JPH08304269A - Jig for measuring strength of adhesive used for semiconductor chip and method for forecasting rupture of the adhesive - Google Patents
Jig for measuring strength of adhesive used for semiconductor chip and method for forecasting rupture of the adhesiveInfo
- Publication number
- JPH08304269A JPH08304269A JP10627695A JP10627695A JPH08304269A JP H08304269 A JPH08304269 A JP H08304269A JP 10627695 A JP10627695 A JP 10627695A JP 10627695 A JP10627695 A JP 10627695A JP H08304269 A JPH08304269 A JP H08304269A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- semiconductor chip
- load
- jig
- mounting substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体チップと実装基
板とを接合する接着剤の強度を測定する治具及び有限要
素法による破断予測方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for measuring the strength of an adhesive for joining a semiconductor chip and a mounting board and a fracture prediction method by the finite element method.
【０００２】[0002]
【従来の技術】一般に材料の応力測定には、例えば特開
昭６１−２２２２１号公報に開示されているように、ス
トレインゲージを用いてひずみ量を計測するなどの方法
があった。しかしながら、このようにストレインゲージ
を貼る方法では、被計測部にストレインゲージが十分貼
れるだけの広く平らな面が必要である。2. Description of the Related Art Generally, as a method for measuring the stress of a material, there has been a method of measuring the amount of strain using a strain gauge, as disclosed in JP-A-61-22211, for example. However, in such a method of sticking a strain gauge, it is necessary to have a wide and flat surface enough to stick the strain gauge to the measured portion.
【０００３】そのため、半導体チップ接着剤の強度測定
には、従来から図７に示したように実装基板６を保持治
具７で固定し、基板６に接着剤４で接合された半導体チ
ップ５の上面に引張り治具１０を接着剤１１で接着し、
引張り治具１０を上方に引張り、接着剤４の強度を測定
するというスタッドプルテストが行われていた。Therefore, to measure the strength of the semiconductor chip adhesive, the mounting substrate 6 is fixed by a holding jig 7 as shown in FIG. 7 and the semiconductor chip 5 bonded to the substrate 6 with the adhesive 4 is conventionally used. Attach the pulling jig 10 to the upper surface with the adhesive 11,
A stud pull test has been performed in which the pulling jig 10 is pulled upward and the strength of the adhesive 4 is measured.
【０００４】このスタッドプルテストは、チップ接着剤
４が破断する時の荷重をチップ接着剤４の面積で割った
破断平均応力３を、チップ接着剤４の破断応力と見なす
ものである。また、半導体製品の設計をする場合、数値
解析から得られた製品のチップ接着剤４の応力を、カタ
ログ値やスタッドプルテストから算出した破断平均応力
３と比較して、チップ接着剤４が破断するかどうかを予
測していた。In the stud pull test, the breaking average stress 3 obtained by dividing the load when the chip adhesive 4 breaks by the area of the chip adhesive 4 is regarded as the breaking stress of the chip adhesive 4. Further, when designing a semiconductor product, the stress of the chip adhesive 4 of the product obtained from the numerical analysis is compared with the fracture stress 3 calculated from the catalog value or the stud pull test to break the chip adhesive 4. I was predicting whether or not to do it.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら従来のよ
うな方法では、半導体チップ５を引張り治具１０に接合
する接着剤１１の強度よりもチップ接着剤４の法が強か
った場合、先に接着剤１１の方が破断してしまい、チッ
プ接着剤４の破断荷重を測定することができないという
問題点があった。However, in the conventional method, when the chip adhesive 4 is stronger than the adhesive 11 for joining the semiconductor chip 5 to the pulling jig 10, the adhesive is first applied. There was a problem that 11 was broken and the breaking load of the chip adhesive 4 could not be measured.
【０００６】さらに半導体製品の設計をする場合、数値
解析から得られる製品のチップ接着剤４の応力には通
常、応力分布があり、最大応力とカタログ値又はスタッ
ドプルテストから算出した破断平均応力３を比較して、
チップ接着剤４が破断するかどうかを予測するには、誤
差が大きすぎるという問題があった。Further, when designing a semiconductor product, the stress of the chip adhesive 4 of the product obtained from the numerical analysis usually has a stress distribution, and the maximum stress and the average stress at break 3 calculated from the catalog value or the stud pull test. Compare
There was a problem that the error was too large to predict whether or not the chip adhesive 4 was broken.
