JPH08287850A - Cathode-ray tube, display unit, and manufacture of cathode-ray tube - Google Patents

Abstract

PURPOSE: To realize prevention of static electricity on a panel by an effective and simple means in a cathode-ray tube of such a type that a function film is sticked to the surface of the panel. CONSTITUTION: A cathode-ray tube has a function film 11 bonded to the surface of a panel 1 having a phosphor surface 6 on an inner surface to emit light by radiation of an electron beam 8 from an electron gun 4. The function film 11 at least has a conductive film, and a reflection preventing film formed on the surface side of the conductive film 16, and a grounding electrode is formed by ultrasonic soldering electrically connected to the conductive film as the reflection preventing film exists between them in an outer range of an effective image plane on the surface of the function film 11.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD OF THE INVENTION The present invention relates to a cathode ray tube (hereinafter referred to as CRT).
Also referred to as), a display device and a method for manufacturing a cathode ray tube.

[0002]

2. Description of the Related Art CRT panels are produced by molding molten glass in a mold. However, since unevenness occurs on the surface of the panel during molding, the panel surface is polished before use. In the CRT manufacturing process, the polishing step occupies 20 to 30% of the panel cost, and the polishing process needs to be rationalized in order to meet the demand for the reduction of the CRT manufacturing cost. is there.

Further, with the increase in size and flat panel of the CRT, the panel tends to be thick in order to exhibit a predetermined explosion-proof performance, but if the panel becomes thick, the weight increases, which is not preferable. From these circumstances, a method of adhering the functional glass to the surface of the panel through an adhesive (PPG laminating method) without requiring the polishing accuracy of the panel surface so much and keeping the thickness itself thin,
Alternatively, a method of adhering a transparent functional film to the surface of a panel via an adhesive has been proposed.

In the former PPG laminating method, finish polishing of the panel is omitted, but steps such as taping are complicated, and the latter method is regarded as promising.

[0005]

However, in any of the methods, prevention of static electricity on the panel surface is a problem. The following two methods are known as the antistatic technique, but each has its own problems.

In the first method, an alcohol solution of silicon alkoxide in which a conductive filler such as tin-containing indium oxide or antimony-containing tin oxide is dispersed is sprayed on the face surface of the panel by a spraying method, and a relatively high temperature (15
This is a method of forming a conductive film on the surface of the panel by performing a baking process at 0 to 200 ° C. However, the conductive film formed by this method is extremely difficult to salvage after baking due to defective coating, and stains such as fingerprints adhere to the film when it is touched by the hand, resulting in deterioration of the quality of reproduced images. Further, this stain has a drawback that it is difficult to remove it with a dry wipe or a water wipe.

In the second method, an antireflection film composed of a transparent conductive film such as ITO and a multilayer optical thin film such as TiO ₂ or SiO ₂ is formed on the surface of a flat plate glass formed according to the curvature of the outer surface of the panel. The panel is attached to the outer surface of the CRT panel with an adhesive. Although this method is used for a part of a display tube, it has drawbacks such as difficulty in mass productivity and high manufacturing cost.

Further, it has been considered to include a transparent conductive film in the functional film attached to the surface of the panel, but an effective and simple means for grounding the transparent conductive film has been demanded. . The present invention has been made in view of such circumstances, and in a cathode ray tube of a type in which a functional film is attached to the surface of the panel, the structure of the cathode ray tube capable of realizing antistatic of the panel by effective and simple means. An object of the present invention is to provide a display device using the same and a method for manufacturing a cathode ray tube.

[0009]

In order to achieve the above object, a cathode ray tube according to the present invention is provided with a function on a surface of a panel having a fluorescent surface on its inner surface which is illuminated by an electron beam emitted from an electron gun. A cathode ray tube to which a film is adhered, wherein the functional film has at least a conductive film and an insulating film such as an antireflection film formed on the surface side of the conductive film, and the functional film has an effective surface. In the area outside the screen, a grounding electrode is formed by ultrasonic solder which is electrically connected to the conductive film with the insulating film interposed.

A display device according to the present invention is a display device in which a functional film is adhered to the surface of a panel on which an image is displayed, wherein the functional film is formed on a conductive film and a surface side of the conductive film. Having at least an insulating film such as an anti-reflection film, in the area outside the effective screen on the surface of the functional film,
A grounding electrode is formed by ultrasonic solder which is electrically connected to the conductive film with the insulating film interposed.

