JPH08281954A - Cutting method for ink jet printer head board - Google Patents

Abstract

PURPOSE: To provide a method for cutting an ink jet printer head board in which the board of an ink jet printer head is accurately cut to form it in an arbitrary head board shape and which has a low cutting cost. CONSTITUTION: The method for cutting an ink jet printer head board comprises the steps of rigidly holding a board 5, and first, second board holding jigs 14a, 14b during working, fixing it by using double-sided adhesive sheets 17a, 17b for remarkably lowering the holding force by a method such as emitting an ultraviolet ray or heating after the working, masking except the worked surface, cutting it by a sand erosion to form a head board 19 of arbitrary shape, lowering the adhesion of the sheets 17a, 17b after cutting, and releasing the board 19 from the jigs 14a, 14b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting an ink jet type printer head substrate for ejecting ink droplets to form an image on a recording medium.

[0002]

2. Description of the Related Art As computers have become more sophisticated, smaller, and cheaper, printers are required to have similar characteristics.
Models are about to be switched from conventional dot printers to laser printers and ink jet printers.

There are various types of ink jet printer heads. Typical examples are a method of pushing out ink by deformation of a piezo-piezoelectric element and a method of boiling ink by thermal resistance heating by energizing direct current to eject ink. And a method of ejecting the ink by boiling the ink by high-frequency heating by applying an alternating current.

Here, as a conventional technique, a printer head of a type in which ink is ejected by boiling the ink by high-frequency heating by energizing an alternating current is taken up, and the configuration thereof is shown in FIGS. 4 and 5.

In the figure, a nozzle plate 1 is provided with a nozzle 6 for ejecting ink droplets and an ink supply hole 7 for supplying ink from an ink tank to the nozzle. A pair of electrodes 4a and 4b are formed on the substrate 5, and a drive controller 8 and a power source 9 for applying a voltage to the electrodes 4a and 4b are provided. Note that 2 is an adhesive and 3 is an insulating interface.

Next, the operating principle of this conventional printer head will be described. When the drive control device 8 is turned on, a high frequency voltage is applied between the pair of electrodes 4a and 4b, the electrolyte existing in the ink vibrates, and Joule heat is generated to heat and boil the ink. Bubbles are generated in the ink due to the boiling of the ink, and the ink droplets are pushed out from the ejection port 6a due to the rapid expansion of the ink volume. Then, the ink droplets fly toward and adhere to the surface of the recording paper to form a 1-dot print.

After that, when the drive control device 8 is turned off, the high frequency voltage applied between the pair of electrodes 4a and 4b is removed, so that the ink is rapidly cooled and the bubbles in the ink disappear. Return to the state of.

By the way, a substrate (hereinafter referred to as "head substrate") constituting the printer head is manufactured by a manufacturing method similar to a semiconductor manufacturing process. That is,
Since a large number of head substrate patterns are formed in units of several tens to several hundreds on a substrate of about φ3 to φ6 inches by a thin film process using photolithography technology, each is separated into individual head substrates. is there.

On the other hand, with respect to this printer head substrate, not only high dimensional accuracy is required, but also it is necessary to prevent the occurrence of chipping as much as possible. Was being done.

[0010]

However, in the conventional cutting work using a grindstone, since the substrate itself is a hard material that is difficult to process, the grindstone wears quickly and the cost required for the cutting work is very high. Met. Also, in recent years, the price of the printer itself has fallen sharply, but since the cutting cost of the board is not one that can be expected to reduce costs due to mass production, the ratio of the cutting cost to the total manufacturing cost tends to increase year by year. It was

Further, in the case of cutting work with a grindstone, since only linear cutting can be performed, the demand for cutting of arbitrary shape including a curved line which is required in the future due to the progress of higher performance of printer heads. However, the fact is that cutting with a grindstone cannot handle it at all.

On the other hand, as a method of cutting a substrate which can be cut with a relatively simple curved shape and at a low cutting cost, after scratching the substrate with a diamond having a sharp tip, bending force or a bending force is applied to the substrate. Although there is a method of applying a tensile force to divide, dimensional accuracy is extremely poor and chipping often occurs, so control is extremely difficult and practical application is impossible.

