JPH08293434A - Chip type aluminum electrolytic capacitor - Google Patents
Chip type aluminum electrolytic capacitorInfo
- Publication number
- JPH08293434A JPH08293434A JP9828995A JP9828995A JPH08293434A JP H08293434 A JPH08293434 A JP H08293434A JP 9828995 A JP9828995 A JP 9828995A JP 9828995 A JP9828995 A JP 9828995A JP H08293434 A JPH08293434 A JP H08293434A
- Authority
- JP
- Japan
- Prior art keywords
- aluminum
- bottomed
- case
- sealing body
- reinforcing member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は各種電子機器に利用され
るチップ形アルミ電解コンデンサに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type aluminum electrolytic capacitor used in various electronic devices.
【0002】[0002]
【従来の技術】昨今の電子機器の小形・薄型化・多機能
化に伴い、電子回路は高密度化を余儀なくされ、電子部
品においても小形化・低背化・面実装化が急速に進んで
いる。2. Description of the Related Art With the recent miniaturization, thinning, and multi-functionalization of electronic equipment, electronic circuits have been required to have a higher density, and electronic parts are rapidly becoming smaller, lower in height, and surface-mounted. There is.
【0003】従来のチップ形アルミ電解コンデンサは特
開昭59−211214号に示されているように、すな
わち図3,図4に示すように、リード部材1が引き出さ
れたコンデンサ素子2に電解液3を含浸させてコンデン
サ素子2を有底ケース4内に収納し、かつこの有底ケー
ス4の開口部には前記リード部材1を貫通させた封口体
5を装着し、そして有底ケース4の開口部を封口体5と
共に巻き締め、かつ有底ケース4の開口端部にカール6
を施して有底ケース4の開口端を封口体5に押し当てて
抑えることにより封止を行い、さらに前記リード部材1
は有底ケース4の開口部端面に当接するように配置され
た絶縁板7に貫通させ、かつこのリード部材1の先端部
を折曲して絶縁板7の外表面に設けた凹部7aに収納す
るようにしていた。A conventional chip-type aluminum electrolytic capacitor is as shown in Japanese Patent Laid-Open No. 59-212114, that is, as shown in FIGS. 3 and 4, an electrolytic solution is applied to a capacitor element 2 from which a lead member 1 is drawn out. 3, the capacitor element 2 is housed in the bottomed case 4, and the opening 5 of the bottomed case 4 is fitted with the sealing body 5 penetrating the lead member 1. Tighten the opening together with the sealing body 5, and curl 6 at the opening end of the bottomed case 4.
Then, the open end of the bottomed case 4 is pressed against the sealing body 5 to hold it, thereby performing sealing, and further, the lead member 1
Is penetrated through the insulating plate 7 arranged so as to abut the end face of the opening of the bottomed case 4, and the tip of the lead member 1 is bent to be housed in the recess 7 a provided on the outer surface of the insulating plate 7. I was trying to do it.
