JPH08256451A - Multi-core slip ring device for rotating device - Google Patents
Multi-core slip ring device for rotating deviceInfo
- Publication number
- JPH08256451A JPH08256451A JP7057784A JP5778495A JPH08256451A JP H08256451 A JPH08256451 A JP H08256451A JP 7057784 A JP7057784 A JP 7057784A JP 5778495 A JP5778495 A JP 5778495A JP H08256451 A JPH08256451 A JP H08256451A
- Authority
- JP
- Japan
- Prior art keywords
- side substrate
- slip ring
- core slip
- contact plate
- rotating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Motor Or Generator Current Collectors (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は低速な回転部に使用する
回転装置用多芯スリップリング装置に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multi-core slip ring device for a rotating device used in a low speed rotating part.
【0002】[0002]
【従来の技術】従来の技術としては、図3のような回転
円筒8の導電部8aと接触子9を用いたものや、図4の
ような円板10の導電部と接触子11を用いたスリップ
リングであった。2. Description of the Related Art As a conventional technique, one using a conductive portion 8a of a rotating cylinder 8 and a contactor 9 as shown in FIG. 3 and one using a conductive portion of a disk 10 and a contactor 11 as shown in FIG. It was a slip ring.
【0003】[0003]
【発明が解決しようとする課題】前述の従来技術には、
多芯にすることにより、円筒を用いたものは長さが長く
なり、円板を用いたものは直径が大きくなるという欠点
がある。DISCLOSURE OF THE INVENTION Problems to be Solved by the Invention
The use of multiple cores has a drawback that the length using a cylinder becomes long and the diameter using a disk increases.
【0004】本発明は、これらの欠点を除き小型で製作
が容易な多芯スリップリングを提供することを目的とす
る。An object of the present invention is to provide a multi-core slip ring which is small in size and easy to manufacture except for these drawbacks.
【0005】[0005]
【課題を解決するための手段】本発明は上記目的を達成
するため、固定側基板と回転側基板とばね性を有する接
触板を同軸上に重ねて、多芯のスリップリングを構成す
るようにしたものである。In order to achieve the above object, the present invention comprises a fixed-side substrate, a rotating-side substrate, and a contact plate having a spring property, which are coaxially overlapped with each other to form a multi-core slip ring. It was done.
【0006】[0006]
【作用】固定基板は両面の同軸上に独立した導電面を有
し、回転基板も同様に導電面を有しており、両基板をば
ね性を有する接触板を間にはさむようにして順次重ねて
いくことにより希望の芯数のスリップリングが出来る。
そのため直径も小さく長さも短い多芯のスリップリング
が構成される。The fixed board has coaxially independent conductive surfaces on both sides, and the rotary board also has a conductive surface. Both boards are sequentially stacked with a contact plate having a spring property interposed therebetween. The slip ring with the desired number of cores can be made by going.
Therefore, a multi-core slip ring having a small diameter and a short length is constructed.
【0007】[0007]
【実施例】以下にこの発明の一実施例を図1、図2にて
説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS.
【0008】図1はスリップリング装置の構造図で、1
は固定軸で固定側基板4を固定ピンAで1体物化してい
る。同様に2は回転軸で回転側基板5を固定ピンBで1
体物化している。両基板4、5の間にばね性有する接触
板6がはさまれており、回転軸2が回転しても両基板の
導電面間に導通が得られ回転による線材7のよじれもな
く電流や信号が伝達できる。FIG. 1 is a structural diagram of a slip ring device.
Is a fixed shaft, and the fixed side substrate 4 is integrated into one body by the fixed pin A. Similarly, 2 is a rotating shaft, and 1 is a fixing pin B for the rotating side substrate 5.
It has become a physical body. A contact plate 6 having a spring property is sandwiched between the two substrates 4 and 5, so that even if the rotating shaft 2 rotates, conduction is obtained between the conductive surfaces of the two substrates, and the wire 7 is not twisted due to the rotation and the current and Signal can be transmitted.
【0009】図2は固定側基板4、回転側基板5、ばね
性を有する接触板6の関係を詳細に示したもので、固定
軸側と回転軸側との間の電流又は信号の伝達は固定側基
板4と回転側基板5の間に狭まれた導電性およびばね性
を有する接触板6を介して行われる。なお、この接触板
は固定側基板4、回転側基板のいずれか一方に固定され
ていても、いずれにも固定されていなくてもよい。FIG. 2 shows in detail the relationship between the fixed-side substrate 4, the rotating-side substrate 5, and the contact plate 6 having a spring property, and the transmission of current or signals between the fixed shaft side and the rotating shaft side. It is performed through a contact plate 6 having a conductive property and a spring property, which is narrowed between the fixed-side substrate 4 and the rotating-side substrate 5. The contact plate may be fixed to either one of the fixed-side substrate 4 and the rotating-side substrate, or may not be fixed to any of them.
【0010】[0010]
【発明の効果】本発明によれば、1板の基板で2回路得
られ、基板間も狭くすることが出来るため多芯になって
も小型に出来る。また、芯数も増すことも減らすことも
任意に出来、基板はプリント技術を用いることにより安
価に製作出き、組立も容易になる。As described above, according to the present invention, two circuits can be obtained from one board, and the distance between the boards can be narrowed, so that the size can be reduced even if the number of cores is increased. Further, the number of cores can be arbitrarily increased or decreased, and the substrate can be manufactured at low cost by using a printing technique and the assembling can be facilitated.
【図1】本発明のスリップリングの一実施例を示す図。FIG. 1 is a diagram showing an embodiment of a slip ring of the present invention.
【図2】本発明の実施例の部分詳細図である。FIG. 2 is a partial detailed view of an embodiment of the present invention.
【図3】従来技術の円筒形スリップリングの一例を示す
図である。FIG. 3 is a diagram showing an example of a conventional cylindrical slip ring.
【図4】従来技術の円板形スリップリングの一例を示す
図である。FIG. 4 is a diagram showing an example of a conventional disc-shaped slip ring.
1 固定軸 2 回転軸 3 軸受 4 固定側基板 5 回転側基板 6 接触板 2 線材 8 回転筒 9、11 接触子 10 回転円板 A、B 固定ピン 1 Fixed shaft 2 Rotation shaft 3 Bearing 4 Fixed side substrate 5 Rotation side substrate 6 Contact plate 2 Wire rod 8 Rotating cylinder 9, 11 Contact 10 Rotating disk A, B Fixed pin
Claims (1)
側基板と回転側基板とを交互に同軸上に重ねて配置する
とともに、それらを導通させるばね性を有する接触板を
固定側基板と回転側基板の間に介在させたことを特徴と
する回転装置用多芯スリップリング装置。1. A stationary-side substrate and a rotating-side substrate, which have conductive portions on at least opposite surfaces thereof, are alternately and coaxially overlapped with each other, and a contact plate having a spring property for electrically connecting them is provided. A multi-core slip ring device for a rotating device, characterized by being interposed between substrates.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7057784A JPH08256451A (en) | 1995-03-16 | 1995-03-16 | Multi-core slip ring device for rotating device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7057784A JPH08256451A (en) | 1995-03-16 | 1995-03-16 | Multi-core slip ring device for rotating device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH08256451A true JPH08256451A (en) | 1996-10-01 |
Family
ID=13065514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7057784A Pending JPH08256451A (en) | 1995-03-16 | 1995-03-16 | Multi-core slip ring device for rotating device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH08256451A (en) |
-
1995
- 1995-03-16 JP JP7057784A patent/JPH08256451A/en active Pending
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |