JPH08314119A - Method for correcting defect of photomask - Google Patents

Abstract

PURPOSE: To form a correction film which is not erroneously detected by a dust inspecting machine by forming this correction film in such a manner as to fill the groove part formed in a glass substrate in the defective part where a light shielding film lacks. CONSTITUTION: The light shielding film 3 consisting of chromium (Cr), etc., is formed on the glass substrate 4 and a photomask is formed. While the region enclosing the defective part 1 of the light shielding film lacks existing in the light shielding film 3 of this photomask is scanned with a convergent ion beam 2, the region is irradiated with this ion beam and is subjected to sputter etching. The surface part of the glass substrate 4 is dug by the sputter etching by such scanning with the convergent ion beam 2, by which the groove part 5 is formed. The depth of groove part 5 is set about the depth twice the thickness of the light shielding film 3. Next, the groove part 5 is scanned with the convergent ion beam 2 while an org. gas 6 blown to be adsorbed thereon, by which the org. gas 6 is brought into polymn. reaction and the correction film 7 consisting of a carbon film is deposited. The correction film 7 deposited up to the same height as the height of the light shielding film 3 is formed on the defective part 1 where light shielding film lacks.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for repairing a photomask defect, and more particularly to a method for repairing a photomask for an LSI using a focused ion beam.

[0002]

2. Description of the Related Art A photomask for LSI is manufactured by forming a light-shielding film pattern on a glass substrate of quartz or the like, and this light-shielding film pattern sometimes has a missing defect. In the process of repairing such a defect of the light shielding film, a repair method using a focused ion beam is mainly used.

FIG. 2 is a partial plan view of a photomask in which a light shielding film missing defect 21 exists in a light shielding film 23 formed on a glass substrate 20. A conventional method of repairing the missing defect portion 21 of the photomask will be described with reference to FIG. 3 which is a cross-sectional view taken along line XX of FIG. As shown in FIG. 3, by scanning the focused ion beam 22 while spraying and adsorbing the organic gas 26 onto the portion to be corrected, the organic gas undergoes a polymerization reaction to gradually form a correction film made of a carbon film. It is.

[0004]

When the formed carbon film obtains the same optical density as the general chromium light-shielding film 23, that is, the light-shielding property, it is about three times as large as the chromium light-shielding film. A film thickness of about 3000 angstroms) is required. Therefore, in the conventional correction method, the correction trace shape when the correction is completed is as shown in the sectional view of FIG.
7 is projected from the surface of the light shielding film pattern.

When a circuit pattern of a photomask is transferred in a semiconductor manufacturing process, a dust inspection on the surface and a cleaning if necessary are performed beforehand so that foreign matter on the mask is not transferred. . In the dust inspection, a laser dust inspection machine that scans a laser beam and detects a foreign substance with scattered light obtained from the surface is generally used. However, 0.5μ
When a foreign matter of about m is to be detected by a laser dust inspection machine, a correction mark by the carbon film 27, which has not been a problem in the past, is projected from the surface of the light shielding film 23, so that it is detected. Has occurred. In this case, it is difficult to immediately determine whether the object is a foreign substance or a correction mark. In order to make the determination immediately, it is necessary to obtain the position information and the like of the portion that has been corrected in advance, which is a disadvantage that the dust inspection work becomes complicated.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a photomask defect repairing method capable of forming a repairing film which has the same light-shielding properties as a light-shielding film and is not erroneously detected by a dust tester.

[0007]

According to the present invention, there is provided a photomask defect correcting method, comprising the steps of: forming a groove in a glass substrate located at a light-shielding film defect existing in a light-shielding film on a glass substrate; And scanning the focused ion beam while spraying an organic gas to deposit a correction film for filling the groove.

[0008]

The correction film is formed so as to fill the groove formed in the glass substrate corresponding to the defect portion of the light shielding film. Can be the same height.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In order to clarify the above and other objects, features and effects of the present invention, embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view in the order of steps for explaining one embodiment of the photomask defect correcting method of the present invention.
First, as shown in FIG. 1A, a light shielding film 3 made of chromium (Cr) or the like is formed on a glass substrate 4 to form a photomask. Sputter etching is performed by irradiating the region surrounding the defect portion 1 of the light shielding film present in the light shielding film 3 of the photomask with the focused ion beam 2 while scanning. As shown in FIG. 1B, the surface of the glass substrate 4 is dug to form a groove 5 by the sputter etching by the scanning of the focused ion beam 2. Here, in the case where the glass substrate 4 has a thickness of 2.2 to 2.3 mm and a photomask using chrome (Cr) with a thickness of 1000 Å as the light shielding film 3, the depth of the groove 5 is 2,000 angstroms, which is twice the thickness of the ion beam, and the depth of the focused ion beam 2 is reduced by controlling the current value and the number of scans. Specifically, the dug can be performed by, for example, ejecting and accelerating ions from a liquid metal ion source such as gallium (Ga) and irradiating the photomask with a current value of 200 to 300 pA for several minutes.