【０００７】本発明の目的は、スタッドプルテストで測
定できない高い接着力をもつ接着剤に対して、その破断
荷重を測定できる治具、及び数値解析を用いて材料固有
の破断応力を求めてチップ接着剤の破断を制度よく予測
する方法を提供することにある。An object of the present invention is to obtain an adhesive having a high adhesive force which cannot be measured by a stud pull test, a jig capable of measuring the breaking load, and a fracture stress peculiar to a material by using numerical analysis to obtain a chip. An object of the present invention is to provide a method of accurately predicting the breakage of an adhesive.
【０００８】[0008]
【課題を解決するための手段】前記目的を達成するた
め、本発明に係る半導体チップ接着剤の強度測定治具
は、保持部と、ガイド部と、荷重部とを有し、半導体チ
ップと実装基板とを接合する接着剤の接着強度を測定す
るための半導体チップ接着剤の強度測定治具であって、
保持部は、前記実装基板を測定すべき姿勢に保持するも
のであり、ガイド部は、荷重部を前記半導体チップと実
装基板との接着剤による接合部位に誘導するものであ
り、荷重部は、前記ガイド部に誘導され、外力を受けて
測定対象の接着剤をせん断変形破断させ、実装基板から
半導体チップを剥離するものである。In order to achieve the above object, a strength measuring jig for a semiconductor chip adhesive according to the present invention has a holding portion, a guide portion, and a load portion, and is mounted on a semiconductor chip and a mounting portion. A jig for measuring the strength of a semiconductor chip adhesive for measuring the adhesive strength of an adhesive for joining a substrate,
The holding unit holds the mounting substrate in a posture to be measured, the guide unit guides the load unit to a joint portion of the semiconductor chip and the mounting substrate with an adhesive, and the load unit is, The adhesive is guided by the guide portion and subjected to an external force to shear-deform and fracture the adhesive to be measured, thereby peeling the semiconductor chip from the mounting substrate.
【０００９】また前記荷重部は、前記半導体チップと実
装基板との接着剤による接合部位に食い込むものであ
る。Further, the load portion cuts into a joint portion between the semiconductor chip and the mounting substrate with an adhesive.
【００１０】また前記荷重部は、前記接合部位に食い込
む楔形形状をなすものである。The load portion has a wedge shape that bites into the joint portion.
【００１１】また前記荷重部は、楔形形状の先端部が曲
率をもつ円弧形状に形成されたものである。Further, the load portion is formed in an arc shape having a wedge-shaped tip with a curvature.
【００１２】また本発明に係る半導体チップ接着剤の破
断予測方法は、測定処理と、予測処理とを行い、半導体
チップと実装基板とを接合する接着剤の破断予測を行う
半導体チップ接着剤の破断予測方法であって、測定処理
は、半導体チップと実装基板との接着剤による接合部位
に楔形状の測定治具を食い込ませて接着剤の破断応力を
測定する処理であり、予測処理は、前記測定処理で得ら
れた破断応力値と、数値解析で得られた接着剤の最大応
力値とを比較し、接着剤が破断するか否かを予測する処
理である。The semiconductor chip adhesive breakage predicting method according to the present invention performs a measuring process and a predicting process to predict the breakage of the adhesive bond between the semiconductor chip and the mounting substrate. In the prediction method, the measurement process is a process of measuring the breaking stress of the adhesive by causing a wedge-shaped measurement jig to bite into the bonding site between the semiconductor chip and the mounting substrate with the adhesive, and the prediction process is This is a process of comparing the breaking stress value obtained by the measurement process with the maximum stress value of the adhesive obtained by the numerical analysis to predict whether or not the adhesive will break.
