JPH08273219A - Apparatus for producing optical disk - Google Patents

Abstract

PURPOSE: To produce a metallic master disk which is excellent in yield and reliability by realizing the reduction of a treatment cost and the improvement in installation environment, equipment area and cycle time in a process for producing the master disk. CONSTITUTION: A polishing and washing mechanism is composed by providing this mechanism with an original plate installing means 31 and disposing a polishing means 32 as well as first washing means 33 and second washing means 34 around (near) the original plate installing means 31. A polishing treatment and a washing treatment are executed in one process.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical disk manufacturing apparatus, and more particularly to an optical disk manufacturing apparatus for executing a master disk manufacturing process for manufacturing a metal master disk of an optical disk using a glass master plate.

[0002]

2. Description of the Related Art Generally, when manufacturing an optical disk, a master manufacturing process for manufacturing a metal master of an optical disk using a glass master plate and a disk forming process for replicating on a predetermined substrate using the metal master are performed. As a result, a plurality of optical disks are manufactured.

Specifically, FIG. 26 shows a flow chart of a master disk manufacturing process in the conventional optical disk manufacturing processes. In this case, first, the process of processing the original glass plate is started. As a material for the glass plate, it is desirable that a flat surface can be obtained relatively easily with high precision, and that it is inexpensive and easily available. For example, soda lime is considered.

By the way, since the above glass master plate is used again for manufacturing the metal master plate after the master plate manufacturing process is completed and the metal master plate is manufactured, the metal master plate is first manufactured prior to this master plate manufacturing process. After that, the nickel and the resist remaining on the surface of the original glass plate are washed and removed (regeneration treatment step).

Next, in order to remove deposits such as a chemical liquid layer and an oxide film on the surface of the original glass plate which cannot be completely removed by the above-mentioned regeneration treatment process, and to flatten fine irregularities formed on the surface of the original glass plate, Polishing is performed using a slurry of cerium oxide having a particle size of about 0.5 μm as a polishing material (polishing step).

Then, the abrasive remaining on the surface of the glass original plate is washed with a scrubber, and further ultrasonic cleaning is performed to dry the glass original plate (washing step), and then a predetermined photoresist, here. A positive type in which the exposed portion melts in a developing solution is applied to the surface of the original glass plate (resist applying step). At this time, in order to strengthen the adhesion of the resist layer to the glass original plate, after applying the adhesion reinforcing agent (such as a silane coupling agent) to the surface of the glass original plate in advance before applying the photoresist, and after performing shake-off drying Apply photoresist.

Next, the glass original plate is heat-treated to stabilize the resist layer on the surface of the glass original plate (baking step), and it is checked whether or not there is a defect in the resist layer, and the thickness of the resist layer is measured ( After the defect inspection / resist thickness measurement step), a predetermined latent image is formed on the resist layer using a laser recording device or the like (cutting step).

Next, the resist layer on which the latent image is formed is developed to reveal the relief pattern of the unevenness on the resist layer (developing step). In general, the sensitivity of a resist is greatly affected by many factors such as its manufacturing lot, coating / drying conditions, temperature and humidity, and a developing solution, which affects the reproduction signal of an optical disk. Therefore, it is desirable to control the end of development by monitoring the progress of development, including fluctuations in the exposure amount during latent image formation, and absorb the above-mentioned fluctuation factors.

Subsequently, in order to perform electroforming for transferring the relief pattern onto the metal master, it is necessary to make the surface of the resist layer a conductor. Therefore, an electroless plating method is used to transform the glass master into an electroless solution. The surface of the resist layer is dipped and nickel plated (electroless plating step). At this time,
Prior to the electroless plating step, it is necessary to improve the surface condition of the resist layer and promote plating deposition (electroless plating pretreatment step).

Then, the surface of the conductive resist layer is used as a cathode and nickel is used as an anode to apply current in a nickel sulfamate bath to deposit metallic nickel on an original glass plate (electroforming step). After electroforming is continued until the thickness reaches a certain level, a nickel master is produced by peeling off the metal nickel film from the glass original plate, and by further transferring, a metal master (stamper) is completed through mother (( Stamper peeling process).
After that, as described above, after the metal master is manufactured, the glass master plate is again used for manufacturing the metal master.

[0011]

By the way, one polishing means is used in the above polishing step, and one or two cleaning means is used in the cleaning step which is the next step (abrasives remaining on the surface of the original glass plate are scrubbed with a scrub roller. A first cleaning means for cleaning and removing the surface of the glass original plate by ultrasonic waves and a second cleaning means for cleaning the surface of the original glass plate by ultrasonic waves are required. for that reason,
For convenience, a space for installing two to three independent processing devices is essential, and there is a problem that the processing time (cycle time) of all steps becomes very long.

Further, in the above-mentioned master disc manufacturing process,
When some work defect occurs in each process, the master disc manufacturing process is temporarily stopped in the process in which the defect occurs (denoted as NG in FIG. 26), and the process is performed again from the first reprocessing step. . Therefore, if a work defect occurs at a certain process, the processes in all the previous processes that have already been performed become invalid, resulting in waste of time and resources.

In this case, since the defective glass original plate is taken out from the processing apparatus, it is necessary to take measures against the decrease in cleanliness in the processing means, which is inevitably caused by the large number of steps, and the processing cost is reduced. There are serious problems such as increase and deterioration of working environment.

Therefore, the present invention has been proposed in view of the above-mentioned conventional circumstances, and in the master disc manufacturing process,
It is an object of the present invention to provide an optical disk manufacturing apparatus capable of manufacturing a metal master disc having excellent yield and reliability by realizing reduction of processing time and improvement of working environment.

[0015]

The present invention is directed to an optical disk manufacturing apparatus for manufacturing a metal master disk of an optical disk by using a glass master plate in a master disk manufacturing process.

The optical disk manufacturing apparatus according to the present invention comprises an original plate setting means for rotatably setting and fixing a glass original plate, and a polishing means for performing a polishing process for polishing and flattening the surface of the glass original plate. A cleaning means for performing a cleaning process for cleaning and removing the polishing material remaining on the surface of the original glass plate is characterized in that a polishing and cleaning mechanism is provided in the vicinity of the original plate setting means. .

In this case, the above-mentioned cleaning means is a first cleaning means for cleaning and removing the abrasive remaining on the surface of the original glass plate with a scrub roller, and a second cleaning for cleaning the surface of the original glass plate with ultrasonic waves. It is desirable to configure it with means.

At this time, it is preferable that the polishing / cleaning mechanism re-uses the defective glass original plate again for polishing and cleaning when a defect occurs in the glass original plate.

Specifically, a clean tunnel is provided in which each step of producing a metal master of an optical disc is carried out by sequentially transporting the glass master to the above manufacturing apparatus, and when a defect occurs, the defective glass master is subjected to the next step. It is conceivable to pass the defective glass original plate through the inside of the clean tunnel without returning to the first process.

