン ゲーエムベーハー | Chrome-free plastic plating etching |
| US11174555B2 (en) | 2016-11-22 | 2021-11-16 | Macdermid Enthone Gmbh | Chromium-free plating-on-plastic etch |
| WO2018220946A1 (en) * | 2017-06-01 | 2018-12-06 | 株式会社Ｊｃｕ | Multi-stage resin surface etching method, and plating method on resin using same |
| CN110709535A (en) * | 2017-06-01 | 2020-01-17 | 株式会社杰希优 | Multi-stage etching method for resin surface and method for plating resin using the same |
| CN112831775A (en) * | 2021-01-22 | 2021-05-25 | 镇江阿尔法特种镀膜科技有限公司 | Surface metallization roughening process and equipment for carbon fiber reinforced epoxy resin composite material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3100866B2 (en) | 2000-10-23 |
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