JPH08250886A - Electric board - Google Patents

Electric board

Info

Publication number
JPH08250886A
JPH08250886A JP4733895A JP4733895A JPH08250886A JP H08250886 A JPH08250886 A JP H08250886A JP 4733895 A JP4733895 A JP 4733895A JP 4733895 A JP4733895 A JP 4733895A JP H08250886 A JPH08250886 A JP H08250886A
Authority
JP
Japan
Prior art keywords
board
child
metal plate
substrate
electric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4733895A
Other languages
Japanese (ja)
Inventor
Shigeo Kiyohara
茂夫 清原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP4733895A priority Critical patent/JPH08250886A/en
Publication of JPH08250886A publication Critical patent/JPH08250886A/en
Pending legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

PURPOSE: To provide an electric board which can be mounted/removed from and electrically connected to a mother board easily by reducing influence due to radiation noise between respective subsidiary boards and correcting deflection generated on the board att the time of mounting components. CONSTITUTION: When a subsidiary board 10 is connected to a mother board 20, a metal plate 13 connected and fixed in parallel to the rear of a board 12 constituting the subsidiary board 10 via a plurality of resin spacers 14 is inserted into a support side 31a of a slide rail 31 incorporating a conductive shield finger electrically connected to a housing 30, and a connector 11 provided on the board 12 of the subsidiary board 10 is connected to a connector 21 provided on the mother board 20. Since the metal plate 13 of the subsidiary board 10 is electrically connected to the grounded housing 30 via the slide rail 31 incorporating the conductive shield finger, influence by radiation noise of each subsidiary board is shielded by the metal plate.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、親基板に複数の子基板
を電気的に着脱自在に接続可能な電気基板に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric board to which a plurality of child boards can be electrically and detachably connected to a parent board.

【0002】[0002]

【従来の技術】近年、内部実装部品の小型化及び複合化
により装置の多機能化・コンパクト化が進んでいる。そ
して、親基板と子基板など基板同士を接続する際、コネ
クタを用いることによってケーブルレスでの接続が可能
になり、回路基板と回路基板とを接続するために必要で
あったケーブルが無くなると共に、回路基板のメンテナ
ンス作業性が大幅に向上した。
2. Description of the Related Art In recent years, multifunctionalization and downsizing of devices have been promoted due to miniaturization and combination of internal mounting parts. Then, when connecting the boards such as the parent board and the child board, it is possible to connect without a cable by using a connector, and the cable necessary for connecting the circuit board and the circuit board is eliminated, and Circuit board maintenance work has been greatly improved.

【0003】特開昭57−177599号公報や実開昭
64−29890号公報には複数の子基板の両端部を筐
体に設けたガイド溝に支承させることによって親基板に
対し着脱自在で、子基板をガイド溝に沿わせて挿入した
とき、親基板に設けられている電気的接点を介して電気
的に接続される電気基板が示されている。
Japanese Patent Laid-Open No. 57-177599 and Japanese Utility Model Application Laid-Open No. 64-29890 make it possible to attach / detach to / from a parent board by supporting both ends of a plurality of child boards in guide grooves provided in a housing. There is shown an electric board which is electrically connected through electric contacts provided on a parent board when the child board is inserted along the guide groove.

【0004】しかし、上述のように親基板に対して電気
的に着脱自在に接続される子基板は、電気回路上あるい
はノイズ対策などの理由によって接地する必要が生じる
ことがある。このとき、子基板と親基板とが電気的に接
続される接点を介して接地された筐体に電気的に接続し
たり、あるいは子基板とこの子基板を支承するガイド溝
とを電気的に接続して前記ガイド溝を介して接地された
筐体に電気的に接続するようにしていた。
However, the child board electrically and detachably connected to the parent board as described above may need to be grounded on the electric circuit or for reasons such as noise countermeasures. At this time, the child board and the parent board are electrically connected to a grounded housing via a contact that is electrically connected, or the child board and a guide groove for supporting the child board are electrically connected. It was connected and electrically connected to the grounded housing via the guide groove.

【0005】[0005]

【発明が解決しようとする課題】しかしながら、前記特
開昭57−177599号公報や実開昭64−2989
0号公報に示されいてる電気基板では、親基板に接続さ
れる複数の子基板どおしが近接して配設されるようにな
っているので、各子基板間から発生する輻射ノイズの影
響を受けやすかった。このため、各子基板と親基板との
電気的接点を介して接地された筐体に接続するようにし
ていたが、接地部分に対する抵抗値が大きくなってしま
うという問題あった。
However, the above-mentioned JP-A-57-177599 and JP-A-64-2989 are known.
In the electric board disclosed in Japanese Patent No. 0, a plurality of child boards connected to the parent board are arranged close to each other, so that the influence of radiation noise generated between the child boards is affected. It was easy to receive. For this reason, although it has been attempted to connect to the grounded housing via the electrical contacts between each child board and the parent board, there is a problem that the resistance value with respect to the grounded portion becomes large.

