JPH08297103A - Method and device for tomograph - Google Patents
Method and device for tomographInfo
- Publication number
- JPH08297103A JPH08297103A JP8139927A JP13992796A JPH08297103A JP H08297103 A JPH08297103 A JP H08297103A JP 8139927 A JP8139927 A JP 8139927A JP 13992796 A JP13992796 A JP 13992796A JP H08297103 A JPH08297103 A JP H08297103A
- Authority
- JP
- Japan
- Prior art keywords
- sample
- ray
- image
- cross
- rays
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
【０００１】
【発明の属する技術分野】本発明は、Ｘ線による断層撮
影技術に関し、特に工業用部品の微細な欠陥検査、より
具体的には電子回路基板のはんだ付け部分の欠陥検査に
最適なＸ線断層撮影装置に関するものである。
【０００２】
【従来の技術】従来の工業用ＣＴ装置には、「産業用Ｘ
線ＣＴスキャナとその適用」計装、Ｐ４８〜５１，Ｖol
２７，Ｎｏ.２、中村著に記載されているものがある。
これは、検査対象に比べて比較的大きなＸ線源と、キセ
ノン（Ｘｅ）ガスを封入してなるＸ線検出器であって単
位チャンネル当たりの幅が１〜２ｍｍで、多数個（３０
０〜５００チャンネル）の集合体からなるものを用いて
いる。そしてＸ線源から扇状に放射されるＸ線を検査対
象に照射しながら、検査対象を自転させて、検査対象の
全周方向から透過するＸ線強度を検出し、この検出デー
タを用いて検査対象の断面像を再構成している。
【０００３】
【発明が解決しようとする課題】上記した従来技術で
は、検査対象に対する分解能は３００平方μｍ程度であ
り、より微細な部分の検査が不可能であった。
【０００４】本発明の目的は、微細部分の検査、より詳
しくは断面像を高分解能で検出可能なＸ線断層撮影装置
を提供することにある。
【０００５】
【課題を解決するための手段】上記目的を達成するため
に、本発明では、Ｘ線断層撮影装置を、Ｘ線を発生する
Ｘ線発生手段と、Ｘ線を照射する試料をこの試料へのＸ
線の照射方向と直角な方向の軸の回りに回転可能かつこ
の軸の方向及び軸方向と直角方向に移動可能に載置する
試料載置手段と、この試料載置手段に載置された試料に
照射されてこの試料を透過したＸ線による透過Ｘ線像を
形成する透過Ｘ線像形成手段と、形成された透過Ｘ線像
に基づいてＸ線を照射する方向に対して直角な方向の試
料の２次元の画像を画面上に表示する２次元画像表示手
段と、この２次元画像表示手段に表示された２次元の画
像上で試料の断面を観察すべき位置を設定する断面観察
位置設定手段と、Ｘ線を試料に照射しながら試料載置手
段で試料を回転の軸の回りに回転させたときに透過Ｘ線
像形成手段により形成される所定の回転角度ごとの試料
の透過Ｘ線像に基づいて断面観察位置設定手段で設定さ
れた観察すべき位置の断面形状を再構成するＸ線画像処
理手段と、このＸ線画像処理手段により再構成された試
料の断面形状を表示するＸ線断面画像表示手段とを備え
て構成した。また、Ｘ線断層撮影方法を、Ｘ線を試料に
照射し、この照射により試料を透過したＸ線を検出して
透過Ｘ線像を作成し、この作成した透過Ｘ線像による試
料のＸ線を照射する方向に直角な方向の２次元像を画面
上に表示し、この表示した２次元像の画面上で試料の断
面を観察すべき位置を設定し、試料を回転させながらＸ
線を照射して所定の回転角度ごとの試料の透過Ｘ線像を
得、この所定の回転角度ごとの試料の透過Ｘ線像に基づ
いて断面を観察すべき位置の断面形状を再構成し、この
再構成した断面形状を画面上に表示する方法により行う
ようにした。
【０００６】ここで、以下に述べる実施例では、イメー