An antifouling film is formed on the surface of the antireflection film of the functional film as a countermeasure against adhesion of dirt.
It is preferable that a grounding electrode is formed on the antifouling film. A conductive tape is attached to the ground electrode,
The conductive film is preferably grounded through the conductive tape and the grounding electrode.

In the method of manufacturing a cathode ray tube according to the present invention, a conductive film and a conductive film are formed on the surface of a panel having an inner surface having a fluorescent screen that is illuminated by an electron beam emitted from an electron gun and glows. And a step of adhering a functional film having at least the antireflection film, and a step of forming a grounding electrode on the surface of the functional film outside the effective screen by ultrasonic soldering.

Before the formation of the ground electrode by the ultrasonic solder, it is preferable that the surface of the functional film is cleaned with ultraviolet rays. In the present invention, when forming the grounding electrode, an ultrasonic soldering iron is brought into contact with the surface of the functional film from an oblique direction, moved parallel to the surface of the functional film, and then separated from the oblique direction. preferable.

In the ultrasonic soldering iron, the axis of the iron is substantially perpendicular to the curved surface of the functional film,
It is preferable to move on the surface of the functional film.

[0015]

In a cathode ray tube, a display device having the cathode ray tube, or other display device, it is possible to reduce the reflection of external light on the surface of the panel on which an image is displayed and to reproduce a preferable image or character information. For the purpose, a functional film having an antireflection film or the like laminated on the surface side may be adhered. Moreover, in order to make it difficult for dirt (for example, a finger print) to adhere to the surface, it is preferable that an antifouling film is formed on the outermost surface of the functional film. These antireflection film and antifouling film generally have insulating properties.

From the viewpoint of preventing the panel surface from being charged, it is preferable that the functional film contains a conductive film. In order to exert the antireflection effect of the antireflection film well, it is preferable to configure the functional film so that the antireflection film is located on the surface side of the conductive film.

However, when a functional film having an insulating film such as an antireflection film on the surface side of the conductive film is bonded to the surface of the panel, grounding of the conductive film becomes a problem. In order to achieve grounding with the conductive film, in the conventional method,
It is conceivable to remove a part of the insulating film such as the antireflection film and then attach a conductive tape to the part to establish conduction with the conductive film. However, this method requires a difficult work such as removing a part of the insulating film and is not practical.

The inventors of the present invention have diligently studied a technique for preventing electrostatic charge on the panel surface of a cathode ray tube and a display device having a panel to which a functional film is adhered by an effective and simple means. By conducting ultrasonic soldering on the insulating film, it was found that the grounding electrode formed by the ultrasonic solder is electrically connected to the conductive film on the insulating film, and the present invention has been completed.

In the present invention, it is possible to connect the grounding electrode and the conductive film in the functional film only by forming the grounding electrode by ultrasonic solder from above the functional film having the insulating film on the surface side. . Therefore, by attaching a conductive tape to the grounding electrode, the conductive film can be grounded and the surface of the panel can be effectively prevented from being charged.
It is also effective as a countermeasure against electromagnetic waves.

By cleaning the surface of the functional film with ultraviolet rays before forming the grounding electrode by ultrasonic soldering on the surface of the functional film, the wettability with the solder is improved, and at a lower solder temperature, it becomes stronger. The grounding electrode can be connected. On the surface of the functional film, if a functional film having an antifouling film having a fluorine group or the like is formed on the surface, since it has both non-adhesiveness that stains are hard to attach and lubricity that stains are easily removed, The surface does not become dirty, and even if it becomes dirty, it is easy to remove it, and the image quality is improved.

When forming the grounding electrode by ultrasonic soldering, the ultrasonic soldering iron is brought into contact with the surface of the functional film in an oblique direction (landing), and is moved parallel to the surface of the functional film, and then obliquely. It is preferable to separate from the direction for the following reason.

Even if the soldering iron is landed on the functional film from the direction perpendicular to the surface of the functional film and then moved parallel to the surface of the functional film,
This is because the solder does not extend well along the surface of the functional film. Therefore, as in the present invention, when the soldering iron is brought close to the functional film, it is also preferable to move the soldering iron in the traveling direction of the soldering iron so that the soldering iron is landed on the surface of the functional film from an oblique direction.

