JPH08250880A - Cooling apparatus for electronic circuit - Google Patents

Abstract

PURPOSE: To efficiently cool by a minimum gas volume even if there is a remark able difference among heat from a plurality of semiconductor elements on an electronic circuit board. CONSTITUTION: A semiconductor element 13 large by generating heat and a semiconductor element 14 having a small heat generation are supposed to be mounted on an electronic circuit board 11. A cooling resistor board 12 is placed windward the semiconductor element 14 having a small heat generation which does not need much cooling gas volume. Thus, a part of fluid for cooling the semiconductor element with a smaller heat generation is belocked so that more cooling fluid can be led to the semiconductor element 14 with a larger heat generation. Since a distribution of pressure resistance of the cooling fluid inside the electronic circuit board can be varied and a distribution of gas volume inside the board can freely be changed, thereby cooling an electronic circuit highly efficiently.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit cooling device, and more particularly to an electronic circuit cooling device capable of efficiently removing heat generated from a semiconductor element chip or an integrated circuit chip.

[0002]

2. Description of the Related Art As a conventional technique relating to a cooling device for an electronic circuit, for example, a technique disclosed in Japanese Patent Laid-Open No. 60-108189 is known. In this conventional technique, the pressure loss of the cooling fluid is obtained from the average ventilation area of the electronic circuit board to be cooled, and the cooling efficiency is optimized by providing a pressure adjusting means in the ventilation section.

[0003]

In the above prior art, since the air flow rate distribution ratio of the cooling fluid inside the electronic circuit board cannot be changed arbitrarily, the heat generation amount of a plurality of semiconductor elements mounted on the electronic circuit board is reduced. If there is an extreme difference, it is necessary to set the required cooling air flow rate according to the semiconductor element that generates a large amount of heat, and this causes the problem that an unnecessary large air flow rate is required in other parts. are doing.

Further, in the above-mentioned prior art, when trying to cool a semiconductor element having a large heat generation amount, a large amount of air is required, and accordingly, the size of the fan is enlarged to increase the device scale, the noise is increased, and the fan itself is consumed. There is a problem that an increase in electric power occurs.

Further, in the above-mentioned prior art, the cooling resistance plate is attached for adjusting the cooling air volume, but the method of directly attaching the cooling resistance plate to the electronic circuit board is adopted as the simplest structure. For this reason, due to wiring inside the electronic circuit board or restrictions on the mounting position of the semiconductor element,
There arises a problem that the cooling resistance plate may not be directly mounted or attached.

An object of the present invention is to solve the above-mentioned problems of the prior art, and even when there is a significant difference in the amount of heat generated by a plurality of semiconductor elements mounted on an electronic circuit board, a semiconductor element having a large amount of heat generated. It is not necessary to design the total cooling air volume by matching the target with the target, and it is possible to optimize the air volume distribution according to the heat generation amount of each semiconductor element, and it is possible to perform efficient cooling with the minimum required air volume. An object of the present invention is to provide a cooling device for an electronic circuit that can be used.

[0007]

According to the present invention, the above-mentioned object is to provide an electronic device capable of arbitrarily adjusting the air flow distribution for each semiconductor device arranged on an electronic circuit board constituting an electronic circuit. Install a cooling resistor plate inside the circuit board and attach the cooling resistor plate directly to the electronic circuit board, or
Cooling plate Mounted using a mounting plate and mounted at an arbitrary position in the electronic circuit board to block part of the fluid that cools the semiconductor element with a small heat value, and to use more cooling fluid for a semiconductor element with a large heat value. It is achieved by inducing.

[0008]

By installing the cooling resistance plate inside the electronic circuit board, it is possible to generate a pressure distribution difference in the cooling fluid inside the board. According to the present invention, it is possible to positively change the distribution of the air volume distribution, and it is possible to partially obtain a large air volume even if the entire air volume inside the substrate is small. Therefore, a large air volume is required. It is possible to effectively cool a semiconductor element having a large amount of heat generation.

Further, when the cooling resistance plate cannot be directly attached to the substrate, a cooling plate attachment plate is installed on the side of the substrate, and the cooling resistance plate is attached to the cooling plate to bridge the cooling resistance plate. A resistance plate can be attached.

As described above, according to the present invention, the air flow distribution is determined by the gradient difference in the pressure resistance distribution of the cooling gas flowing therethrough, and it is difficult for the fluid to flow where the pressure resistance is large, and conversely when the pressure resistance is small. Utilizing the property of being easy, by installing an arbitrary cooling resistance plate inside the electronic circuit board, it is possible to control the pressure resistance distribution of the cooling gas and generate an arbitrary air volume distribution.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an electronic circuit cooling device according to the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a diagram for explaining the distribution of air volume by a cooling resistance plate provided on an electronic circuit board, FIG. 2 is a diagram for explaining the cooling effect by the cooling resistance plate, and FIG. 3 is a cooling resistance for the electronic circuit board. It is a figure which shows the Example of this invention which shows the specific example of attachment of a board. In FIGS. 1 and 3, 11
Is an electronic circuit board, 12 is a cooling resistance plate, 13 and 14 are semiconductor elements, 33 is a cooling plate mounting plate, and 34 is a screw.