ジインテンシファイアを用いてＸ線像を可視化している
が、特に可視化せずとも、即ち、Ｘ線像の波長スペクト
ル分布が紫外又は赤外にずれても、当該変換像が増幅さ
れる機能を有する手段であれば、本発明の構成要素たり
得る。
【０００７】微小なスポットサイズのＸ線源に近接した
位置に検査対象を保持し、イメージインテンシファイア
の位置を適宜、選ぶことにより検査部分を拡大投影した
Ｘ線透過像を得ることができる。
【０００８】イメージインテンシファイアと電荷蓄積型
のリニアイメージセンサの組合せを有する検出光学系に
より、高感度かつ広いダイナミックレンジが得られるの
みならず、高解像度の検出が可能となる。
【０００９】また撮像管により２次元画像のモニターが
行えるので、微小な検査対象の検査部分に対して精密な
Ｘ線の照射を可能とする初期位置合わせが実現できる。
【００１０】
【発明の実施の形態】本発明の一実施例を以下に図面を
用いて説明する。
【００１１】図２（ａ）は、検査対象であるＬＳＩチッ
プキャリアの一例を示すもので、具体的にはセラミック
基板２１上にＬＳＩチップ２２をＣＣＢ（Ｃollapsed
Ｃonnecting Ｂamp）はんだ接続２３により搭載したも
のである。図２（ｂ）は、この断面構造の一例を示すも
のでセラミック基板２１は配線層２４ａ〜２４ｄが積層
された多層構造であり、各層間には金属が充填されたス
ルーホール２６があり、また各配線層には金属による回
路配線が設けられている。これらのチップキャリアは、
下面のはんだ３０により接続することで、同図（ｃ）に
示すように、マザー基板３１上に多数実装できるよう構
成されている。
【００１２】本実施例では、図２（ｂ）で示すような、
ＬＳＩチップキャリアのＣＣＢはんだ接続部分に発生す
る気泡２７や形状不良２８等の欠陥を検査することを目
的としている。尚、本発明はこれらに限らず、５０μｍ
φ程度の分解能で電子部品等のＸ線断層撮影検査に適用
できる。
【００１３】図１は、本発明の全体構成を示すもので、
試料ホルダー１０で保持した検査試料２に対して、微小
焦点Ｘ線源１を設けてＸ線照射を行ないこの透過Ｘ線像
をイメージインテンシファイア４により可視像に変換す
る。この後、光路切替ミラー７及びレンズ１７〜１９を
介して前記の可視像を撮像管５又はリニアイメージセン
サ６へ導く構成としている。更に、撮像管５で検出した
Ｘ線像はモニタテレビ９で観察されると共に、リニアイ
メージセンサ６で検出したＸ線像はＡ／Ｄ変換器１１で
逐次、量子化された後、画像メモリ１２に格納され、計
算機１３から読み出しできるように構成されている。
【００１４】また、操作盤１５からの操作指示に従い、
計算機１３、駆動制御回路１６を介して、試料ホルダー
１０のＸ，Ｙ方向の初期の位置決め調整及び光路切替ミ
ラー７の切替えができるように構成されている。また画
像検出周期回路８により、試料ホルダー１０のθ方向に
対する所定回転角度Δθごとに、リニアイメージセンサ
６でＸ線像の検出ができるように構成されている。
【００１５】以下、本実施例に従って、はんだ接続部分
の断面形状検出動作を説明する。
【００１６】先ず、検査試料２（図１）のはんだ検査箇
所の初期位置合わせを行う。このため光路切替ミラー７
を撮像管５によるモニター検出側に切替え、検査試料２
のＸ線透過像をモニタテレビ９に表示する（図３）。こ
こでリニアイメージセンサ６の検出位置に対応したモニ
タテレビ９上の画面位置に、予めカーソル２４を設定し
ておき、カーソル２４に対して検査個所が一致するよう
に、検査試料２のＸ，Ｙ位置を移動し調整する。これに
より精度のよい初期位置合わせが容易に行える。
【００１７】次に光路切替ミラー７をリニアイメージセ
ンサ６の検出側に切り替え、駆動機構３（図１）により
検査試料２をθ方向に回転させながら正面図の図４
（ａ）及び側面図の図４（ｂ）で示すように、はんだ接
続部分の検査個所を透過するＸ線強度を検出する。
【００１８】リニアイメージセンサ６（図１）では、θ
方向の所定回転角度Δθ毎にＸ線透過像の検出を行な
い、その検出信号をＡ／Ｄ変換器１１で量子化しなが
ら、逐次、画像メモリ１２に格納し、θ＝０〜３６０°
の全周方向の検出データを得る。