Further, when the soldering iron is moved in parallel with the surface of the functional film and then pulled up in the vertical direction, the viscosity of the solder pulls up the rearmost portion of the solder in the vertical direction, and the soldering iron is grounded. The thickness exceeds the permissible electrode. In the present invention, since the soldering iron is separated from the oblique direction, the rearmost portion of the solder extends along the traveling direction of the soldering iron, and the thickness of the grounding electrode obtained does not increase.

In the present invention, when the ground electrode is formed by ultrasonic solder, the ultrasonic soldering iron is placed on the surface of the functional film so that the axis of the iron is substantially perpendicular to the curved surface of the functional film. The reason why it is preferable to move along is for the following reason.

This is because, if the axis of the iron is inclined, the solder forming position may shift to both sides or one side around the position where the solder should originally be formed. In the present invention, the ultrasonic soldering iron is moved along the surface of the functional film so that the axis of the iron is substantially perpendicular to the curved surface of the functional film, so that the solder is satisfactorily placed at the desired position. Can be turned on.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A cathode ray tube, a display device and a method for manufacturing a cathode ray tube according to the present invention will be described in detail below with reference to the embodiments shown in the drawings. 1 is a schematic sectional view of a cathode ray tube according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view of an essential part of a II portion shown in FIG. 1, FIG. 3 is a diagram showing an example of a spectral reflectance of an antireflection film, 4 is a cross-sectional view of a main part of a functional film provided with a ground electrode, FIG. 5 is a diagram showing a position where a ground electrode is provided, FIG. 6 is a graph showing an antistatic effect of the functional film,
FIG. 7 is a graph showing the relationship between the surface resistance value and the leakage electric field strength ratio.

The color cathode ray tube according to an embodiment of the present invention shown in the first embodiment FIG. 1 (CRT), a vacuum container is constituted by a panel 1 and a funnel 2 and a neck tube 3, the panel 1 and a funnel 2 Is
Bonded with frit glass. A tension band 9 is wound around the outer periphery of the panel 1 for explosion protection.
Mounting ears 10 are formed on the outer circumference of the tension band 9, and the CRT is mounted inside the television as a display device via the mounting ears 10. The tension band 9 or the mounting ear portion 10 is made of a conductive material such as metal and is grounded through a ground wire 20.

On the inner surface of the panel 1, a phosphor screen 6 coated with phosphors for emitting blue, green and red light is formed, and a color selection mask 5 is arranged in the vicinity of this phosphor screen 6. The color selection mask 5 is held by a mask holding frame, and a magnetic shield 7 is attached to the electron gun side of the mask.

The electron beam 8 from the electron gun 4 housed in the neck 3 passes through the color selection mask 5 and reaches the phosphor screen 6 formed on the inner surface of the panel to excite a predetermined phosphor to emit light. As shown in detail in FIG. 2, a functional film 11 is adhered to the surface of the panel 1 with an ultraviolet curable resin 12.

The functional film 11 is, as shown in FIG.
Transparent plastic film substrate 18, hard coat film 17, conductive film 16, antireflection film 15, antifouling film 1
It is composed of 4 and. As a material for the transparent plastic film substrate 18, polyethylene terephthalate (P
ET), polycarbonate (PC), polymethyl acrylate (PMMA), styrene methyl methacrylate (MS), polystyrene (PS) and the like. The thickness of the substrate 18 is not particularly limited, but is, for example, 50.
It is preferably about 250 μm.

On the transparent plastic film substrate 18, for the purpose of reinforcing the surface hardness and abrasion resistance of the functional film 11, a thin film layer (3 to 10 μm) of an acrylic ultraviolet curing resin is used.
m) is formed on the hard coat layer 17, and an ITO thin film (1) formed on the hard coat layer 17 by the evaporation method or the sputtering method.
The transparent conductive film 16 of 5 nm to 150 nm) is formed.

The antireflection film 15 for reducing the reflection of external light and reproducing preferable image and character information is composed of a multilayer optical thin film. The antireflection effect of the multilayer optical thin film is obtained by alternately laminating thin film materials having different refractive indexes. As a low refractive index material, magnesium fluoride (Mg
F2), silicon oxide (SiO2) or the like is used, and as the high refractive index material, titanium oxide (TiO2), tantalum oxide (Ta2 O5), zirconium oxide (ZrO2) or the like is used. The thickness of the antireflection film 15 is not particularly limited, but is preferably about 210 to 260 nm in the case of four layers, for example.