【0006】また、各子基板をガイド溝に直接沿わせて
着脱する構造になっていたため、部品を実装した際に発
生した反りが子基板に残っていると、ガイド溝への着脱
がスムーズに行えなくなるばかりでなく、子基板に配設
されているコネクタの位置と親基板のコネクタとの位置
が位置ずれすることにより、親基板と子基板とを電気的
に接続することが難しくなることがあった。
Further, since each child board is attached and detached directly along the guide groove, if the warp generated when the components are mounted remains on the child board, the child board is smoothly attached and detached to and from the guide groove. Not only can it not be performed, but the position of the connector disposed on the child board and the position of the connector on the parent board are displaced, which makes it difficult to electrically connect the parent board and the child board. there were.

【0007】本発明は上記事情に鑑みてなされたもので
あり、各子基板間の輻射ノイズによる影響を軽減する一
方、部品実装の際に基板に発生した反りを矯正して支承
部材への着脱及び親基板への電気的接続の容易な電気基
板を提供することを目的としている。
The present invention has been made in view of the above circumstances, and reduces the influence of radiation noise between the respective sub-boards, and corrects the warp generated in the board during mounting of components to attach or detach the board. It is also an object of the present invention to provide an electric board that can be easily electrically connected to a parent board.

【0008】[0008]

【課題を解決するための手段】本発明の電気基板は、複
数の子基板を親基板に対して電気的に着脱自在に接続可
能な電気基板であって、前記子基板を、電気部品が配設
される基板と、この基板の背面側に平行に配設される導
電性を有する板状部材と、この板状部材と基板と平行に
固定する固定手段とで構成し、前記子基板の板状部材の
両端部を、接地された筐体に接続されている導電性を備
えた支承部材に挿入して親基板に接続される。
An electric board according to the present invention is an electric board to which a plurality of child boards can be electrically and detachably connected to a parent board. The substrate of the sub-board, which comprises a substrate to be installed, a conductive plate-shaped member arranged in parallel on the back side of the substrate, and a fixing means for fixing the plate-shaped member and the substrate in parallel. Both ends of the strip-shaped member are inserted into a support member having conductivity, which is connected to a grounded housing, and connected to the parent board.

【0009】[0009]

【作用】この構成によれば、子基板を構成する基板の背
面側に平行に配設される板状部材によって部品実装時に
基板に発生する反りが矯正される。また、各子基板に導
電性を有する板状部材を設け、この板状部材を、接地さ
れた筐体に電気的に接続された導電性を備えた支承部材
で支承することによって各子基板間で発生する輻射ノイ
ズの影響が低減される。
According to this structure, the plate-like member arranged in parallel with the back surface side of the substrate constituting the sub-substrate corrects the warp generated on the substrate during component mounting. In addition, a conductive plate-like member is provided on each child board, and the plate-like member is supported by a conductive support member electrically connected to a grounded housing, thereby providing a space between the child boards. The influence of the radiation noise generated at is reduced.

【0010】[0010]

【実施例】以下、図面を参照して本発明の実施例を説明
する。図1ないし図5は本発明の第1実施例に係り、図
1は子基板の概略構成を示す説明図、図2は親基板と筐
体との構成を説明する斜視図、図3は図2の正面図、図
4はシールドフィンガー内蔵のスライドレールを説明す
る斜視図、図5は子基板と筐体との関係を説明する斜視
図である。
Embodiments of the present invention will be described below with reference to the drawings. 1 to 5 relate to a first embodiment of the present invention, FIG. 1 is an explanatory diagram showing a schematic configuration of a child board, FIG. 2 is a perspective view illustrating the configurations of a parent board and a housing, and FIG. 2 is a front view of FIG. 4, FIG. 4 is a perspective view illustrating a slide rail with a built-in shield finger, and FIG. 5 is a perspective view illustrating a relationship between a child board and a housing.

