JPH08306534A - Magnetic device for adjustment - Google Patents

Abstract

PURPOSE: To provide a magnetic device for adjustment where the variable range of inductance is wide and there is no restriction on alignment of cutting start points, etc. CONSTITUTION: Two pieces of spiral conductor patterns 13 are juxtaposed in symmetry about a point, with an insulation gap 16 between, on the surface side of an insulating substrate 9, and a magnetic substance film 14 is made to cover roughly all of these, and two pieces of spiral conductor patterns 13 made on the surface of the rear are juxtaposed likewise, and a magnetic substance film 14 is made to cover roughly all of these, and two pieces each of conductor patterns 13 are made into one coil by a through hole 15, and the adjustment of inductance is performed by cutting the magnetic substance film 14 along the cutting line set on the insulating gap 16.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adjustable adjustment magnetic circuit formed on a wiring board used in various electronic devices.

[0002]

2. Description of the Related Art An adjustable magnetic circuit formed on a conventional thick film type wiring substrate is shown in FIG.

In FIG. 5, reference numeral 9 is a wiring board, and a coil pattern 3 is formed in a spiral shape on one surface of the wiring board 9, and one end of the coil pattern 3 is provided with one through a fine adjustment short pattern 5. It is connected to terminal 2. The other end of the coil pattern 3 has a wiring board 9
It is connected to the wiring on the back surface through the through hole 13 provided above. The wirings connected to these terminals 2 are coil terminals T1 and T2, respectively. Further, a rough adjustment short pattern 4 is formed around the other end of the coil pattern 3. Reference numeral 11 is a rough adjustment short pattern 4 and 12 is a fine adjustment short pattern cutting portion, which is cut by a general method such as laser, sandblast, or cutter.

In such an adjustable magnetic circuit, a predetermined inductance value is obtained by the spiral coil pattern 3 between the coil terminals T1 and T2. As shown in FIG. 1, when the rough adjustment short pattern 4 is cut along the cutting line in the order of X1, X2, X3, ... X5, the inductance value between the coil terminals T1 and T2 increases stepwise, Further, when the fine adjustment short pattern 5 is cut along the cutting line in the order of Y1, Y2, Y3, ... Y5, the inductance value between the coil terminals T1 and T2 slightly increases stepwise. The change characteristic of the inductance value at this time is shown in FIG.

As described above, also in the above-mentioned conventional adjustable magnetic circuit, the inductance value can be changed by cutting the short pattern.

[0006]

However, in the above-mentioned conventional configuration, in the above-mentioned conventional adjustable magnetic circuit, the obtainable inductance value is small. Therefore, the number of turns of the spiral coil must be increased in order to increase the inductance value. In that case, the line width and line spacing of the coil pattern become fine, the area becomes large, the Q characteristic deteriorates, and the cost increases.

Since the inductance value is adjusted by changing the effective number of turns of the spiral coil by cutting, the usual variable range is small. Therefore, it is conceivable to increase the cutting margin, but in that case, it is necessary to perform complicated cutting, and the processing cost increases.

Since the inductance value obtained by the adjustment changes stepwise, it is not suitable for precise adjustment.

Since the short pattern provided on the coil pattern, that is, the metal portion is cut without leaving an uncut portion, stable cutting is difficult. In particular, when cutting is performed using laser light, metal may cause reflection of the laser light, which may cause cutting residue.

Since there are a plurality of cutting lines and cutting start points, the electrodes and coil patterns may be damaged during cutting. Therefore, complicated control is required for cutting, which causes an increase in processing cost. There was a problem.

The present invention solves such a conventional problem. The variable range of the inductance value is wide, the adjustment accuracy of the inductance value is high, there is no fear of damage to the electrodes and patterns at the time of cutting, and the cutting line is It is an object of the present invention to provide an excellent adjusting magnetic circuit which is located at the center and has no restriction on the positioning of the cutting start point and the like.

[0012]

In order to achieve the above object, the present invention provides two spiral conductor patterns and a magnetic film on one surface of a wiring board in sequence and on the other surface of the wiring board. Also, two spiral conductor patterns and a magnetic film were sequentially stacked to provide two spiral conductor patterns on the one surface and the other surface, respectively, on the wiring board. The coils are connected to each other through the holes to form one coil. Next, the magnetic film provided between the two spiral conductor patterns formed on one surface is cut to change the inductance, and the magnetic film is cut. The feature is that the line is set on the insulation gap. At this time, the two spiral conductor patterns formed on the one surface were a pair of conductor patterns arranged in parallel with each other with an insulating gap therebetween. The two spiral conductor patterns formed on the other surface are also juxtaposed in the same manner and are connected to each other on the surface.

