JPH08255886A - Package for ccd - Google Patents

Abstract

PURPOSE: To obtain a high quality package for a CCD by fixing a window frame onto a glass substrate through a lead frame while exposing the terminal part of the lead frame mounted on the glass substrate. CONSTITUTION: The terminal part 3 of a lead frame 2 is mounted on a glass substrate 1 with the leg part 4 projecting from the surface thereof. Surface of the glass substrate 1 is cut with a predetermined width so that a ceramic member 5 is exposed partially and a CCD chip is bonded into the cut part 6. A wind frame 7 is fixed onto a glass substrate 1 through a lead frame 2 while exposing the terminal part 3 of the lead frame 2. The lead frame 2 and the wind frame 7 can be bonded using a thin glass plate 8 having low melting point and a cover glass 9 can be bonded thereon.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CCD package which can prevent warpage and can significantly reduce the defective rate at the time of chip attachment and can be provided at a low cost.

[0002]

2. Description of the Related Art Conventionally, as a CCD package for a line sensor incorporated in an image reader, a scanner or the like used in various OA devices, most of all-ceramic products in which the whole substrate is made of ceramic are used. Is.

This all-ceramic product has a lead frame in which a terminal portion is placed on a ceramic substrate and protrudes from the plate surface of the ceramic substrate, and a terminal portion of the lead frame is exposed on the ceramic substrate. It consists of a ceramic cover fixed to the lead frame.

[0004]

However, it is known that this all-ceramic product causes a large warp.

Further, this all-ceramic product has a drawback in that the cost cannot be reduced so much and it is not possible to meet the recent demand for lower prices.

[0006] In order to solve this problem, when the substrate is made of glass to eliminate the warp and an attempt has been made to develop a product which can further reduce the cost, a tentative result has been obtained.
In other words, it was possible to obtain a product that was qualitatively satisfactory in terms of eliminating warpage.

However, in the above glass substrate,
It turns out that there is a problem in thermal conductivity. this is,
Because the density of line sensors built into image readers and scanners used in OA equipment in recent years has increased and the colorization has progressed, heat is likely to accumulate on the glass substrate during operation, causing problems. is there.

The CCD package of the present invention is intended to solve the above-mentioned drawbacks of the conventional example, and to provide a CCD package of good quality by using a glass substrate as the substrate.

[0009]

[Means for Solving the Problems] CC of the present invention
In the D package, a glass substrate, a lead frame on which a terminal portion is mounted on the glass substrate, and a wind frame is sandwiched on the glass substrate with the terminal portion of the lead frame exposed. It is characterized by that.

In the CCD package of the present invention, a glass substrate having a ceramic member substantially in the center thereof to improve thermal conductivity, a lead frame having a terminal portion mounted on the glass substrate, and the lead frame are provided. It is characterized in that the window frame is fixed on the glass substrate with the lead frame being sandwiched in a state where the terminal portion of is exposed.

In the CCD package of the present invention, a glass substrate having a heat conductivity improved by interposing a metal member substantially in the center, a lead frame having a terminal portion mounted on the glass substrate, and a lead frame of the lead frame are provided. It is characterized in that the window frame is fixed on the glass substrate with the lead frame sandwiched in a state where the terminal portion is exposed.

In the above description, one of the features is that the corner portion of the ceramic member or the metal member interposed in the glass substrate substantially at the center is rounded.

Further, the CCD package of the present invention is
It is also characterized in that a ceramic member or a metal member interposed at substantially the center of the glass substrate is laminated on the glass substrate having an opening at the substantially center.

It should be noted that, in the above, by laminating on the glass substrate having an opening at the substantially center, the ceramic member or the metal member interposed in the glass substrate at the substantially center has a groove formed on the joint surface with the glass substrate. Is also one of the features.

[0015]

According to the CCD package of the present invention, since the substrate is made of glass, the cost can be reduced, and the warp of the substrate can be eliminated to obtain a product of satisfactory quality. .