【0011】図1に示すように子基板10は、後述する
親基板に電気的に接続されるコネクタ11や図示しない
電気部品を配設する基板12と、この基板12の背面側
に取り付けられて前記基板12への電気部品実装時に発
生した反りを矯正する板状の金属板13とで構成されて
いる。前記基板12と金属板13とは接続手段である例
えば樹脂性の同じ長さに形成された複数のスペーサ14
によって平行に接続固定されるようになっている。
As shown in FIG. 1, the child board 10 is provided with a connector 11 electrically connected to a parent board, which will be described later, and a board 12 on which electrical parts (not shown) are arranged, and is attached to the back side of the board 12. It is composed of a plate-shaped metal plate 13 that corrects a warp that occurs when the electrical components are mounted on the substrate 12. The substrate 12 and the metal plate 13 are connecting means, for example, a plurality of spacers 14 formed of resin and having the same length.
It is designed to be connected and fixed in parallel by.

【0012】図2に示すように複数の子基板10が電気
的に接続される親基板20には子基板10の支承部材を
構成する導電性を有するシールドフィンガーを内蔵した
スライドレール31を複数配設した筐体30が所定の位
置に配置されている。
As shown in FIG. 2, a plurality of slide rails 31 having a conductive shield finger, which constitutes a support member of the child board 10, are arranged on the parent board 20 to which the plurality of child boards 10 are electrically connected. The provided housing 30 is arranged at a predetermined position.

【0013】図3に示すように親基板20の基板上には
筐体30のスライドレール31に沿って挿入される子基
板10の基板12上に設けられたコネクタ11に電気的
に接続するコネクタ21が前記コネクタ11に対向して
設けられている。
As shown in FIG. 3, a connector electrically connected to a connector 11 provided on a substrate 12 of a child substrate 10 inserted along a slide rail 31 of a housing 30 on a substrate of a parent substrate 20. 21 is provided to face the connector 11.

【0014】図4に示すようにスライドレール31には
金属板13が着脱される支承部側31aと、接地された
筐体に電気的に接続される接続部側31bとが設けられ
ている。前記支承部側31aの溝部には板ばね状の導電
性を有するシールドフィンガー32が前記金属板13を
挟み込んで電気的に接続されるように配設されている。
一方、前記接続部側31bには前記筐体30と電気的に
接続するための爪状のフィンガー部32aが複数設けら
れている。
As shown in FIG. 4, the slide rail 31 is provided with a support portion side 31a to which the metal plate 13 is attached and detached, and a connection portion side 31b to be electrically connected to the grounded housing. In the groove of the support portion side 31a, a shield finger 32 having a leaf-spring-like conductivity is disposed so as to sandwich the metal plate 13 and be electrically connected.
On the other hand, a plurality of claw-shaped finger portions 32a for electrically connecting to the housing 30 are provided on the connection portion side 31b.

【0015】なお、前記基板12の反り矯正を向上させ
るため及び前記金属板13の板厚を薄くして軽量化を図
るため、金属板13の端部に曲げ加工を施した構造にし
てもよい。また、前記シールドフィンガーを内蔵したス
ライドレール31の代わりに、スライドレール全体を導
電性を有する部材で形成するようにしてもよい。さら
に、前記筐体30は導電性を有している。
In order to improve the warp correction of the substrate 12 and to reduce the thickness of the metal plate 13 to reduce its weight, the metal plate 13 may be bent at its end. . Further, instead of the slide rail 31 having the shield fingers built therein, the entire slide rail may be formed of a conductive member. Further, the housing 30 has conductivity.

【0016】上述のように構成されている基板の作用を
説明する。図5に示すように親基板20に対して子基板
10を接続する際には、子基板10を構成する基板12
の背面に複数の樹脂性のスペーサ14を介して平行に接
続固定されている金属板13を、筐体30に電気的に接
続されている導電性のシールドフィンガーを内蔵したス
ライドレール31の支承部側31aに挿入して、子基板
10の基板12に設けられているコネクタ11を親基板
20に設けたコネクタ21に接続する。このとき、子基
板10の金属板13は接地された筐体30に対して導電
性のシールドフィンガーを内蔵したスライドレール31
を介して電気的に接続されている。
The operation of the substrate configured as described above will be described. When connecting the child board 10 to the parent board 20 as shown in FIG.
The metal plate 13 connected and fixed in parallel to the back surface of the housing via a plurality of resin spacers 14 and the support portion of the slide rail 31 incorporating the conductive shield finger electrically connected to the housing 30. The connector 11 provided on the board 12 of the child board 10 is inserted into the side 31a and connected to the connector 21 provided on the parent board 20. At this time, the metal plate 13 of the child board 10 has a slide rail 31 in which conductive shield fingers are incorporated with respect to the grounded housing 30.
Are electrically connected via.