In addition to the above, a method of cutting the substrate by sandblasting has been proposed. However, in the case where the final size of the head substrate is small, the head substrate scatters at the moment when the cutting by sandblasting is completed. It has not been realized. Therefore, measures were taken such as mechanically fixing the substrate to the jig or using an adhesive.However, when the substrate was mechanically fixed to the jig, the abrasive particles of sandblast hit the jig and it was worn. Moreover, when an adhesive is used, another problem such as difficulty in peeling after cutting occurs.

The present invention has been made to solve such a problem, and it is possible to cut a substrate with high accuracy and process it into an arbitrary head substrate shape, and the cutting cost is extremely low. An object is to provide a method for cutting a jet printer head substrate.

[0015]

In order to solve the above-mentioned problems, the present invention firmly holds the substrate and the substrate holding jig during processing, and after the processing, the holding power is remarkably increased by a method such as UV irradiation or heating. It is fixed using a double-sided adhesive sheet that drops and can be easily peeled off, masks the parts other than the processed surface, cuts by sand erosion to form a head substrate of any shape, and reduces the adhesive strength of the adhesive sheet after processing. Then, the head substrate is removed from the substrate holding jig.

[0016]

According to the present invention, the above-mentioned means enables the substrate to be cut with high precision and low cost and processed into chips of any shape.

When an ink supply hole for supplying ink to an ejection port for ejecting an ink droplet is formed by sand erosion processing, a mask corresponding to the ink supply hole and the cut surface is used to form the ink supply hole. In the process, cutting can be completed and the cutting process itself can be abolished.

[0018]

Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment 1) Embodiment 1 of the present invention will be described with reference to FIG.

FIG. 1A shows a cross section of the substrate 5 before cutting. The substrate 5 has a diameter of 3 inches and a thickness of 1.0 mm.
The soda glass substrate of was used. Next, on both sides of the substrate 5,
The photosensitive dry film 15 having a thickness of 100 μm (for example,
Tokyo Ohka dry film (Audil OF-11
0)) is laminated with a laminator at a temperature of 80 ° C., a pressure of 2.5 kg / cm ² , and a speed of 1.0 m / min, taking care that air is not entrapped.
The state of (b) is obtained.

The pattern formation on the surface of the substrate 5 is performed by using a photolithography technique. FIG. 1C shows a cutting line opening 13a1 and an ink supply hole opening 13a2 in the substrate front surface opening 13a, and a pattern surface side ink supply hole 13b2 and a cutting line opening 13b1 in the substrate back surface 13b.
Are aligned and formed so that their positions are aligned with each other. The pattern formation process was performed by exposure with energy of 200 mmJ, spray development at 30 ° C. anhydrous sodium carbonate solution 0.3%, pressure of 1.5 kg / cm ² , and post-baking at 90 ° C. for 30 minutes. .

A plan view of the entire substrate 5 after pattern formation is as shown in FIG. Chip size is 8mm x 4m
In m, the white parts are the ink supply hole opening 13a2 and the cutting line opening 13a1. Since the pattern formation is performed by the photolithography method, the size of each head substrate can be freely set, and the cutting line can be not only a linear shape but also an arbitrary shape.

Next, as shown in FIG. 1D, the thickness 1.
A double-sided adhesive sheet 17a whose adhesive strength is reduced by heating the first substrate holding jig 14a of 0 mm and SiN ₄ and the rear surface 13b of the substrate (for example, Liver Alpha P manufactured by Nitto Denko Corporation)
Adhesion is performed using an ET base foaming type on both sides).

Next, as shown in FIG. 1 (e), sand erosion is performed by injecting # 600 SiC dry abrasive grains 16 from the substrate surface 13a side at a pressure of 3.5 kg / cm ² for 15 minutes.

Next, as shown in FIG. 1 (f), after the substrate 5 is cleaned by air blowing and water washing, the thickness is 1.0 m.
m, glass second substrate holding jig 14b and substrate surface 13a
Are adhered to each other using a double-sided adhesive sheet 17b (for example, UV curable double-sided adhesive tape UC-228W manufactured by Furukawa Electric Co., Ltd.) whose adhesive strength is reduced by UV irradiation. In this state, as shown in FIG. 1G, the first substrate holding jig 1
When the heater 18 is heated from the 4a side at 120 ° C. for 5 minutes, the adhesive force of the double-sided adhesive sheet 17a, which was 200 g / cm ² before heating, becomes almost 0 after heating. 14a can be easily peeled off from the back surface 13b of the substrate.