【００１９】図５は、このようにして得られる検査試料
２の各角度方向θに対応して得られる検出データ関数Ｉ
（Ｌ，θ）の例を示す。ここで、Ｌはリニアイメージセ
ンサ上の検出位置を示すものとする。
【００２０】以下、これらの多数方向の検出データＩ
（Ｌ，θ）を用い、計算機１３の演算処理によりはんだ
接続部分の断面形状の再構成を行ない、ディスプレイ１
４上に表示を行なう。
【００２１】リニアイメージセンサで検出される透過Ｘ
線強度のデータ関数Ｉ（Ｌ，θ）は、検査対象のＸ線吸
収係数の分布関数をμ（ｘ，ｙ）とすれば、数１で与え
られる。
【００２２】
【数１】
【００２３】ここで∫μ（ｘ，ｙ）ｄlはＸ線ビームの
通過位置におけるＸ線吸収係数の関数μ（ｘ，ｙ）の線
積分を表わす。またＩ0（Ｌ）は、照射Ｘ線の強度分布
関数を示すものとする。
【００２４】数１を書き直せば数２が得られる。
【００２５】
【数２】
【００２６】数２で示すＰ（Ｌ，θ）は検査対象なしで
予めリニアイメージセンサでＸ線を検出し求めた照射Ｘ
線の強度分布関数Ｉ0（Ｌ）より求められる投影データ
である。
【００２７】断面再構成の問題は、各検出方向の投影デ
ータ関数Ｐ（Ｌ，θ）を算出した後、Ｘ線吸収係数の関
数μ（ｘ，ｙ）の分布を求めることである。
【００２８】このμ（ｘ，ｙ）の算出方法には各種方法
が知られているが、コンボリューション法を適用する一
例について概要を説明する。
【００２９】この再構成原理は、図６の平行Ｘ線ビーム
を用いた例で示すように平行ビームによる投影データ関
数をＰ0（Ｌ0，θ0）とすれば、これに対して所定の補
正関数を作用してコンボリューション関数を得ながら、
各方向の投影データに対するコンボリューション関数を
合成して断面像を得るものである。この演算式を下記に
示す。
【００３０】
【数３】
【００３１】ここで、＊はコンボリューションを表わ
す。またｇ(Ｌ0)は補正関数を表わし、ＳheppとＬogan
が開発した下記のものを用いれば、精度の良い画像が得
られることが実証されている。
【００３２】
【数４】
【００３３】ただしＬ0＝ｎａ（ｎ＝０，±１，±２，
…）とし、ａは投影データの得られるサンプリング間隔
を示す。
【００３４】本発明の場合、投影データ関数Ｐ（Ｌ，
θ）はファンビーム（扇状ビーム）によって検出される
ため、Ｐ（Ｌ，θ）から平行ビーム座標系における投影
データ関数Ｐ0（Ｌ0，θ0）を求める必要がある。これ
は、図７の幾何学的関数で示すように、下記の関数式よ
り変換できる。
【００３５】
【数５】
【００３６】
【数６】
【００３７】ここで、ＳはＸ線源から検出器までの距
離、またＤは、Ｘ線源から検査試料の回転中心までの距
離を表わすものとする。
【００３８】以上で示すように、数５、６を用い、平行
ビームとして考えた場合の投影データ関数Ｐ0（Ｌ0，θ
0）を算出して断面形状の算出を行なうことができる。
【００３９】
【発明の効果】本発明によれば、微小な検査対象、具体
的には５０μｍφの分解能を必要とする対象物の所定位
置における断面検出撮影が可能となる。更には電子回路
のはんだ付け部分における微細な内部欠陥の検査が行え
る効果がある。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an X-ray tomography technique, and more particularly to inspection of fine defects in industrial parts, more specifically, soldering of electronic circuit boards. The present invention relates to an X-ray tomography apparatus most suitable for defect inspection of a part. 2. Description of the Related Art A conventional industrial CT apparatus includes an "industrial X-ray system".