【0017】このように、子基板を構成する基板の背面
に板状の金属板をスペーサーを介して平行に設け、この
金属板を筐体に接続されたスライドレールに挿抜させる
ことによって、筐体への子基板の着脱を容易に行うこと
ができる。
As described above, the metal plate-like plate is provided in parallel on the back surface of the substrate constituting the sub-board through the spacer, and the metal plate is inserted into and removed from the slide rail connected to the case. The sub-board can be easily attached to and detached from.

【0018】また、子基板に設けた金属板を接地された
筐体に対して電気的に接続されているスライドレールに
支承させることにより、各子基板を金属板でシールドす
ることができるので輻射ノイズによる影響を大幅に低減
することができる。
Further, by supporting the metal plate provided on the sub-board on the slide rail electrically connected to the grounded housing, each sub-board can be shielded by the metal plate so that the radiation can be radiated. The influence of noise can be significantly reduced.

【0019】さらに、子基板の基板に対して板状の金属
板をスペーサを介して平行に配設したことによって、部
品を実装した際に発生した基板の反りが矯正されると共
に、この金属板をスライドレールに着脱させることによ
り、親基板上のコネクタと金属板によって反りを矯正さ
れた各基板上のコネクタとの接続を容易に行うことがで
きる。
Further, by disposing the plate-shaped metal plate in parallel with the substrate of the child substrate through the spacer, the warp of the substrate generated when the components are mounted is corrected and the metal plate is By attaching / detaching to / from the slide rail, the connector on the parent board and the connector on each board whose warp is corrected by the metal plate can be easily connected.

【0020】なお、図6に示すように子基板10を構成
する基板12と金属板13とを金属製ビス15で固定す
ることによって、筐体30に電気的に接続されているス
ライドレール31に子基板10を支承させて親基板20
に対して電気的に接続することにより、各子基板間で発
生する輻射ノイズの影響をさらに低減すると共に、各子
基板10のシグナルグランドを基板12→金属製ビス1
5→金属板13→スライドレール31→筐体30とを経
由して接地される。このことにより、各子基板10のシ
グナルグランドが容易、且つ確実に接地されてノイズの
軽減を確実に行うことができる。
As shown in FIG. 6, by fixing the substrate 12 and the metal plate 13 constituting the child substrate 10 with metal screws 15, the slide rail 31 electrically connected to the housing 30 is attached. Supporting the child board 10 to support the parent board 20
By electrically connecting to each of the child boards, the influence of the radiation noise generated between the child boards is further reduced, and the signal ground of each child board 10 is changed from the board 12 to the metal screw 1.
It is grounded via 5 → metal plate 13 → slide rail 31 → casing 30. Thereby, the signal ground of each child board 10 is easily and surely grounded, and noise can be surely reduced.

【0021】また、図7に示すように筐体30に対して
電気的に接続されるシャーシ33に、立上がり部を形成
するサブシャーシ33aを着脱自在に取付けられる構成
にしている。すなわち、筐体30に対して複数の子基板
10,10..を着脱するとき、前記シャーシ33に取
り付けられているサブシャーシ33aを取り外すことに
より、筐体30の一番下側に配設される子基板10の着
脱を容易に行うことができる。このことにより、前記電
気基板を配設する筐体30の高さを低く設計して小型化
に貢献する。
Further, as shown in FIG. 7, a sub chassis 33a forming a rising portion is detachably attached to a chassis 33 electrically connected to the housing 30. That is, a plurality of sub boards 10, 10 ,. . When attaching and detaching, the sub-chassis 33a attached to the chassis 33 can be removed to easily attach and detach the child board 10 disposed at the bottom of the housing 30. This contributes to downsizing by designing the height of the housing 30 on which the electric board is arranged to be low.

【0022】ところで、基板上に実装された電気部品か
ら発生する熱を効率良く放熱させることが望まれてい
た。
By the way, it has been desired to efficiently dissipate the heat generated from the electric components mounted on the substrate.

【0023】そこで、図8に示すように本実施例におい
ては、子基板10を構成する基板12の金属板側に、放
熱を必要とする電気部品16を配設する。このとき、こ
の電気部品16を子基板10を構成する金属板13に密
着させるようにしている。このため、基板12に配設さ
れている放熱を必要とする電気部品16から発生する熱
は、金属板13を介して外部に速やかに放熱される。
Therefore, as shown in FIG. 8, in this embodiment, the electric component 16 requiring heat radiation is arranged on the metal plate side of the substrate 12 which constitutes the child substrate 10. At this time, the electric component 16 is brought into close contact with the metal plate 13 that constitutes the child board 10. Therefore, the heat generated from the electric components 16 arranged on the substrate 12 and requiring heat radiation is quickly radiated to the outside through the metal plate 13.

