JPH08287823A - Protection film forming method of ac gas discharge pannel - Google Patents

Abstract

PURPOSE: To improve performance of an AC-PDP pannel by forming a film for protecting a dielectric for accumulating wall electric charge of the AC-PDP by a screen printing method. CONSTITUTION: A paste for forming a protection film is prepared by mixing an organic Mg of monomolecule, organic polymer wall and organic solvent. The paste is printed on a dielectric for accumulating electric charge 16 and thereafter it is baked form a protection film 18 composed of MgO. With such a paste, an MgO protection film 18 can be formed without a pin hole and with high purity.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a protective film for covering a wall charge storage dielectric of an AC gas discharge panel.

[0002]

2. Description of the Related Art Conventionally, in an AC type gas discharge panel, the purpose is to extend the life of the panel and improve its characteristics.
The wall charge storage dielectric is covered with a MgO protective film. As a method of forming the MgO protective film, for example, the literature: Technical Report of the Television Society, IDY94-14.
As disclosed in p1 to p6, a thin film forming technique or a screen printing method is used.

[0003]

However, in the case of forming the MgO protective film used in the AC type gas discharge panel of the large screen display by the thin film forming technique, a large thin film forming device such as a vapor deposition device is required. The large-sized thin film forming apparatus is expensive, and the running cost of the large-sized thin film forming apparatus is also high. On the other hand, by screen printing, MgO
If the protective film is formed, a cheaper device can be used and the running cost of the device can be reduced. However, when the protective film of AC-PDP is formed by the conventional method,
The panel characteristics of the AC-PDP, such as the discharge starting voltage, the discharge sustaining voltage and the luminous efficiency, are inferior to those of the cathode ray tube (CRT).

An object of the present invention is to solve the above-mentioned conventional problems and to provide a method for forming a protective film capable of obtaining better panel characteristics by a screen printing method.

[0005]

In order to achieve this object, a method for forming a protective film for an AC type gas discharge panel according to the present invention comprises a metal oxide on a wall charge storage dielectric of the AC type gas discharge panel. In forming a protective film made of, a mixed solution of a single molecule of an organometallic compound, an organic polymer, and an organic solvent was used as a paste for forming the protective film, and this paste was used as a dielectric for wall charge storage. It is characterized in that the protective film is formed by printing on top and then baking.

According to such a method, a monomolecular organometallic compound, an organic polymer and an organic solvent are mixed to prepare a paste for forming a protective film. Therefore, by firing this paste, it is possible to oxidize the metal component of the organometallic compound to generate a metal oxide and obtain a protective film made of this metal oxide.

Further, the organic metal compound, the organic polymer and the organic solvent are organic substances, and these organic components are
By heating the paste during firing, it is gasified and dissipated into the firing atmosphere. Moreover, since the organometallic compound is not a polymer but a single molecule, it is possible to easily separate the metal component and the organic component of the organometallic compound by heating during firing of the paste, and thus the organic component of the organometallic compound during firing of the paste. Can be easily gasified.

Therefore, since the organic components remaining in the metal oxide forming the protective film can be reduced, the purity of the metal oxide forming the protective film can be increased. Further, since the remaining organic components can be reduced, it is possible to form a protective film in which pinholes are less likely to occur in the metal oxide serving as the protective film and which have few pinholes.

Further, by mixing an organic polymer, it is possible to prevent a single molecule of organometallic compound from gelling,
Therefore, it is possible to prevent the paste for forming the protective film from being hard to print due to the gelation.

[0010]

【Example】

(First Embodiment) First, as a first embodiment, an example of forming the MgO protective film of the AC gas discharge panel shown in FIG. 1 will be described.

FIG. 1 is a perspective view of a main part schematically showing the basic structure of an AC type gas discharge panel according to the first embodiment. An AC type gas discharge panel (hereinafter referred to as AC-PDP) 10 shown in the figure is a surface discharge type panel.
A plurality of pairs of display electrodes 14 are provided on the back plate 12 of the DP 10.
Are arranged in parallel. And these display electrodes 1
4 is covered with a wall charge storage dielectric 16 and the wall charge storage dielectric 16 is covered with a protective film 18 over the entire surface. A phosphor layer 22 and barrier ribs (not shown) are provided on the front plate 20 of the AC-PDP 10.

