JPH08288674A - Frame earth connection structure of printed board - Google Patents

Frame earth connection structure of printed board

Info

Publication number
JPH08288674A
JPH08288674A JP9475395A JP9475395A JPH08288674A JP H08288674 A JPH08288674 A JP H08288674A JP 9475395 A JP9475395 A JP 9475395A JP 9475395 A JP9475395 A JP 9475395A JP H08288674 A JPH08288674 A JP H08288674A
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
shelf
printed board
connection structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9475395A
Other languages
Japanese (ja)
Inventor
Shuji Imai
修司 今井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Engineering Ltd
Original Assignee
NEC Engineering Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Engineering Ltd filed Critical NEC Engineering Ltd
Priority to JP9475395A priority Critical patent/JPH08288674A/en
Publication of JPH08288674A publication Critical patent/JPH08288674A/en
Withdrawn legal-status Critical Current

Links

Abstract

PURPOSE: To enable frame earth connection of a printed board, only by mounting the printed board on a shelf, when printed boards are mutually connected by using a back board on the rear of the shelf. CONSTITUTION: A roller 5 which is made of conducting material and installed on the front surface of a guide rail 4 fixed to a shelf 1, and a conductor surface 6 for frame earth which is installed on a printed board 3 are arranged at positions where electric connection is obtained when the printed board 3 is mounted on the shelf 3. The gap between a pair of the rollers 5 is set as the size which enables close contact connection of the conductor surface 6 for frame earth in the printed board 3 and the roller 5. The material which enables surface contact with the conductor surface 6 for frame earth in the printed board 3 is used for the roller 5. Thereby the conductor surface 6 for frame earth in the printed board 3 is brought into contact with the roller 5, and frame earth connection of the printed board 3 is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、電気通信機器に使用さ
れるプリント基板のアース接続構造に関し、特に静電対
策を必要とするプリント基板のフレームアース接続構造
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ground connection structure for a printed circuit board used in telecommunications equipment, and more particularly to a frame ground connection structure for a printed circuit board which requires countermeasures against static electricity.

【0002】[0002]

【従来の技術】従来、この種のプリント基板のフレーム
アース接続構造としては、次に述べる様な2つのものが
知られている。
2. Description of the Related Art Conventionally, the following two types of frame earth connection structures for printed circuit boards of this type are known.

【0003】その1つは、特開平1−95598号公報
に開示された「シェルフと回路ユニットとのフレームア
ース接続の構造」であり、図2(a)に示すように、シ
ェルフ1の構造部材1aと,プリント基板3用の表面板
9に設けた貫通ねじ8と、プリント基板3の前縁部固定
用の曲折部9aとにより、プリント基板3をフレームア
ースに導通させていた。
One of them is the "frame earth connection structure between the shelf and the circuit unit" disclosed in Japanese Patent Laid-Open No. 1-95598, and as shown in FIG. 2 (a), a structural member of the shelf 1 is provided. The printed circuit board 3 is electrically connected to the frame ground by 1a, the through screw 8 provided on the surface plate 9 for the printed circuit board 3, and the bent portion 9a for fixing the front edge of the printed circuit board 3.

【0004】もう1つは、実願昭63−138657号
のマイクロフィルム(実公平2−60291号公報)に
開示された「積層基板のフレームアース接続構造」であ
り、図2(b)に示すように、プリント基板3用の導電
部材製のガイドレール10とプリント基板3に設けた導
体部材11とが接触する寸法とし、導通させる方法であ
る。
The other is the "frame earth connection structure of laminated substrate" disclosed in Japanese Patent Application No. 63-138657, Microfilm (Japanese Utility Model Publication No. 2-60291), which is shown in FIG. 2 (b). As described above, the guide rail 10 made of a conductive member for the printed circuit board 3 and the conductor member 11 provided on the printed circuit board 3 are dimensioned to be in contact with each other, which is a method of electrical conduction.

【0005】[0005]

【発明が解決しようとする課題】上述したように、図2
(a)に示す従来のプリント基板のフレームアース接続
構造では、プリント基板3用の表面板9を利用している
ので、シェルフ1にプリント基板3を導通させるために
は表面板9が必要であった。
As described above, as shown in FIG.
In the conventional frame ground connection structure for a printed circuit board shown in (a), since the surface plate 9 for the printed circuit board 3 is used, the surface plate 9 is necessary to make the printed circuit board 3 conductive to the shelf 1. It was

【0006】また、図2(b)に示すように、プリント
基板3用のガイドレール10とプリント基板3に設けた
導体部材11とを導通させる方法は、ガイドレール10
の寸法精度を得るのが困難であり、プリント基板をガイ
ドレール10へ挿入する場合、プリント基板3とガイド
レール10とが相互に擦れるため、プリント基板2を挿
入するのが容易でなかった。
As shown in FIG. 2B, the guide rail 10 for the printed circuit board 3 and the conductor member 11 provided on the printed circuit board 3 are electrically connected by the guide rail 10 method.
It is difficult to obtain the dimensional accuracy of 1. and when the printed circuit board is inserted into the guide rail 10, the printed circuit board 3 and the guide rail 10 rub against each other, so that it is not easy to insert the printed circuit board 2.