【００１３】[0013]
【作用】半導体チップと実装基板との接着剤による接合
部位に楔形状の測定治具を食い込ませて、接着剤の破断
応力を測定し、その測定応力値と、数値解析で得られた
最大応力値とを比較し、接着剤が破断されるか否かを予
測する。[Function] The wedge-shaped measuring jig is digged into the joint between the semiconductor chip and the mounting substrate with the adhesive to measure the breaking stress of the adhesive, and the measured stress value and the maximum stress obtained by numerical analysis. Compare with the value to predict if the adhesive will break.
【００１４】[0014]
【実施例】以下、本発明について図を参照して説明す
る。The present invention will be described below with reference to the drawings.
【００１５】図１において、本発明に係る半導体チップ
接着剤の強度測定治具は基本的構成として、保持部７
と、ガイド部８と、荷重部１とを有し、半導体チップ５
と実装基板６とを接合する接着剤４の接着強度を測定す
るようにしたものである。In FIG. 1, the strength measuring jig for a semiconductor chip adhesive according to the present invention has a basic structure as a holding portion 7.
And the guide portion 8 and the load portion 1, and the semiconductor chip 5
The adhesive strength of the adhesive 4 that joins the mounting board 6 with the mounting board 6 is measured.
【００１６】各構成の機能について説明する。保持部７
は、実装基板６を測定すべき姿勢に固定するものであ
る。具体的には図１に示すように、実装基板６を受け入
れる凹部７ａを有し、凹部７ａの口縁には、実装基板６
を凹部７ａ内に固定する固定具９が取付けられている。The function of each component will be described. Holding part 7
Is to fix the mounting substrate 6 in a posture to be measured. Specifically, as shown in FIG. 1, there is a recess 7a for receiving the mounting board 6, and the mounting board 6 is provided at the edge of the recess 7a.
A fixture 9 is attached to fix the inside of the recess 7a.
【００１７】ガイド部７は、荷重部１を半導体チップ５
と実装基板６との接着剤４による接合部位に誘導するも
のであって、具体的には図１に示すように、長方形状の
板体８ａからなり、２個の板体８ａを平行に配置して、
その先端開口が半導体チップ５と基板６との接着剤４に
よる接合部位に向けて設けてある。The guide portion 7 connects the load portion 1 to the semiconductor chip 5
1 and the mounting substrate 6 are guided to a joint portion by an adhesive 4. Specifically, as shown in FIG. 1, a rectangular plate body 8a is formed and two plate bodies 8a are arranged in parallel. do it,
The tip opening is provided toward the joint portion between the semiconductor chip 5 and the substrate 6 with the adhesive 4.
【００１８】荷重部１は、ガイド部８に誘導され、外力
を受けて測定対象の接着剤をせん断変形破断させ、実装
基板６から半導体チップ５を剥離するものであり、さら
に荷重部１は、半導体チップ５と実装基板６との接着剤
４による接合部位に食い込むものであって、具体的には
図１に示すように荷重部１は、前記接合部位に食い込む
楔形形状をなすものであり、また荷重部１は、楔形形状
の先端部１ａが曲率をもつ円弧形状に形成されている。
荷重部１の先端部１ａの曲率半径は、適度な半径、例え
ば約１０μｍ程度になっており、半導体チップ５と接触
してもチップ５が割れないようになっている。The load part 1 is guided by the guide part 8 and receives an external force to shear-deform and rupture the adhesive to be measured, thereby peeling the semiconductor chip 5 from the mounting substrate 6. The semiconductor chip 5 and the mounting substrate 6 bite into the joint portion by the adhesive 4, and specifically, as shown in FIG. 1, the load portion 1 has a wedge shape that bites into the joint portion. The load portion 1 is formed in an arc shape with a wedge-shaped tip portion 1a having a curvature.
The radius of curvature of the tip portion 1a of the load portion 1 is an appropriate radius, for example, about 10 μm, so that the chip 5 does not crack even if it contacts the semiconductor chip 5.
【００１９】またガイド部８は、荷重部１を円滑にガイ
ドしやすいようにテフロン製となっており、またガイド
部８，固定具９は、実装基板６を保持部７に脱着しやす
くするため、保持部７にネジ止めされるようになってい
る。Further, the guide portion 8 is made of Teflon so that the load portion 1 can be smoothly guided, and the guide portion 8 and the fixing member 9 make it easy to attach and detach the mounting substrate 6 to the holding portion 7. It is adapted to be screwed to the holding portion 7.