Line CT scanner and its application ”Instrumentation, P48-51, Vol
27, No. 2 and Nakamura.
This is an X-ray detector in which a relatively large X-ray source and a xenon (Xe) gas are enclosed in comparison with an object to be inspected, and the width per unit channel is 1 to 2 mm.
0 to 500 channels) is used. Then, while irradiating the inspection target with X-rays radiated in a fan shape from the X-ray source, the inspection target is rotated and the intensity of X-rays transmitted from the entire circumferential direction of the inspection target is detected and the inspection data is used A cross-sectional image of the subject is reconstructed. In the above-mentioned conventional technique, the resolution of the inspection object is about 300 square μm, and it is impossible to inspect a finer portion. It is an object of the present invention to provide an X-ray tomography apparatus capable of inspecting a fine portion, more specifically, capable of detecting a sectional image with high resolution. In order to achieve the above object, in the present invention, an X-ray tomography apparatus comprises an X-ray generating means for generating X-rays and a sample for irradiating with X-rays. X to sample
Sample placing means for rotatably around an axis in a direction perpendicular to the line irradiation direction and movably in the direction of the axis and in a direction perpendicular to the axial direction, and a sample placed on the sample placing means A transmission X-ray image forming means for forming a transmission X-ray image by X-rays that have been irradiated onto the sample and transmitted through this sample; and a direction perpendicular to the direction of irradiating the X-rays based on the formed transmission X-ray image. Two-dimensional image display means for displaying a two-dimensional image of the sample on the screen, and cross-section observation position setting for setting the position at which the cross-section of the sample should be observed on the two-dimensional image displayed on the two-dimensional image display means. Means, and the transmitted X-rays of the sample for each predetermined rotation angle formed by the transmitted X-ray image forming means when the sample is rotated around the axis of rotation by the sample mounting means while irradiating the sample with X-rays. The position to be observed set by the section observation position setting means based on the image And X-ray image processing means for reconstructing a cross-sectional shape, and configuration and an X-ray cross section image display means for displaying the cross-sectional shape of the sample reconstructed by the X-ray image processing means. Further, according to the X-ray tomography method, a sample is irradiated with X-rays, the X-rays transmitted through the sample are detected by this irradiation, a transmission X-ray image is created, and the X-ray of the sample based on the created transmission X-ray image. A two-dimensional image in a direction perpendicular to the irradiation direction is displayed on the screen, the position at which the cross section of the sample is to be observed is set on the screen of the displayed two-dimensional image, and the sample is rotated while X
A transmission X-ray image of the sample for each predetermined rotation angle is obtained by irradiating a ray, and the cross-sectional shape of the position where the cross-section should be observed is reconstructed based on the transmission X-ray image of the sample for each predetermined rotation angle, The reconstructed cross-sectional shape is displayed on the screen. Here, in the embodiments described below, an X-ray image is visualized by using an image intensifier. However, even if the X-ray image is not visualized, that is, the wavelength spectrum distribution of the X-ray image is ultraviolet or infrared. Even if it shifts to, any means that has a function of amplifying the converted image may be a constituent element of the present invention. An X-ray transmission image in which the inspection portion is enlarged and projected can be obtained by holding the inspection object in a position close to the X-ray source having a minute spot size and appropriately selecting the position of the image intensifier. A detection optical system having a combination of an image intensifier and a charge-accumulation type linear image sensor enables not only high sensitivity and a wide dynamic range to be obtained, but also high-resolution detection. Further, since the two-dimensional image can be monitored by the image pickup tube, it is possible to realize the initial alignment capable of irradiating the minute inspection portion of the inspection object with precise X-rays. An embodiment of the present invention will be described below with reference to the drawings. FIG. 2A shows an example of an LSI chip carrier to be inspected. Specifically, an LSI chip 22 is mounted on a ceramic substrate 21 by CCB (Collapsed).