Then, the back plate 12 and the front plate 20 are opposed to each other through the discharge space 24 and sealed, and the discharge gas is sealed in the discharge space 24.

When an AC voltage is applied between the pair of display electrodes 14 corresponding to each other, the wall charges caused by the wall charge storage dielectric 16 are accumulated on the protective film 18, and the charges are passed through the discharge space 24. Is discharged. The phosphor 22 is excited to emit light by the ultraviolet rays generated by this discharge.

Next, a method of forming the MgO protective film will be described together with a description of the manufacturing process of the AC-PDP 10.

First, soda lime glass is prepared as the back plate 12. Then, on the back plate 12, Ag paste (ES manufactured by Electro Science Laboratories, Inc.
L-590) is printed (printing is performed by a screen printing method.
same as below. Then, a terminal pattern for forming the display electrode terminal is formed. After that, change the terminal pattern to 150
Heat at 15 ° C for 15 minutes to dry.

Next, an Au paste (A-4615 manufactured by NE Chemcat) is printed on the terminal pattern to form an electrode pattern for forming the display electrode 14. Then, the electrode pattern is heated at 150 ° C. for 15 minutes to be dried. Next, the terminal pattern and the electrode pattern are heated and baked at 580 ° C. for 12.5 minutes to obtain a display electrode terminal including the baked terminal pattern and a display electrode 14 including the baked electrode pattern.

Next, a dielectric paste (G3-0496 manufactured by Okuno Chemical Industries Co., Ltd.) is printed on the display electrodes 14 to form a dielectric pattern for forming the wall charge storage dielectric 16. After that, apply the dielectric pattern at 150 ° C for 15
Heat for minutes to dry. Then, the dielectric pattern is
It is heated and baked at 0 ° C. for 12.5 minutes to obtain a wall charge storage dielectric 16 composed of the baked dielectric pattern.

Next, a dielectric paste (9741 manufactured by DuPont) is printed on the display electrode terminals to form a dielectric pattern for forming an overcoat of the display electrode terminals. After that, the dielectric pattern is heated at 150 ° C. for 15 minutes to be dried. Next, the dielectric pattern is applied at 580 ° C.
And baked for 12.5 minutes to obtain an overcoat consisting of the baked dielectric pattern.

Next, a protective film forming paste is printed on the wall charge accumulating dielectric 16 to form a protective film pattern for forming the protective film 18.

The protective film forming paste is a mixed solution of a single molecule of an organometallic compound, an organic polymer and an organic solvent. As such a protective film forming paste, a paste manufactured by Epoxy Technology Co., Ltd. is used here. A metal polymer solution is used. The organic metal compound, the organic polymer and the organic solvent contained in this metal polymer solution are composed of a single molecule of organic Mg.
Compounds, epoxy polymers and m, n-dimethylformamide.

Next, the protective film pattern is heated at 150 ° C. for 15 minutes to be dried, and thereafter, the protective pattern is heated at 580 ° C. for 12.5 minutes and baked, and the protective film 18 made of the baked protective pattern is formed. Then, the panel forming process on the rear plate 12 side is completed.

The paste for forming the protective film used here is a metal polymer solution manufactured by Epoxy Technology Co., Ltd. and contains an organic Mg compound as an organic metal compound. Therefore, this paste is made of MgO by printing and firing. The protective film 18 can be formed.

Moreover, the organic Mg compound is not a polymer but a single molecule and therefore exists in a single molecule state in the paste. Therefore, the metal component and the organic component of the organic Mg compound can be easily separated by heating during firing. Therefore, the organic component can be gasified and dissipated in the firing atmosphere, and the organic component remaining in the MgO forming the protective film 18 can be reduced, so that the MgO protective film 18 with high purity can be formed. Furthermore, since the organic components remaining in the MgO forming the protective film 18 can be reduced, M
Pinholes are less likely to occur in the gO protective film 18. By forming the MgO protective film 18 with fewer pinholes, the wall charge storage dielectric 16 can be protected more effectively, and thus the life of the wall charge storage dielectric 16 can be expected to be extended.

Since the metal polymer solution manufactured by Epoxy Technology Co., Ltd. used as the paste for forming the protective film contains an epoxy polymer, a single molecule of organic Mg is used.
The flowability of the paste can be maintained so that gelling of the compound can be prevented and thus not hinder printing.