【００２０】本発明は図１に示す強度測定治具を用い
て、半導体チップ５と実装基板６とを接合する接着剤４
の破断予測を行うものである。The present invention uses the strength measuring jig shown in FIG. 1 to bond the semiconductor chip 5 and the mounting substrate 6 with the adhesive 4.
The fracture prediction is performed.
【００２１】すなわち図１に示すように強度測定治具
に、半導体チップ５が実装された実装基板６をセットす
る。That is, as shown in FIG. 1, the mounting substrate 6 on which the semiconductor chip 5 is mounted is set on the strength measuring jig.
【００２２】図２に示すように測定処理Ｓ1において、
半導体チップ５と実装基板６との接着剤４による接合部
位に楔形状の測定治具（荷重部１）を食い込ませる。荷
重部１に外力として荷重を加えて、荷重部１により接着
剤４をせん断変形させて破断させる。この場合荷重部１
は、ガイド部８でガイドされるため、半導体チップ５の
接着剤４に偏らずに当接する。In the measurement process S 1 as shown in FIG.
A wedge-shaped measuring jig (loading part 1) is made to bite into the joint portion of the semiconductor chip 5 and the mounting substrate 6 with the adhesive 4. A load is applied to the load unit 1 as an external force, and the load unit 1 shear-deforms the adhesive 4 to break it. In this case, the load part 1
Is guided by the guide portion 8 and therefore contacts the adhesive 4 of the semiconductor chip 5 without being biased.
【００２３】荷重部１で荷重を加えて接着剤４をせん断
変形させて破断させたときの接着剤に対する破断荷重１
２を測定する。Breaking load 1 on the adhesive when the adhesive 4 is sheared and broken by applying a load at the load portion 1
Measure 2.
【００２４】そして、その破断荷重１２と半導体チップ
４の形状とに基づいて有限要素法解析などの数値解析Ｃ
1により、チップ接着剤４が破断する時の荷重をチップ
接着剤４の面積で割った破断平均応力２をチップ接着剤
４の破断応力１３として測定する。Then, based on the breaking load 12 and the shape of the semiconductor chip 4, a numerical analysis C such as a finite element method analysis is performed.
According to 1 , the load when the chip adhesive 4 breaks is divided by the area of the chip adhesive 4 and the breaking average stress 2 is measured as the breaking stress 13 of the chip adhesive 4.
【００２５】一方製品設計Ｄにおいて、半導体チップに
荷重を加えて破断するか否かを検証し、半導体チップの
形状を加味して有限要素解析などの数値解析Ｃ2により
最大応力１４を予め算出しておく。On the other hand, in the product design D, it is verified whether a load is applied to the semiconductor chip to break it, and the maximum stress 14 is calculated in advance by numerical analysis C 2 such as finite element analysis in consideration of the shape of the semiconductor chip. Keep it.
【００２６】そして予測処理Ｓ2において、前記測定処
理Ｓ1で得られた破断応力値１３と、数値解析Ｃ2で得ら
れた接着剤の最大応力値１４とを比較し、接着剤４が破
断するか否かを予測する。すなわち半導体チップの有限
要素法解析などの数値解析から得られた最大応力値１４
と、接着剤４の固有の破断応力値１３とを比較して、前
者が大きければ破断する、後者が大きければ破断しない
と予測判断する。Then, in the predicting process S 2 , the breaking stress value 13 obtained in the measuring process S 1 is compared with the maximum stress value 14 of the adhesive obtained in the numerical analysis C 2 , and the adhesive 4 is broken. Predict whether to do it or not. That is, the maximum stress value 14 obtained from the numerical analysis such as the finite element method analysis of the semiconductor chip
And the fracture stress value 13 peculiar to the adhesive 4 are compared, and it is predicted that the former will be broken if it is large and the latter will not be broken if the latter is large.