【0004】[0004]
【発明が解決しようとする課題】一般に、図3,図4に
示すチップ形アルミ電解コンデンサにおいては、電子機
器のプリント基板上へ実装する際のリフローはんだ付け
時にチップ形アルミ電解コンデンサは、200℃から2
40℃の高温に晒されるため、電解液3が体積膨張する
ことになり、そしてこの体積膨張によって有底ケース4
の内部空間が圧縮されて内部圧力を上昇させるもので、
封口部の強度が不足すると、前記内部圧力の上昇により
封口体5が膨れて変形する。これを防止するために、図
3,図4に示すチップ形アルミ電解コンデンサにおいて
は、有底ケース4の開口端部にカール6を施して有底ケ
ース4の開口端を封口体5に押し当てて抑えることによ
って封口強度を得ている。このような構造においては、
リフローはんだ付け時に有底ケース4内に発生した内部
圧力は封口体5を内側から押し曲げて封口体5を外側に
向かって膨らませる力として働くもので、このような内
部圧力が封口体5を内側から押し曲げる時の支点は有底
ケース4の開口端部のカール6の先端となるため、有底
ケース4に発生する内部圧力によって封口体5を膨らま
せないようにするために、有底ケース4の開口部のカー
ル6の先端が形成する円の径(以後カール径8という)
ができるだけ小さくなるようにしている。Generally, in the chip type aluminum electrolytic capacitors shown in FIGS. 3 and 4, the chip type aluminum electrolytic capacitor is 200 ° C. at the time of reflow soldering when mounted on a printed circuit board of an electronic device. From 2
Since it is exposed to a high temperature of 40 ° C., the electrolytic solution 3 expands in volume, and due to this volume expansion, the bottomed case 4
The internal space of is compressed to increase the internal pressure,
When the strength of the sealing portion is insufficient, the sealing body 5 is swollen and deformed due to the increase in the internal pressure. In order to prevent this, in the chip-type aluminum electrolytic capacitors shown in FIGS. 3 and 4, the open end of the bottomed case 4 is curled to press the open end of the bottomed case 4 against the sealing body 5. The sealing strength is obtained by holding down. In such a structure,
The internal pressure generated in the bottomed case 4 at the time of reflow soldering works as a force to press and bend the sealing body 5 from the inside so as to expand the sealing body 5 toward the outside. Since the fulcrum when pushing and bending from the inside is the tip of the curl 6 at the opening end of the bottomed case 4, in order to prevent the sealing body 5 from expanding due to the internal pressure generated in the bottomed case 4, the bottomed case Diameter of the circle formed by the tip of the curl 6 at the opening of 4 (hereinafter referred to as curl diameter 8)
Is to be as small as possible.
【0005】しかしながら、図3,図4に示すチップ形
アルミ電解コンデンサにおいては、有底ケース4の開口
部に施されるカール6は、有底ケース4の内径方向に曲
げてカールを施して構成されるものであるため、有底ケ
ース4の全長ばらつきの倍のばらつきをカール径8に反
映させ、さらに多ヘッドのカールローラで構成されてい
る封口装置で封口されたような場合には、それぞれのカ
ールローラの位置決めばらつきが前記有底ケース4の全
長ばらつきによるカール径8のばらつきに加わるため、
結果的には有底ケース4の開口部のカール径8は大きな
ばらつきを余儀なくされていた。このような理由によ
り、有底ケース4の開口部のカール径8は大きくばらつ
くものであるため、リフローはんだ付け時に封口体5を
安定的に膨れ変形させないようにすることは実際には困
難であり、そしてこの封口体5の膨れ変形は絶縁板7を
圧迫して絶縁板7に反りを生じさせ、この反りによって
絶縁板7の外表面の面実装面は曲がるため、電子機器の
プリント基板上へリフローはんだ付けによりチップ形ア
ルミ電解コンデンサを実装する際に、チップ形アルミ電
解コンデンサが傾いた状態で実装されるという問題点が
あった。However, in the chip-type aluminum electrolytic capacitors shown in FIGS. 3 and 4, the curl 6 applied to the opening of the bottomed case 4 is formed by bending the bottomed case 4 in the direction of the inner diameter. Since the curl diameter 8 reflects a variation that is twice the variation in the total length of the bottomed case 4, and if the sealing device is composed of a curl roller with multiple heads, Since the positioning variation of the curl roller is added to the variation of the curl diameter 8 due to the variation of the total length of the bottomed case 4,
As a result, the curl diameter 8 of the opening of the bottomed case 4 had to be largely varied. For this reason, the curl diameter 8 of the opening of the bottomed case 4 varies greatly, and it is actually difficult to prevent the sealing body 5 from stably bulging and deforming during reflow soldering. Then, the bulging deformation of the sealing body 5 presses the insulating plate 7 to cause the insulating plate 7 to warp, and the warping causes the surface mounting surface of the outer surface of the insulating plate 7 to bend, so When mounting a chip type aluminum electrolytic capacitor by reflow soldering, there is a problem that the chip type aluminum electrolytic capacitor is mounted in an inclined state.
【0006】本発明は上記従来の問題点を解決するもの
で、電子機器のプリント基板上へのはんだ付けによる実
装を、チップ形アルミ電解コンデンサが傾くことなく、
安定した状態で行わせることができるチップ形アルミ電
解コンデンサを提供することを目的とするものである。The present invention solves the above-mentioned problems of the prior art by mounting an electronic device by soldering on a printed circuit board without tilting the chip-type aluminum electrolytic capacitor.