Next, as shown in FIG. 1 (c), the organic gas 6 is blown into and adsorbed on the groove portion 5 to scan the focused ion beam while adsorbing the organic gas 5 to cause a polymerization reaction of the organic gas 6 to form a correction film 7 made of a carbon film. Deposit. The organic gas 5 preferably contains a large amount of carbon, and as an example, it is conceivable that solid pyrene is vaporized and used at room temperature. For the focused ion beam, the same focused ion beam device as the focused ion beam 2 used for forming the groove 2 can be used, and the current value for depositing the carbon film is, for example, 100 to 150 pA. When the correction is stopped when the carbon film is deposited to the same height as the light-shielding film 3, the correction mark shape becomes as shown in FIG. The light-shielding film missing defect portion 1 having a diameter of about 2 μm is deposited to the same height as the light-shielding film 3 in a deposition time of, for example, about 3 to 5 minutes to form the correction film 3.

The thickness of the repair film 7 formed according to this embodiment, which is the sum of the depth of the dug groove 5 and the thickness of the light-shielding film 3, is 3000 Å here, and is 100 Å.
Compared with the light-shielding film 3 having a thickness of 0 Å, it has a sufficient light-shielding property. In addition, there is no projection on the light-shielding film pattern surface as compared with the light-shielding film 3. Therefore, according to the present embodiment of the present invention, the false detection rate is 0% even in the dust inspection with the sensitivity of 0.3 μm, which is conventionally 100% falsely detected in the dust inspection with the sensitivity of 0.5 μm. As a result, 64
It becomes possible to cope with the manufacture of leading-edge devices such as M and 256 MDRAM.

In the above-described embodiment, the region including the light-shielding film missing defect portion 1 is irradiated with the focused ion beam 2 while scanning it to perform sputter etching. However, a reactive gas such as chlorine is used in a vacuum. Gas assisted etching can also be used. When such gas assisted etching is used, chemical etching by a reactive gas occurs simultaneously in a portion irradiated with the focused ion beam, so that the etching rate is improved and the etching time can be reduced by about 20%. Therefore, the substrate digging process can be completed in a shorter time.

[0014]

As described above, in the photomask defect repairing method using the focused ion beam of the present invention, the glass substrate below the light-shielding film in the region including the light-shielding film lacking part is once repaired in the light-shielding film lacking defect part. After digging,
By correcting the deposition of the carbon film, a defect-corrected shape having no surface irregularities can be obtained. As a result, it is possible to eliminate erroneous detection of a defect correction mark when a foreign matter inspection of a photomask is performed by the laser dust inspection machine.

[Brief description of drawings]

1A to 1C are cross-sectional views in the order of steps for explaining an embodiment of the present invention.

FIG. 2 is a partial plan view of a photomask having a light-shielding film missing defect portion.

FIG. 3 is a sectional view taken along the line XX of FIG. 2 for explaining a conventional correction method using a focused ion beam.

FIG. 4 is a cross-sectional view showing a correction mark shape of a conventional light-shielding film missing defect portion.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Defective part of light shielding film missing 2 Focused ion beam 3 Light shielding film 4 Glass substrate 5 Groove 6 Organic gas 7 Correction film

Claims (6)

[Claims] In a method of repairing a defect in a photomask, wherein a repair film is formed by simultaneously performing adsorption of an organic gas onto a photomask and scanning of a focused ion beam, a predetermined depth of a glass substrate at a portion to be repaired of the photomask is defined. A photomask defect repairing method, wherein the repair film is formed after digging is performed. 2. The method according to claim 1, wherein the digging of the predetermined depth is performed by scanning with a focused ion beam. 3. The method according to claim 2, wherein the digging at a predetermined depth is performed by gas assisted etching using a reactive gas. 4. A step of forming a light-shielding film on a glass substrate, a step of forming a groove in the glass substrate located at a light-shielding film defect portion existing in the light-shielding film, and an organic gas being blown onto the groove. While scanning the focused ion beam to fill the groove and deposit the correction film to a height substantially the same as the surface of the light-shielding film. 5. The method according to claim 4, wherein the groove is formed by scanning a focused ion beam. 6. The groove portion is formed by gas assisted etching by scanning the focused ion beam while using a reactive gas together.
A method for forming a photomask according to claim 5.