FIG. 3 shows an example of the spectral reflectance of a multilayer optical thin film as an antireflection film. As shown, it has a good antireflection effect. The antifouling film 14 formed on the outermost surface of the functional film 11 is unlikely to have dirt such as fingerprints attached when the surface is directly touched, and the adhered dirt can be wiped dry.
Can be easily removed by wiping with water. As a material for forming the antifouling film 14, a thin film of a coating agent containing a perfluoro group on a silicone resin base or a coating agent containing a perfluoro group on an acrylic resin base is used.

Conductive film 16 formed on functional film 11
Is a conductive tape 1 adhered to a plurality of positions on the outer periphery of the functional film 11 shown in FIG. 1 by means described later.
3, the tension band 9 and the mounting ear 10 are connected to the ground, and the tube surface charge is released to the ground to provide an antistatic effect. The conductive tape 13 is not particularly limited, but, for example, a metal foil tape is used.

Next, the reason why grounding is necessary will be described. Aluminum (Al) is vapor-deposited on the phosphor surface of the inner surface of the panel 1 shown in FIG. 1, and a carbon layer is coated on the inner surface of the funnel 2 to stabilize the potential of the inner wall of the cathode ray tube. It is configured to let. When a high voltage is applied to the anode, the applied high voltage is applied to the inner wall of the cathode ray tube, and the surface of the panel 1 is positively charged by electrostatic induction. Since this electrostatic induction itself is unavoidable, the conductive film 16 is laminated in the functional film 11 and the conductive film 16 is connected to the ground electrode via the conductive tape 13 in order to release the charged voltage. . A carbon film is formed on the outer surface of the funnel 2 and is connected to the ground electrode.

As a guideline, there is a Swedish standard (MPR-II) for the prevention of electrostatic charge of a cathode ray tube such as a display tube. Room temperature 2 according to MPR-II standard
The surface potential of the cathode ray tube 20 minutes after the power switch was turned on (ON) or off (OFF) was measured in an environment where the temperature was 1 ° C to 22 ° C and the relative humidity was 21% to 40% and dried at room temperature. It is supposed to be within 500V. To cope with this, a surface resistance value of about 10 10 Ω / port or less is required.

FIG. 6 is a characteristic diagram for explaining the antistatic function of the conductive film 16 in the cathode ray tube to which the functional film 11 of this embodiment is adhered. The curves Q1 and Q2 are 17
The surface resistance value between the conductive tapes attached to both ends of the functional plastic film adhered to the inch cathode ray tube surface is 10 9 Ω /
Fig. 4 shows changes in the potential on the surface of the cathode ray tube when the power is turned on and off, using the cathode ray tube of the mouth. Compared to the characteristic curves L1 and L2 of the cathode ray tube having no antistatic function, the charge-up is greatly reduced in this embodiment.

On the other hand, the standard (MPR-II) is also applied to the AC electric field which is the source of the deflection yoke and the high voltage transformer.
And guidelines (TCO) are provided. In order to comply with these standards, a method of lowering the surface resistance value of a cathode ray tube such as a display tube has been taken as one countermeasure.

FIG. 7 shows an example of countermeasures for a 17-inch display tube. As a countermeasure against electromagnetic waves leaking from the face surface of the cathode ray tube, a conductive film attached to both ends of a functional film adhered to the panel surface of the cathode ray tube. The relationship between the surface resistance value between the tapes and the electromagnetic wave prevention effect is shown.

As shown in FIG. 7, in the case of the 17-inch display tube, if the surface resistance value between the conductive tapes attached to the functional film adhered to the panel surface is 2 KΩ or less, this standard can be cleared without any problem. confirmed. FIG.
Conductive tape 1 attached to both ends of the functional film 11 shown in
In order to improve the surface resistance value between the three, the antireflection film 15 and the antifouling film 14 which are interposed between the conductive film 16 shown in FIG. 2 and the conductive tape 13 shown in FIG. There is a method of lowering the resistance value by penetrating.

In this embodiment, as shown in FIGS.
On the antifouling film 14 of the functional film 11 using the transparent plastic film substrate 18 made of PET or the like, the ground electrode 19 is formed in the area outside the effective screen by ultrasonic solder used for bonding glass or ceramic. Table 1 below shows the conditions when the ground electrode 19 is formed on the functional film 11 using the PET material as the substrate 18 by using Asahi Glass's trade name: Cerasolzer W123 (melting point 123 ° C.) as ultrasonic solder. Indicates.

