JPH08306462A - Lapping connecting method of conductor and lapping tool - Google Patents

Abstract

PURPOSE: To simultaneously perform connection and fixation by making the fixing while performing lapping at electric connection work time of a conductor fine wire after an adhesive is mixed in a covering liquid in lapping to form a covering body by sticking the covering liquid to the conductor fine wire. CONSTITUTION: An adhesion is mixed in a covering liquid 3, and it is fixed while performing lapping at connection work time of a fine wire 1. This s composed of a lead guide 11 to penetratingly pass the fine wire 1 as its tool, an insulating covering liquid delivery cylinder part 12 whose one end is opened and other end is closed as covering liquid delivery ports 12b and 13b and in which covering liquid injection ports 12a and 13a arranged in its vicinity so as to inject an insulating covering liquid 2 and a conductor covering liquid 3 into a cylinder and a conductor covering liquid delivery cylinder part 13.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor lapping connection method and a lapping tool, and more particularly to a method for simultaneously performing lapping and fixing of a conductor thin wire during wiring work of the conductor thin wire, and a method necessary for realizing the method. Related to wrapping tools.

[0002]

2. Description of the Related Art Conventionally, wiring of electronic parts including a chip or the like is performed even if a thin conductor is used. Cut together, peel off the coating on both ends,
After the bare portion of the conductive wire is welded or soldered to a predetermined place, it is fixed using an adhesive sheet or other methods.

[0003]

In recent years, the mounting density of electronic circuits has been required to be high, and accordingly, it has become necessary to arrange and wire very fine conductive wires at high density. However, the conventional method has a drawback that it is not easy to remove the coating of the ultrafine conductor without damaging the conductor. In addition, the ultrafine conductor is cut into required lengths that are different each time, the coatings at both ends are peeled off, placed at predetermined positions, and after electrical processing at both ends is performed, an adhesive sheet is used at that location. Small and cumbersome measures were required to fix them.

On the other hand, in order to miniaturize electronic equipment, a cubic-shaped block as shown in FIG. 5 can be considered as a chip mounting block. To cool the core of this block (or maintain an appropriate temperature). Pipe 21 for injecting a medium such as water, oil, or air for cooling (keeping heat) into the hollow portion of the core temperature control unit, and discharge pipe 2 for discharging the medium
Wiring can be performed while using a part of 2 as a work grip and rotating this block while supporting this part, but it is extremely inefficient and almost impossible to perform this wiring by the conventional method. . Further, there is a problem that even if wiring can be performed, a finish having low reliability is obtained.

An object of the present invention is to eliminate the above drawbacks and to provide a method and a tool for wrapping a conductor fine wire in which extremely fine conductor wires are arranged at a high density to enable efficient and reliable wiring. To provide.

[0006]

In order to achieve the above object, a conductor lapping connection method according to the present invention comprises applying a coating liquid 2 or 3 to a portion of a conductor fine wire 1 to be coated and solidifying the coating liquid. In the wrapping for forming the coated bodies 2f and 3f, an adhesive is mixed into one of the coating liquids 2 and 3;
A method of fixing the covering body by a bonding effect of the adhesive agent at a place to be arranged while performing wrapping at the time of electrically connecting the fine conductor wires 1 is provided.

Further, a coating is formed in a multi-layered form, an adhesive is mixed in at least the coating liquid 3 of the outermost layer, and the coating of the layer in contact with the conductor thin wire 1 is made into an insulating coating 2f. In this method, at least one of the layers that is not in contact with is formed of the conductive covering body 3f.

In order to achieve the above-mentioned object, the conductor wrapping tool of the present invention comprises applying a coating liquid 2, 3 to a portion of the conductor fine wire 1 to be coated, and solidifying the coating liquid 2, 3. In a wrapping tool for forming the coverings 2f and 3f, a pipe-shaped lead guide 11 for penetrating the conductor fine wire 1 and one end are opened as coating liquid discharge ports 12b and 13b, and the other end is closed and the other end is closed. Coating liquid inlet 12
a and 13a are provided, and the cylindrical coating liquid ejecting cylinders 12 and 13 penetrate the lead guide 11 along the axis.