In order to achieve another object, two spiral conductor patterns, an insulating film, and a magnetic film are sequentially provided on one surface of the wiring board, and the other surface is also sequentially formed. Two spiral conductor patterns,
An insulating film and a magnetic film are provided.

Further, in order to achieve another object, two spiral conductor patterns and a magnetic film are sequentially provided on one surface of the wiring board and two spirals are also provided on the other surface. The conductor pattern is shaped like a circle.

Furthermore, in order to achieve another object, two spiral conductor patterns, an insulating film, and a magnetic film are sequentially provided on one surface of the wiring board, and the other surface is also sequentially formed. In this structure, two spiral conductor patterns and an insulating film are stacked and provided.

In order to achieve other objects, in addition to the above-mentioned constitutions, a magnetic film provided on one surface and the other surface is provided around the spiral conductor pattern and at the center. The wiring boards are connected to each other through holes formed in the wiring board.

[0017]

Therefore, the present invention has the following actions due to the above-mentioned configuration. That is, two spiral-shaped conductor patterns and magnetic films are sequentially provided on one surface of the wiring board, and two spiral-shaped conductor patterns and magnetic films are sequentially stacked on the other surface. Provided,
Further, since each two spiral conductor patterns provided on one surface and the other surface are connected to each other through a hole provided in the wiring board to form one coil, a magnetic film having a high magnetic permeability. A large inductance value can be obtained by the effect of.

Further, the magnetic film is removed by cutting the magnetic film provided between the two spiral conductor patterns formed on one surface, that is, on the insulating gap. As a result, the magnetic path resistance of the magnetic flux passing through the magnetic film can be changed and the inductance value can be changed.

Further, the two spiral conductor patterns formed on one surface are a pair of conductor patterns arranged side by side with an insulating gap therebetween. Furthermore, since the two spiral conductor patterns formed on the other surface are also juxtaposed in the same manner and are connected to each other on that surface,
The cutting line can be a simple single cut line.

Further, two spiral conductor patterns, an insulating film, and a magnetic film are sequentially provided on one surface of the wiring board, and two spiral conductor patterns are sequentially stacked on the other surface. Since the pattern, the insulating film, and the magnetic film are provided, it is possible to use a magnetic film having a low electric insulation property.

Furthermore, two spiral conductor patterns and a magnetic film are provided in sequence on one surface of the wiring board, and two spiral conductor patterns are also provided on the other surface. Therefore, the configuration can be simplified and the cost can be further reduced.

Further, two spiral conductor patterns, an insulating film, and a magnetic film are sequentially provided on one surface of the wiring board, and two spiral conductor patterns are sequentially stacked on the other surface. Since the pattern and the insulating film are provided, the structure can be simplified while using the magnetic film having a low electric insulation property, and the reliability can be improved at low cost.

In addition to the above-mentioned constitutions, the magnetic film provided on one surface and the other surface is provided around the spiral conductor pattern and through the holes of the wiring board formed at the center. Since they are connected to each other, the magnetic flux passing through the magnetic body is concentrated, and the inductance value and the Q characteristic are improved.

[0024]

FIG. 1 shows an embodiment of the present invention.
In this figure, FIG. 1A is a front view in front view, FIG. 1B is a sectional view taken along the line AA ′, and FIG. 1C is a rear view in front view. In FIG. 1, reference numeral 9 is a wiring board, and two spiral conductor patterns 13 are juxtaposed on the surface of the wiring board 9 with an insulating gap 16 interposed therebetween. A magnetic film 14 is formed on the pair of spiral conductor patterns 13 so as to cover almost all of them. Further, the pair of conductor patterns 13 are connected to the respective external extraction electrode terminals 2. Also,
Similarly, the two spiral conductor patterns 13 formed on the surface on the back surface side are also juxtaposed and connected to each other on the surface so that the magnetic film 14 covers almost all of them.
Is formed. Furthermore, a pair of conductor patterns 1 on the back surface
3 is also connected to each external extraction electrode terminal 2. Further, the two spiral conductor patterns 13 provided on the front surface and the back surface are connected to each other through the through holes 15 provided in the wiring board 9 to form one coil. The wirings connected to these terminals 2 are coil terminals T1 and T2.