It is an object of the present invention to provide a chip type aluminum electrolytic capacitor which can be stably operated.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に本発明のチップ形アルミ電解コンデンサは、リード部
材が引き出されたコンデンサ素子と、このコンデンサ素
子に含浸された電解液と、前記コンデンサ素子を収納す
る有底アルミケースと、この有底アルミケースの開口部
を封口する封口体と、前記有底アルミケースの開口部端
面に当接するように配設され、かつ前記リード部材を外
表面に臨ませた絶縁板とを有し、前記リード部材が引き
出されたコンデンサ素子に電解液を含浸させてコンデン
サ素子を有底アルミケース内に収納し、かつ有底アルミ
ケースの開口部に前記リード部材を貫通させた封口体を
装着し、この封口体の外側から封口体に当接するように
アルミニウム補強部材を配置し、さらに有底アルミケー
スの開口端部にカールを施して有底アルミケースの開口
端をアルミニウム補強部材に押し当てて抑えることによ
り封止を行うとともに、前記リード部材を絶縁板に貫通
させ、かつこのリード部材の先端部を絶縁板の外表面に
沿わせて折曲するように構成したものである。In order to achieve the above object, a chip type aluminum electrolytic capacitor of the present invention comprises a capacitor element from which a lead member is drawn out, an electrolytic solution impregnated in the capacitor element, and the capacitor element. With a bottomed aluminum case, a sealing body for sealing the opening of the bottomed aluminum case, and a lead member disposed on the outer surface so as to abut the end surface of the opening of the bottomed aluminum case. The lead member is housed in a bottomed aluminum case by impregnating the capacitor element from which the lead member is drawn out with an electrolytic solution, and the lead member is provided in the opening of the bottomed aluminum case. Attach the sealing body that penetrates the sealing body, arrange the aluminum reinforcing member so that it abuts the sealing body from the outside of the sealing body, and further cover the open end of the bottomed aluminum case. And the open end of the bottomed aluminum case is pressed against the aluminum reinforcing member to hold it down, and at the same time, the lead member is passed through the insulating plate, and the tip of the lead member is placed outside the insulating plate. It is configured to be bent along the surface.
【0008】[0008]
【作用】上記構成のチップ形アルミ電解コンデンサによ
れば、リード部材が引き出されたコンデンサ素子に電解
液を含浸させてコンデンサ素子を有底アルミケース内に
収納し、かつ有底アルミケースの開口部に前記リード部
材を貫通させた封口体を装着し、この封口体の外側から
封口体に当接するようにアルミニウム補強部材を配置
し、さらに有底アルミケースの開口端部にカールを施し
て有底アルミケースの開口端をアルミニウム補強部材に
押し当てて抑えることにより封止を行うようにしている
ため、前記封口体に当接しているアルミニウム補強部材
が前記カールの代わりに封口体の封口強度を得るための
直接的な働きをすることになり、この結果、カールおよ
びその先端は単にアルミニウム補強部材に封口体を抑え
る力を伝達する働きをするに過ぎず、リフローはんだ付
け時に発生する内部圧力が封口体を内側から押し曲げて
封口体を外側に向かって膨らませる時の支点としては働
かなくなるため、有底アルミケースの全長あるいは封口
時のカールローラの位置決めのばらつき等でカール径が
ばらつくことによって引き起こされていたリフローはん
だ付け時に封口体の膨れ変形の問題は解消されるもので
ある。このように封口体の外側から封口体に当接するよ
うに配置されたアルミニウム補強部材が封口体を堅固に
抑えるため、封口体が膨れて変形することはなく、そし
て有底アルミケースの開口部端面に当接するように配設
され、かつリード部材を外表面に臨ませた絶縁板が圧迫
を受けて反りが生じることもないため、電子機器のプリ
ント基板上へのはんだ付けによる実装を、チップ形アル
ミ電解コンデンサが傾くことなく、安定した状態で行わ
せることができるものである。According to the chip type aluminum electrolytic capacitor having the above structure, the capacitor element with the lead member pulled out is impregnated with the electrolytic solution to house the capacitor element in the bottomed aluminum case, and the opening of the bottomed aluminum case is provided. Attach the sealing body that penetrates the lead member to the above, and arrange the aluminum reinforcing member so as to come into contact with the sealing body from the outside of the sealing body. Since the sealing is performed by pressing the open end of the aluminum case against the aluminum reinforcing member, the aluminum