On the other hand, soda lime glass is prepared as the front plate 20. Then, a dielectric paste (9741 manufactured by DuPont) is printed on the front plate 20 to form a lower layer rib pattern for forming barrier ribs. Then, the lower layer rib pattern is heated at 150 ° C. for 15 minutes to be dried. Then, the lower layer rib pattern was formed at 580 ° C.
It is heated and baked for 5 minutes to obtain a lower layer barrier rib composed of the baked lower layer rib pattern.

Next, a phosphor paste (made by Kasei Optonix Co., Ltd.) is applied on the front plate 20 in a region adjacent to the lower barrier rib.
P1-G1) is printed to form a phosphor pattern for forming the phosphor layer 22. After that, the phosphor pattern is heated at 150 ° C. for 15 minutes to be dried. The phosphor paste manufactured by Optonics Co., Ltd. used here is a paste containing a green phosphor Zn ₂ SiO ₄ : Mn.

Next, a dielectric paste (9741 manufactured by DuPont) is printed on the lower barrier ribs to form an upper rib pattern for forming the barrier ribs. After that,
The upper rib pattern is heated at 150 ° C. for 15 minutes to be dried. Printing of the dielectric paste and drying of the upper layer rib pattern are repeated, and after the upper layer rib pattern is laminated to a desired height, the upper layer rib pattern is formed at 580 ° C. for 12.5.
It is heated and baked for a minute to obtain an upper barrier rib composed of the baked upper rib pattern. In this way, a barrier rib having a two-layer structure composed of lower and upper barrier ribs is obtained, and the panel forming process on the front plate side is completed.

After the panel forming process on the back plate side and the front plate side is completed, the back plate 12 and the front plate 20 are connected to the discharge space 24.
Seal through. After that, the discharge gas was He-5% Xe.
Gas (He-5% Xe gas 95 vol% and 5 vol
% Gas), and He-5% Xe gas is enclosed in the discharge space 24 so that the gas pressure in the discharge space 24 is 500 Torr to complete the AC-PDP 10.

FIG. 2 is a diagram showing the results of characteristic tests performed on the AC-PDP according to the first embodiment and the AC-PDP for comparison.

In the figure, the panel No. The 4000 AC-PDPs according to the first example were manufactured as described above by setting the firing temperature of the protective film forming paste to 580 ° C.
-It is PDP10. No. In 4000, a metal polymer solution containing an organic Mg compound and manufactured by Epoxy Technology Co., Ltd. was printed once as a protective film forming paste,
The MgO protective film 18 having a film thickness of about 3.6 μm is formed.

Panel No. The AC-PDP according to the first example of No. 4001 is No. 4001 except that the firing temperature of the paste for forming the protective film is 460 ° C. AC-PDP 10 manufactured under the same manufacturing conditions as the 4000 panel.

Panel No. AC for comparison of 643
In PDP, the protective film 18 is not formed, and No. 40
AC-PDP manufactured under the same manufacturing conditions as the 00 panel
Is.

No. for comparison The panel of No. 753 has a different paste for forming a protective film, and is No. 753. 4000
It is an AC-PDP manufactured under the same manufacturing conditions as the panel of. No. The protective film forming paste used in 753 is
27 wt% of MgO fine powder having a particle size of 1000 Å (manufactured by Ube Industries), ethyl cellulose, and butyl carbitol,
It is a paste obtained by mixing 5 wt% and 68 wt%. The MgO fine powder is a single crystal particle formed by a gas phase oxidation reaction of Mg vapor and O ₂ gas (by a gas phase method) and has a very high purity. Therefore, by forming the MgO protective film 18 using the paste containing the MgO fine powder, the MgO protective film 18 has a characteristic of MgO as a panel characteristic of the AC-PDP.
It is possible to obtain panel characteristics that are substantially the same as those when the protective film is formed by the vapor deposition method.

A characteristic test was conducted on each of these AC-PDPs as described below. In this characteristic test, the frequency 2 was applied to one of the pair of corresponding display electrodes.
A rectangular pulse of 0 KHz is applied and a frequency of 20
A rectangular pulse of KHz is applied to form a plasma discharge for display light emission. The discharge start voltage Vf at this time
[V], discharge sustaining voltage Vs [V], and brightness [cd / m
² ] and a cell current flowing between a pair of corresponding display electrodes (cell current flowing per display cell) [μA / c
ell] and luminous efficiency [lm / W] are examined for each panel.

