JPH08292128A - Method for measuring position and inclination, inclination measuring method and adjustment for position and inclination of ccd element - Google Patents

Abstract

PURPOSE: To provide a method for measuring the position and the inclination and the inclination measuring method of the parts mounted on a precision mechanical equipment such as CCD cameras and the method for adjusting the position and the inclination of a CCD element. CONSTITUTION: At first, an optical unit 10 casts four rays 1, 2, 3 and 4 into a CCD element 15a. Then, the CCD element 15a detects the incident positions of the four rays 1, 2, 3 and 4. Finally, the deviating amounts in the directions of ϕ, θ, X, ψ and Y are detected by performing the operation by using the results of the detection.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for measuring the position / tilt of a component attached to a precision instrument, a method for measuring the tilt, and a position / position of a CCD element mounted on a CCD camera.
The present invention relates to a method of measuring tilt and adjusting the position and tilt.

[0002]

2. Description of the Related Art In a precision instrument such as an optical device, its components are aligned and attached with high accuracy during its assembly. The attachment of the above components will be described below by taking a CCD camera as an example.

FIG. 7 is an explanatory diagram showing a main part of the CCD camera 5. FIG. 7A is a perspective view thereof.
7B is a sectional view taken along line XX ′ of FIG. In this figure, 20 is a camera cabinet, and 17 is a camera mount portion of the camera cabinet 20. Reference numeral 15 is a CCD package in which a CCD element 15a is mounted. Reference numeral 18 denotes a cushion material, and the CCD package 15 is attached to the camera cabinet 20 via the cushion material 18.

In the CCD camera 5, the camera mount unit 1
For the light 17p that is vertically incident on 7, the CCD is vertically
It is important that the element 15a is arranged. Therefore, conventionally, the CCD package 15 is provided with a positioning hole 45, the camera cabinet 20 is provided with a positioning pin 16, and the positioning pin 16 is inserted into the positioning hole 45. Further, screws 16 are screwed into the through holes of the CCD package 15 and fixed to the camera cabinet 20.

[0005]

However, due to poor surface accuracy of the mounting surface of the component, distortion at the time of screw tightening or bonding, etc., the component may be mounted at a displaced position or may be mounted at an angle. In the example of the CCD camera described above, the molding precision of the surface of the camera cabinet 20 to which the CCD package 15 is attached and the CC of the CCD element 15a.
Due to the inclination of the CCD element 15a with respect to the D package 15, positional deviation and inclination deviation occur. CCD element 15a
Such a deviation causes the image captured by the CCD camera 5 to be distorted. In particular, the distortion becomes remarkable when measured at a high magnification.

In order to solve this problem, it is necessary to adjust the above-mentioned positional deviation and inclination deviation, but it has been impossible to measure the deviation amount so far, so it is difficult to adjust the deviation accurately. there were.

Therefore, an object of the present invention is to provide a position / tilt measuring method, a tilt measuring method, and a CCD element position / tilt adjusting method capable of measuring the positional deviation amount and the inclination deviation amount. .

[0008]

The present invention irradiates a measuring object with four or more light rays, measures the incident positions of the four or more light rays on the measuring object, and based on the measurement results. The amount of deviation of the position / tilt of the measuring object is calculated by

Further, the incident position is measured by an area sensor arranged so as to be in close contact with the measurement target surface of the measurement target in parallel.

Further, the measurement object is irradiated with four or more light rays, and the incident positions of the four or more light rays on the measurement object are arranged so as to photograph the measurement object surface of the measurement object. The measured amount is measured by the area sensor, and the amount of deviation of the inclination of the measuring object is calculated based on the measurement result.

A method for adjusting the position and inclination of a CCD element mounted on a CCD camera, in which an optical unit for emitting four or more light beams is closely attached to the CCD camera, and four or more optical units are attached from the optical unit. The CCD element is irradiated with light rays, the incident positions of four or more light rays are measured by the CCD element, and the position of the CCD element is measured based on the measurement result.
The amount of tilt deviation is calculated, and only the calculated deviation amount is CC
The D element is moved.