【００２７】次に本発明の実施例について説明する。図
３に示すように４０ｍｍ□の実装基板６に、大きさ１５
ｍｍ□，厚さ４００μｍの半導体チップ５を、チップ接
着剤４であるＡｌ／ＰＩ（アルミ粉混入ポリイミド樹
脂）によって接合した。ガイド部８によって、くさび形
の荷重部１を半導体チップ５の側面に偏らずに当てる。
くさび形荷重部１の先端は、半導体チップ５に接触して
もチップ５が割れないように、適度の曲率（曲率半径１
０μｍ程度）がついた形状となっている。また、ガイド
部８はくさび形荷重部１が滑りやすいようにテフロン製
であり、ガイド部８，固定具９は実装基板６を装着しや
すくするために、保持部７にネジ止めするようになって
いる。この場合、図５に示したように、Ａｌ／ＰＩ接着
剤４は荷重５．４［ｋｇｆ］でせん断変形破断した。Next, examples of the present invention will be described. As shown in FIG. 3, the size 15
A semiconductor chip 5 having a size of mm □ and a thickness of 400 μm was bonded by a chip adhesive 4 of Al / PI (aluminum powder mixed polyimide resin). With the guide portion 8, the wedge-shaped load portion 1 is applied to the side surface of the semiconductor chip 5 without being biased.
The tip of the wedge-shaped load part 1 has an appropriate curvature (curvature radius 1 so that the chip 5 does not crack even if it contacts the semiconductor chip 5).
0 μm). Further, the guide portion 8 is made of Teflon so that the wedge-shaped load portion 1 is slippery, and the guide portion 8 and the fixture 9 are screwed to the holding portion 7 in order to easily mount the mounting substrate 6. ing. In this case, as shown in FIG. 5, the Al / PI adhesive 4 was sheared and fractured under a load of 5.4 [kgf].
【００２８】（実施例２）同様にチップ接着剤４がＡｕ
／Ｓｉ（金とシリコンの共晶合金）の場合、半導体チッ
プ５に接触してもチップが割れないように曲率半径５０
μｍ程度の曲率をつけた本発明のくさび形荷重部１を用
いれば、Ａｕ／Ｓｉ接着剤４の破断荷重１２は１０．６
［ｋｇｆ］であるとして測定することができた。従来の
スタッドプルテストでは治具接着剤１１が先に破断し、
Ａｕ／Ｓｉ接着剤４の破断荷重は測定できなかった。(Embodiment 2) Similarly, the chip adhesive 4 is Au.
/ Si (eutectic alloy of gold and silicon) has a radius of curvature of 50 so that the chip does not crack even if it contacts the semiconductor chip 5.
If the wedge-shaped load portion 1 of the present invention having a curvature of about μm is used, the breaking load 12 of the Au / Si adhesive 4 is 10.6.
It could be measured as being [kgf]. In the conventional stud pull test, the jig adhesive 11 breaks first,
The breaking load of the Au / Si adhesive 4 could not be measured.
【００２９】（実施例３）実施例１の結果から、有限要
素法による数値解析を用いて、同じ接着剤を用いた半導
体製品であるＤＩＰパッケージ（Ｄｕａｌ Ｉｎ−ｌｉ
ｎｅＰａｃｋａｇｅ）の破断を予測した。(Embodiment 3) From the results of Embodiment 1, by using the numerical analysis by the finite element method, a DIP package (Dual In-li) which is a semiconductor product using the same adhesive is used.
rupture of nePackage) was predicted.
【００３０】図２は接着剤の破断予測方法の説明図であ
る。実施例１で得られたＡｌ／ＰＩ接着剤４の破断荷重
１２から、有限要素法解析を用いて接着剤固有の破断応
力１３として１４．０［ｋｇｆ／ｍｍ2］を得た（図
５）。図４（ａ），（ｂ）は用いた有限要素法解析のモ
デルである。くさび形荷重部１によって荷重がかかった
半導体チップ５の位置に、破断荷重１２である５．４
［ｋｇｆ］を負荷した。さらに、Ａｌ／ＰＩ接着剤４の
硬化温度である３５０［℃］から実験を行った室温まで
の温度変化も負荷した。一般に高温で接着して固着させ
るエポキシ系の熱硬化性樹脂材料の場合は室温までの冷
却による熱変形も無視できないが、これによって接着剤
に生じる応力もこの数値解析結果には含まれている。FIG. 2 is an explanatory diagram of a method of predicting the breakage of the adhesive. From the breaking load 12 of the Al / PI adhesive 4 obtained in Example 1, 14.0 [kgf / mm 2 ] was obtained as the breaking stress 13 peculiar to the adhesive using finite element method analysis (FIG. 5). . FIGS. 4A and 4B are models of the finite element method analysis used. The breaking load 12 is 5.4 at the position of the semiconductor chip 5 loaded by the wedge-shaped load portion 1.