Connecting Bamp) Solder connection 23 is mounted. FIG. 2B shows an example of this cross-sectional structure. The ceramic substrate 21 has a multilayer structure in which wiring layers 24a to 24d are laminated, and there is a through hole 26 filled with metal between the layers, and Circuit wiring made of metal is provided in each wiring layer. These chip carriers are
By connecting with the solder 30 on the lower surface, as shown in FIG. 7C, a large number can be mounted on the mother board 31. In this embodiment, as shown in FIG.
The purpose is to inspect defects such as bubbles 27 and defective shapes 28 generated in the CCB solder connection portion of the LSI chip carrier. The present invention is not limited to these, but is 50 μm.
It can be applied to X-ray tomography inspection of electronic parts with a resolution of about φ. FIG. 1 shows the overall structure of the present invention.
The inspection sample 2 held by the sample holder 10 is provided with a microfocus X-ray source 1 to perform X-ray irradiation, and the transmitted X-ray image is converted into a visible image by the image intensifier 4. After that, the visible image is guided to the image pickup tube 5 or the linear image sensor 6 via the optical path switching mirror 7 and the lenses 17 to 19. Further, the X-ray image detected by the image pickup tube 5 is observed on the monitor television 9, and the X-ray image detected by the linear image sensor 6 is sequentially quantized by the A / D converter 11 and then the image memory 12 And is configured to be read from the computer 13. In addition, according to the operation instruction from the operation panel 15,
Via the computer 13 and the drive control circuit 16, the initial positioning adjustment of the sample holder 10 in the X and Y directions and the switching of the optical path switching mirror 7 can be performed. Further, the image detection cycle circuit 8 is configured so that the linear image sensor 6 can detect an X-ray image for each predetermined rotation angle Δθ with respect to the θ direction of the sample holder 10. The operation of detecting the cross-sectional shape of the solder connection portion will be described below according to this embodiment. First, initial alignment of solder inspection points of the inspection sample 2 (FIG. 1) is performed. Therefore, the optical path switching mirror 7
Is switched to the monitor detection side by the image pickup tube 5, and the inspection sample 2
The X-ray transmission image of is displayed on the monitor television 9 (FIG. 3). Here, the cursor 24 is set in advance at a screen position on the monitor television 9 corresponding to the detection position of the linear image sensor 6, and the X and Y of the inspection sample 2 are aligned so that the inspection point coincides with the cursor 24. Move and adjust the position. This facilitates accurate initial alignment. Next, the optical path switching mirror 7 is switched to the detection side of the linear image sensor 6, and the drive mechanism 3 (FIG. 1) rotates the inspection sample 2 in the θ direction while the front view of FIG.
As shown in (a) and FIG. 4 (b) of the side view, the X-ray intensity transmitted through the inspection portion of the solder connection portion is detected. In the linear image sensor 6 (FIG. 1), θ
The X-ray transmission image is detected for each predetermined rotation angle Δθ of the direction, and the detection signal is sequentially stored in the image memory 12 while being quantized by the A / D converter 11, and θ = 0 to 360 °
To obtain detection data in the omnidirectional direction. FIG. 5 shows the detection data function I obtained corresponding to each angle direction θ of the inspection sample 2 obtained in this way.
An example of (L, θ) is shown. Here, L indicates the detection position on the linear image sensor. The detected data I in these multiple directions will be described below.