[0012]

In the position / tilt measuring method according to the first or second aspect, the incident positions of four or more light rays on the measuring object are detected, and the position of the measuring object is detected by using the detection result. The amount of deviation of the inclination is calculated. Therefore, by moving the measuring object based on the calculation result, it becomes possible to adjust the position / tilt shift. In addition, it is possible to determine whether or not the measurement target is a defective product based on the amount of deviation.

In the tilt measuring method according to the third aspect, the area sensor for photographing the surface of the object to be measured detects the incident positions of four or more light rays, and the detected result is used to deviate the tilt of the object to be measured. Calculate the amount. Therefore, the tilt deviation can be adjusted by moving the measurement object based on the calculation result. Also, depending on the amount of deviation,
It is possible to determine whether or not the measurement object is a defective product.

According to the fifth aspect of the CCD element adjusting method, since the CCD elements can be precisely arranged, an image without distortion can be obtained even at the time of photographing at a high magnification.

[0015]

【Example】

(First Embodiment) In this embodiment, the C mounted on the CCD camera is used.
A method of measuring the position / tilt of the CD element and a method of adjusting the displacement of the position / tilt will be described.

Position / Tilt Measuring Method FIG. 7 is a perspective view showing the main part of the CCD camera 5. Since this configuration has been described in the conventional example, the description is omitted here.

FIG. 2 is a perspective view showing the structure of the optical unit 10 used for the measurement. The optical unit 10 includes a laser element 11, a beam splitter 12, and a reflection mirror 13. The light emitted from the laser element 11 enters the beam splitter 12, and is split into four light beams by the polarization splitting surfaces 12a and 12b. The reflection mirrors 13 are 90
It consists of 4 mirrors arranged at a
4 parallel rays (rays) 1, 2, 3,
Convert to 4.

FIG. 1 is an explanatory diagram showing the principle of the position / tilt measuring method of this example. In this figure, for simplicity, CCD
Portions other than the CCD element 15a of the camera 5 are omitted.

The measuring method will be described below with reference to FIGS.

First, in order to obtain reference data prior to the measurement of the CCD camera 5 to be inspected, an ideal C
The measurement of the CD camera 5 '(hereinafter, all the components of the ideal CCD camera 5'is indicated by adding a dash "'") is performed.

First, the optical unit 10 is brought into close contact with the camera cabinet 20 '. FIG. 3A is a perspective view showing a state in which the optical unit 10 is attached to the camera mount portion 17 ′ of the camera cabinet 20 ′,
FIG. 3B is a sectional view taken along the line AA '. FIG. 1G is a perspective view showing the positional relationship between the optical unit 10 and the CCD element 15'a at this time.

Next, the laser element 1 of the optical unit 10
1 is operated and four parallel lights 1, 2, 3 and 4 are emitted to the CCD camera 5 ′. 1A is a top view showing the arrangement of the optical unit 10 and the CCD element 15'a at this time, and FIG. 1B is a front view showing the image pickup screen 15's of the CCD element 15'a. It is a figure. The elliptical spots in the front view of (b) indicate the incident positions of the above four parallel lights.

Next, the central coordinates of each spot {(X1, Y1) (X2, Y2) (X3, Y in the CCD element 15'a.
3) (X4, Y4)} is detected and used as reference data.

Then, the CCD camera 5 which is an object to be measured.
Measure.

First, as shown in FIG. 3, the optical unit 10 is set to C
It is brought into close contact with the camera mount 17 of the CD camera 5. Since the camera mount of a CCD camera usually has high surface accuracy, the optical unit 10 can be attached to the CCD camera 5 with high accuracy. Therefore, the positional relationship between the CCD camera 5 and the optical unit 10 is substantially the same as the previously measured positional relationship between the CCD camera 5 ′ and the optical unit 10.

Next, the laser element 1 of the optical unit 10
1 is operated and four parallel lights 1, 2, 3 and 4 are emitted to the CCD camera 5. The four parallel rays 1, 2, 3, 4
Enters the image pickup screen 15s of the CCD camera 5. FIG.
(B) to (f) are φ, θ, and
It is a figure which shows the state which the CCD element 15a has shifted | deviated to X, (psi), and Y direction, (a) is a top view which shows arrangement | positioning of the optical unit 10 and CCD element 15a, respectively (b) is a CCD element 15a. It is a front view which shows 15 s of imaging screens.