[0042]

[Table 1]

The numbers in the horizontal columns in Table 1 above are the output (W: wattage) of the ultrasonic oscillator, and the numbers in the vertical columns are the temperature of the iron. From the results shown in Table 1, it was found that the solder did not melt at the soldering iron temperature of 140 ° C., but at 170 ° C., the solder melted but the adhesive strength to the functional film surface was weak and the solder easily peeled off.

At a soldering iron temperature of 195 to 220 ° C.,
It was found that the adhesive force with the surface of the functional film 11 was strong regardless of the ultrasonic oscillator output: 2 to 10 W. At the soldering iron temperature of 250 ° C., the functional film 11 was deformed. The heat distortion temperature of "PET" is 200 ° C and the melting point thereof is 263 ° C.

In FIG. 5, Cerasolza W123 (trade name of Asahi Glass Co., Ltd.) solder is used on both ends of the functional film 11,
The electrode 19 formed at a trowel temperature of 200 ° C. and an ultrasonic oscillator output of 5 W is shown. The width a of each electrode 19 is 3 mm,
The length b is 9 mm, and the distance e between the electrodes 19 on both ends is 35 mm.
The pitch d between the electrodes 19 at each end is 55 mm.
And A position (or 1 position) to E position (or 5)
The distance C to the position) is 220 mm. The thickness of each electrode 19 was 0.1 mm or less.

Table 2 shows the results of the measured surface resistance values between the electrodes 19 at positions 1 to 5 and the electrodes at positions A to E.

[0047]

[Table 2]

The functional film 1 with the electrode 19 described above
No. 1 had no change in the adhesive force of the electrodes 19 and the surface resistance value between the electrodes 19 after the heat cycle test at −40 ° C. to + 70 ° C. for 36 hours. As shown in Table 2, it was confirmed that the surface resistance value was 2 KΩ or less. Therefore, together with the results shown in FIG. 7, it was confirmed that the surface resistance value was 2 KΩ or less, so that the standard regarding electromagnetic wave prevention could be cleared without any problem. Further, as shown in FIG. 4, even if the antireflection film 15 and the antifouling film 14 are present between the electrode 19 and the conductive film 16, they can be electrically conducted by the ultrasonic solder. confirmed.

Next, in order to improve the wettability of the ultrasonic solder on the antifouling film 14, the surface of the functional film 11 was washed with ultraviolet rays using ultraviolet rays and ozone. A low-pressure mercury lamp that emits ultraviolet rays of 184.9 nm and 253.7 nm is used for UV cleaning, and stains (organic substances) attached to the surface of the functional plastic film are decomposed to create an active surface.
The electrode 19 was formed on this surface by ultrasonic soldering.

Table 3 below shows the effect of ultrasonic solder adhesion with and without UV cleaning.

[0051]

[Table 3]

Ultraviolet irradiation amount is 360 millijoule / cm
2 improves the wettability of the solder on the surface of the antifouling film 14, and the electrode 1 has a strong adhesive force even when the soldering iron temperature is 170 ° C.
It was confirmed that 9 could be formed. The specifications of the ultrasonic solder power source used in the above embodiment are as follows.

Ultrasonic oscillating frequency: 60 KHz ± 5 KHz Ultrasonic oscillating output: Rated 15 W (maximum) Effective 10 W (maximum) Next, an example of a method for manufacturing the CRT according to this embodiment will be described.

As the panel 1 shown in FIG. 1, a panel whose outer surface has not been polished is prepared, a phosphor screen 6 is formed on the inner surface of the panel 1, and a color selection mask 5 is mounted on the panel 1.
CRT with explosion-proof band
To manufacture. After that, the surface of the panel 1 of the CRT is sequentially washed with a cleaning liquid, pure water, and an alcohol solvent, and then dried.

Next, the ultraviolet curable resin 12 is applied to the surface of the panel 1. As the ultraviolet curable resin 12, a resin obtained by adjusting the refractive index of the cured product to be within 0.8% of the refractive index of the panel 1 is used. In the present embodiment, as the ultraviolet curable resin, bisphenol A type epoxy (meth) acrylate having a molecular weight of 550 or more: 10 wt%, urethane (meth) acrylate: 20 wt%,
Hydroxyl group-containing mono (meth) acrylate: 70% by weight,
A composition containing a photopolymerization initiator: 3% and an additive: several% is used.