【0007】本発明は上記の課題を解決するためになさ
れたもので、その目的は、プリント基板をシェルフに実
装するだけでプリント基板をフレームアース接続するこ
とができるプリント基板のフレームアース接続構造を提
供することにある。
The present invention has been made to solve the above problems, and an object of the present invention is to provide a frame ground connection structure for a printed circuit board, which enables the printed circuit board to be connected to the frame ground only by mounting the printed circuit board on a shelf. To provide.

【0008】[0008]

【課題を解決するための手段】本発明によれば、複数の
プリント基板をシェルフの背面に設けたバックボードで
相互接続する際に、各プリント基板をフレームアース接
続する構造において、前記シェルフはその内部に前記各
プリント基板を挿入するために使用されるガイドレール
と、該ガイドレールの前面に設けられた導電性部材製の
1対のローラとを備え、前記各プリント基板は、該各プ
リント基板を前記シェルフに実装したときに前記1対の
ローラと電気的に接続するような、前記各プリント基板
の両面の位置に設けられた導体面を有することを特徴と
するプリント基板のフレームアース接続構造が得られ
る。
According to the present invention, when a plurality of printed circuit boards are interconnected by a backboard provided on the back surface of the shelf, each printed circuit board is connected to the frame ground. A guide rail used to insert each of the printed circuit boards therein, and a pair of rollers made of a conductive member provided on the front surface of the guide rail, each of the printed circuit boards, Frame ground connection structure for a printed circuit board, which has conductor surfaces provided on both sides of each of the printed circuit boards so as to be electrically connected to the pair of rollers when mounted on the shelf. Is obtained.

【0009】上記プリント基板のフレームアース接続構
造において、前記1対のローラ間の隙間は、前記導体面
と前記1対のローラとが密着接続可能となる寸法である
ことが好ましい。また、前記1対のローラの材料は、前
記導体面と面接触できるものであるのが望ましい。
In the frame earth connection structure for the printed circuit board, the gap between the pair of rollers is preferably dimensioned so that the conductor surface and the pair of rollers can be closely contacted. Further, it is desirable that the material of the pair of rollers be one that can make surface contact with the conductor surface.

【0010】[0010]

【作用】ガイドレール前面に導電性部材製の一対のロー
ラを設置した構造であるので、プリント基板をシェルフ
に実装するだけで、プリント基板をフレームアース接続
ができる。
Since the pair of rollers made of a conductive member is installed on the front surface of the guide rail, the printed circuit board can be connected to the frame ground only by mounting the printed circuit board on the shelf.

【0011】[0011]

【実施例】以下、図面を参照して本発明の実施例につい
て詳細に説明する。
Embodiments of the present invention will now be described in detail with reference to the drawings.

【0012】図1は本発明の一実施例によるプリント基
板のアース接続構造を示す斜視図である。前面が開口し
た箱型のシェルフ1にプリント基板3が実装されてい
る。シェルフ1の背面にはバックボード2が設けられて
おり、プリント基板3はバックボード2に相互接続され
る。
FIG. 1 is a perspective view showing a ground connection structure for a printed circuit board according to an embodiment of the present invention. A printed circuit board 3 is mounted on a box-shaped shelf 1 having an open front surface. A backboard 2 is provided on the back surface of the shelf 1, and the printed circuit board 3 is interconnected to the backboard 2.

【0013】シェルフ1の底面には、プリント基板3を
シェルフ1内に挿入するために使用されるガイドレール
4が前後方向に沿って設けられている。ガイドレール4
の前面には導電性部材製の1対のローラ5が備えられて
いる。プリント基板3の両面には、プリント基板3をシ
ェルフ1に実装したとき、ローラ5と電気的に接続する
位置にフレームアース用導体面6が設けられている。
A guide rail 4 used to insert the printed circuit board 3 into the shelf 1 is provided on the bottom surface of the shelf 1 along the front-rear direction. Guide rail 4
A pair of rollers 5 made of a conductive member is provided on the front surface of the. On both sides of the printed circuit board 3, when the printed circuit board 3 is mounted on the shelf 1, frame ground conductor surfaces 6 are provided at positions electrically connected to the rollers 5.