Next, the central coordinates {(x1, y1) (x2, y) of the incident positions of the above four parallel lights in the CCD element 15a.
2) (x3, y3) (x4, y4)} is detected.

Subsequently, by using the coordinates, calculation is performed to calculate the positional deviation amount and the inclination deviation amount of the CCD element 15a. The calculation formula is described below.

[0029]

[Equation 1]

As described above, the CC mounted on the CCD camera 5
The position / tilt deviation of the D element 15a can be detected, and the position / tilt of the CCD element can be confirmed in the assembly process of the CCD camera. In addition, defective products can be easily extracted.

In this example, the ideal CCD camera 5'is measured to obtain the reference data, but an ideal CCD camera 5'may be used instead of the ideal one. However, in this case, it is necessary to add a correction to the above equation. Further, when the reference data is known, it is not necessary to obtain the reference data before measuring the position / tilt.

In this example, C in the CCD camera 5
Although the method of measuring the position / tilt of the CD element 15a has been described, the position / tilt of the workpiece to be measured other than the CCD element can be measured by applying the position / tilt measuring method of this example. For example, by arranging an area sensor such as a CCD element in close contact with the measurement target surface of the measurement target work in parallel, and measuring the position / tilt shift amount of the area sensor by the above method, the position of the measurement target work is measured.・
It is possible to measure the deviation of the inclination.

Position / Tilt Adjustment Method The position / tilt adjustment of the CCD element is performed by using the above-mentioned position / tilt measurement result. However, as shown in FIG.
Therefore, the adjustment cannot be performed with the CCD package 15 fixed. Therefore, here, the above-mentioned measurement is performed with the CCD package 15 fixed by the piezoelectric element, and the CCD package 15 is moved based on the result, and the internal CC
A method of adjusting the displacement of the position and inclination of the D element 15a will be described.

FIG. 4 is a perspective view for explaining the adjusting method. In the figure, 21 to 32 are piezoelectric elements. They have a spherical object bonded to the tip, and CCD package 1
5, and the CCD package 15 is properly fixed to the camera cabinet 20.

Prior to the adjustment, first, the displacement amount of the position and inclination of the CCD element 15a inside the CCD package 15 is
It measures by the above-mentioned measuring method.

Subsequently, the piezoelectric elements 21 to 32 are operated, and the CCD is displaced by the amount of deviation of the position / tilt obtained by the above measurement.
Move the package 15.

Finally, in that state, the CCD package 1
5 is fixed to the camera cabinet 20 with an adhesive or the like, and the adjustment is completed.

By adjusting the position and the inclination of the CCD element 15a as described above, the distortion of the CCD element 15a is eliminated, and the image taken by the camera 5 becomes free even when taken at a high magnification. .

In this example, the CCD package 15 is fixed to the camera cabinet 20 with an adhesive or the like after adjusting the deviation, but it is not always necessary to fix it with the adhesive or the like. For example, in the CCD camera 5, the piezoelectric elements 21 to
2 may be provided, and each time the CCD camera 5 is used, the piezoelectric elements 21 to 32 are operated to adjust the CCD element 15a. In this case, it is necessary to store the displacement amount of the position / tilt in the storage means or the like.

Further, in this example, the displacement of the position and the inclination is adjusted by the piezoelectric elements 21 to 32, but it goes without saying that the adjustment may be performed by any method.

In this example, the four light beams are transmitted to the CCD element 1.
Although the optical unit 10 is used to make the light incident on the CCD 5a, any optical unit can be used as long as it can make four or more light rays incident on the CCD 15a.

(Second Embodiment) In this embodiment, a method for measuring the inclination of a work mounted on a substrate will be described.

FIG. 5 is a perspective view showing the measuring system. Four
Reference numeral 0 is a work to be measured, which is mounted on the substrate 41. Reference numeral 10 denotes the optical unit shown in FIG.
Is an area sensor.

The optical unit 10 includes a work 40 to be measured.
Is an ideal work 40 'having no inclination, it is arranged so that four rays 1, 2, 3, 4 can be irradiated from the angle of θ with respect to the vertical direction of the work 40'.
The area sensor 50 measures the measurement target surface 4 of the measurement target work 40 from the angle θ with respect to the vertical direction of the work 40 ′.
It is arranged so as to photograph for 0 s.