reinforcing member in contact with the sealing body obtains the sealing strength of the sealing body instead of the curl. As a result, the curl and its tip simply transmit the force to hold the sealing body to the aluminum reinforcing member. However, the internal pressure generated during reflow soldering does not work as a fulcrum when the sealing body is pressed and bent from the inside to inflate the sealing body toward the outside. The problem of swollen deformation of the sealing body at the time of reflow soldering, which has been caused by the variation of the curl diameter due to the variation of the position of the curl roller, can be solved. In this way, the aluminum reinforcing member arranged so as to contact the sealing body from the outside of the sealing body firmly suppresses the sealing body, so that the sealing body does not swell and deform, and the opening end surface of the bottomed aluminum case is closed. The insulating plate with the lead member facing the outer surface will not be warped due to pressure when it is arranged so as to abut on the chip. The aluminum electrolytic capacitor can be operated in a stable state without tilting.
【0009】[0009]
【実施例】以下、本発明の一実施例を添付図面にもとづ
いて説明する。図1は本発明の一実施例におけるチップ
形アルミ電解コンデンサを示したもので、この図1にお
いて、11はコンデンサ素子で、このコンデンサ素子1
1は陽極箔と陰極箔とをその間にセパレータを介在させ
て巻回することにより構成され、そしてこのコンデンサ
素子11からはリード部材12を引き出すとともに、こ
のコンデンサ素子11に電解液13を含浸させて有底円
筒状に構成された有底アルミケース14内に収納し、か
つこの有底アルミケース14の開口部には前記リード部
材12を貫通させた封口体15を装着し、そしてこの封
口体15の外側から封口体15に当接するように前記リ
ード部材12を貫通させたアルミニウム補強部材16を
配置し、さらに前記有底アルミケース14の開口端部に
カール17を施して有底アルミケース14の開口端をア
ルミニウム補強部材16に押し当てて抑えることにより
封止を行っている。18は有底アルミケース14の開口
部端面に当接するように配設された絶縁板で、前記リー
ド部材12はこの絶縁板18も貫通させ、そしてこのリ
ード部材12の先端部は折曲して絶縁板18の外表面に
設けた凹部18aに収納している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows a chip-type aluminum electrolytic capacitor according to an embodiment of the present invention. In FIG. 1, 11 is a capacitor element.
1 is constituted by winding an anode foil and a cathode foil with a separator interposed therebetween, and pulling out a lead member 12 from the capacitor element 11 and impregnating the capacitor element 11 with an electrolytic solution 13. It is housed in a bottomed aluminum case 14 formed in a bottomed cylindrical shape, and a sealing body 15 penetrating the lead member 12 is attached to the opening of the bottomed aluminum case 14, and this sealing body 15 The aluminum reinforcing member 16 penetrating the lead member 12 is arranged so as to come into contact with the sealing body 15 from the outside, and a curl 17 is applied to the opening end of the bottomed aluminum case 14 so that the bottomed aluminum case 14 has Sealing is performed by pressing the open end against the aluminum reinforcing member 16 and holding it down. Reference numeral 18 denotes an insulating plate arranged so as to abut the end face of the opening of the bottomed aluminum case 14. The lead member 12 also penetrates the insulating plate 18, and the leading end of the lead member 12 is bent. It is housed in a recess 18 a provided on the outer surface of the insulating plate 18.
【0010】前記アルミニウム補強部材16は、図2
(a)に示すようにリード部材12を引き出すための貫
通穴16aを設けた円板あるいは図2(b)に示すよう
にリング状の円板で構成し、機械的強度を得るととも
に、リード部材12の陽極と陰極間が短絡しないように
工夫している。The aluminum reinforcing member 16 is shown in FIG.