Using (L, θ), the cross-sectional shape of the solder connection portion is reconstructed by the arithmetic processing of the computer 13, and the display 1 is displayed.
4 Display on top. Transmission X detected by linear image sensor
The data function I (L, θ) of the line intensity is given by Equation 1 when the distribution function of the X-ray absorption coefficient of the inspection object is μ (x, y). [Equation 1] Here, ∫μ (x, y) d l represents the line integral of the function μ (x, y) of the X-ray absorption coefficient at the passage position of the X-ray beam. I 0 (L) represents the intensity distribution function of the irradiation X-ray. By rewriting the equation 1, the equation 2 can be obtained. [Equation 2] P (L, θ) shown in Equation 2 is an irradiation X obtained by previously detecting X-rays with a linear image sensor without an inspection target.
This is projection data obtained from the line intensity distribution function I 0 (L). The problem of cross-section reconstruction is to obtain the distribution of the function μ (x, y) of the X-ray absorption coefficient after calculating the projection data function P (L, θ) in each detection direction. Although various methods are known for calculating μ (x, y), an outline of an example of applying the convolution method will be described. As shown in the example using the parallel X-ray beam in FIG. 6, the reconstruction principle is defined as follows: if the projection data function by the parallel beam is P 0 (L 0 , θ 0 ). While applying the correction function to obtain the convolution function,
The cross-sectional image is obtained by combining the convolution functions for the projection data in each direction. This calculation formula is shown below. [Equation 3] Here, * represents convolution. Further, g (L 0 ) represents a correction function, and Shepp and Logan
It has been proved that an accurate image can be obtained by using the following developed by. [Equation 4] However, L 0 = na (n = 0, ± 1, ± 2,
...), and a indicates a sampling interval at which projection data is obtained. In the case of the present invention, the projection data function P (L,
Since θ) is detected by the fan beam (fan beam), it is necessary to obtain the projection data function P 0 (L 0 , θ 0 ) in the parallel beam coordinate system from P (L, θ). This can be converted by the following functional expression as shown by the geometrical function in FIG. 7. [Equation 5] [Equation 6] Here, S represents the distance from the X-ray source to the detector, and D represents the distance from the X-ray source to the center of rotation of the test sample. As shown above, the projection data function P 0 (L 0 , θ) when using the equations 5 and 6 and considering it as a parallel beam.
0 ) can be calculated to calculate the cross-sectional shape. According to the present invention, it is possible to perform cross-section detection and imaging at a predetermined position of a minute inspection object, specifically, an object requiring a resolution of 50 μmφ. Furthermore, there is an effect that a fine internal defect can be inspected in a soldered portion of an electronic circuit.
【図面の簡単な説明】
【図１】本発明の一実施例を示す全体構成図である。
【図２】検査対象の説明図である。
【図３】Ｘ線検出位置のモニタＴＶ表示例の説明図であ
る。
【図４】検査試料に対するＸ線像検出動作の説明図であ
る。
【図５】リニアイメージセンサにより検出される検出デ
ータの説明図である。
【図６】断面形状を再構成するアルゴリズムの原理説明
図である。
【図７】ファンビームＸ線による検出データと平行ビー
ムによる検出データとの座標関係の説明図である。
【符号の説明】
１…微小焦点Ｘ線源、
２…検査試料、
３…駆動機構、
４…イメージ・インテンシファイア、
５…撮像管、
６…リニア・イメージセンサ、
７…光路切替ミラー、
８…画像検出同期回路、
９…モニタテレビ、
１０…試料ホルダー、
１１…Ａ／Ｄ変換器、
１２…画像メモリ、
１３…計算機、
１４…断面像ディスプレイ、
１５…操作盤、
１６…駆動制御回路。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an overall configuration diagram showing an embodiment of the present invention. FIG. 2 is an explanatory diagram of an inspection target. FIG. 3 is an explanatory diagram of a monitor TV display example of an X-ray detection position. FIG. 4 is an explanatory diagram of an X-ray image detection operation for an inspection sample. FIG. 5 is an explanatory diagram of detection data detected by a linear image sensor. FIG. 6 is a diagram illustrating the principle of an algorithm for reconstructing a cross-sectional shape. FIG. 7 is an explanatory diagram of a coordinate relationship between fan beam X-ray detection data and parallel beam detection data. [Explanation of Codes] 1 ... Micro focus X-ray source, 2 ... Inspection sample, 3 ... Driving mechanism, 4 ... Image intensifier, 5 ... Image pickup tube, 6 ... Linear image sensor, 7 ... Optical path switching mirror, 8 ... image detection synchronization circuit, 9 ... monitor TV, 10 ... sample holder, 11 ... A / D converter, 12 ... image memory, 13 ... calculator, 14 ... cross-sectional image display, 15 ... operation panel, 16 ... drive control circuit.