Since the measurement is carried out in substantially the same manner as in the first embodiment, only the essential parts will be described.

First, prior to the measurement of the workpiece 40 to be measured, the ideal workpiece 40 '(attached to the substrate 41') is measured. That is, the area sensor 50 detects the center coordinates of the light incident position on the work 40 '. The detected coordinates are {(X1, Y1) (X2, Y
2) (X3, Y3) (X4, Y4)}. Figure 6
(A) of (a) and (a ′) are views of the measurement system viewed from the A direction and B direction of FIG. 5, and (b) is a view showing a captured image of the area sensor 50. However, in this figure, the substrate 41 '
Is omitted.

Next, the workpiece 40 to be measured is measured.
That is, the area sensor 50 detects the center coordinates of the light incident position on the measurement target surface 40s. The detected coordinates are {(x1, y1) (x2, y2) (x3, y3) (x
4, y4)}. At the time of this measurement, the area sensor 5
The positional relationship between 0 and the substrate 41 is set to be the same as the positional relationship between the area sensor 50 and the substrate 41 ′ in the previous measurement.

FIGS. 6B and 6C show the workpiece 4 to be measured.
1 shows a state of being inclined in the φ direction in FIG. 5, and (a) is a top view showing the measurement system,
(B) is a front view showing a captured image of the area sensor 50. In addition, FIGS. 6D and 6E show the workpiece 41 to be measured.
Shows that it is tilted in the ψ direction in FIG.
Each of (a) is a top view showing the measurement system, and (b) is
FIG. 4 is a front view showing a captured image of the area sensor 50.

Finally, based on the above detection result, the following calculation is performed to obtain φ direction, ψ direction in FIG.
The amount of tilt in the direction can be calculated.

[0050]

[Equation 2]

By calculating the amount of inclination of the work as described above, accurate adjustment of the inclination and simplification of defective product extraction can be realized.

[0052]

As described above, according to the position / tilt measuring method of the first and second aspects and the tilt measuring method of the third aspect, the position and the inclination of the parts of the precision equipment are Since the amount of misalignment can be detected, it is possible to accurately adjust the misalignment, confirm the misalignment on the manufacturing line, and extract defective products.

Further, since the position and inclination of the CCD element mounted on the CCD camera can be adjusted, an image without distortion can be obtained even when photographed at a high magnification.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a position / tilt measuring method according to a first embodiment.

FIG. 2 is a perspective view showing a configuration of an optical unit.

FIG. 3 is a perspective view showing a measurement system of the first embodiment.

FIG. 4 is a perspective view illustrating a position example of a position / tilt adjusting method.

FIG. 5 is a perspective view showing a measurement system of a second embodiment.

FIG. 6 is a diagram illustrating a position / tilt measuring method according to a second embodiment.

FIG. 7 is a perspective view showing a configuration of a main part of a CCD camera.

[Explanation of symbols]

 1, 2, 3, 4 rays 10 optical unit 15 CCD package 15a CCD element 15s imaging screen 40 work to be measured 50 area sensor

Claims (4)

[Claims] 1. An object to be measured is irradiated with four or more light rays, the incident positions of the four or more light rays on the object to be measured are measured, and the position of the object to be measured based on the measurement result. A position / tilt measuring method characterized by calculating a tilt shift amount. 2. The position / tilt measuring method according to claim 1, wherein the measurement of the incident position is performed by an area sensor arranged so as to be in parallel contact with a measurement target surface of the measurement target. 3. An object to be measured is irradiated with four or more light rays, and the incident positions of the four or more light rays on the object to be measured are
An inclination measuring method, comprising: measuring an area of a measurement target surface of an object to be measured with an area sensor, and calculating a deviation amount of the inclination of the measurement object based on the measurement result. 4. A method for adjusting the displacement of the position and inclination of a CCD element mounted on a CCD camera, wherein an optical unit for emitting four or more light beams is brought into close contact with the CCD camera, Irradiating four or more light rays to the CCD element, measuring the incident positions of the four or more light rays by the CCD element, and calculating the displacement amount of the position / tilt of the CCD element based on the measurement result. A method for adjusting the position and inclination of a CCD element, characterized in that the CCD element is moved by the calculated shift amount.