【0024】このように、子基板を電気部品を配設した
基板と金属板とで構成することにより、基板の反りを矯
正すると共に、各子基板の輻射ノイズによる影響を低減
するばかりでなく、基板に配設される電気部品を金属板
に密着させることにより、電気部品の放熱性を高めた熱
対策を併用する電気基板を提供することができる。
As described above, by constructing the sub-board by the board on which electric parts are arranged and the metal plate, not only the warp of the board is corrected but also the influence of radiation noise of each sub-board is reduced. By closely contacting the electric component arranged on the substrate to the metal plate, it is possible to provide an electric substrate that also uses heat countermeasures with improved heat dissipation of the electric component.

【0025】[付記] 1.複数の子基板を親基板に対して電気的に着脱自在に
接続可能な電気基板において、前記子基板を、電気部品
が配設される基板と、この基板の背面側に平行に配設さ
れる導電性を有する板状部材と、この板状部材と基板と
平行に固定する固定手段とで構成し、前記子基板の板状
部材の両端部を、接地された筐体に接続されている導電
性を備えた支承部材に挿入して親基板に接続する電気基
板。
[Additional Notes] 1. In an electric board in which a plurality of child boards can be electrically and detachably connected to a parent board, the child boards are arranged in parallel with a board on which electric components are arranged and on the back side of the boards. A conductive plate-like member and fixing means for fixing the plate-like member and the substrate in parallel with each other. Both ends of the plate-like member of the sub-board are connected to a grounded housing. An electrical board that is inserted into a supporting member that is flexible and connected to the parent board.

【0026】2.前記板状部材は、金属板からなる付記
1記載の電気基板。
2. 2. The electric board according to appendix 1, wherein the plate member is a metal plate.

【0027】3.前記支承部材は、シールドフィンガー
を内蔵したガイドレールからなる付記1記載の電気基
板。
3. 2. The electric board according to appendix 1, wherein the support member is a guide rail having shield fingers built therein.

【0028】4.前記支承部材は、導電性を有する部材
で形成されたガイドレールからなる付記1記載の電気基
板。
4. 2. The electric board according to appendix 1, wherein the support member is a guide rail formed of a conductive member.

【0029】5.前記固定手段は、樹脂性のスペーサか
らなる付記1記載の電気基板。
5. 2. The electric board according to appendix 1, wherein the fixing means is a resin spacer.

【0030】6.前記固定手段は、金属製ビスからなる
付記1記載の電気基板。
6. 2. The electric board according to appendix 1, wherein the fixing means is a metal screw.

【0031】7.前記筐体は、導電性を有する付記1記
載の電気基板。
7. The electric board according to appendix 1, wherein the casing has conductivity.

【0032】[0032]

【発明の効果】以上説明したように本発明によれば、各
子基板間の輻射ノイズによる影響を軽減し、部品実装の
際に基板に発生した反りを矯正して支承部材への着脱及
び親基板への電気的接続が容易な電気基板を提供するこ
とができる。
As described above, according to the present invention, the influence of the radiation noise between each child board is reduced, the warp generated on the board at the time of mounting the component is corrected, and the attachment / detachment to / from the support member and the parent member are performed. It is possible to provide an electric substrate that can be easily electrically connected to the substrate.

【図面の簡単な説明】[Brief description of drawings]

【図1】図1ないし図5は本発明の第1実施例に係り、
図1は子基板の概略構成を示す説明図
FIG. 1 to FIG. 5 relate to a first embodiment of the present invention,
FIG. 1 is an explanatory diagram showing a schematic configuration of a child board.

【図2】親基板と筐体との構成を説明する斜視図FIG. 2 is a perspective view illustrating a configuration of a main board and a housing.

【図3】図2の正面図3 is a front view of FIG.

【図4】シールドフィンガー内蔵のスライドレールを説
明する斜視図
FIG. 4 is a perspective view illustrating a slide rail with built-in shield fingers.

【図5】子基板と筐体との関係を説明する斜視図FIG. 5 is a perspective view illustrating a relationship between a child board and a housing.

【図6】子基板の別の構成を説明する斜視図FIG. 6 is a perspective view illustrating another configuration of the child board.