In this adjusting magnetic circuit, the cutting line is set above the insulating gap 16. Further, reference numeral 17 is a cut portion of the magnetic film 14 cut along a cutting line set on the insulating gap 16, and is cut by a general method such as laser, sandblast, or cutter.

FIG. 2 is a sectional view taken along the line AA 'of FIG.
2A shows a state before the magnetic film 14 is cut, and FIG.
(B) shows a state after cutting. When an alternating current is applied to such an adjusting magnetic circuit, the spiral conductor pattern 1
3, an inductance is generated between the coil terminals T1 and T2. The magnetic flux 18 generated at this time intensively passes through the magnetic film 14 having a higher magnetic permeability, as shown in FIG. Next, when the magnetic film 14 is cut, the magnetic film 14 having a high magnetic permeability is lost at the cutting portion 17, the magnetic path resistance is increased, and the passage of magnetic flux is blocked. As a result, the inductance value gradually decreases as the magnetic film 14 is cut. The change characteristics are shown in FIG. As can be seen from FIG. 3, the inductance value gradually decreases, so that high adjustment accuracy can be obtained.
Further, the width of change in the inductance value can be expanded by widening the groove width of the cut portion 17.

Further, FIG. 4 shows another embodiment of the present invention. That is, in addition to the components of the above-described embodiments of the present invention, the magnetic film 14 provided on the front surface and the back surface is provided around the spiral conductor pattern 13.
And the holes 19 of the insulating substrate 1 opened in the center are connected to each other (the back side is not shown). In this case, the spiral conductor pattern 13
The magnetic flux 18 passing around and in the center of is concentrated, and the inductance value and the Q characteristic are improved.

The present invention is a thick film system, a thin film system, a laminated system,
Alternatively, the same effect can be obtained even if it is configured by a polymer method using a resin substrate.

Furthermore, although the conductor pattern 13 and the magnetic film 14 are formed on both surfaces of the wiring board 9 in the above embodiment, an insulating film is formed between the conductor pattern and the magnetic film.
The same effect can be obtained by omitting the magnetic film on the back surface.

Further, the remaining terminals other than the coil terminals T1 and T2 can be used as intermediate taps of the coil.

[0031]

As is apparent from the above embodiment, the present invention provides two spiral conductor patterns and a magnetic film on both surfaces of a wiring board in order, and further, on one surface and the other surface. Each of the two spiral conductor patterns provided in the above is connected to each other through a through hole provided in the insulating substrate to form one coil, and between the two spiral conductor patterns formed on one surface. The inductance is changed by cutting the magnetic film provided, and the cutting line of the magnetic film is set on the insulating gap. The two spiral conductor patterns formed on one surface are a pair of conductor patterns arranged side by side with an insulating gap therebetween. Then, the two spiral conductor patterns formed on the other surface are also juxtaposed in the same manner,
They are connected to each other on the surface and have the following effects.

Since the magnetic flux is concentrated due to the effect of the magnetic film having a high magnetic permeability, the obtained inductance value is large.

Since the inductance value is adjusted by removing the magnetic film having a high magnetic permeability, the variable range of the inductance value is wide.

Since the inductance value can be changed by a simple single cut, it is not necessary to perform complicated cutting.

Since the inductance value obtained by the adjustment continuously changes, precise adjustment is possible.

Since the magnetic film is cut, stable cutting can be performed. Since the cutting line is in the center and there is no conductor pattern or electrode near the cutting start point, there is no restriction on the positioning of the cutting start point.

Further, by sandwiching the insulating film between the conductor pattern and the magnetic film, a magnetic film having a low insulating property can be used, and thus a larger inductance value can be obtained.

Furthermore, by omitting the magnetic film on the back surface, the structure can be simplified and the cost can be further reduced.

Further, two spiral conductor patterns, an insulating film, and a magnetic film are sequentially provided on one surface of the wiring board, and two spiral conductor patterns are sequentially stacked on the other surface. By providing the pattern and the insulating film, the structure can be simplified while using the magnetic film having a low electric insulation property, and the reliability can be improved at low cost.