Further, the problem of thermal conductivity in the glass substrate can be solved by interposing a ceramic member or a metal member in the substantially center of the glass substrate, and it has become possible to provide a CCD package of higher quality. .

[0017]

Embodiments of the CCD package of the present invention will be described below with reference to the drawings.

1 to 3 show an embodiment of a CCD package according to the present invention. In the figure, 1 is a glass substrate. The glass for the glass substrate 1 has a coefficient of thermal expansion substantially matched to that of a ceramic or metal that is an inclusion.

A lead frame 2 is attached to the surface of the glass substrate 1. That is, the terminal portion 3 of the lead frame 2 is placed on the glass substrate 1 and the leg portion 4
Are projected from the plate surface of the glass substrate 1.

Further, on the back surface of the glass substrate 1, a plate-shaped ceramic member 5 having a predetermined width is embedded substantially in the center thereof. The ceramic member 5 prevents the glass substrate 1 from accumulating heat during the operation of the CCD package, so that trouble can be prevented. The surface of the glass substrate 1 is cut out with a predetermined width so that the ceramic member 5 is partially exposed, and a CCD chip is bonded to the cutout 6.

With the terminal portion 3 of the lead frame 2 exposed, the wind frame 7 is fixed on the glass substrate 1 with the lead frame 2 interposed therebetween. Then, the lead frame 2 and the wind frame 7 can be fixed to each other by using a low melting point glass thin plate (frit glass) 8 and a cover glass 9 can be adhered thereon. Of course, the glass substrate 1 and the wind frame 7
May be made compatible with each other, and may be integrated by heat fusion.

The lead frame 2 has its terminal portion 3
Is placed so as not to cover the notch 6 on the surface of the glass substrate 1, and the wind frame 7 fixed thereon is formed in a frame shape and attached so as to surround the periphery of the glass substrate 1. Therefore, the terminal portion 3 of the lead frame 2 is attached while being exposed in the wind frame 7.

At the approximate center of the back surface of the glass substrate 1,
Instead of the ceramic member 5, a plate-shaped metal member having a predetermined width can be embedded. This metal plate can prevent heat accumulation with the same efficiency as the ceramic member 5.

The glass substrate 1 in which a ceramic member or a metal member is embedded has a warp of 3/100 mm or less and is of excellent quality. A conventional ceramic-only molded product is liable to warp during firing, and it is difficult to correct the warp by polishing or the like. Since the ceramic plate used in the present invention is plate-shaped, it has little warpage, and the warpage can be easily corrected by polishing or the like, which is excellent in mass productivity. The same thing can be said for metal plates.

4 and 5 show another embodiment of the CCD package of the present invention. In the figure, reference numeral 1 denotes a glass substrate. On the surface of the glass substrate 1, a terminal portion 3 is placed on the glass substrate 1, and a leg portion 4 is protruded from the plate surface of the glass substrate 1, whereby a lead frame 2 is formed. It is installed.

Further, the surface of the glass substrate 1 is cut out with a predetermined width, and the CCD chip is bonded onto the cutout groove 6 '.

Also in this example, the lead frame 2 is used.
The window frame 7 is fixed on the glass substrate 1 with the lead frame 2 sandwiched therebetween with the terminal portion 3 exposed. Then, the lead frame 2 and the wind frame 7 can be fixed to each other by using a low melting point glass thin plate 8 or a means of heat fusion, and a cover glass 9 can be bonded thereon.

The obtained CCD package had substantially the same effect as that of the above-mentioned embodiment except for the thermal conductivity.

FIG. 6 is a rear view showing another embodiment of the CCD package of the present invention. In the figure, 11 is a glass substrate, in which a ceramic member or a metal member 12 is embedded. Then, the corner portion 13 of the ceramic member or the metal member 12 is rounded as shown in FIG. In this way, it is possible to absorb the difference in the expansion coefficient between the glass substrate 11 and the ceramic member or the metal member 12 by simply rounding the corner portion 13, and as shown in FIG. It is possible to eliminate the crack 14 from the corner portion 13 of the glass substrate 11.