【0014】ガイドレール4の前面に設けた1対のロー
ラ5間の隙間は、プリント基板3内のフレームアース用
導体面6とローラ5とが密着接続可能となるような寸法
である。ローラ5の材料は、フレームアース用導体面6
と面接触できるものを使用している。すなわち、プリン
ト基板3をシェルフ1に実装すると、プリント基板3内
のフレームアース用導体面6がローラ5と面接触し、こ
れにより、プリント基板3のフレームアース接続が行え
る。
The gap between the pair of rollers 5 provided on the front surface of the guide rail 4 is dimensioned so that the frame grounding conductor surface 6 in the printed circuit board 3 and the roller 5 can be closely contacted. The material of the roller 5 is the frame ground conductor surface 6
Uses one that can make surface contact with. That is, when the printed circuit board 3 is mounted on the shelf 1, the frame grounding conductor surface 6 in the printed circuit board 3 comes into surface contact with the roller 5, whereby the frame ground connection of the printed circuit board 3 can be performed.

【0015】[0015]

【発明の効果】以上説明したように、本発明のプリント
基板のフレームアース接続構造は、ガイドレール前面に
導電性部材製の一対のローラを設置した構造であるの
で、プリント基板をシェルフに実装するだけで、プリン
ト基板をフレームアース接続ができるという効果を奏す
る。
As described above, the frame earth connection structure of the printed circuit board of the present invention is a structure in which a pair of rollers made of a conductive member is installed on the front surface of the guide rail, so that the printed circuit board is mounted on the shelf. Only by doing so, the printed circuit board can be connected to the frame ground.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例によるプリント基板のフレー
ムアース接続構造を示す斜視図である。
FIG. 1 is a perspective view showing a frame ground connection structure for a printed circuit board according to an embodiment of the present invention.

【図2】従来のフレームアース接続構造を示す斜視図で
ある。
FIG. 2 is a perspective view showing a conventional frame ground connection structure.

【符号の説明】[Explanation of symbols]

1 シェルフ 2 バックボード 3 プリント基板 4 ガイドレール 5 ローラ 6 フレームアース用導体面 1 Shelf 2 Backboard 3 Printed circuit board 4 Guide rail 5 Roller 6 Frame Ground conductor surface

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 複数のプリント基板をシェルフの背面に
設けたバックボードで相互接続する際に、各プリント基
板をフレームアース接続する構造において、前記シェル
フはその内部に各プリント基板を挿入するために使用さ
れるガイドレールと、該ガイドレールの前面に設けられ
た導電性部材製の1対のローラとを備え、前記各プリン
ト基板は、該各プリント基板を前記シェルフに実装した
ときに前記1対のローラと電気的に接続するような、前
記各プリント基板の両面の位置に設けられた導体面を有
することを特徴とするプリント基板のフレームアース接
続構造。
1. In a structure in which a plurality of printed circuit boards are interconnected by a backboard provided on the back surface of the shelf, each printed circuit board is connected to a frame ground, and the shelf is provided for inserting each printed circuit board therein. A guide rail to be used and a pair of rollers made of a conductive member provided on the front surface of the guide rail are provided, and each printed circuit board has the pair of rollers when the printed circuit board is mounted on the shelf. A printed circuit board frame ground connection structure having conductor surfaces provided on both surfaces of each printed circuit board so as to be electrically connected to the roller.
【請求項2】 前記1対のローラ間の隙間は、前記導体
面と前記1対のローラとが密着接続可能となる寸法であ
る、請求項1記載のプリント基板のフレームアース接続
構造。
2. The frame ground connection structure for a printed circuit board according to claim 1, wherein the gap between the pair of rollers has a size such that the conductor surface and the pair of rollers can be closely contacted to each other.
【請求項3】 前記1対のローラの材料は、前記導体面
と面接触できるものである、請求項1記載のプリント基
板のフレームアース接続構造。
3. The frame ground connection structure for a printed circuit board according to claim 1, wherein the material of the pair of rollers is capable of making surface contact with the conductor surface.
JP9475395A 1995-04-20 1995-04-20 Frame earth connection structure of printed board Withdrawn JPH08288674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9475395A JPH08288674A (en) 1995-04-20 1995-04-20 Frame earth connection structure of printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9475395A JPH08288674A (en) 1995-04-20 1995-04-20 Frame earth connection structure of printed board

Publications (1)

Publication Number Publication Date
JPH08288674A true JPH08288674A (en) 1996-11-01

Family

ID=14118881

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9475395A Withdrawn JPH08288674A (en) 1995-04-20 1995-04-20 Frame earth connection structure of printed board

Country Status (1)

Country Link
JP (1) JPH08288674A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080070A1 (en) * 2005-01-27 2006-08-03 Fujitsu Limited Electronic device
CN104466540A (en) * 2013-09-13 2015-03-25 町洋机电(中国)有限公司 PCB electric connector module grounding structure

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006080070A1 (en) * 2005-01-27 2006-08-03 Fujitsu Limited Electronic device
US7637743B2 (en) 2005-01-27 2009-12-29 Fujitsu Limited Electronic device with a structure preventing a electromagnetic wave leak
CN104466540A (en) * 2013-09-13 2015-03-25 町洋机电(中国)有限公司 PCB electric connector module grounding structure
CN104466540B (en) * 2013-09-13 2016-07-06 町洋机电(中国)有限公司 The ground structure of PCB electric connector module

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20020702