[0020]

In the optical disc manufacturing apparatus according to the present invention, the polishing means for polishing and flattening the surface of the glass original plate and the cleaning means for cleaning and removing the abrasive material remaining on the surface of the glass original plate are provided. Since the polishing cleaning mechanism is configured by arranging the glass original plates in the vicinity of the original plate setting means rotatably installed and fixed, the polishing (polishing) process and the cleaning process using the polishing means and the cleaning means move. The above is performed by the polishing and cleaning mechanism without the above.

In the polishing and cleaning mechanism, when a defect occurs in the glass original plate, the defective glass original plate is again subjected to each of the above-mentioned processes, so that the defective glass original plate is surely conveyed. And the cycle time is shortened, and the film thickness and adhesiveness of the resist layer are improved.

In addition, the above-described manufacturing apparatus executes each step of the master plate manufacturing process by sequentially transporting the defective glass original plate in the clean tunnel, and after performing the defective post-treatment step, does not perform the next step. The original plate is passed through the clean tunnel and returned to the initial process. Therefore, the defective glass original plate is easily conveyed to the first step without taking out the defective glass original plate to the outside and disturbing the state inside the clean tunnel.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Specific embodiments to which the optical disk manufacturing apparatus of the present invention is applied will be described below with reference to the drawings.

In the present embodiment, a master manufacturing process for manufacturing a metal master of an optical disc using a glass master,
An optical disk manufacturing apparatus that executes a master disk manufacturing process when manufacturing an optical disk through a disk manufacturing process in which a copy is made on a predetermined substrate using the metal master disk is targeted.

Specifically, FIG. 1 shows the flow of the master disk manufacturing process of the above optical disk manufacturing processes. In this case, the master manufacturing process includes polishing and cleaning steps, resist coating steps, baking steps, defect inspection / resist thickness measurement steps, cutting steps, development steps, electroless plating pretreatment steps, electroless plating steps, electroforming steps. , A stamper peeling step. Here, the developing step, the electroless plating pretreatment step, and the electroless plating step are collectively referred to as a glass master step.

As shown in FIG. 2, the above-mentioned manufacturing apparatus has a clean tunnel 1 in which each process from the polishing process to the stamper peeling process except the recycling process is executed, and is provided at the entrance of the clean tunnel 1. Regeneration processing means 11 for performing the regeneration processing step is provided and configured. Inside this clean tunnel 1, there are 7 rooms 1
2 to 18 are formed, and further, a conveying means 19 for sequentially conveying the original glass plate to each step is provided.
Shutters 12a to 18a are provided on the side portions of each room.
And 12b and 18b are arranged, and serve as an entrance and exit of the glass original plate when the glass original plate is transferred from one room to the next room by the transfer means 19.

The inside of each room of the clean tunnel 1 has a cleanness of about class 100, and the inside of the regeneration processing means 11 has an environment of a cleanness of about 100,000.

Each of the chambers 12 to 18 is a place where a polishing and cleaning process, a resist coating process, a baking process, a defect inspection / resist thickness measuring process and a cutting process, a glass master process, an electroforming process, and a stamper peeling process are performed. is there.

The carrying means 19 is provided so as to be movable along the conveyors 21 for carrying the original glass plate from the recycling processing means 11 to the room 12 in which the next step of polishing and cleaning is performed. It is configured with a transfer unit 22 in which a glass original plate is installed in each room. Here, the transfer unit 22
Has one end 22a rotatably fixed and a tip 22b.
Has a hook shape and is configured to hold the original glass plate at the tip portion 22b. The above-mentioned glass plate is subjected to the following steps in the recycling processing means 11 and the respective chambers 12 to 18, and when one step is completed, the conveying means 11 is carried out.
21 and transfer unit 2 provided in the
According to 2, it is sequentially conveyed to the next process.

The above-described master plate manufacturing process starts with a glass master plate processing step. As a material for the glass plate, it is desirable that a flat surface can be obtained relatively easily with high precision, and that it is inexpensive and easily available. For example, soda lime is considered.

By the way, the above glass master plate is used again for manufacturing the metal master plate after the master plate manufacturing process is completed and the metal master plate is manufactured. That is, first, as a regeneration treatment process, the regeneration treatment means 11 is used to dissolve, wash and remove nickel and resist, which are surface foreign matters remaining on the surface of the glass original plate after the metal original disc is first produced.

Next, in order to remove deposits such as a chemical liquid layer and an oxide film on the surface of the glass original plate that cannot be completely removed by the above-mentioned regeneration treatment process, and to flatten fine irregularities formed on the surface of the glass original plate, Polishing is performed by using a slurry of cerium oxide having a particle size of about 0.5 μm as an abrasive, the abrasive remaining on the surface of the glass original plate is cleaned by using a scrubber, and further ultrasonic cleaning is performed to perform the glass original plate. Is dried (polishing and washing steps).

When performing the polishing and cleaning steps, a polishing and cleaning mechanism (polishing / cleaning unit) as shown in FIG. 3 is used. This polishing / cleaning mechanism has an original plate setting means 31, and a polishing means 32, a first cleaning means 33, and a second cleaning means 34 are arranged around (in the vicinity of) the original plate setting means 31. ing. Here, in consideration of prevention of contamination around the original plate setting means 31, a chamber 35 which is a defense wall surrounding the original plate setting means 31 is installed.

As shown in FIG. 4, the original plate setting means 31 has a turntable 41 on which the glass original plate 2 is mounted and fixed.
Is rotatably installed on the substrate 43 via the main shaft 42, and the coupling 44 provided on the lower part of the main shaft 42 and the substrate 43.
The turntable 41 is connected to the drive motor 45 by means of, and the drive motor 45 is connected to the speed setter 47 via the speed control circuit 46 that controls the speed of the drive motor 45. An exhaust pipe 42a is provided in the main shaft 42 so as to penetrate therethrough, and an opening is formed in the surface of the turntable 41. The exhaust pipe 42a is used to exhaust the original glass plate 2 onto the turntable 41. Adsorb.

The polishing means 32 comprises a polishing section 51, a chemical solution supply section 52, and a polishing pad cleaning section 53.

The polishing section 51 has a polishing arm 61 mounted on the substrate 43 and rotatable at one end 61a, and a polishing pad 62 is provided at the other end 61b of the polishing arm 61. In addition to being provided, the one end portion 61a is connected via a main shaft 63 to a polishing arm vertical cylinder 64 and a polishing arm turning cylinder 65 provided below the substrate 43.

Here, the polishing pad 62 is made of a special cloth for polishing, and is pressed against the surface of the glass original plate 2 which is rotated on the turntable 41 by the rotation of the drive motor 45, so that the glass original plate 2 is pressed. The surface is polished. Here, the polishing arm vertical cylinder 64 moves the polishing arm 61 up and down with respect to the substrate 43, and the polishing arm turning cylinder 65 swings the polishing pad 62 during polishing.

In the polishing section 51, at the time of starting, the polishing pad 62 rotates the surface of the original glass plate 2 around the one end 61a as a rotation axis as shown in FIG.

The chemical solution supply section 52 has a polishing agent supply nozzle 66 for supplying a slurry of cerium oxide as a polishing agent and a pure water nozzle 67 for supplying pure water to the surface of the glass original plate 2.
It consists of and.