The application of the ultraviolet curable resin 12 is performed by a known method such as a flow coating method, a roll coating method or a bar coating method after defoaming the air bubbles contained therein before the coating. You can Next, the functional film 11 cut into a shape corresponding to the front shape of the panel 1 is attached to the application surface of the ultraviolet curable resin 12. As the functional film 11, the one shown in FIG. 4 is used in the present embodiment.

After that, the functional film 11 is pressed against the surface of the panel 1 by using a pressure roll or the like to make the thickness of the ultraviolet curable resin 12 uniform so that no streaks or wrinkles appear on the surface. The thickness of the ultraviolet curable resin 12 is 0.05 to
About 2.5 mm is preferable. As the pressure roll, a metal roll, a hard rubber roll, a rubber lining metal roll, or the like can be used.

Next, ultraviolet rays are irradiated from above the functional film 11 using an irradiation light source to cure the ultraviolet curable resin 12. A metal halide lamp,
A high pressure mercury lamp, a xenon lamp or the like can be used, and the irradiation energy is 300 to 500 mJ /
cm2 is suitable.

After that, the ground electrode 19 as shown in FIGS. 4 and 5 is formed by ultrasonic solder in a region other than the effective screen of the functional film 11. The number of ground electrodes 19 formed and the formation interval are not particularly limited, and are determined so as to obtain desired antistatic effect and electromagnetic wave preventive effect. The other ultrasonic soldering conditions are the same as those described above. Further, as described above, the functional film 11 is placed before the ultrasonic soldering.
It is preferable that the surface of the is washed with ultraviolet rays under the conditions as described above. This UV cleaning may be performed before or after the functional film 11 is bonded to the panel.

Thereafter, the conductive tape 13 is attached to a plurality of locations or the entire circumference of the functional film 11 in correspondence with the ground electrode 19, and the ground electrode 19 and the tension band 9 are provided.
And the conductive film 16 shown in FIG. 4 is grounded. Second Embodiment In this embodiment, the CRT is performed in the same manner as in the above embodiment except that the ultrasonic soldering method for forming the ground electrode 19 on the surface of the functional film 11 is performed by the following method.
To manufacture. In the following description, description of the parts common to the first embodiment will be omitted, and only different parts will be described.

In this embodiment, as shown in FIG. 8A, the ultrasonic soldering iron 30 is used to form the ground electrode 19. First, the soldering iron 30 having the solder 19a attached to its tip is brought close to the surface of the functional film 11 and, at the same time, moved in the coating direction Y (parallel to the film surface). As a result, the soldering iron 30 makes a landing with respect to the surface of the functional film 11 from an oblique direction, as indicated by an arrow X.

Then, the soldering iron 30 is attached to the functional film 1.
It is moved in the direction Y parallel to the surface of No. 1 and then separated from the diagonal direction Z. As shown in FIG. 8 (A), when the ground electrode is formed by ultrasonic solder, the ultrasonic solder trowel 30 is contacted obliquely to the surface of the functional film (landing), and The reason why it is preferable to move in parallel with each other and then to separate from the oblique direction is as follows.

As shown in FIG. 8B, the functional film 1
Even if the soldering iron 30 is landed on the functional film 11 from the direction V perpendicular to the surface of the functional film 11 and then moved in the parallel direction Y with respect to the surface of the functional film 11, the solder 19a runs along the surface of the functional film 11. Because it does not extend well. If the pressing force of the soldering iron 30 is too large, the tip of the iron 30 may penetrate the film 11 as shown in FIG.

Therefore, as in the present embodiment shown in FIG. 8A, when the soldering iron 30 is brought close to the functional film 11, it is also moved in the traveling direction Y of the iron 30 and, as a result, the iron 30 Is preferably landed on the surface of the functional film 11.

Further, as shown in FIG. 8D, when the soldering iron 30 is moved in parallel to the surface of the functional film 11 and then the soldering iron 30 is pulled up in the vertical direction, the viscosity of the solder causes Last part 19b of solder
Is pulled up in the vertical direction, resulting in a thickness t'exceeding the thickness t (FIG. 8A) allowed as the grounding electrode. In the present embodiment, as shown in FIG. 8A, the soldering iron 30 is separated from the oblique direction, so that the tail portion 19b of the solder extends along the traveling direction of the soldering iron 30, and the thickness of the grounding electrode 19 obtained. t does not increase.