[Kgf] was loaded. Furthermore, a temperature change from 350 [° C.], which is the curing temperature of the Al / PI adhesive 4, to the room temperature at which the experiment was performed was also applied. In general, in the case of an epoxy thermosetting resin material that is adhered and fixed at a high temperature, thermal deformation due to cooling to room temperature cannot be ignored, but the stress caused in the adhesive due to this is also included in this numerical analysis result.
【００３１】次に１００［ｋｇｆ］の荷重を受けるＤＩ
Ｐパッケージの有限要素法解析を行った。図５に示した
ように、得られた最大応力１４は１８．５［ｋｇｆ／ｍ
ｍ2］であった。この値は前記の材料固有の破断応力１
３と比較して大きく、１００［ｋｇｆ］の荷重を受ける
ＤＩＰパッケージにおけるＡｌ／ＰＩ接着剤４は破断す
ると予測される。実際にこの条件下ではＡｌ／ＰＩ接着
剤４の破断が観察されている。このように接着剤固有の
破断応力１３を求めておけば、製品の数値解析を行うだ
けで、製品の半導体チップ接着材４が破断するかどうか
を予測することができる。Next, DI receiving a load of 100 [kgf]
Finite element method analysis of P package was performed. As shown in FIG. 5, the maximum stress 14 obtained was 18.5 [kgf / m
m 2 ]. This value is the breaking stress peculiar to the above material 1
It is expected that the Al / PI adhesive 4 in the DIP package, which is larger than that of No. 3 and is subjected to a load of 100 [kgf], breaks. In fact, under this condition, breakage of the Al / PI adhesive 4 is observed. If the breaking stress 13 peculiar to the adhesive is obtained in this way, it is possible to predict whether or not the semiconductor chip adhesive 4 of the product will break only by numerically analyzing the product.
【００３２】さらに、接着剤固有の破断応力１３を求め
ておけば、製品の設計において接着剤４が破断するよう
な荷重を逆算することも可能である。図６に示したよう
に、製品にかかる荷重を種々変えて数値解析し、接着剤
固有の破断応力１３と比較することによって、接着剤４
が破断するような荷重を精度よく知ることができる。Furthermore, if the breaking stress 13 peculiar to the adhesive is obtained, it is possible to back-calculate the load at which the adhesive 4 breaks in the product design. As shown in FIG. 6, the load applied to the product was changed variously, numerical analysis was performed, and by comparing the breaking stress 13 peculiar to the adhesive, the adhesive 4
It is possible to accurately know the load at which the fracture occurs.
【００３３】[0033]
【発明の効果】以上のように本発明は、スタッドプルテ
ストで測定できない高い接着力をもつ接着剤に対して、
その破断荷重を測定でき、その測定値に基づき、数値解
析を用いて材料固有の破断応力を求めることができる。
これにより、製品設計における、接着剤破断の精度よい
予測を実現できるという効果がある。As described above, the present invention can be applied to an adhesive having a high adhesive force that cannot be measured by the stud pull test.
The breaking load can be measured, and based on the measured value, the breaking stress peculiar to the material can be obtained using numerical analysis.
This has the effect of enabling accurate prediction of adhesive breakage in product design.
【図１】本発明に係る強度測定治具の一実施例の構成を
示す斜視図である。FIG. 1 is a perspective view showing a configuration of an embodiment of a strength measuring jig according to the present invention.
【図２】本発明に係る接着剤の破断予測方法を示す図で
ある。FIG. 2 is a diagram showing a method of predicting fracture of an adhesive according to the present invention.