The polishing pad cleaning section 53 is provided at one end of the substrate 43, and has a pad brush 69 installed on the substrate 43 via a spindle 68, and below the substrate 43 via the spindle 68. The polishing pad 6 is composed of the installed drive motor 70, and the polishing pad 6 is attached to the pad brush 69 which is rotated by the rotation drive of the drive motor 70.
2 by pressing the polishing pad 62
Is to be cleaned.

As shown in FIG. 5, the first cleaning means 33 has a scrub arm 71 which is installed on the substrate 43 and is rotatable at one end 71a. A scrub roller 73 is provided on the other end portion 71b of the scrub arm 73 via a drive motor 72, and the one end portion 71a is connected to a scrub arm vertical cylinder 74 and a scrub arm swivel cylinder 75 provided under the substrate 43 via a main shaft 63. Is configured. A pure water nozzle 76 for supplying pure water to the surface of the original glass plate 2 is provided in the vicinity of the scrub arm 71, and pure water for supplying pure water to the rear surface of the original glass plate 2 is provided below the substrate 43. Nozzles 77 are arranged respectively.

Here, the scrub roller 73 is rotated by the rotation drive of the drive motor 72, receives the supply of pure water from the pure water nozzle 76, and the bottom surface portion of the original glass plate 2
The surface of the glass is washed, and the end face of the original glass plate 2 is washed by its side surface. The scrub arm up / down cylinder 74 moves the scrub roller 73 up and down with respect to the original glass plate, and the scrub arm swivel cylinder 75 swings the scrub roller 73 during scrubbing work.

In the first cleaning means 33, at the time of start-up, the scrub roller 73 rotates the surface of the original glass plate 2 around the one end 71a as a rotation axis as shown in FIG.

The second cleaning means 34 comprises an ultrasonic cleaning section 81 and a pure water supply section 82.

The ultrasonic cleaning section 81 has an ultrasonic arm 91 which is installed on the substrate 43 and is rotatable at one end 91a, and the other end 91b of the ultrasonic arm 91 is provided at the other end 91b. A cleaning nozzle 92 is provided, and the one end portion 91a is connected via a main shaft 93 to an ultrasonic arm up-and-down cylinder 94 and an ultrasonic arm turning motor 95 provided under the substrate 43. Here, the ultrasonic arm vertical cylinder 94 moves the cleaning nozzle 92 up and down, and the ultrasonic arm swing motor 95 swings the cleaning nozzle 92 during cleaning.

In the ultrasonic cleaning section 81, at the time of start-up, the cleaning nozzle 92 rotates on the surface of the original glass plate 2 with a predetermined distance with the one end 91a as a rotation axis, as shown in FIG.

The pure water supply section 82 is composed of a pure water supply pipe 96 for supplying pure water and an ultrasonic pure water supply pipe 97 for supplying pure water with ultrasonic vibration. In the pure water supply unit 82, the tips of the supply pipes 96 and 97 are connected to the cleaning nozzle 92, and pure water or pure water subjected to ultrasonic vibration is supplied to the supply pipes 96 and 97. As a result, the cleaning nozzle 92 discharges the glass onto the surface of the original glass plate 2.

A control means for controlling each means of the polishing and cleaning mechanism is provided near the polishing and cleaning mechanism. As shown in FIG. 6, the control means includes a CPU 101 for controlling, a memory 102 in which a control program is stored, an I / O interface 103 for providing a relay function between the CPU 101 and each control circuit to be described later, and each of the above. It is composed of a motor control circuit 104 for controlling the drive motor, and a solenoid drive circuit 105 for controlling the cylinders and supply pipes (nozzles).

Here, the I / O interface 103 includes a motor control circuit 104 and a drive circuit 1 such as a solenoid.
In addition to the signal output to 05, position detection sensors 106 for detecting the vertical position of each of the above and below cylinders, the center position and the outer peripheral position when the above arms are rotated, and an operation for starting and stopping the polishing and cleaning mechanism. Signals are input from the panel 107. The control of each means of the polishing and cleaning mechanism is executed while confirming the completion of the operation by the input signal to the position detection sensors 106.

In order to perform the polishing and cleaning steps using the polishing / cleaning mechanism having the above-described structure, first, as shown in FIG. 7, the glass original plate 2 is placed and fixed on the turntable 41 of the original plate setting means 31. The glass original plate 2 is rotated by using the second cleaning means 34, and the ultrasonic arm 91 is rotated on the glass original plate 2 to apply pure water ultrasonically vibrated from the cleaning nozzle 92 to the surface of the glass original plate 2. (Ultrasonic cleaning process T1). At this time, the wettability of the surface of the original glass plate 2 before polishing is improved, and relatively large deposits on the surface are removed.

Then, after returning the ultrasonic arm 91 to the initial position, the polishing means 32 is used to rotate the polishing arm 61 of the polishing section 51 onto the original glass plate 2 to move the polishing pad 62 to the surface of the original glass plate 2. The residual substance is removed by pressing against the surface and the fine irregularities on the surface are flattened (polishing step T2).

Then, after returning the polishing arm 61 to the initial position, the second cleaning means 34 is used to supply the pure water that has been subjected to ultrasonic vibration again to the surface of the original glass plate 2 (ultrasonic cleaning step T3. ). At this time, the abrasive or the like remaining on the surface of the original glass plate 2 is washed and removed.

Next, after returning the ultrasonic arm 91 to the initial position, the first cleaning means 33 is used,
By rotating the scrub arm 71 on the glass original plate 2 and pressing the scrub roller 73 against the surface and the end surface of the glass original plate 2, some residual substances are scraped off (scrub cleaning step T4).

Next, after returning the scrub arm 71 to the initial position, the second cleaning means 34 is used to supply the pure water that has been subjected to ultrasonic vibration again to the surface of the original glass plate 2 (ultrasonic cleaning process). T5). At this time, the residue on the surface of the original glass plate 2 is completely removed by washing.

The surface of the glass original plate 2 is dried by returning the ultrasonic arm 91 to the initial position. At this time, if the surface is naturally dried, dry stains are generated on the surface of the original glass plate 2. Therefore, turntable 4
While rotating 1 at a high rotation speed of about 1000 rpm, the water adhering to the original glass plate 2 is shaken off and dried (drying process T6).

Here, the above steps T1 to T6 are shown in FIG.
A specific and detailed description will be made with reference to FIGS.

First, as shown in FIG. 8, in performing the ultrasonic cleaning process T1, the room 1 in which the polishing and cleaning mechanism is housed is installed.
2, the entrance side shutter 12b is opened, and the original glass plate 2 in the reproduction processing means 11 is conveyed into the room 12 by the conveyor 21 and then the shutter 12b is closed.

Next, the room 1 containing the polishing and cleaning mechanism.
The second shutter 12a is opened, and the transfer unit 22 of the transporting means 19 pulls up the original glass plate 2 held by the conveyor 21. After that, the transfer unit 22 conveys and mounts the glass original plate 2 on the turntable 41 of the original plate installation means 31, exhausts the gas from the exhaust pipe 42a, and vacuum-adsorbs the glass original plate 2 on the turntable 41. Then, the transfer unit 22 is retracted from the room 12 and the shutter 12a is closed.