7 and 8 show another embodiment of the CCD package of the present invention. FIG. 7 shows a manufacturing process of a semi-finished product, and 21 is a glass thin plate provided with a substantially central strip-shaped opening 22. This glass sheet 21
Is assembled by sandwiching it between the lead frame 23 and the ceramic substrate or metal substrate 25, and then sealed at a high temperature in a jig (not shown). At this time, the terminal portion 24 of the lead frame 23 is fixed in the thin glass plate 21 in a buried state.

In the semi-finished product 31 thus obtained, as shown in FIG. 8, the wind frame 33 is joined via the low melting glass thin plate 32 for joining, and the temperature lower than the above temperature is again set in the jig. Then, they are sealed and completed as a CCD package. Of course, a cover glass can be glued on this.

In the embodiment shown in FIG. 9, a groove 34 is formed on the ceramic substrate or metal substrate 25 of the above-mentioned embodiment and along the joint surface with the thin glass plate. This groove 3
In No. 4, when the thin glass plate is sandwiched between the lead frame and the ceramic substrate or the metal substrate and sealed and sealed at a high temperature, the thin glass plate melts into the groove 34, thereby further improving the adhesion with the thin glass plate. It is possible to let.

[0033]

According to the CCD package of the present invention, since the substrate is made of glass, the cost can be reduced, and the warp of the substrate can be eliminated to obtain a product of satisfactory quality. became.

Further, the problem of heat conductivity in the glass substrate is solved by interposing a ceramic member or a metal member in the substantially center of the glass substrate, and it becomes possible to provide a CCD package of higher quality. .

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of a CCD package according to the present invention.

FIG. 2 is a bottom view thereof.

FIG. 3 is an enlarged cross-sectional view of the relevant part.

FIG. 4 is a plan view showing another embodiment.

FIG. 5 is an enlarged cross-sectional view of the relevant part.

FIG. 6 is a main part plan view showing another embodiment.

FIG. 7 is a manufacturing process diagram of a semi-finished product according to still another embodiment.

FIG. 8 is a manufacturing process diagram of the finished product.

FIG. 9 is a perspective view showing another embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 glass substrate 2 lead frame 3 terminal portion 4 leg portion 5 ceramic member 6 notch portion 6'notch groove 7 wind frame 8 low melting glass thin plate 9 cover glass 11 glass substrate 12 ceramic member or metal member 13 corner portion 14 crack 21 Glass thin plate 22 Opening 23 Lead frame 24 Terminal part 25 Ceramic or metal substrate 31 Semi-finished product 32 Low melting glass thin plate 33 Wind frame 34 Groove

Claims (6)

[Claims] 1. A glass substrate, a lead frame on which terminal portions are mounted on the glass substrate, and a wind frame is fixed on the glass substrate with the lead frame sandwiched with the terminal portions of the lead frame exposed. CCD package characterized by the following. 2. A glass substrate having a ceramic member interposed substantially in the center to improve thermal conductivity, a lead frame having a terminal portion mounted on the glass substrate, and a terminal portion of the lead frame exposed. A package for a CCD characterized in that a wind frame is fixed on a glass substrate with a lead frame sandwiched between them. 3. A glass substrate having a heat conductivity improved by interposing a metal member substantially in the center, a lead frame having a terminal portion mounted on the glass substrate, and a terminal portion of the lead frame exposed. A package for a CCD characterized in that a wind frame is fixed on a glass substrate with a lead frame sandwiched between them. 4. The package for CCD according to claim 2, wherein a corner portion of a ceramic member or a metal member interposed in the glass substrate at substantially the center thereof is rounded. 5. The CCD package according to claim 2, wherein the ceramic member or the metal member interposed substantially at the center of the glass substrate is laminated on the glass substrate having the substantially central opening. 6. A ceramic member or a metal member, which is interposed in a substantially central portion of the glass substrate by laminating it on a glass substrate having a substantially central opening, forms a groove on a joint surface with the glass substrate. The CCD package described in 5.