As shown in FIG. 2 (a), the lead member 12 is formed by a disk provided with a through hole 16a or a ring-shaped disk as shown in FIG. 2 (b) to obtain mechanical strength and lead member. Twelve anodes and cathodes are devised so as not to short-circuit.
【0011】(表1)はアルミニウム補強部材16の材
料として、純アルミニウム(JIS名:A1050)、
アルミニウム/マンガン合金(JIS名:A300
4)、アルミニウム/マグネシウム合金(JIS名:A
5052)を用いた本発明の実施例1〜3と、本発明の
効果を明らかにするためにアルミニウム補強部材16を
配置していない従来例を比較のために示したものであ
る。Table 1 shows, as the material of the aluminum reinforcing member 16, pure aluminum (JIS name: A1050),
Aluminum / manganese alloy (JIS name: A300
4), aluminum / magnesium alloy (JIS name: A
5052) is used for comparison with Examples 1 to 3 of the present invention and a conventional example in which the aluminum reinforcing member 16 is not arranged in order to clarify the effect of the present invention.
【0012】上記した本発明の実施例では具体的には示
していないが、アルミニウム補強部材16の材料として
は、本発明の実施例1〜3で示したもの以外に、アルミ
ニウム合金を用いてもよいものである。Although not specifically shown in the above-mentioned embodiments of the present invention, as the material of the aluminum reinforcing member 16, an aluminum alloy may be used other than those shown in the first to third embodiments of the present invention. It's good.
【0013】はんだ付け時に有底アルミケース14内に
発生した内部圧力が封口体15を内側から押し曲げて封
口体15を外側に向かって膨らませる力に抗するため
に、前記アルミニウム補強部材16の熱変形温度ははん
だ付け時にチップ形アルミ電解コンデンサが晒される温
度以上にし、かつはんだ付け時にチップ形アルミ電解コ
ンデンサが晒される温度におけるアルミニウム補強部材
16の曲げ強度ははんだ付け時に有底アルミケース14
内に発生した内部圧力以上の強度にする必要があるが、
現状のチップ形アルミ電解コンデンサにおいては、はん
だ付け時にチップ形アルミ電解コンデンサが晒される温
度は高くて260℃程度であり、またはんだ付け時に有
底アルミケース14内に発生した内部圧力に耐えるため
に必要な前記曲げ強度は10kg/mm2程度であり、この
場合、アルミニウム補強部材16の前記した材料は、そ
の材料特性上、前記した熱変形温度および曲げ強度を十
分に満足する特性を有しているものである。そしてアル
ミニウム補強部材16は材料としてアルミニウムを採用
しているもので、このアルミニウムは通常表面に耐食性
の酸化皮膜を形成しているため、極めて耐食性に優れて
おり、これにより、通常のチップ形アルミ電解コンデン
サの使用環境においてはアルミニウム補強部材16自身
の腐食性は有底アルミケース14と同様全く問題になる
ものではなく、上記した封口体15の補強機能を十分に
果たし得るものである。さらにアルミニウム補強部材1
6と有底アルミケース14とは同種類の材料であるた
め、封止に伴うアルミニウム補強部材16と有底アルミ
ケース14のカールとの接触でお互いに接触電位差が生
じることはなく、例え、生じたとしても極めて微少なも
のであるため、この点での腐食についても全く問題にな
らないものである。In order to resist the force of the internal pressure generated in the bottomed aluminum case 14 during soldering, which pushes the sealing body 15 from the inside to inflate the sealing body 15 toward the outside, the aluminum reinforcing member 16 is provided. The heat deformation temperature is set to be equal to or higher than the temperature to which the chip type aluminum electrolytic capacitor is exposed during soldering, and the bending strength of the aluminum reinforcing member 16 at the temperature to which the chip type aluminum electrolytic capacitor is exposed during soldering is the bottomed aluminum case 14 during soldering.