Next, the turntable 41 starts to rotate by the rotational drive of the drive motor 45, pure water is supplied from the pure water nozzle 77 to the back surface of the original glass plate 2, and the ultrasonic cleaning process T1 is executed. First, as shown in FIG. 9, the ultrasonic arm 91 rotates and moves to the outer peripheral position of the original glass plate 2. At the same time, the wetting process of the scrub roller 73 and the cleaning of the polishing pad 62 by the polishing pad cleaning unit 53 are executed.

Then, the ultrasonic cleaning is started while the cleaning nozzle 92 is rocked by the ultrasonic arm swiveling cylinder 95, and the pure water is stopped from being discharged from the cleaning nozzle 92 after rocking a predetermined number of times. The ultrasonic arm 91 rotates and moves to the initial position. At this time,
The wetting process of the scrub roller 73 is completed.

Then, the polishing process T2 is performed. First, the polishing arm 61 of the polishing section 51 is used as the original glass plate 2.
Move to rotate to the center position of. Then, the polishing arm upper and lower cylinders 64 lower the polishing arm 61 and press the polishing pad 62 against the surface of the original glass plate 2. In this state, the polishing arm swing cylinder 65 starts swinging the polishing pad 62 while discharging the slurry of cerium oxide from the polishing agent supply nozzle 66 of the chemical solution supply unit 52 onto the surface of the original glass plate 2, and swings a prescribed number of times. After that, the supply of cerium oxide is stopped and the polishing is completed.

Then, as shown in FIG. 10, water polishing for discharging pure water from the pure water nozzle 67 onto the surface is started. When the polishing pad 62 has been rocked a specified number of times, the supply of pure water is stopped and the water polishing is completed.
Then, the polishing arm 61 rotates and moves to the initial position. Then, the polishing pad 62 is cleaned.

Next, the ultrasonic cleaning process T3 is performed. This process is similar to the ultrasonic cleaning process T1.

Then, the scrub cleaning process T4 is executed. First, after the ultrasonic arm 91 rotates and moves to the initial position, as shown in FIG. 11, the scrub arm 71 rotates and moves to the central position of the glass original plate 2,
The scrub roller 73 is pressed against the surface of the original glass plate 2. After that, while the scrub roller 73 is being rotated by the rotation drive of the drive motor 72, the scrub arm rotating cylinder 75 starts swinging the scrub arm 71, and when the swing is performed a predetermined number of times, the scrub roller 73 is rotated and the scrub arm 71 is rotated. Oscillating stops.

Thereafter, by rotating the scrub arm 71 and adjusting the height position of the scrub arm 71 by the scrub arm vertical cylinder 74, the scrub roller 73 is pressed against the end surface of the original glass plate 2 to clean the end surface for a predetermined time. To do. After the lapse of a predetermined time, the rotation of the scrub roller 73 and the supply of pure water from the pure water nozzle 76 are stopped, the scrub arm 71 is rotated to the initial position, and the wetting process of the scrub roller 73 for a predetermined time is started. To do.

Then, the ultrasonic cleaning process T5 is executed.
This process is almost the same as the ultrasonic cleaning process T3, but there are some differences after performing the ultrasonic cleaning. That is, as shown in FIG. 12, the supply of pure water from the cleaning nozzle 92 to which ultrasonic vibration is applied is stopped, the ultrasonic cleaning is completed, and the pure water from the pure water nozzle 77 to the back surface of the glass original plate 2 is removed. After stopping the supply, the pure water supply pipe 9 of the pure water supply unit 82
Pure water is supplied from 6 and the glass original plate 2 is supplied from the cleaning nozzle 92.
Ultrasonic arm 9 while discharging pure water on the surface of
Shake 1 to wash.

Next, after confirming that the original glass plate 2 does not exist in the chamber 13 in which the resist coating process as the next process is performed, the supply of pure water and the swinging of the ultrasonic arm 91 are stopped.

Next, after returning the ultrasonic arm 91 to the initial position, in the drying process T6, the turntable 41 is rotated at a high speed for a predetermined time, and the glass original plate 2 is shaken off and dried. After a lapse of a predetermined time, the turntable 41 stops, and as shown in FIG.
The shutter 12a of is opened. In this state, the transfer unit 22 moves to grip the original glass plate 2 on the turntable 41 and stop the exhaust of the exhaust pipe 42a. Then, the transfer unit 22 is used in the room 13 in which the original glass plate 2 is subjected to the next resist coating step.
And the shutter 12a is closed.

After the polishing and cleaning steps are completed, a predetermined photoresist is applied to the surface of the original glass plate (resist applying step). At this time,
In order to enhance the adhesion of the resist layer to the glass original plate, an adhesion reinforcing agent (such as a silane coupling agent) is previously applied to the surface of the glass original plate before applying the photoresist.

The composition of the positive resist is composed of a quinonediazide photodecomposing agent (naphthoquinonediazide derivative or the like), a phenol novolac resin, a solvent and the like. Naphthoquinonediazide is decomposed by irradiation of ultraviolet rays to become an alkali-soluble carboxylic acid derivative, which is dissolved in an inorganic / organic alkaline aqueous solution. By utilizing this photoreaction phenomenon, fine pits can be formed in the resist layer.

When performing the resist coating step,
A coating device as shown in FIG. 14 is used. This coating apparatus is composed of a master plate setting means 111 and a coating means 112. In the original plate setting means 111, a turntable 121 is rotatably installed on a substrate 123 via a main shaft 122, and the turntable 121 is connected to a drive motor 125 by a main shaft 122 and a coupling 124 provided below the substrate 123. The drive motor 125 controls the speed of the drive motor 125.
It is configured to be connected to the speed setter 130 via.

Further, the resist coating means 112 is provided above the original plate setting means 111, and the adhesion reinforcing agent nozzle 126 for supplying the adhesion reinforcing agent and the photoresist.
And a resist nozzle 127.

In order to apply the photoresist using the above coating apparatus, as shown in FIG. 15, first, the glass original plate 2 is placed and fixed on the turntable 121 of the original plate setting means 111, and the drive motor 125 is driven. Thus, the adhesion reinforcing agent is discharged from the adhesion reinforcing agent nozzle 126 while rotating the glass original plate 2 at a predetermined low rotation speed to apply the adhesion reinforcing agent to the surface of the glass original plate 2 (adhesion reinforcing agent applying process).

Next, in order to uniformly apply the adhesion reinforcing agent to the surface of the glass original plate 2, the rotation speed of the turntable 121 is increased, and the adhesion reinforcing agent of the adhesion reinforcing agent is increased while rotating the glass original plate 2 at a predetermined medium speed. Shake off (shaking off process). Then, in order to dry the adhesion reinforcing agent applied to the surface of the glass original plate 2, the rotation speed of the turntable 121 is further increased and the glass original plate 2 is rotated at a predetermined high rotation speed (drying process).