No. 1 according to the first embodiment. 4000 and N
o. Each of the AC-PDPs 4001 is No. 4001 for comparison. It shows superior characteristics to the AC-PDP of 643 (no protective film). That is, the discharge start voltage V
f and the sustaining voltage Vs are the AC-PD according to the first embodiment.
P is lower and the brightness is AC-PD according to the first embodiment.
P is higher and the cell current is AC− according to the first embodiment.
The PDP is lower, and the luminous efficiency is higher in the AC-PDP according to the first embodiment.

No. 1 according to the first embodiment. 4000 A
The discharge starting voltage Vf and the discharge sustaining voltage Vs of C-PDP (firing temperature 580 ° C.) are the same as those of No. 3 for comparison. 753 A
Almost equal to C-PDP, but the luminous efficiency is N for comparison.
o. It is slightly inferior to AC-PDP of 753.

No. 1 according to the first embodiment. 4001 A
Discharge starting voltage Vf of C-PDP (baking temperature 460 ° C.)
Is a No. for comparison. The discharge sustaining voltage Vs is higher than that of the AC-PDP of No. 753, but the discharge sustaining voltage Vs. 75
3 is lower than that of AC-PDP, and the luminous efficiency is No. 3 for comparison. It is almost equivalent to the AC-PDP of 753.

These No. According to the result of comparison with AC-PDP of 753, it is considered that the panel characteristics of the AC-PDP according to the first embodiment can be optimized by adjusting the firing temperature of the protective film forming paste.

In the above-mentioned first embodiment, the metal polymer solution manufactured by Epoxy Technology Co., Ltd. was used as the paste for forming the MgO protective film. In addition to this, the following paste was used as the paste for forming the MgO protective film. Can be used.

For example, the monomolecular organometallic compound is selected from magnesium diethoxide, magnesium naphthenate, magnesium octylate, magnesium dimethoxide, magnesium n-propoxide, magnesium i-propoxide and magnesium n-butoxide. The organic polymer is an epoxy polymer, and the organic solvent is any one selected from m, n-dimethylformamide and 2,4-pentadione, and a mixture of the organometallic compound, the organic polymer and the organic solvent. The solution can be used as a paste for forming a MgO protective film.

(Second Embodiment) In the above-mentioned first embodiment,
As the paste for forming the protective film, the paste for forming the protective film in which the organic Mg compound of a single molecule is mixed is used to form the MgO protective film 18 by the screen printing method. Then, a protective film 18 made of a composite oxide containing alkaline earth and rare earth is formed by using a protective film forming paste in which two kinds of organic metal compounds of an organic alkaline earth compound and an organic rare earth compound are mixed. .

The complex oxide containing alkaline earth and rare earth is, for example, AB ₂ O ₄ type complex oxide or A1.
Examples thereof include _X A2 _1-X B ₂ O ₄ type composite oxides. Here, A, A1, A2: alkaline earth elements (2A
Group element), B: Rare earth element. Examples of the alkaline earth elements A, A1 and A2 are Ba, Sr, Ca or M.
g, and the rare earth element B is, for example, La, Y, D
y, Gd or Yb can be used.

These AB ₂ O ₄ type and A1 _X A2 _1-X B
Each of the ₂ O ₄ type complex oxides has a spinel structure,
Since these spinel-structured complex oxides have a low crystallization temperature, the protective film 18 having good crystallinity can be formed.
It is expected that the panel characteristics of DP, such as the discharge start voltage Vf, the discharge sustaining voltage Vs, and the light emission efficiency, can be further improved.

Protective film made of AB ₂ O ₄ type complex oxide
As the protective film forming paste for forming 18, the following can be used.

For example, an organic alkaline earth compound containing an alkaline earth element A is barium isopropoxide,
Strontium isopropoxide, magnesium isopropoxide, and calcium isopropoxide are selected as one of the organic rare earth compounds containing the rare earth element B, and gadolinium isopropoxide, yttrium isopropoxide, ytribium isopropoxide are used. One of propoxide, dysprosium isopropoxide and lanthanum isopropoxide, the organic polymer is an epoxy polymer, and the organic solvent is m, n-dimethylformamide and 2,4-pentadione. Any one selected from the above, a mixed solution of these organic alkaline earth compound, organic rare earth compound, organic polymer, and organic solvent can be used as the protective film forming paste.