【図３】本発明の強度測定治具を用いて測定を行う状態
を示す断面図である。FIG. 3 is a cross-sectional view showing a state in which measurement is performed using the strength measuring jig of the present invention.
【図４】本発明の接着剤の破断予測方法を説明する図で
ある。FIG. 4 is a diagram illustrating a method of predicting the breakage of an adhesive according to the present invention.
【図５】本発明の接着剤の破断予測方法を説明する図で
ある。FIG. 5 is a diagram illustrating a method of predicting the breakage of an adhesive according to the present invention.
【図６】本発明の接着剤の一実施態様を示す図である。FIG. 6 is a view showing an embodiment of the adhesive of the present invention.
【図７】従来の接着剤の強度測定治具を示す図である。FIG. 7 is a diagram showing a conventional adhesive strength measuring jig.
１ くさび形状の荷重部 ２ 接着剤に生じた応力 ３ 従来の方法で得られる接着剤の破断平均応力 ４ 半導体チップ用接着剤 ５ 半導体チップ ６ チップ実装用基板 ８ くさび形治具のガイド部 ９ 実装基板固定具 １０ 従来のスタッドプルテスト用引張り治具 １１ 従来のスタッドプルテスト用治具接着剤 １２ くさび形治具で得られた接着剤の破断荷重 １３ 数値解析で得られた接着剤固有の破断応力 １４ 数値解析で得られた製品の接着剤の最大応力 1 Wedge-shaped load part 2 Stress generated in adhesive 3 Average stress at break of adhesive obtained by conventional method 4 Adhesive for semiconductor chip 5 Semiconductor chip 6 Chip mounting board 8 Guide part of wedge jig 9 Mounting Substrate fixture 10 Conventional stud pull test pulling jig 11 Conventional stud pull test jig Adhesive 12 Breaking load of adhesive obtained by wedge-shaped jig 13 Breakage peculiar to adhesive obtained by numerical analysis Stress 14 Maximum stress of the adhesive of the product obtained by numerical analysis
Claims (5)
し、半導体チップと実装基板とを接合する接着剤の接着
強度を測定するための半導体チップ接着剤の強度測定治
具であって、 保持部は、前記実装基板を測定すべき姿勢に保持するも
のであり、 ガイド部は、荷重部を前記半導体チップと実装基板との
接着剤による接合部位に誘導するものであり、 荷重部は、前記ガイド部に誘導され、外力を受けて測定
対象の接着剤をせん断変形破断させ、実装基板から半導
体チップを剥離するものであることを特徴とする半導体
チップ接着剤の強度測定治具。1. A strength measuring jig for a semiconductor chip adhesive, which has a holding portion, a guide portion, and a load portion, and is used for measuring the bonding strength of an adhesive agent for joining a semiconductor chip and a mounting substrate. The holding portion holds the mounting substrate in a posture to be measured, and the guide portion guides the load portion to a joint portion of the semiconductor chip and the mounting substrate with an adhesive. Is a jig for peeling a semiconductor chip from a mounting substrate, which is guided by the guide portion and receives an external force to cause the adhesive to be measured to undergo shear deformation and fracture to peel off the semiconductor chip.
基板との接着剤による接合部位に食い込むものであるこ
とを特徴とする請求項１に記載の半導体チップ接着剤の
強度測定治具。2. The jig for measuring the strength of a semiconductor chip adhesive according to claim 1, wherein the load portion cuts into a joint portion between the semiconductor chip and the mounting substrate with an adhesive.
楔形形状をなすものであることを特徴とする請求項１又
は２に記載の半導体チップ接着剤の強度測定治具。3. The strength measuring jig for a semiconductor chip adhesive according to claim 1, wherein the load portion has a wedge shape that bites into the joint portion.
をもつ円弧形状に形成されたものであることを特徴とす
る請求項３に記載の半導体チップ接着剤の強度測定治
具。4. The strength measuring jig for a semiconductor chip adhesive according to claim 3, wherein the load portion is formed in an arc shape having a wedge-shaped tip end having a curvature.