Then, while lowering the rotation speed of the turntable 121 to rotate the glass base plate 2 at a predetermined low rotation speed, the photoresist is discharged from the resist nozzle 127 to apply the photoresist to the surface of the glass base plate 2. (Resist coating process).

Thereafter, in order to obtain the prescribed size and shape required for forming a predetermined pit on the surface of the resist layer, the rotation speed of the turntable 121 is increased, and the original glass plate 2 is moved at a predetermined medium rotation speed. The thickness of the resist layer is adjusted while rotating (shaking process).

Then, in order to dry the photoresist applied on the surface of the original glass plate 2, the turntable 1
The rotation speed of 21 is further increased, and the original glass plate 2 is rotated at a predetermined high rotation speed to form a desired resist layer (drying process).

Next, the glass base plate is heat-treated to stabilize the resist layer on the surface of the glass base plate (baking step), it is checked whether or not there is a defect in the resist layer, and the thickness of the resist layer is measured ( After the defect inspection / resist thickness measurement step), a predetermined latent image is formed on the resist layer using a laser recording device or the like (cutting step).

Then, the glass master plate is subjected to a glass master process. First, the resist layer on which the latent image is formed is developed to reveal the relief pattern of unevenness on the resist layer (developing step). Generally, the sensitivity of a resist depends on its manufacturing lot, coating and drying conditions, temperature and humidity,
And greatly affected by many factors such as developer,
This affects the reproduction signal of the optical disc. Therefore,
It is desirable to control the end of development by monitoring the progress of development, including fluctuations in the amount of exposure during latent image formation, and to absorb the above-mentioned fluctuation factors.

In carrying out this developing step, FIG.
A development processing apparatus as shown in 6 is used. This developing processing apparatus is composed of an original plate setting means 131, a preprocessing means 132, and a light detecting means 133.

In the original plate setting means 131, the turntable 141 is rotatably installed on the substrate 143 via the main shaft 142, and the turntable 21 is driven by the main shaft 142 and the coupling 144 provided under the substrate 143. A speed control circuit 146 that is connected to the drive motor 145 and controls the speed of the drive motor 145.
It is configured to be connected to the speed setter 147 via.

The pretreatment means 132 is the original plate setting means 1
A pure water nozzle 148 for supplying pure water and a developing nozzle 149 for supplying a developing solution are provided on the upper part of the reference numeral 31, respectively. Here, as the developer, an inorganic alkali type such as sodium metasilicate is used.

Further, the light detecting means 133 has a laser irradiating section 151 for irradiating the surface of the glass original plate 32 with a laser beam such as a semiconductor laser beam, and a zero order of the laser beam irradiating the surface of the glass original plate 2. In order to execute the developing process using the above-mentioned developing processing apparatus, which is composed of photodetectors 152 and 153 for detecting the first-order diffracted light and the first-order diffracted light, respectively, as shown in FIG. The original glass plate 2 is placed and fixed on the turntable 141, and pure water is discharged from the pure water nozzle 148 while rotating the original glass plate 2 at a predetermined low rotation speed by driving the drive motor 145 to clean the surface of the resist layer. (Washing process P1).

Next, the rotation speed of the turntable 141 is increased, and while the glass base plate 2 is rotated at a predetermined medium speed, a developing solution is discharged from the developing nozzle 149 and applied on the surface of the resist layer (developing process). P2). At this time, the laser irradiation unit 151 irradiates the surface of the original glass plate 2 with laser light, and the photodetectors 152 and 153 detect the 0th-order and 1st-order diffracted light of the irradiated laser light, respectively. The required development time is determined by monitoring the light amount of the first-order diffracted light detected by the photodetector 153 with a voltage value.

Next, in order to wash off the developing solution and the resist dissolved material remaining on the surface of the resist layer to stop the progress of the developing, the developing time is determined and the discharging of the developing solution is stopped. At the same time, the turntable 141 is rotated. Pure water is discharged from the pure water nozzle 148 while maintaining the low speed to clean the surface of the resist layer (water washing process P3).

Then, in order to shake off the pure water adhering to the signal forming surface and the outer peripheral corners of the original glass plate 2, the rotation speed of the turntable 141 is increased and the original glass plate 2 is rotated at a predetermined high rotational speed for drying. Allow (shake-off process P4).

Subsequently, in order to perform electroforming for transferring the relief pattern to the metal master, it is necessary to make the surface of the resist layer a conductor. Therefore, the electroless plating method is used.
Apply nickel plating (plating process).

In this plating step, an electroless plating pretreatment step is carried out prior to the electroless plating step for converting the resist layer surface into a conductor in order to improve the surface state of the resist layer and promote plating deposition. .

When carrying out this electroless plating pretreatment step, a plating pretreatment apparatus as shown in FIG. 18 is used. This plating pretreatment device is composed of an original plate setting means 161 and a pretreatment means 162.

In the original plate installation means 161, the turntable 171 is rotatably installed on the substrate 173 via the main shaft 172, and the main shaft 172 and the coupling 54 provided under the substrate 173 drive the turntable 171 to drive the motor. The drive motor 175 is connected to a speed setter 177 via a speed control circuit 56 for controlling the speed of the drive motor 175.

The pretreatment means 162 is provided above the original plate setting means 161, and a pure water nozzle 178 for supplying pure water, a surfactant nozzle 179 for supplying a surfactant liquid, and a catalyst. A catalyst nozzle 180 for supplying the wrist liquid and an accelerator nozzle 181 for supplying the accelerator liquid are provided.

Here, the surfactant liquid is a surfactant for improving the wettability of the resist layer surface, and the catalyst liquid is colloidal of stannous chloride and stannous chloride. The acidic solution, which is an accelerator solution, promotes the adsorption action of palladium and promotes the deposition of nickel plating, and is a solution containing glucose or the like as a main component.

In order to execute the electroless plating pretreatment process using the above-mentioned plating pretreatment apparatus, as shown in FIG. 19, first, the glass original plate 2 is placed and fixed on the turntable 171 of the original plate setting means 161. The surface of the resist layer is washed by discharging pure water from the pure water nozzle 178 while rotating the original glass plate 2 at a predetermined low rotation speed by driving the driving motor 175 (water washing process Q1).

Next, while keeping the rotation speed of the turntable 171 low, the surfactant liquid is discharged from the surfactant nozzle 179 and applied on the resist layer surface (surfactant application process Q2), and then on the resist layer surface. In order to remove the remaining excess surfactant solution, pure water is again discharged from the pure water nozzle 178 to wash the surface of the resist layer (water washing process Q3).

Next, while the rotation speed of the turntable 171 was kept low, the catalyst liquid was discharged from the catalyst nozzle 180 and applied on the resist layer surface (catalyst applying process Q4), and then remained on the resist layer surface. Pure water nozzle 1 again to remove excess catalyst liquid
Pure water is discharged from 78 to wash the surface of the resist layer (water washing process Q5).

Thereafter, similarly, while maintaining the rotation speed of the turntable 171 at a low speed, the accelerator liquid is discharged from the accelerator nozzle 181 to apply the accelerator liquid to the resist layer surface (accelerator applying step Q6), and then the excess residual liquid on the resist layer surface is left. In order to remove the accelerator liquid, pure water is again discharged from the pure water nozzle 178 to wash the surface of the resist layer (washing process Q7).