In the present embodiment, as shown in FIG. 9, when the trowel 30 is landed, moved in parallel, and moved apart, the axis of the trowel 30 is moved so as to be substantially perpendicular to the surface of the film 11. . That is, in this embodiment, the angles θ ₁ , θ ₂ , θ ₃ , and θ ₄ between the axis of the iron 30 and the surface of the film 11 are substantially vertical.

In the present embodiment, when the ground electrode 19 is formed by ultrasonic solder, the ultrasonic solder iron 30
Is preferably moved along the surface of the functional film 11 so that the axis of the trowel 30 is substantially perpendicular to the curved surface of the functional film 11 for the following reason.

For example, when the axis of the iron 30 is inclined so that θ ₁ is slightly larger than θ _{2 with} respect to the traveling direction Y in FIG. 9, it is effective in terms of solder feeding. However, depending on the iron tip temperature and the iron tip load, as shown in FIGS. 10 (A) and 10 (B), the solder 19c may be formed on both sides of the position 32 to be originally attached. Further, in this case, the residue of the film 11 is likely to adhere to the tip of the trowel 30,
Not preferred.

Further, when the iron 30 is inclined with respect to the film surface so that θ ₃ or θ ₄ shown in FIG. 9 are not equal, as shown in FIG.
The formation position of d may be shifted to one side. In the present embodiment, the ultrasonic soldering iron 30 is moved along the surface of the functional film 11 so that the axis of the iron 30 is substantially perpendicular to the curved surface of the functional film 11, so that the ultrasonic soldering iron 30 is placed at a desired position. The ground electrode 19 can be formed by soldering well.

In the present embodiment, the pressing force of the trowel 30 against the surface of the film 11 varies depending on the traveling speed of the parallel movement in the Y direction shown in FIG.
It is about 0 to 700 g, and it is preferable to increase the traveling speed in direct proportion to the pressing force.

The temperature of the tip of the iron 30 is 110-110.
About 150 ° C is preferable, but it is preferable to increase the traveling speed in proportion to the temperature of the iron tip. Although the traveling speed in the arrow Y direction shown in FIG.
It is preferably 0 mm / sec.

Furthermore, in the present embodiment, the grounding electrode is formed by soldering by one run of the iron 30. This is because, if the solder is made to travel twice or more, the solder that has already adhered may be squeezed out by the tip of the iron during the second and subsequent runs. Grounding electrode 19 according to the present embodiment
In the forming method, the sheet surface is soldered manually, but it can be automated, which contributes to labor saving at the work site. Further, by automating the formation of the grounding electrode, it is possible to make the amount of solder used constant and to improve the quality of the grounding electrode.

The present invention is not limited to the above-mentioned embodiment, but can be variously modified within the scope of the present invention. For example, the antistatic structure and method for a panel surface according to the present invention can be applied not only to a cathode ray tube but also to a display device having such a cathode ray tube or all display devices having a panel on which an image is displayed. it can.

[0074]

As described above, according to the present invention, the ground electrode and the functional film are formed only by forming the ground electrode by ultrasonic solder on the functional film having the insulating film on the surface side. The connection with the conductive film inside becomes possible.
Therefore, by attaching a conductive tape to the grounding electrode, the conductive film can be grounded and the surface of the panel can be effectively prevented from being charged. In addition, measures against electromagnetic waves (E
It is also effective for LF / VLF).

If the surface of the functional film is cleaned with ultraviolet rays before forming the grounding electrode by ultrasonic soldering on the surface of the functional film, the wettability with the solder is improved, and at a lower solder temperature, it becomes stronger. The grounding electrode can be connected. On the surface of the functional film, if a functional film having an antifouling film having a perfluoro group formed on the surface is used, it has both non-adhesiveness that stains are hard to adhere and lubricity that stains are easily removed. The surface does not become dirty, and even if it becomes dirty, it is easy to remove it, and the image quality is improved.

Compared to the method of adhering the glass plate to the surface of the panel, in the method according to the present invention, when the surface of the adhered functional film has a defect or is damaged, the functional film is removed from the panel. It can be easily peeled off and easily re-bonded.