It is necessary to make it stronger than the internal pressure generated inside,
In the current chip type aluminum electrolytic capacitor, the temperature to which the chip type aluminum electrolytic capacitor is exposed at the time of soldering is as high as about 260 ° C., or in order to withstand the internal pressure generated in the bottomed aluminum case 14 at the time of soldering. The required bending strength is about 10 kg / mm 2 , and in this case, the above-mentioned material of the aluminum reinforcing member 16 has characteristics that sufficiently satisfy the above-mentioned heat deformation temperature and bending strength due to its material characteristics. There is something. The aluminum reinforcing member 16 employs aluminum as a material. Since this aluminum usually has a corrosion-resistant oxide film formed on its surface, it is extremely excellent in corrosion resistance. In the environment where the capacitor is used, the corrosiveness of the aluminum reinforcing member 16 itself does not pose any problem as in the bottomed aluminum case 14, and can sufficiently fulfill the reinforcing function of the sealing body 15 described above. Furthermore, aluminum reinforcing member 1
Since 6 and the bottomed aluminum case 14 are of the same type of material, the contact between the aluminum reinforcing member 16 and the curl of the bottomed aluminum case 14 due to the sealing does not cause a contact potential difference between them, and, for example, it occurs. Even if it is extremely small, there is no problem with corrosion at this point.
【0014】また(表1)には上記した本発明の実施例
1,2,3におけるチップ形アルミ電解コンデンサと、
従来例におけるチップ形アルミ電解コンデンサを50v
10μFの定格で各々1000個ずつ製造し、温度23
0℃でリフローはんだ付け試験を行った結果も示してい
る。Further, (Table 1) shows the chip-type aluminum electrolytic capacitors according to the first, second and third embodiments of the present invention,
50v of the chip type aluminum electrolytic capacitor in the conventional example
1000 pieces each with a rating of 10 μF are manufactured, and the temperature is 23
The results of a reflow soldering test at 0 ° C are also shown.
【0015】[0015]
【表1】 [Table 1]
【0016】この(表1)から明らかなように、本発明
の実施例1,2,3のチップ形アルミ電解コンデンサに
よれば、封口体15に当接するようにアルミニウム補強
部材16を配置し、このアルミニウム補強部材16によ
って直接封口体15を堅固に抑えているため、従来のチ
ップ形アルミ電解コンデンサのようにカール径8のばら
つきによって引き起こされていたリフローはんだ付け時
の封口体15の膨れ変形という問題はなくなるもので、
このようにリフローはんだ付け時に封口体15が膨れて
変形することはなく、そして有底アルミケース14の開
口部端面に当接するように配設された絶縁板18が圧迫
を受けて反りが生じることもないため、電子機器のプリ
ント基板上へのはんだ付けによる実装を、チップ形アル
ミ電解コンデンサが傾くことなく、安定した状態で行わ
せることができるものである。As is clear from this (Table 1), according to the chip-type aluminum electrolytic capacitors of Examples 1, 2, and 3 of the present invention, the aluminum reinforcing member 16 is disposed so as to abut the sealing body 15, Since the aluminum reinforcing member 16 directly suppresses the sealing body 15 firmly, it is called a bulging deformation of the sealing body 15 at the time of reflow soldering which is caused by the variation of the curl diameter 8 as in the conventional chip type aluminum electrolytic capacitor. The problem goes away,
In this way, the sealing body 15 does not swell and deform during reflow soldering, and the insulating plate 18 arranged so as to abut the end face of the opening of the bottomed aluminum case 14 receives pressure and warps. Therefore, the electronic device can be mounted on a printed circuit board by soldering in a stable state without tilting the chip-type aluminum electrolytic capacitor.
【0017】また図2(a)に示すリード部材12の貫
通穴16aを設けた円板あるいは図2(b)に示すリン
グ状の円板で構成したアルミニウム補強部材16におい
て、図2(a)に示すアルミニウム補強部材16は封口
体15の外面全体を抑えるため、比較的大きい封口強度
を得ることができるという利点があり、一方、図2
(b)に示すアルミニウム補強部材16はリード部材1
2をアルミニウム補強部材16の貫通穴16aに位置決
めして通すというような操作を経て装着する必要がない
ため、比較的容易に製造ができるという利点を有するも
のである。In addition, in the aluminum reinforcing member 16 constituted by the disc provided with the through hole 16a of the lead member 12 shown in FIG. 2A or the ring-shaped disc shown in FIG. The aluminum reinforcing member 16 shown in FIG. 2 has an advantage that a relatively large sealing strength can be obtained because the entire outer surface of the sealing body 15 is suppressed.