Then, the rotation speed of the turntable 171 is increased in order to prevent an excessive chemical solution from being brought into a plating layer to be described later used in the electroless plating step of the next step and to maintain the life of the nickel electroless solution. Then, the original glass plate 178 is rotated at a predetermined high rotation speed to shake off the chemical liquid to dry the resist layer surface (shaking process Q8).

Then, the electroless plating step is performed after the electroless plating pretreatment step is completed as described above. When performing this step, a plating apparatus as shown in FIG. 20 is used. This plating apparatus includes a transfer unit 191, a plating tank 192, and a shower tank 19
It consists of three.

The transfer unit 191 has a pair of support shafts 201 and 2 provided so as to be orthogonal to each other.
02 and the original plate supporting portion 203 to which the glass original plate 2 is fixed.

Here, the original plate supporting portion 203 is engaged with the support shaft 202 by the engaging portion 203a thereof so as to be movable in the vertical direction indicated by the arrow Z in the drawing, and the engaging portion 203b at the other end.
The original glass plate 202 can be fixed to the. Further, the support shaft 202 is engaged with the support shaft 201 at the engaging portion 201a so as to be movable in the left-right direction indicated by the arrow X in the figure. Therefore, the original plate support portion 203 is also left-right via the support shaft 202. It is movable in any direction.

The plating bath 192 has the shape of a container with an open top, and is filled with nickel electroless solution (N
A heater 204 for heating the ED solution) is provided and configured at the bottom. Here, the nickel electroless solution is a solution containing nickel chloride, which is a metal salt, as a main component, and a pH adjusting agent, a buffering agent, a complexing agent, an accelerator, a stabilizer, and an improving agent as auxiliary components. is there. This auxiliary component serves to prolong the life of the nickel electroless solution and improve the efficiency of the reducing agent.

The shower bath 193 is the plating bath 207.
And the deionized water supply means 205 is provided on the side thereof. This pure water supply means 2
05 has a plurality of shower nozzles 206, and the shower nozzles 206 are engaged with the side portions of the shower tub 193. With the pure water supply means 205, the shower tank 1
Pure water is supplied into 93 in the form of a shower.

To carry out the electroless plating process using the above plating apparatus, as shown in FIG. 21, first, the glass original plate 2 is fixed to the engaging portion 203b of the original plate supporting portion 203 and the glass is transferred by the transfer unit 191. The original plate 2 is conveyed into the shower tank 193, and pure water is jetted by the pure water supply means 205 onto the surface of the glass original plate 2 for cleaning (water washing process R1).

Next, the plating tank 192 in which the glass original plate 2 was poured with a nickel electroless solution (NED solution) whose pH and temperature were controlled by the transfer unit 71.
The glass original plate 2 is transported to the inside and immersed in a nickel electroless solution to deposit nickel on the resist layer to form a plating film (nickel electroless solution immersion (NED immersion) step R2). At this time, the transfer unit 1
The original glass plate 2 is repeatedly swung up and down in the nickel electroless solution by 91 to prevent bubbles generated by a chemical reaction from adhering to the resist layer surface.

After that, the glass original plate 2 is showered by the transfer unit 191 as in the above.
Then, the pure water is supplied to the surface of the original glass plate 2 by the pure water supply means 205 to wash it (washing process R
3) The dry spots on the surface of the resist layer and foreign substances floating on the surface of the nickel electroless solution and adhering to the surface of the resist layer are removed.

Then, in order to prevent the occurrence of dry spots which are likely to occur due to the drying after the above washing process, the glass unit 2 is held still by the transfer unit 71 while being dried (drying process R4).

After the above plating process is completed, the surface of the conductive resist layer is used as a cathode and nickel is used as an anode in a nickel sulfamate bath to conduct current to deposit metallic nickel on the glass original plate (electroforming). Process). Then, after electroforming is continued until the thickness of the metal nickel film is about 0.3 mm, the metal nickel film is peeled off from the glass original plate to prepare a nickel master, and further transferred to pass through the mother. A metal master (stamper) is completed (stamper peeling process).
After that, as described above, after the metal master is manufactured, the glass master plate is again used for manufacturing the metal master.

Then, after the above-described master disk manufacturing process is completed and a metal master disk is manufactured, each optical disk is manufactured in a disk forming process.

Here, in the above-described master disc manufacturing process,
A case in which some work defect occurs in each process will be described.

First, except for the polishing and cleaning steps, the resist coating step, and the glass master step, a reprocessing process which is a pre-process of the master disk manufacturing process, a baking process, a defect inspection / resist thickness measuring process and a cutting process, and an electroforming process. For each step of the process and the stamper peeling process, if it is determined that a work defect has occurred during each process or after the process ends, this defective glass original plate is sent to the room where the next process is performed in the clean tunnel. Although it is carried by the carrying means, it is carried to the next step without being subjected to the treatment, is sent again to the regeneration processing means 1, and is again provided for the regeneration processing process.

In the polishing step and the cleaning step, if any work failure occurs during the execution of the polishing step, as shown in FIG. 22, an interrupt is started and the processing of the glass original plate 2 is stopped first. To be done. At this time, it is determined that the original glass plate 2 is defective, the trouble of the processing apparatus is reset, the processing apparatus is restarted, and the polishing and cleaning steps are performed again from the work of H shown in FIG. To do.

The following work defects may be considered as the following:

(1) During processing, the user interrupts the work by pressing the emergency stop switch of the processing apparatus.

(2) During the treatment, a shortage of abrasive and pure water occurred.

(3) During the processing, ultrasonic oscillation, scrubbing, and supply of pure water were stopped.

(4) A defect has occurred in the actuator of the processing device.

(5) The door of the processing device is opened, and the cleanliness is lowered.

On the other hand, even when the operation of the polishing / cleaning mechanism is stopped for some reason after the main work in the polishing and cleaning steps is finished and the original glass plate 2 is left for a certain time or more, Similarly, after the glass original plate 2 is determined to be defective, the trouble of the polishing / cleaning mechanism is reset, the polishing / cleaning mechanism is restarted, and the polishing process is performed again.

That is, first, when the ultrasonic cleaning step T5 is performed, when the original glass plate 2 is present in the chamber 13 (resist coating step) after the ultrasonic cleaning is performed, the ultrasonic arm 91 is swung and pure water is discharged. On the other hand, while continuing the operation (this work is referred to as S), it is determined whether or not the glass original plate 2 has been left for a certain period of time (denoted as x minutes) or more. x
When it is determined that the minutes have passed, the NG flag is set, and after the drying process T6 is completed, the polishing and cleaning processes are performed again from the operation G shown in FIG. If it is judged that the elapsed time is less than x minutes, the Ultrasonic Arm 9
The oscillation of 1 and the discharge of pure water are continued.

It starts from the rocking of.