【図7】筐体に接続されるシャーシの構成を示す説明図FIG. 7 is an explanatory diagram showing a configuration of a chassis connected to the housing.

【図8】子基板に配設される電気部品と金属板との関係
を説明する斜視図
FIG. 8 is a perspective view illustrating a relationship between an electric component arranged on a child board and a metal plate.

【符号の説明】[Explanation of symbols]

10…子基板 12…基板 13…金属板 20…親基板 30…筐体 10 ... Substrate 12 ... Substrate 13 ... Metal Plate 20 ... Parent Substrate 30 ... Case

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 複数の子基板を親基板に対して電気的に
着脱自在に接続可能な電気基板において、 前記子基板を、電気部品が配設される基板と、この基板
の背面側に平行に配設される導電性を有する板状部材
と、この板状部材と基板と平行に固定する固定手段とで
構成し、 前記子基板の板状部材の両端部を、接地された筐体に接
続されている導電性を備えた支承部材に挿入して親基板
に接続することを特徴とする電気基板。
1. An electric board in which a plurality of child boards can be electrically and detachably connected to a parent board, wherein the child board is parallel to a board on which electric components are arranged and a rear side of the board. And a fixing means for fixing the plate-shaped member and the board in parallel with each other. The both ends of the plate-shaped member of the sub-board are connected to a grounded casing. An electric board, which is inserted into a connected supporting member having conductivity and connected to a parent board.
JP4733895A 1995-03-07 1995-03-07 Electric board Pending JPH08250886A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4733895A JPH08250886A (en) 1995-03-07 1995-03-07 Electric board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4733895A JPH08250886A (en) 1995-03-07 1995-03-07 Electric board

Publications (1)

Publication Number Publication Date
JPH08250886A true JPH08250886A (en) 1996-09-27

Family

ID=12772414

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4733895A Pending JPH08250886A (en) 1995-03-07 1995-03-07 Electric board

Country Status (1)

Country Link
JP (1) JPH08250886A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0884939A2 (en) * 1997-06-11 1998-12-16 Hewlett-Packard Company Method and apparatus for adding shielding for circuit packs
US6101089A (en) * 1997-05-07 2000-08-08 Kabushiki Kaisha Toshiba Electronic apparatus
JP2002374078A (en) * 2001-06-15 2002-12-26 Matsushita Electric Ind Co Ltd Electronic circuit device
US7102897B2 (en) 2003-05-14 2006-09-05 Hitachi High-Technologies Corporation Circuit board module, circuit board chassis and electromagnetic shielding plate therefor
JP2008153363A (en) * 2006-12-15 2008-07-03 Fuji Xerox Co Ltd Electronic apparatus and printed circuit board assembly
JP2008153364A (en) * 2006-12-15 2008-07-03 Fuji Xerox Co Ltd Electronic apparatus
JP2009011507A (en) * 2007-07-03 2009-01-22 Olympus Medical Systems Corp Housing mechanism and ultrasonic observation apparatus
KR200457920Y1 (en) * 2009-10-08 2012-01-12 순환엔지니어링 주식회사 Moduled rmb board

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6101089A (en) * 1997-05-07 2000-08-08 Kabushiki Kaisha Toshiba Electronic apparatus
EP0884939A2 (en) * 1997-06-11 1998-12-16 Hewlett-Packard Company Method and apparatus for adding shielding for circuit packs
EP0884939A3 (en) * 1997-06-11 1999-07-28 Hewlett-Packard Company Method and apparatus for adding shielding for circuit packs
US6143979A (en) * 1997-06-11 2000-11-07 Agilent Technologies Method and apparatus for adding shielding for circuit packs
JP2002374078A (en) * 2001-06-15 2002-12-26 Matsushita Electric Ind Co Ltd Electronic circuit device
US7102897B2 (en) 2003-05-14 2006-09-05 Hitachi High-Technologies Corporation Circuit board module, circuit board chassis and electromagnetic shielding plate therefor
JP2008153363A (en) * 2006-12-15 2008-07-03 Fuji Xerox Co Ltd Electronic apparatus and printed circuit board assembly
JP2008153364A (en) * 2006-12-15 2008-07-03 Fuji Xerox Co Ltd Electronic apparatus
JP2009011507A (en) * 2007-07-03 2009-01-22 Olympus Medical Systems Corp Housing mechanism and ultrasonic observation apparatus
KR200457920Y1 (en) * 2009-10-08 2012-01-12 순환엔지니어링 주식회사 Moduled rmb board

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