The aluminum reinforcing member 16 shown in (b) is the lead member 1.
Since it is not necessary to mount the 2 through the through-hole 16a of the aluminum reinforcing member 16 through an operation such as positioning and passing it through, it has an advantage of being relatively easy to manufacture.
【0018】[0018]
【発明の効果】以上のように本発明のチップ形アルミ電
解コンデンサは、リード部材が引き出されたコンデンサ
素子に電解液を含浸させてコンデンサ素子を有底アルミ
ケース内に収納し、かつ有底アルミケースの開口部に前
記リード部材を貫通させた封口体を装着し、この封口体
の外側から封口体に当接するようにアルミニウム補強部
材を配置し、さらに有底アルミケースの開口端部にカー
ルを施して有底アルミケースの開口端をアルミニウム補
強部材に押し当てて抑えることにより封止を行うように
しているため、前記封口体に当接しているアルミニウム
補強部材が前記カールの代わりに封口体の封口強度を得
るための直接的な働きをすることになり、この結果、カ
ールおよびその先端は単にアルミニウム補強部材に封口
体を抑える力を伝達する働きをするに過ぎず、リフロー
はんだ付け時に発生する内部圧力が封口体を内側から押
し曲げて封口体を外側に向かって膨らませる時の支点と
しては働かなくなるため、有底ケースの全長あるいは封
口時のカールローラの位置決めのばらつき等でカール径
がばらつくことによって引き起こされていたリフローは
んだ付け時の封口体の膨れ変形の問題は解消されるもの
である。このように封口体の外側から封口体に当接する
ように配置された補強部材が封口体を堅固に抑えるた
め、封口体が膨れて変形することはなく、そして有底ア
ルミケースの開口部端面に当接するように配設され、か
つリード部材を外表面に臨ませた絶縁板が圧迫を受けて
反りが生じることもないため、電子機器のプリント基板
上へのはんだ付けによる実装を、チップ形アルミ電解コ
ンデンサが傾くことなく、安定した状態で行わせること
ができるものである。As described above, according to the chip type aluminum electrolytic capacitor of the present invention, the capacitor element from which the lead member is drawn out is impregnated with the electrolytic solution to house the capacitor element in the bottomed aluminum case and the bottomed aluminum electrolytic capacitor. A sealing body having the lead member penetrating through it is attached to the opening of the case, an aluminum reinforcing member is arranged so as to come into contact with the sealing body from the outside of the sealing body, and a curl is provided at the opening end of the bottomed aluminum case. Since the sealing is performed by pressing and holding the open end of the bottomed aluminum case against the aluminum reinforcing member, the aluminum reinforcing member abutting on the sealing member is replaced by the sealing member instead of the curl. It acts directly to obtain the sealing strength, and as a result, the curl and its tip simply transmit the force to hold the sealing body to the aluminum reinforcing member. However, since the internal pressure generated during reflow soldering does not work as a fulcrum when the sealing body is bent from the inside to inflate the sealing body toward the outside, the length of the bottomed case or the sealing The problem of swollen deformation of the sealing body at the time of reflow soldering, which has been caused by variations in the curl diameter due to variations in the positioning of the curl roller at the time, can be solved. In this way, the reinforcing member arranged so as to contact the sealing body from the outside of the sealing body firmly suppresses the sealing body, so that the sealing body does not swell and deform, and the end face of the opening of the bottomed aluminum case is not deformed. Since the insulating plate, which is arranged so as to abut and the lead member faces the outer surface, is not pressed and warped, mounting by electronic soldering on the printed circuit board of a chip type aluminum The electrolytic capacitor can be operated in a stable state without tilting.
【図1】本発明の一実施例を示すチップ形アルミ電解コ
ンデンサの縦断面図FIG. 1 is a vertical sectional view of a chip-type aluminum electrolytic capacitor showing an embodiment of the present invention.