The following paste can be used as the protective film forming paste for forming the protective film 18 made of the A1 _x A2 _1-x B ₂ O ₄ type composite oxide.

For example, an organic alkaline earth compound containing alkaline earth elements A1 and A2 is selected from two different kinds selected from barium isopropoxide, strontium isopropoxide, magnesium isopropoxide and calcium isopropoxide. As the compound, an organic rare earth compound containing a rare earth element B is selected from gadolinium isopropoxide, yttrium isopropoxide, ytterbium isopropoxide, dysprosium isopropoxide and lanthanum isopropoxide. The organic polymer is an epoxy polymer, and the organic solvent is any one selected from m, n-dimethylformamide and 2,4-pentadione, and these two organic alkaline earth compounds and organic rare earth compounds are used. A mixed solution of machine the polymer and the organic solvent may be used as a protective film-forming paste.

The present invention is not limited to the above-described embodiments, and the shape, dimensions, arrangement position, forming material, composition, temperature, and others of each constituent component can be arbitrarily selected within the scope of the present invention. It can be changed appropriately.

For example, the protective film of the present invention can be applied to AC-PDPs having various structures other than the structure shown in FIG.

[0050]

As is apparent from the above description, according to the method of forming a protective film for an AC gas discharge panel of the present invention, the paste for forming a protective film comprises an organic metal compound, an organic polymer and an organic solvent. It is a mixed solution. These organometallic compounds, organic polymers and organic solvents are organic substances,
These organic components are gasified and dissipated into the firing atmosphere by heating during paste firing. Moreover, since the organometallic compound is not a polymer but a single molecule, it is possible to easily separate the metal component and the organic component of the organometallic compound by heating during firing of the paste, and thus the organic component of the organometallic compound during firing of the paste. Can be easily gasified.

Therefore, since the organic components remaining in the metal oxide forming the protective film can be reduced, the purity of the metal oxide forming the protective film can be increased. As a result, A
It is possible to improve the panel characteristics of the C-PDP, such as the discharge starting voltage, the discharge sustaining voltage, and the luminous efficiency.

Further, since the remaining organic components can be reduced, pinholes are less likely to occur in the metal oxide forming the protective film. Therefore, since the protective film with few pinholes can be formed, the wall charge storage dielectric of the AC-PDP can be protected more effectively.

Further, by mixing an organic polymer, it is possible to prevent a single molecule of organometallic compound from gelling,
Therefore, it is possible to prevent the paste for forming the protective film from being hard to print due to the gelation.

Therefore, the protective film capable of further improving the panel characteristics of the AC-PDP can be formed by the screen printing method. By forming the protective film by the screen printing method, the AC-PDP can be manufactured more inexpensively.

[Brief description of drawings]

FIG. 1 is a perspective view of a main part schematically showing the basic structure of an AC-PDP according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a characteristic test result of the AC-PDP according to the first embodiment of the present invention.

[Explanation of symbols]

 10: AC type gas discharge panel (AC-PDP) 12: Back plate 14: Display electrode 16: Wall charge storage dielectric 18: Protective film 20: Front plate 24: Discharge space

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Aya Yamanaka 1-7-12 Toranomon, Minato-ku, Tokyo Oki Electric Industry Co., Ltd.

Claims (3)

[Claims] 1. When forming a protective film made of a metal oxide on a wall charge storage dielectric of an AC type gas discharge panel, a single-molecule organometallic compound and an organic compound are used as a protective film forming paste. Using a mixed solution of a polymer and an organic solvent, the paste is printed on the wall charge storage dielectric and then fired to form a protective film, thereby forming a protective film for an AC gas discharge panel. Method. 2. The method for forming a protective film for an AC gas discharge panel according to claim 1, wherein the protective film made of Mg oxide is formed using a protective film forming paste mixed with an organic Mg compound. A method for forming a protective film for an AC gas discharge panel, which is characterized. 3. The method for forming a protective film for an AC gas discharge panel according to claim 1, wherein an alkaline earth is formed by using a paste for forming a protective film in which two kinds of organic alkaline earth compound and organic rare earth compound are mixed. And a method of forming a protective film of an alternating-current gas discharge panel, which comprises forming a protective film made of a complex oxide containing a rare earth element.