Further, a plurality of coating liquid discharge cylinders are provided, and a coating liquid discharge cylinder 1 for discharging an insulating coating liquid 2 is provided.
A coating liquid discharge tube portion 13 for discharging the conductive coating liquid 3 is arranged outside the layer 2 to form a multilayer structure.

Alternatively, in order to achieve the above object, the conductor wrapping tool of the present invention is a wrapping for depositing a coating liquid on a portion of a conductor to be coated and solidifying the coating liquid to form a coating. In the tool, one end of the space sandwiched between two coaxial double cylinders is opened to form the coating liquid discharge ports 71, 72, 73, 74 and the other end is closed, and the coating liquid is injected into the cylinder near the other end. Has a plurality of coating liquid injecting cylinders for supplying the coating liquid, and the coating liquid ejecting cylinder is axially penetrated through the conductor or the conductor and another coating liquid ejecting cylinder. Are arranged inside and outside in a multi-layered manner, and each of the coating liquid discharge cylinders has a plurality of cylinder end divisions 75 from the central portion of the cylinder toward the discharge port side so that the coating liquid discharge ports are divided into a plurality of parts. The cylinder ends of the pair of coating liquid discharge cylinders that are provided inside and adjacent to each other A structure in which the split part is arranged so as not to overlap each other.

[0011]

Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a perspective view showing a lapping tool according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the embodiment of FIG. 1 cut to the left and right along a plane including a center line. FIG.
FIG. 4 is a perspective view showing a wrapping tool according to another embodiment of the present invention. FIG. 4 is a cross-sectional view of the embodiment of FIG. 3 taken along the plane including the center line. The embodiment shown in FIGS. 1 and 2 is a tool for lapping an insulating coating on an ultrafine bare conductor thin wire (hereinafter referred to as a thin wire).
The embodiment shown in FIG. 1 is a tool for simultaneously performing the same insulating coating and conductor coating for the outer shield.

1 to 4, 1 is a thin line, and 2 is
Insulating coating liquid 3 which serves as an insulating coating covering the outside of the thin wire 1,
This is a conductor coating liquid that becomes a conductor coating that covers the outside of the insulating coating 2. Reference numeral 11 denotes a lead guide for guiding the thin wire 1 to penetrate the center along the axis of the tool. Reference numeral 12 denotes a coating liquid discharge cylinder for creating a space for filling the insulating coating liquid 2 between the lead guide 11 penetrating the center along the axis and the inner surface of the cylinder forming the outer wall. . Reference numeral 12a denotes an insulating coating liquid injection port for injecting the insulating coating liquid 2 into the insulating coating liquid discharge cylinder 12, and reference numeral 12b denotes an insulating coating liquid discharge port for discharging the insulating coating liquid 2. Reference numeral 13 denotes a coating liquid discharge cylinder for forming a space for filling the conductor coating liquid 3 between the coating liquid discharge cylinder portion 12 penetrating the center along the axis and the inner side surface of the cylinder forming the outer wall. It is a department. 13a is a conductor coating liquid inlet for injecting the conductor coating liquid 3 into the conductor coating liquid discharge cylinder 13, and 13b is an insulating coating liquid discharge port for discharging the conductor coating liquid 3.