Further, after the drying process T6 is finished and the turntable 41 is stopped, when the operation stop and restart commands of the polishing and cleaning mechanism are issued in S, the glass base plate 2
It is determined whether or not it has been left for a certain period of time (denoted as y minutes) or more. When it is determined that y minutes have passed, the polishing and cleaning steps are performed again from the work of G shown in FIG. 8, and when it is determined that the elapsed time is less than y minutes, the shutter of the room 12 is left as it is. 12a is opened, and the original glass plate 2 is conveyed to the resist coating step which is the next step.

If the command to stop the operation of the polishing / cleaning mechanism is not issued in S, if the NG flag is set, the polishing and cleaning steps are executed again from the work of G, and if the NG flag is not set, the above room is left as it is. The shutter 12a of 12 opens, and the original glass plate 2 is conveyed to the next process.

If the glass original plate 2 is left for a predetermined time or more after the polishing process is completed, the abrasive material on the surface of the glass original plate is solidified. Therefore, the abrasive material may be removed in the cleaning process. It will be impossible. Further, the glass original plate 2 tends to have a delicate physical or chemical change on its surface when left untreated after the polishing process. If such a change occurs, the film thickness and the adhesiveness of the resist layer applied and formed on the surface of the glass original plate 2 will be significantly deteriorated in the resist applying step, which is a step subsequent to the polishing and cleaning steps.

Therefore, it is considered very appropriate to judge that a work defect has occurred in the glass original plate 2 when the glass original plate 2 is left for a certain period of time as described above, and then polishing is performed again. By executing from the processing, the surface state of the glass original plate 2 is recovered.

If the original glass plate 2 is left for a predetermined period of time after the cleaning process is completed, the adhesive force of the resist layer formed when the resist is applied in the next step is significantly reduced. Further, the temperature and so-called wettability of the original glass plate 2 are changed by leaving it after the cleaning process is finished, and the film thickness of the resist layer is changed.

Therefore, it is considered very appropriate to judge that a work defect has occurred in the glass base plate 2 when the glass base plate 2 is left for a certain period of time as described above, and then polishing is performed again. By performing the processing from the processing, the surface state of the original glass plate 2 is recovered.

Regarding the resist coating process, FIG.
As shown in FIG. 3, when some work failure occurs during the execution of the resist coating process, first, the processing of the original glass plate is stopped. Note that, as the above-mentioned work failure, the following may be considered, for example.

(1) During processing, the user interrupts the work by pressing the emergency stop switch of the processing apparatus.

(2) During processing, a shortage of photoresist and adhesion enhancer occurred.

(3) Exhaust defects in the clean tunnel and other utility abnormalities occurred.

(4) A defect has occurred in the actuator of the processing device.

(5) The door of the processing device is opened, and the cleanliness is lowered.

After performing a trouble reset on the processing apparatus (the above-mentioned coating apparatus installed in the room 13 in the clean tunnel), the processing apparatus is restarted and the defective post-processing step is executed. In this defective post-treatment process,
The defective glass original plate mounted and fixed on the turntable 121 of the original plate setting means 111 is rotated at a high speed to shake off the photoresist and the adhesion reinforcing agent remaining on the defective glass original plate, and then the defective glass original plate is dried.

At this time, it is determined that the glass original plate is defective, and the defective glass original plate is conveyed by the conveying means to the chamber 14 for carrying out the baking step which is the next step in the clean tunnel. Without being processed, it is further transported to the next step in sequence and sent again to the regeneration processing means 11 to be reused in the regeneration processing process.

As described above, in the present embodiment, when a defect occurs during the execution of the resist coating process in the master disk manufacturing process, the photoresist and the adhesion reinforcing agent remaining on the defective glass master plate are removed by shaking off the defect. After drying the glass original plate, the defective glass original plate is again subjected to the reprocessing process. Therefore, the defective glass original plate is conveyed to the regeneration processing means 11 without the photoresist and the adhesion reinforcing agent being adhered to the surroundings in a state where the photoresist and the adhesion reinforcing agent are sufficiently removed from the defective glass original plate.

In the glass master process,
As shown in FIGS. 24 and 25, when a defect occurs in each step, the defective glass original plate is washed and dried, and then again subjected to the reprocessing step which is the initial step of the original plate manufacturing process.

That is, as shown in FIG. 24, first, in the execution of the developing process, if any work defect occurs during the processing, the progress of the processing is stopped and an instruction to restart the processing apparatus is issued. After that, the glass master plate 2 is washed with water P3.
And the shake-off process P4 is performed. Then, the original glass plate 2 is judged to be a defective original glass plate, and is returned to the reprocessing process which is a pre-process of the original plate manufacturing process which is the same as the other processes except the polishing process and the cleaning process, and is processed again.

Therefore, the original glass plate 2 is conveyed without being contaminated with the chemical solution or the like in the processing apparatus, and is again subjected to the recycling processing process in the same state as the initial state.

Further, as shown in FIG. 24, after the development process is normally completed, in the plating process, when the electroless plating pretreatment process is first performed, when some work defect occurs during the process, Also, the same treatment as in the developing step is performed. That is, the glass master plate 2 is washed with water Q7.
After performing the shake-off process Q8, the process is returned to the regeneration process and processed again in the same manner as the other processes except the polishing and cleaning processes.

Therefore, the original glass plate 2 is transported without being contaminated in the processing apparatus by a chemical solution or the like, and is again subjected to the reprocessing process in the same state as in the initial state.

Note that, as the above-mentioned work failure, the following may be considered, for example.

(1) During the process, the user interrupts the work by pressing the emergency stop switch of the processor.

(2) A shortage of various chemicals occurred during the treatment.

(3) A defect has occurred in the actuator of the processing device.

(4) The door of the processing device was opened, and the cleanliness was lowered.

On the other hand, after the pretreatment step of the electroless plating is completed, when the glass original plate 2 is left for a predetermined fixed time (denoted by α in FIG. 25) for a predetermined period of time, it is repeated until that time. The total number of times of the pretreatment process for electroless plating was calculated by adding 1 to the total number of pretreatment steps (denoted as N = N + 1 in FIG. 24), the glass base plate 2 was determined to be a defective glass base plate, and electroless plating was performed again Subject to the pretreatment process.

Further, when the glass base plate 2 is not left for a predetermined period of time or more (that is, when the leaving time is less than α minutes) after the completion of the electroless plating pretreatment step, the glass base plate is Assuming that the pretreatment process for electroless plating was successfully performed on No. 2 (indicated as OK in FIG. 24),
Proceed to the next step, the electroless plating step.

In this way, when the glass base plate 2 is left to stand after the completion of the electroless plating pretreatment step, the glass base plate 2 is left to stand.
Unevenness occurs on the surface of the nickel plating film, and the deposition reaction rate of the nickel plating film locally changes in the subsequent electroless plating process to form the nickel plating film unevenly. Therefore, in this example, when the glass original plate 2 was left for a certain period of time (α minutes) after the completion of the electroless plating pretreatment step, it was determined that the glass original plate 2 was a defective glass original plate, and electroless plating was performed again. By applying the plating pretreatment step, uneven formation of the nickel plating film on the glass original plate 2 in the electroless plating step is suppressed, and the work failure in the electroless plating step is reduced. Therefore, the rate of returning to the initial process again is significantly reduced.