【図2】(a)同チップ形アルミ電解コンデンサにおけ
るプラスチック補強部材の平面図 (b)同プラスチック補強部材の他の例を示す平面図FIG. 2A is a plan view of a plastic reinforcing member in the same chip-type aluminum electrolytic capacitor. FIG. 2B is a plan view showing another example of the plastic reinforcing member.
【図3】従来例を示すチップ形アルミ電解コンデンサの
縦断面図FIG. 3 is a vertical sectional view of a chip-type aluminum electrolytic capacitor showing a conventional example.
【図4】同アルミ電解コンデンサの下面図[Fig. 4] Bottom view of the aluminum electrolytic capacitor
11 コンデンサ素子 12 リード部材 13 電解液 14 有底アルミケース 15 封口体 16 アルミニウム補強部材 16a 貫通孔 17 カール 18 絶縁板 11 Capacitor Element 12 Lead Member 13 Electrolyte Solution 14 Aluminum Case with Bottom 15 Sealing Body 16 Aluminum Reinforcing Member 16a Through Hole 17 Curl 18 Insulating Plate
───────────────────────────────────────────────────── フロントページの続き (72)発明者 藤本 克也 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 岩切 隆 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Katsuya Fujimoto 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Takashi Iwakiri 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (2)
子と、このコンデンサ素子に含浸された電解液と、前記
コンデンサ素子を収納する有底アルミケースと、この有
底アルミケースの開口部を封口する封口体と、前記有底
アルミケースの開口部端面に当接するように配設され、
かつ前記リード部材を外表面に臨ませた絶縁板とを有
し、前記リード部材が引き出されたコンデンサ素子に電
解液を含浸させてコンデンサ素子を有底アルミケース内
に収納し、かつ有底アルミケースの開口部に前記リード
部材を貫通させた封口体を装着し、この封口体の外側か
ら封口体に当接するようにアルミニウム補強部材を配置
し、さらに有底アルミケースの開口端部にカールを施し
て有底アルミケースの開口端をアルミニウム補強部材に
押し当てて抑えることにより封止を行うとともに、前記
リード部材を絶縁板に貫通させ、かつこのリード部材の
先端部を絶縁板の外表面に沿わせて折曲するように構成
したチップ形アルミ電解コンデンサ。1. A capacitor element from which a lead member is drawn out, an electrolytic solution impregnated in the capacitor element, a bottomed aluminum case for accommodating the capacitor element, and a sealing for sealing the opening of the bottomed aluminum case. The body and the bottomed aluminum case are arranged so as to contact the end face of the opening,
And an insulating plate with the lead member facing the outer surface, the capacitor element from which the lead member is drawn out is impregnated with an electrolytic solution, and the capacitor element is housed in a bottomed aluminum case. A sealing body having the lead member penetrating through it is attached to the opening of the case, an aluminum reinforcing member is arranged so as to come into contact with the sealing body from the outside of the sealing body, and a curl is provided at the opening end of the bottomed aluminum case. By applying and pressing the open end of the bottomed aluminum case against the aluminum reinforcing member for sealing, the lead member is penetrated into the insulating plate, and the tip of the lead member is attached to the outer surface of the insulating plate. A chip-type aluminum electrolytic capacitor configured to bend along the line.
貫通穴を設けた円板あるいはリング状の円板で構成した
請求項1記載のチップ形アルミ電解コンデンサ。2. The chip-type aluminum electrolytic capacitor according to claim 1, wherein the aluminum reinforcing member is a disk provided with a through hole for the lead member or a ring-shaped disk.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09828995A JP3368716B2 (en) | 1995-04-24 | 1995-04-24 | Chip type aluminum electrolytic capacitor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP09828995A JP3368716B2 (en) | 1995-04-24 | 1995-04-24 | Chip type aluminum electrolytic capacitor |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH08293434A true JPH08293434A (en) | 1996-11-05 |
JP3368716B2 JP3368716B2 (en) | 2003-01-20 |
Family
ID=14215778
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP09828995A Expired - Fee Related JP3368716B2 (en) | 1995-04-24 | 1995-04-24 | Chip type aluminum electrolytic capacitor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3368716B2 (en) |
-
1995
- 1995-04-24 JP JP09828995A patent/JP3368716B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP3368716B2 (en) | 2003-01-20 |
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