When wiring a thin wire using the embodiment of FIG. 1 (FIG. 2), the thin wire 1 is first pulled out a little from the tip of the lead guide 11. (Since the thin wire 1 is slightly pulled out from the second wiring at the end of the previous wiring, it is not necessary to pull it out again.) At this time, the insulating coating liquid 2 is
Although the space inside the insulating coating liquid discharge cylinder 12 is filled, the insulating coating liquid is not discharged from the insulating coating liquid discharge port 12b. Next, the bare portion of the drawn thin wire 1 is electrically connected to the metal terminal 40 or 41 to be connected by welding or soldering. Subsequently, while pulling out the thin wire 1, the pressure of a coating liquid injection pressure source (not shown) is increased to discharge the insulating coating liquid 2 from the insulating coating liquid discharge port 12b. By this discharge, the insulating coating liquid 2 is applied to the surface of the thin wire 1 to form a coating film.

If the coating liquid injection pressure source (not shown) is stopped or depressurized when the wire 1 is pulled out while covering the thin wire 1 of a predetermined length, the discharge of the insulating coating liquid 2 is stopped, and the thin wire 1 is moved from that position. It is no longer covered and becomes a bare wire. Further, the thin wire 1 is pulled out and cut, leaving a bare wire portion at the end of the wiring, and the bare wire portion is electrically connected to a predetermined connection point. Although this cut portion is not particularly shown, since it is appropriately separated from the insulating coating liquid discharge port 12b,
From the second wiring, the thin wire 1 is already at the end of the previous wiring.
Is slightly pulled out, so that a bare wire portion necessary for connection is secured.

It is also possible to connect the bare part to a predetermined location without cutting at the end of the previous wiring, and proceed to the next wrapping wiring as it is. Further, the insulating coating liquid applied to the fine wire 1 starts to solidify immediately after being discharged, but since the coating liquid contains an adhesive, it is directly adhered and fixed at a position arranged for wiring. As described above, the wrapping connection method of the conductor thin wire of the present invention performs connection while wrapping the bare thin wire, and simultaneously performs the fixation, but as in the technology found in the conventional microwire wiring board, the existing coated wire is used. Since a wire is not used, it is possible to prevent a substance (such as a coating material) other than a weld metal from being mixed into a welded portion at the time of welding by a laser or the like, and to prevent deterioration in welding strength and the like.

In the lapping connection method of the conductor thin wires according to the present embodiment, it is possible to make the thickness of the coating extremely thin. However, if a problem such as crosstalk occurs in the electrical characteristics, FIG. The use of the embodiment of 4) is appropriate.
When the thin wire is wired using the embodiment of FIG. 3 (FIG. 4), the thin wire 1 is pulled out from the lead guide 11 as in the case of the embodiment of FIG. 1 (FIG. 2). (From the second wiring, it is drawn out at the end of the previous wiring.) At this time, the insulating coating liquid 2 and the conductor coating liquid 3 are inside the insulating coating liquid discharge cylinder 12 and the conductor coating liquid discharge cylinder 13. Although it is filled in the space, the insulating coating liquid discharge port 12b and the conductor coating liquid discharge port 13b are not discharged.

Next, the bare portion of the drawn thin wire 1 is electrically connected to the metal terminal 40 or 41 to be connected by welding or soldering. Then thin line 1
While pulling out, the pressure of the coating liquid injection pressure source (not shown) is increased to discharge the insulating coating liquid 2 and the conductor coating liquid 3 from the respective discharge ports 12b and 13b. However, the discharge from 13b is delayed from that of 12b so that the conductor coating liquid 3 does not directly contact the thin wire 1. Therefore, the conductor coating liquid 3 always forms a coating film only on the outside of the insulating coating liquid 2.

When the thin wire 1 having a predetermined length is drawn out while being coated, the pressurization of the coating liquid injection pressure source (not shown) is stopped or the pressure is reduced, the discharge of the insulating coating liquid 2 and the conductor coating liquid 3 is stopped, and the thin wire is stopped. 1 is no longer covered from that position,
It becomes a bare wire state. In this case, the conductor coating liquid 3 is prevented from directly touching the thin wire 1 by stopping the pressurization or depressurization of the injection pressure source for the conductor coating liquid 3 with respect to the insulating coating liquid 2. After that, when the embodiment shown in FIG. 1 (FIG. 2) is used, the bare wire portion at the end of the same wiring is cut, electrical connection, etc. are performed, and the bare wire portion necessary for the first connection of the next wiring is secured. To be done. Further, the insulating coating liquid 2 and the conductor coating liquid 3 start to solidify immediately after being discharged, but since the conductor coating liquid 3 contains an adhesive, it is directly adhered and fixed at a position arranged for wiring.