Claims (1)
向と直角な方向の軸の回りに回転可能かつ該軸の方向及
び該軸方向と直角方向に移動可能に載置する試料載置手
段と、 該試料載置手段に載置された前記試料に照射されて該試
料を透過した前記Ｘ線による透過Ｘ線像を形成する透過
Ｘ線像形成手段と、 前記形成された透過Ｘ線像に基づいて前記Ｘ線を照射す
る方向に対して直角な方向の前記試料の２次元の画像を
画面上に表示する２次元画像表示手段と、 該２次元画像表示手段に表示された前記２次元の画像上
で前記試料の断面を観察すべき位置を設定する断面観察
位置設定手段と、 前記Ｘ線を前記試料に照射しながら前記試料載置手段で
前記試料を前記回転の軸の回りに回転させたときに前記
透過Ｘ線像形成手段により形成される所定の回転角度ご
との前記試料の透過Ｘ線像に基づいて前記断面観察位置
設定手段で設定された前記観察すべき位置の断面形状を
再構成するＸ線画像処理手段と、 該Ｘ線画像処理手段により再構成された前記試料の断面
形状を表示するＸ線断面画像表示手段とを備えたことを
特徴とするＸ線断層撮影装置。 ２．前記Ｘ線画像処理手段は、前記試料の透過Ｘ線像を
結像する光学系部と該結像させた前記試料の透過Ｘ線像
を１次元で検出する１次元画像検出部を備え、前記光学
系部により結蔵されて前記１次元画像検出部により検出
された前記試料の透過Ｘ線像に基づいて前記観察すべき
位置の断面形状を再構成することを特徴とする特許請求
の範囲第１項記載のＸ線断層撮影装置。 ３．Ｘ線を試料に照射し、 該照射により前記試料を透過した前記Ｘ線を検出して透
過Ｘ線像を作成し、 該作成した透過Ｘ線像による前記試料の前記Ｘ線を照射
する方向に直角な方向の２次元像を画面上に表示し、 該表示した２次元像の画面に基づいて前記試料の断面を
観察すべき位置を設定し、 前記試料を回転させながら前記Ｘ線を照射して所定の回
転角度ごとの前記試料の透過Ｘ線像を得、 該所定の回転角度ごとの前記試料の透過Ｘ線像に基づい
て前記断面を観察すべき位置の断面形状を再構成し、 該再構成した断面形状を画面上に表示することを特徴と
するＸ線断層撮影方法。[Claims] 1. X-ray generating means for generating X-rays, a sample for irradiating the X-rays, rotatable about an axis in a direction perpendicular to the irradiation direction of the X-rays on the sample, and the direction of the axis and the axial direction. Sample mounting means movably mounted in a right angle direction, and transmitted X-rays that form a transmitted X-ray image of the X-rays that have been transmitted through the sample by irradiating the sample mounted on the sample mounting means. Image forming means, and two-dimensional image display means for displaying on the screen a two-dimensional image of the sample in a direction perpendicular to the direction of irradiating the X-rays based on the formed transmitted X-ray image, Cross-section observation position setting means for setting a position at which a cross-section of the sample should be observed on the two-dimensional image displayed on the two-dimensional image display means, and the sample mounting while irradiating the sample with the X-ray. When the sample is rotated around the axis of rotation by means of X-ray image processing for reconstructing the cross-sectional shape of the position to be observed set by the cross-section observation position setting device based on the transmission X-ray image of the sample for each predetermined rotation angle formed by the line image forming device. An X-ray tomography apparatus comprising: a means and an X-ray sectional image display means for displaying a sectional shape of the sample reconstructed by the X-ray image processing means. 2. The X-ray image processing means includes an optical system unit that forms a transmission X-ray image of the sample and a one-dimensional image detection unit that detects the formed transmission X-ray image of the sample in one dimension. The cross-sectional shape of the position to be observed is reconstructed based on a transmission X-ray image of the sample stored by an optical system unit and detected by the one-dimensional image detection unit. The X-ray tomography apparatus according to item 1. 