チップと実装基板とを接合する接着剤の破断予測を行う
半導体チップ接着剤の破断予測方法であって、 測定処理は、半導体チップと実装基板との接着剤による
接合部位に楔形状の測定治具を食い込ませて接着剤の破
断応力を測定する処理であり、 予測処理は、前記測定処理で得られた破断応力値と、数
値解析で得られた接着剤の最大応力値とを比較し、接着
剤が破断するか否かを予測する処理であることを特徴と
する半導体チップ接着剤の破断予測方法。5. A method for predicting breakage of a semiconductor chip adhesive, which comprises performing a measurement process and a prediction process to predict a breakage of an adhesive that joins a semiconductor chip and a mounting substrate. This is a process to measure the breaking stress of the adhesive by digging a wedge-shaped measuring jig into the bonding part with the mounting board, and the prediction process is the breaking stress value obtained by the measurement process and the numerical analysis. A method for predicting breakage of a semiconductor chip adhesive, which is a process of comparing the maximum stress value of the adhesive obtained in step 1 to predict whether or not the adhesive will break.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10627695A JPH08304269A (en) | 1995-04-28 | 1995-04-28 | Jig for measuring strength of adhesive used for semiconductor chip and method for forecasting rupture of the adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10627695A JPH08304269A (en) | 1995-04-28 | 1995-04-28 | Jig for measuring strength of adhesive used for semiconductor chip and method for forecasting rupture of the adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08304269A true JPH08304269A (en) | 1996-11-22 |
Family
ID=14429564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10627695A Pending JPH08304269A (en) | 1995-04-28 | 1995-04-28 | Jig for measuring strength of adhesive used for semiconductor chip and method for forecasting rupture of the adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08304269A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013096852A (en) * | 2011-11-01 | 2013-05-20 | Lintec Corp | Adhesive strength measuring apparatus and adhesive strength measuring method |
| CN103115868A (en) * | 2013-03-07 | 2013-05-22 | 中国空间技术研究院 | Fixing device for testing pulling-out force of device chip |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61172059A (en) * | 1985-01-28 | 1986-08-02 | Mitsubishi Heavy Ind Ltd | Method for nondestructive forecasting of life of turbine |
| JPS6152258B2 (en) * | 1983-05-28 | 1986-11-12 | Jiipura Patentoentoitsukurungusu Unto Betairigungusu Gmbh | |
| JPH04349644A (en) * | 1991-05-28 | 1992-12-04 | Matsushita Electron Corp | Evaluation of semiconductor device |
| JPH05180744A (en) * | 1991-12-26 | 1993-07-23 | Nec Corp | Analyzing method of stress and evaluating method of strength using the same |
| JPH064652B2 (en) * | 1985-08-30 | 1994-01-19 | 花王株式会社 | Phosphate ester |
| JPH0666696A (en) * | 1991-07-19 | 1994-03-11 | Nec Corp | Strength evaluating method |
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1995
- 1995-04-28 JP JP10627695A patent/JPH08304269A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6152258B2 (en) * | 1983-05-28 | 1986-11-12 | Jiipura Patentoentoitsukurungusu Unto Betairigungusu Gmbh | |
| JPS61172059A (en) * | 1985-01-28 | 1986-08-02 | Mitsubishi Heavy Ind Ltd | Method for nondestructive forecasting of life of turbine |
| JPH064652B2 (en) * | 1985-08-30 | 1994-01-19 | 花王株式会社 | Phosphate ester |
| JPH04349644A (en) * | 1991-05-28 | 1992-12-04 | Matsushita Electron Corp | Evaluation of semiconductor device |
| JPH0666696A (en) * | 1991-07-19 | 1994-03-11 | Nec Corp | Strength evaluating method |
| JPH05180744A (en) * | 1991-12-26 | 1993-07-23 | Nec Corp | Analyzing method of stress and evaluating method of strength using the same |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013096852A (en) * | 2011-11-01 | 2013-05-20 | Lintec Corp | Adhesive strength measuring apparatus and adhesive strength measuring method |
| CN103115868A (en) * | 2013-03-07 | 2013-05-22 | 中国空间技术研究院 | Fixing device for testing pulling-out force of device chip |
| CN103115868B (en) * | 2013-03-07 | 2015-01-21 | 中国空间技术研究院 | Fixing device for testing pulling-out force of device chip |
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