Next, as shown in FIG. 1 (h), the # 600 SiC dry abrasive grain 16 is applied to the back surface 13b of the substrate at a pressure of 3.
Sand erosion is performed by spraying at 5 kg / cm ² for 30 minutes to penetrate the substrate 5.

Next, as shown in FIG. 1I, from the side of the second substrate holding jig 14b, ultraviolet rays 18u of 1000 mmJ are applied.
When the irradiation is performed, the adhesive force, which was 5 g / cm ² before the ultraviolet irradiation, becomes almost 0 after the irradiation, so that the second substrate holding jig 14b can be easily peeled from the substrate surface 13a.

When the adhesion force between the substrate 5 and the second holding jig 14b is weak or partial floating occurs, the pressure of the abrasive grains is so strong that each head substrate scatters during penetration. In the example, since the double-sided adhesive sheet 17b had extremely good adhesion, no such scattering of the head substrate was observed.

Next, the substrate 5 is dipped in a 5% aqueous sodium hydroxide solution at 0 ° C. for 10 minutes, and the photosensitive dry film 15 on the front and back of the substrate 5 is peeled off.
As shown in (j), the head substrate 19 alone can be obtained.

Then, the head plate can be completed by adhering the nozzle plate 1 having ejection holes for ejecting ink to the head substrate 19 with the adhesive 2. In addition,
By adhering the nozzle plate 1 and sealing the head substrate 19 and the nozzle plate 1 at the insulating interface 3, the printing ink does not leak and ink can be supplied to the ejection port 6a.

In the conventional process, after the ink supply holes 7 are usually formed in the substrate 5, the substrate 5 is cut with a grindstone, but by using the method of the first embodiment, this cutting process can be omitted completely. It has become possible to achieve significant lead time and cost reductions.

Further, if the substrate 5 is made larger or the chip size is made smaller in the ordinary grinding stone cutting, the cutting length becomes longer accordingly, and the cutting time is extended and the cost is increased. The method (2) hardly increases the time and can be said to be a method suitable for mass production.

(Embodiment 2) Next, a cutting method according to Embodiment 2 of the present invention will be described with reference to FIG.

FIG. 3 (a) shows a cross section of the electrode substrate 5. As the substrate 5, an S of φ5 inch and a thickness of 0.3 mm is used.
i substrate was used. A substrate 5 was provided with a photosensitive dry film 15 (for example, Tokyo Ohka dry film (Audyl OF-110)) having a film thickness of 100 μm by a laminator at a temperature of 95 ° C., a pressure of 3.5 kg / cm ² , and a speed of 0.
When laminating under the condition of 5 m / min so that air is not entrained on the surface of the substrate 5, it becomes as shown in FIG.

The pattern formation is performed using a photolithography technique. When the ink supply hole opening 13a2 and the cutting line opening 13a1 are formed, the state shown in FIG. 3C is obtained. The photolithography condition is energy 10
It was carried out by exposure at 0 mmJ, spray development under anhydrous sodium carbonate solution at 28 ° C. 0.25%, pressure 1.0 kg / cm ² , and post-baking at 75 ° C. for 20 minutes. The size of the head substrate alone is 5 mm × 3.5 mm. Since the pattern formation is performed by a photolithography technique, the size of the head substrate is free. Further, the cutting line opening 13a1 can have not only a linear shape but also an arbitrary shape.

Next, a double-sided adhesive sheet 17a (for example, Liver Alpha PET manufactured by Nitto Denko Corporation) whose adhesive strength is reduced by heating the first substrate holding jig 14a made of SiN _{4 having} a thickness of 2.0 mm and the rear surface 13b of the substrate is heated. When the two substrates are foamed on both sides to be bonded, the state shown in FIG.

Next, as shown in FIG. 3 (e), the substrate surface
From the 13a side, # 400 Al₂ O ₃ Dry abrasive grain 16,
Pressure 5.0kg / cm² For 15 minutes at Sandero
Version processing. In addition, of sand erosion processing
To further improve the effect, Al₂ O₃ Mixed with water
A soaked slurry may be used.