3. The sample is irradiated with X-rays, the X-rays transmitted through the sample are detected by the irradiation, and a transmitted X-ray image is created. In the direction in which the created transmitted X-ray image is irradiated with the X-rays of the sample. A two-dimensional image in a perpendicular direction is displayed on the screen, a position for observing the cross section of the sample is set based on the screen of the displayed two-dimensional image, and the X-ray is irradiated while rotating the sample. A transmission X-ray image of the sample for each predetermined rotation angle is obtained, and a cross-sectional shape at a position where the cross-section is to be observed is reconstructed based on the transmission X-ray image of the sample for each predetermined rotation angle, An X-ray tomography method, wherein the reconstructed cross-sectional shape is displayed on a screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8139927A JP2713287B2 (en) | 1996-06-03 | 1996-06-03 | X-ray tomography method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8139927A JP2713287B2 (en) | 1996-06-03 | 1996-06-03 | X-ray tomography method and apparatus |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62042535A Division JPH0752162B2 (en) | 1987-02-27 | 1987-02-27 | X-ray tomography system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08297103A true JPH08297103A (en) | 1996-11-12 |
| JP2713287B2 JP2713287B2 (en) | 1998-02-16 |
Family
ID=15256912
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8139927A Expired - Lifetime JP2713287B2 (en) | 1996-06-03 | 1996-06-03 | X-ray tomography method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2713287B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106289120A (en) * | 2016-08-11 | 2017-01-04 | 中国航空工业集团公司沈阳发动机设计研究所 | A kind of aero-engine sigmatron is tested with adjustable measuring basis device |
| JP2019090802A (en) * | 2017-11-10 | 2019-06-13 | 東芝Ｉｔコントロールシステム株式会社 | Non-destructive analyzer |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101435784B (en) * | 2008-10-14 | 2012-01-18 | 重庆大学 | Turbine blade CT detection device and detection method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5568359A (en) * | 1978-11-20 | 1980-05-23 | Tokyo Shibaura Electric Co | Computer tomogram device |
| JPS59177026A (en) * | 1983-03-29 | 1984-10-06 | 浜松ホトニクス株式会社 | X-ray tomographic image enlarging apparatus |
-
1996
- 1996-06-03 JP JP8139927A patent/JP2713287B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5568359A (en) * | 1978-11-20 | 1980-05-23 | Tokyo Shibaura Electric Co | Computer tomogram device |
| JPS59177026A (en) * | 1983-03-29 | 1984-10-06 | 浜松ホトニクス株式会社 | X-ray tomographic image enlarging apparatus |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106289120A (en) * | 2016-08-11 | 2017-01-04 | 中国航空工业集团公司沈阳发动机设计研究所 | A kind of aero-engine sigmatron is tested with adjustable measuring basis device |
| JP2019090802A (en) * | 2017-11-10 | 2019-06-13 | 東芝Ｉｔコントロールシステム株式会社 | Non-destructive analyzer |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2713287B2 (en) | 1998-02-16 |
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