In addition to each of the above-mentioned constitutions, a magnetic film provided on one surface and the other surface is provided around the spiral conductor pattern and through a hole of an insulating substrate formed in the center. By connecting to each other, the magnetic flux passing through the magnetic body is concentrated, and the inductance value and the Q characteristic are improved.

[Brief description of drawings]

FIG. 1 is a top view, a side view, and a bottom view of an adjusting magnetic circuit according to an embodiment of the present invention.

FIG. 2 is a side sectional view of an adjusting magnetic circuit in the same embodiment.

FIG. 3 is a characteristic diagram of the inductance value of the adjusting magnetic circuit in the example.

FIG. 4 is a top view and a side view of an adjusting magnetic circuit according to another embodiment of the present invention.

FIG. 5 is a top view of a conventional adjusting magnetic circuit.

FIG. 6 is a characteristic diagram of an inductance value of a conventional adjusting magnetic circuit.

[Explanation of symbols]

 2 terminals 9 wiring board 13 spiral conductor pattern 14 magnetic film 15 through hole 16 insulation gap 17 cut portion 18 magnetic flux

Claims (8)

[Claims] 1. A wiring board having two spiral conductor patterns and a magnetic film, which are sequentially stacked on one surface of the wiring board, and which are sequentially stacked on the other surface of the wiring board.
Each having two spiral conductor patterns and a magnetic film, and connecting each two spiral conductor patterns on one surface and the other surface to each other through holes provided in the wiring board. An adjusting magnetic circuit, which comprises one coil and changes the inductance by cutting a magnetic film provided between two spiral conductor patterns formed on one surface, The two spiral-shaped conductor patterns formed on the surface of the above are a pair of conductor patterns juxtaposed with each other with a wiring gap interposed therebetween, and the two spiral-shaped conductor patterns formed on the other surface are also the same. And a cut line of the magnetic film is set on the insulating gap so as to be connected to each other on the surface. 2. Two spiral conductor patterns, an insulating film, which are sequentially provided on one surface of a wiring board.
2. The adjusted magnetic circuit according to claim 1, further comprising a magnetic film, and two spiral conductor patterns, an insulating film, and a magnetic film, which are sequentially stacked on the other surface. 3. A wiring board having two spiral conductor patterns and a magnetic film, which are sequentially stacked on one surface of the wiring board, and two spiral conductor patterns on the other surface. The adjusted magnetic circuit according to claim 1. 4. Two spiral conductor patterns, an insulating film, which are sequentially provided on one surface of a wiring board.
2. The adjusted magnetic circuit according to claim 1, further comprising a magnetic film, and two spiral conductor patterns and an insulating film which are sequentially stacked on the other surface. 5. A wiring board having two spiral conductor patterns and a magnetic film, which are sequentially stacked on one surface of the wiring board, and which are sequentially stacked on the other surface of the wiring board.
Each having two spiral conductor patterns and a magnetic film, and connecting each two spiral conductor patterns on one surface and the other surface to each other through holes provided in the wiring board. One coil is formed, and the magnetic films provided on one surface and the other surface are connected to each other around the spiral conductor pattern and through the hole of the wiring board provided at the center. A regulating magnetic circuit for changing the inductance by cutting a magnetic film provided between two spiral conductor patterns formed on one surface, the adjustment magnetic circuit being formed on the one surface The two spiral conductor patterns are a pair of conductor patterns arranged side by side with an insulating gap interposed therebetween, and the two spiral conductor patterns formed on the other surface. Similarly juxtaposed, connected to each other on the surface, adjusting the magnetic circuit of the cutting line of said magnetic film is characterized in that set on the insulating gap. 6. Two spiral conductor patterns, an insulating film, which are sequentially stacked on one surface of a wiring board.
6. The adjusted magnetic circuit according to claim 5, further comprising a magnetic film, and two spiral conductor patterns, an insulating film, and a magnetic film, which are sequentially stacked on the other surface. 7. A wiring board having two spiral conductor patterns and a magnetic film, which are sequentially stacked on one surface of the wiring board, and two spiral conductor patterns on the other surface. 6. The adjusted magnetic circuit according to claim 5. 8. A two spiral conductor pattern, an insulating film, which are sequentially provided on one surface of a wiring board.
6. The adjusting magnetic circuit according to claim 5, further comprising two spiral conductor patterns and an insulating film which are provided on the other surface of the magnetic material film and are sequentially stacked.