Then, in the electroless plating step which is the next step, as shown in FIG. 25, the treatment differs depending on the number of times (N times) the electroless plating pretreatment step is repeated.
First, when N = 0, that is, when the electroless plating pretreatment process is performed only once, the glass base plate 2 in the plating bath 192 in the nickel electroless solution dipping process is processed.
Set the number of swings of to X times. On the other hand, when N ≠ 0, the number of times of rocking in the electroless plating step is reduced according to the calculated value of N.

That is, the number of swings Y in the process is expressed by the following equation (1) with k as a coefficient.

Y = X−kN (1) Therefore, in this step, the immersion time of the glass original plate 2 in the nickel electroless solution is reduced according to the number of times the pretreatment step of electroless plating is repeated. It will be.

As described above, when the electroless plating pretreatment process is performed again, the total number N of repeated electroless plating pretreatment processes is calculated, and the glass in the electroless plating process is calculated according to the calculated value. By reducing the immersion time of the original plate 2 in the nickel electroless solution, the excessive amount of treatment due to the repetition of the electroless plating pretreatment process is offset, and a constant nickel plating film is always formed on the glass original plate 2. .

Then, the number of swings Y set as described above
If any work failure occurs during the electroless plating process, the same treatment as in the developing process is performed. That is, after subjecting the glass base plate 2 to the water washing process R3 and the drying process R4, the glass base plate 3
It is judged that No. 2 is a defective glass original plate, and the process is returned to the recycling process and processed again.

Therefore, the original glass plate 2 is conveyed without being contaminated by the chemical solution or the like in the processing apparatus, and is again subjected to the recycling processing process in the same state as the initial state.

On the other hand, after the electroless plating process is completed,
When the glass original plate 2 is left for a predetermined fixed time (indicated as β time in FIG. 25) or more, it is determined that the glass original plate 2 is defective, and the process returns to the recycling process to be processed again. .

Further, after the electroless plating process is completed,
If the glass original plate 2 has not been left for a predetermined period of time or longer (that is, the leaving time is less than β hours), it is assumed that the glass original plate 2 has been successfully subjected to the electroless plating process (Fig. 25, referred to as “OK”), and proceeds to the next step, an electroforming step.

As described above, according to the optical disk manufacturing method of the present embodiment, the polishing and cleaning steps, the resist coating step, and the glass master step are executed as described above in the master disk manufacturing process, so that the working environment is improved. It is possible to realize the improvement and manufacture a metal master having excellent yield and reliability.

Although the embodiments to which the present invention is applied have been described above, the present invention is not limited to these embodiments, and, for example, the configuration of the master making process is changed without departing from the gist of the present invention. Mastering can be performed.

[0159]

According to the optical disk manufacturing apparatus of the present invention, it is possible to shorten the processing time and improve the working environment in the master disk manufacturing process to manufacture a metal master disk having excellent yield and reliability. It will be possible.

[Brief description of drawings]

FIG. 1 is a flow chart showing a master disc manufacturing process in the present embodiment.

FIG. 2 is a schematic diagram showing a clean tunnel for executing each step of the master disk manufacturing process in the present embodiment.

FIG. 3 is a plan view schematically showing a polishing / cleaning mechanism of the present embodiment.

FIG. 4 is a front view schematically showing an original plate setting means, a polishing means, and a second cleaning means, which are components of the polishing and cleaning mechanism.

FIG. 5 is a front view schematically showing an original plate setting means and a first cleaning means which are components of the polishing and cleaning mechanism.

FIG. 6 is a block diagram schematically showing a control means that is a component of the polishing and cleaning mechanism.

FIG. 7 is a flowchart showing polishing and cleaning steps in the master disk manufacturing process.

FIG. 8 is a flowchart specifically showing a polishing and cleaning process including a case where a work defect occurs.

FIG. 9 is a flowchart specifically showing a polishing and cleaning process including a case where a work defect occurs.

FIG. 10 is a flowchart specifically showing a polishing and cleaning process including a case where a work defect occurs.

FIG. 11 is a flowchart specifically showing a polishing and cleaning process including a case where a work defect occurs.

FIG. 12 is a flowchart specifically showing a polishing and cleaning process including a case where a work defect occurs.

FIG. 13 is a flowchart specifically showing a polishing and cleaning process including a case where a work defect occurs.

FIG. 14 is a side view schematically showing a coating apparatus used when performing a resist coating step.

FIG. 15 is a flowchart showing a resist coating step in the master disk manufacturing process.

FIG. 16 is a side view schematically showing a coating device used when performing a developing process.

FIG. 17 is a flowchart showing a developing step in the master disk manufacturing process.

FIG. 18 is a side view schematically showing a coating apparatus used when performing a pretreatment step of electroless plating.

FIG. 19 is a flowchart showing a pretreatment step of electroless plating in the master disk manufacturing process.

FIG. 20 is a side view schematically showing a coating apparatus used when performing an electroless plating process.

FIG. 21 is a flowchart showing an electroless plating step in the master disk manufacturing process.

FIG. 22 is a flowchart showing a process when a work defect occurs in the polishing process and the cleaning process.

FIG. 23 is a flowchart showing a process when a work defect occurs in the resist coating process.

FIG. 24 is a flowchart showing a process when a work defect occurs in the developing process and the electroless plating pretreatment process.

FIG. 25 is a flow chart showing a process when a work failure occurs in the electroless plating process.

FIG. 26 is a flowchart showing a conventional master disk manufacturing process.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Clean tunnel 2 Glass original plate 11 Regeneration processing means 12-18 Room 31 Original plate setting means 32 Polishing means 33 First cleaning means 34 Second cleaning means

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Norio Mitsui 6-735 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony Corporation

Claims (5)

[Claims] 1. An optical disk manufacturing apparatus for manufacturing a metal original disk of an optical disk using a glass original plate, comprising an original plate setting means for rotatably installing and fixing the glass original plate, and polishing the surface of the glass original plate to flatten it. And a cleaning means for performing a cleaning process for cleaning and removing the polishing material remaining on the surface of the original glass plate, and a polishing and cleaning mechanism provided in the vicinity of the original plate setting means. An optical disk manufacturing apparatus characterized by being provided. 2. The cleaning means comprises a first cleaning means for cleaning and removing the abrasive remaining on the surface of the glass original plate using a scrub roller, and a second cleaning means for cleaning the surface of the glass original plate by ultrasonic waves. The optical disc manufacturing apparatus according to claim 1, wherein the optical disc manufacturing apparatus comprises: 3. The optical disk manufacturing apparatus according to claim 1, wherein the polishing / cleaning mechanism returns the defective glass original plate to the polishing process and the cleaning process when a defect occurs in the original glass plate. 4. The optical disk manufacturing apparatus according to claim 1, further comprising a clean tunnel in which each step of manufacturing a metal master of an optical disk is performed by sequentially transporting a glass master. 5. The optical disk manufacturing apparatus according to claim 4, wherein the defective glass original plate is passed through the clean tunnel and returned to the initial process without performing the next step on the defective glass original plate.