[Brief description of drawings]

FIG. 1 is a schematic sectional view of a cathode ray tube according to an embodiment of the present invention.

FIG. 2 is an enlarged cross-sectional view of a main part of a II portion shown in FIG.

FIG. 3 is a diagram showing an example of a spectral reflectance of an antireflection film.

FIG. 4 is a cross-sectional view of a main part of a functional film provided with a ground electrode.

FIG. 5 is a diagram showing a position where a ground electrode is provided.

FIG. 6 is a graph showing the antistatic effect of the functional film.

FIG. 7 is a graph showing a relationship between a surface resistance value and a leakage electric field strength ratio.

FIG. 8A to FIG. 8D are schematic views showing an example of ultrasonic solder by a soldering iron.

FIG. 9 is a schematic view showing a relationship between angles of a soldering iron and a functional film.

10 (A), (B) and (C) are schematic views showing an unfavorable example of ultrasonic soldering by a soldering iron.

[Explanation of symbols]

1 ... Panel, 2 ... Funnel, 3 ... Between necks, 4
... Electron gun, 5 ... Color selection mask, 6 ... Fluorescent screen, 7 ... Magnetic shield, 8 ... Electron beam, 9 ... Tension band, 10 ... Mounting ear, 11 ... Functional film, 12
... UV curable resin, 13 ... Conductive tape, 30 ... Soldering iron.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Tatsuya Soma 30 Ibarjima, Oya-cho, Inazawa-shi, Aichi Sony Inazawa Corporation

Claims (12)

[Claims] 1. A cathode ray tube in which a functional film is adhered to the surface of a panel having a fluorescent surface which is illuminated by an electron beam emitted from an electron gun and shines, the functional film being a conductive film. At least an insulating film formed on the surface side of the conductive film, and a super conductive film electrically connected to the conductive film in a state outside the effective screen on the surface of the functional film with the insulating film interposed. A cathode ray tube with a grounding electrode formed by sonic solder. 2. The anti-fouling film as a countermeasure against adhesion of dirt is formed on the surface of the antireflection film of the functional film, and the grounding electrode is formed on the anti-fouling film. The cathode ray tube described in. 3. A conductive tape is attached to the ground electrode, and the conductive tape and the ground electrode are passed through the conductive tape.
The cathode ray tube according to claim 1, wherein the conductive film is grounded. 4. A display device in which a functional film is adhered to a surface of a panel on which an image is displayed, the functional film including a conductive film and an insulating film formed on a surface side of the conductive film. A display device having at least a grounding electrode by ultrasonic solder, which is electrically connected to the conductive film with the insulating film interposed, in an area outside the effective screen on the surface of the functional film. 5. The antifouling film as a measure against adhesion of dirt is formed on the surface of the antireflection film of the functional film, and the grounding electrode is formed on the antifouling film. Display device according to. 6. A conductive tape is attached to the grounding electrode, and the conductive tape and the grounding electrode are passed through the conductive tape.
The display device according to claim 4, wherein the conductive film is grounded. 7. A function having at least a conductive film and an antireflection film formed on a surface side of the conductive film on a surface of a panel having a fluorescent screen which is illuminated by an electron beam emitted from an electron gun and glows. A method of manufacturing a cathode ray tube comprising: a step of adhering a film; and a step of forming an electrode for grounding with ultrasonic solder in an area outside the effective screen on the surface of the functional film. 8. The method of manufacturing a cathode ray tube according to claim 7, wherein a conductive tape is attached to the ground electrode, and the conductive film is grounded through the conductive tape and the ground electrode. 9. The method for producing a cathode ray tube according to claim 7, wherein the functional film having an antifouling film formed on its outermost surface is used. 10. The method of cleaning a cathode ray tube according to claim 7, wherein the surface of the functional film is cleaned with ultraviolet rays before the grounding electrode is formed by the ultrasonic solder. 11. When forming the grounding electrode, an ultrasonic soldering iron is brought into contact with the surface of the functional film in an oblique direction, moved parallel to the surface of the functional film, and then separated from the oblique direction. 7. The method according to claim 7,
A method of manufacturing a cathode ray tube according to. 12. The ultrasonic soldering iron according to claim 11, wherein the surface of the functional film is moved such that an axis of the iron is substantially perpendicular to a curved surface of the functional film. Method for manufacturing cathode ray tube.