FIG. 5 is a perspective view showing an example of a chip mounting block to be used in the embodiment of FIG. 1 (FIG. 2) and FIG. 3 (FIG. 4). In FIG. 5, 15 is a connector for external connection corresponding to the connection fitting 50, 16 is a cord connected to the connector, 17, 17,..., 17 are wrap wires for electrically connecting the connection fittings (in this embodiment, Wrapped and wired). Reference numeral 40 is a connection fitting for supporting electronic components such as resistors and capacitors externally attached to the circuit of a chip (not shown) (mounted on the chip mounting portions 33, 34, 35, 36) for electrical connection.

The wiring of the wrap wire 17 is supported by working grips 21 and 22 which also serve as pipes of a core cooling unit (not shown) incorporated in the chip mounting portion main body 30 and are rotated while rotating the entire chip mounting portion main body 30. I do. The electrical connection between the chip and the thin wire 1 is not made directly, but is made via the chip connection fittings 33a, 34a, 35a, 36a, etc., so that thermal stress on the chip itself is minimized. Only the heat generated at the time of bonding for connection between the chip and the metal fitting for chip connection is generated. The supply pipe 21 and the discharge pipe 22 are attached so as to penetrate the chip mounting portion main body 30 in a skewered shape along one of the diagonal lines of the hexahedron in the shape of the core cooling portion.

FIG. 6 is an enlarged perspective view showing an example of connection and arrangement of thin wires to be wired. FIG. 7 is a plan view showing an example of a situation of connection and arrangement of still another thin wire. FIG.
FIG. 8 is a sectional view taken along line XX of FIG. 7. As shown in FIGS. 7 and 8, by adhering to a wiring to be adjacent to the wiring at the time of wiring, it is possible to integrate lead wires at the time of three-dimensional wiring. Further, by electrically connecting the conductor coating to the shield ground, it is possible to prevent crosstalk with an adjacent wiring and an electrical influence on a chip or the like.

As described above, this embodiment does not require an adhesive sheet or the like by the multi-wire method, facilitates three-dimensional wiring, and furthermore, shields and adheres each of the shields and bundles even in a bundle. Can be performed simultaneously with three-dimensional wiring. The required amount of the wiring that requires an insulating distance from the adjacent wiring can be ensured by increasing the amount of the insulating coating liquid 2 discharged per unit time and thickening the coating. In addition, when wire wiring is performed on the printed circuit board, through-hole processing is always performed to connect the wiring between the upper and lower sides of the board, and T branching of the wiring occurs. Since metal fittings are used, there is no problem of missing through holes, and all signal wiring can be made with one stroke. Therefore, for example, a highly reliable wiring having a shielding effect can be provided for a clock signal line and the like.

Further, as an application example of this embodiment, there is a cable made by bundling conductive wires, and there is a connection portion between individual conductive wires in the middle, and an object having a change in the outer diameter of the entire cable.
An embodiment of a wrapping tool capable of continuous coating will be described. FIG. 9 is an explanatory view in which a part of the cable of the object to be used in such an embodiment is broken and shown. In FIG.
61 is a conductor cable, 61, 61 ... 61 are conductor cables, 62, 62 ... 62 are conductor cable connection points, 63 is quasi-corrosion resistant, quasi-strength primary coating, 64 is corrosion resistant,
It is a secondary coating with high strength. The primary coating 63 swells in the vicinity of the location where the connection points 62 of the conductor cable are concentrated, and therefore the secondary coating 64 also swells, and the outer diameter of the entire cable in this vicinity becomes larger than that before and after that.