Next, after cleaning the substrate 5 by blowing air and washing it with water, as shown in FIG. 3 (f), from the first substrate holding jig 14a side to the heater 18 at 90 ° C. for 3 minutes. When heated, the adhesive strength of the double-sided adhesive sheet 17a, which was 150 g / cm ² before heating, becomes almost 0 after heating, and the first substrate holding jig 14a can be easily peeled off from the substrate back surface 13b. Substrate 5 and first substrate holding jig 1
When the adhesive force with 4a is weak or a partial floating occurs, each head substrate is scattered at the time of penetration because the pressure of the abrasive grains is strong, but the double-sided adhesive sheet 17a provides good adhesiveness. As it was possible, no scattering was observed.

Next, the substrate 5 is dipped in a 5% sodium hydroxide aqueous solution at 50 ° C. for 10 minutes, and the photosensitive dry film 15 is peeled off, so that a single piece is prepared as shown in FIG. 3 (g). The head substrate 19 can be obtained.

Finally, the head can be completed by adhering the nozzle plate 1 having the ejection holes for ejecting ink to the head substrate 19 with the adhesive 2. By adhering the nozzle plate 1 and sealing the head substrate 19 and the nozzle sheet 1 at the insulating interface 3, it is possible to supply ink to the ejection ports 6a without leaking ink.

[0041]

According to the method of cutting an ink jet type printer head substrate of the present invention, the work of cutting the substrate can be performed with high accuracy and at low cost, and a shape other than a straight line can be cut. The manufacturing process of the mold printer head substrate can be shortened.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a first embodiment of the present invention.

FIG. 2 is a top view of a dry film patterned.

FIG. 3 is an explanatory diagram of a second embodiment of the present invention.

FIG. 4 is a structural diagram of an AC voltage-applied inkjet printer.

FIG. 5 is a structural diagram of an AC voltage-applied inkjet printer.

[Explanation of Codes] 1 Nozzle plate 2 Adhesive 3 Insulating interfaces 4a, 4b Electrode 5 Substrate 6 Nozzle 6a Discharge port 7 Ink supply hole 8 Drive control device 9 Power supply 11 Opening 12 Insulating layer 13a Substrate surface 13b Substrate backside 13a1, 13b1 Cutting line opening 13a2, 13b2 Ink supply hole opening 14a First substrate holding jig 14b Second substrate holding jig 15 Photosensitive dry film 16 Dry abrasive grains 17a, 17b Double-sided adhesive sheet 18 Heater 18u Ultraviolet 19 Head substrate

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Eizo Ono 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (5)

[Claims] 1. An ink jet printer head substrate A substrate holding member is adhered to one side or both sides of a substrate formed in the shape of a single article by a double-sided adhesive sheet, and one side or both sides of the substrate is sand erosion-processed as desired. A method for cutting an ink jet type printer head substrate, which comprises cutting into a shape, reducing the adhesive strength of the double-sided adhesive sheet after cutting, and removing the cut head substrate single item. 2. When the substrate is cut, the substrate is firmly held during cutting, and the substrate is fixed to a substrate holding jig by using a double-sided adhesive sheet whose adhesive strength is remarkably reduced by UV irradiation or heating after cutting. The method for cutting an ink jet type printer head substrate according to claim 1, wherein 3. When cutting the substrate, an adhesive sheet is used which firmly holds the substrate on a substrate holding jig during cutting on both sides of the substrate, and after cutting, the adhesive strength is remarkably reduced by different treatments on the front and back sides. The method of cutting an ink jet printer head substrate according to claim 1, wherein the substrate and the substrate holding jig are fixed by using the substrate. 4. An ink jet printer according to claim 3, wherein an adhesive sheet whose adhesive strength is remarkably reduced by heating is used on one side, and an adhesive sheet whose adhesive strength is remarkably reduced by UV irradiation is used on the other side. Head substrate cutting method. 5. In the ink jet printer head for ejecting ink from a nozzle, an ink supply hole for supplying ink to an ejection port for ejecting an ink droplet is formed at the same time when the substrate is formed by sand erosion processing. 2. The method for cutting an ink jet printer head substrate according to claim 1, wherein the substrate is cut by erosion to have a predetermined chip shape.