FIG. 10 shows a coating liquid discharge cylinder in which a discharge port having a ring-shaped cross section is divided into a plurality of portions so as to be suitable for coating a cable as shown in FIG. Each of the coating liquid discharge cylinders is provided with a plurality of cylinder end divisions from the center of the cylinder toward the discharge port side so that the coating liquid discharge port is divided into a plurality of parts (75, 75 in the illustration). But it is also provided in each of the other coating liquid discharge cylinders). The pair of coating liquid discharging cylinders adjacent to each other inside and outside are arranged so that the cylinder end divided portions do not overlap each other.

In the embodiment shown in FIG. 10, the coating liquid discharge ports 71,
There are three 72, 73, and 74, respectively, each of which opens one end of the space sandwiched by two coaxial double cylinders and further divides the ring-shaped open end into a plurality of coating liquids. The other end (not shown) is closed in a common ring shape, and a coating liquid injection port (not shown) for injecting the coating liquid into the cylinder is provided near the other end.

The coating liquid discharge cylinder thus formed is passed through the bundle of conductor cables or another coating liquid discharge cylinder disposed outside the bundle of conductor cables in the axial direction so that the coating liquid discharge cylinder extends inward and outward. They are arranged in multiple layers. Then, the division of the similar coating liquid discharge cylinder adjacently arranged inside and outside is performed as shown in FIG.
In this embodiment, the number of divisions is three, but it may be divided into a larger number, or a tube pipe may be arranged in a broom shape along the circumference to serve as a coating liquid discharge port. In any case, with the structure in which the position of the discharge port is expanded in the radial direction, the coating of the entire cable can be made to follow the required change in the thickness of the outer diameter.

[0027]

As described in detail above, the conductor lapping connection method of the present invention relates to a lapping method in which a coating liquid is applied to a portion of a conductor fine wire to be coated, and the coating liquid is solidified to form a coating. By mixing the adhesive into the coating liquid and fixing the coating immediately after solidification at the place where it should be arranged while performing lapping at the time of electrical connection work of the conductor thin wires, the effect that connection and fixing of the conductor thin wires can be performed simultaneously There is. Further, by arranging a plurality of the covering bodies and arranging the insulating covering body on the inner side and the conductive covering body on the outer side in a multi-layered manner, it is possible to easily shield each thin conductor wire.

Further, the wrapping tool of the present invention has a pipe-shaped lead guide for penetrating a conductor fine wire, and a coating for opening the coating liquid discharge port at one end and closing the other end to inject the coating liquid into the cylinder. By providing a coating liquid discharging cylinder having a cylindrical shape provided with a liquid inlet near the other end and penetrating the lead guide in the axial direction, or further comprising a plurality of coating liquid discharging cylinders, the insulating coating liquid By arranging the coating liquid discharging cylinder for discharging the conductive coating liquid outside the coating liquid discharging cylinder for discharging the liquid, the wiring is easily realized by the lapping connection method of the conductor. can do.

Further, as a wrapping tool of the present invention, one end of a space sandwiched between two coaxial double cylinders is opened to form a coating liquid discharge port, and the other end is closed. It has a plurality of coating liquid discharge cylinders provided with a coating liquid injection port for injecting the coating liquid discharged from the outlet into the cylinder, and the coating liquid discharge cylinder has the conductor or the conductor in the axial direction. The other coating liquid discharge cylinders are penetrated and arranged in a multilayered shape inside and outside, and each coating liquid discharge cylinder is positioned from the center of the cylinder to the discharge port side so that the coating liquid discharge port is divided into a plurality. A plurality of tube end divided portions are provided toward the inside, and the tube end divided portions of a pair of the coating liquid discharge tube portions adjacent inside and outside are arranged so as not to overlap with each other, thereby coping with a change in cable thickness. To facilitate wiring by the lapping connection method of the conductor. It can be current.

[Brief description of drawings]

FIG. 1 is a perspective view showing a wrapping tool according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing the embodiment of FIG. 1 cut along a plane including an axis.

FIG. 3 is a perspective view showing a wrapping tool according to another embodiment of the present invention.

FIG. 4 is an explanatory view of the embodiment of FIG. 3 cut along a plane including an axis.

FIG. 5 is a perspective view showing an example of a chip mounting block to be used in the embodiment of FIGS. 1 and 3;

FIG. 6 is a perspective view showing an example of arrangement and wiring of thin wires.

FIG. 7 is a plan view showing an example of a thin wire arrangement and wiring situation.

FIG. 8 is a sectional view taken along line AA of FIG.

FIG. 9 is an explanatory diagram showing a covering state of a cable having a connection portion on a conductor.

FIG. 10 is a perspective view showing a wrapping tool according to an embodiment of the present invention which can correspond to the use example of FIG. 9;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Thin wire 2 Insulating coating liquid 2f Insulating coating 3 Conductor coating liquid 3f Conductor coating 11 Lead guide 12 Insulating coating liquid discharge cylinder 12a Insulating coating liquid injection port 12b Insulating coating liquid discharge port 13 Conductor coating liquid discharge cylinder 13a Conductor coating Liquid injection port 13b Conductor coating liquid discharge port 17 Wrap wire 21,22 Work gripping hand 30 Chip mounting section main body 33,34,35,36 Chip mounting section 33a, 34a, 35a, 36a Chip mounting fittings 40,50 Connection fittings

Claims (5)

[Claims] 1. A wrapping method for applying a coating liquid to a portion of a conductive thin wire to be coated and solidifying the coating liquid to form a coated body, wherein an adhesive is mixed into the coating liquid, A lapping connection method for a conductor thin wire, wherein the covering is fixed to a place to be disposed while performing lapping during connection work by an adhesive effect of the adhesive. 2. A coating which is formed in a multi-layered form, an adhesive is mixed in at least the outermost coating agent, and a coating which is in contact with the conductor fine wire is made into an insulating coating, and a layer which does not contact the conductor fine wire. 2. The method according to claim 1, wherein at least one of the conductive wires is formed of a conductive coating. 3. A lapping tool for adhering a coating liquid to a portion of a conductor thin wire to be coated and solidifying the coating liquid to form a coating, comprising: a pipe-shaped lead guide for penetrating the conductor thin wire; A cylindrical coating liquid having one end opened and the other end closed as a coating liquid discharge port, and a coating liquid injection port for injecting the coating liquid into the cylinder is provided in the vicinity of the other end to penetrate the lead guide along the axis. A wrapping tool comprising a discharge cylinder. 4. A coating liquid discharging cylinder for discharging a conductive coating liquid is provided outside a coating liquid discharging cylinder for discharging an insulating coating liquid, wherein a plurality of coating liquid discharging cylinders are disposed. 4. The wrapping tool according to claim 3, wherein the wrapping tool has a multilayer structure. 5. A lapping tool for adhering a coating liquid to a portion of a conductor to be coated and solidifying the coating liquid to form a coating, wherein one end of a space sandwiched between two coaxial double cylinders. A plurality of coating liquid discharge cylinders provided with a coating liquid discharge port for opening the coating liquid discharge port to close the other end and injecting the coating liquid into the cylinder near the other end, The liquid discharge cylinders are axially penetrated through the conductor or the conductor and other coating liquid discharge cylinders to be arranged in a multilayer structure inside and outside, and each coating liquid discharge cylinder has a plurality of coating liquid discharge ports. A plurality of tube end divided portions are provided from the central portion of the tube portion toward the discharge port side so as to be divided into individual pieces, and the tube end divided portions of the pair of coating liquid ejecting tube portions adjacent to each other inside and outside do not overlap each other. Lapping tool characterized by being arranged as follows.