As shown in FIG. 1, a semiconductor element 13 having a large heat generation amount and a semiconductor element 14 having a small heat generation amount are mounted on the electronic circuit board 11, and the semiconductor element 13 on the electronic circuit board 11 is mounted on the electronic circuit board 11. 14 shall be cooled. In one embodiment of the present invention, a large amount of air is distributed to the semiconductor device 13 that requires a large amount of fluid (air) for cooling, so that as shown in FIG. In addition, the cooling resistance plate 12 made of an arbitrary material is mounted and configured.
The cooling resistance plate 12 blocks a part of the fluid for cooling the semiconductor element 14 having a small heat generation amount, and the semiconductor element 1 having a large heat generation amount.
Induce more cooling fluid into 3.

With respect to the electronic circuit board 12 in which the cooling resistance plate 12 is installed at the above-mentioned position, it is assumed that a fan having an arbitrary FAN output characteristic blows air as a cooling fluid from the inlet of the electronic circuit board 11. To do. At this time, the total air volume at the entrance of the electronic circuit board 11 is Q0, and the total pressure resistance value of the electronic circuit board 11 at that time is P0. Also,
The air flow rate with respect to the semiconductor element 13 having a large heat generation amount is Q1, the pressure resistance value at that time is P1, the air flow rate with respect to the semiconductor element 14 having a small heat generation amount is Q2, and the pressure resistance value at that time is P2.

The air volume distribution under the above-mentioned conditions has a relationship as shown in FIG. That is, the air volume Q0 at the entrance is
It is the total air volume of the air volume Q1 for the semiconductor element 13 having a large heat generation amount and the air volume Q2 for the semiconductor element 14 having a small heat generation amount. On the other hand, the distribution ratio of the amount of airflow flowing over the electronic circuit board 11 is determined by the difference in the internal pressure gradient, so it can be changed by changing the shape of the cooling resistance plate 12 mounted on the windward side of the semiconductor element 14 having a small heat generation amount. You can

For example, as shown in FIG. 2, the cooling resistance plate 1
By 2, the pressure resistance value P2 with respect to the semiconductor element 14 having a small heat generation amount can be changed like P2 ′, and accordingly, the air flow rate Q2 can also be changed to Q2 ′. Since the distribution ratio between the air flow rates Q1 and Q2 can be freely changed by increasing or decreasing the pressure resistance value of the cooling resistance plate 12, the pressure resistance value P for the semiconductor element 14 having a small heat generation amount.
As 2 is increased, the air flow rate Q1 for the semiconductor element 13 having a large heat generation amount is increased, and the cooling efficiency of the semiconductor element 13 having a large heat generation amount can be improved.

Next, with reference to FIG. 3, an embodiment of the present invention will be described with reference to a specific mounting example of a cooling resistance plate on an electronic circuit board.

In the example shown in FIG. 3 (a), a cooling resistance plate 12 having a substantially L-shape and having a flange for mounting a substrate is provided on a side portion of the electronic circuit board 11 with a cooling plate mounting plate 33 and an electronic device. In this example, the screw 34 is attached to the circuit board 11.

Further, the example shown in FIG. 3B is an example in which the rectangular cooling resistance plate 12 is directly attached to the electronic circuit board 11 by the screw 34.

Further, the example shown in FIG. 3 (c) is an example of mounting the cooling resistance plate when the cooling resistance plate cannot be directly mounted on the electronic circuit board 11. That is, in this example, the cooling plate mounting plates 3 are provided on both sides of the electronic circuit board 11.
3 is installed, and the cooling resistance plate 12 is mounted between the cooling plate mounting plates 33 with the screws 34 so as to bridge the cooling resistance plates 12.

The above-described examples shown in FIGS. 3A to 3C are examples for the case where the semiconductor element is arranged on the electronic circuit board 11 as shown in FIG. The shape and the arrangement position of the cooling resistance plate 12 are set so that the amount of air flow to the semiconductor element 14 is reduced. The cooling resistance plate may be a flat plate, a perforated plate, a wire net, or the like at a portion for stopping a part of the fluid for cooling the semiconductor element. Further, even when the arrangement of the semiconductor elements on the electronic circuit board becomes more complicated, the shape and arrangement position of the cooling resistance plate 12 should be set optimally in consideration of the heat generation amount of the arranged semiconductor elements. Good.

In the above-mentioned example, the screw 34 is intended to fix the cooling resistance plate, and if the cooling resistance plate can be fixed, besides the screw, nut tightening, adhesion, soldering, Alternatively, a method such as direct attachment by welding can be used.

[0023]

As described above, according to the present invention, even when there is a significant difference in the heat generation amount of a plurality of semiconductor elements mounted on an electronic circuit board, the target is applied to the semiconductor element having a large heat generation amount. It is not necessary to design the cooling air flow for the entire electronic circuit, and it is possible to optimize the air flow distribution according to the heat generation amount of each semiconductor element, and the effective minimum cooling of the electronic circuit It can be performed.

Further, according to the present invention, the cooling resistance plate can be mounted directly on the electronic circuit board or by using the cooling plate mounting plate by any method. It is possible to mount the cooling resistance plate at the position.

[Brief description of drawings]

FIG. 1 is a diagram illustrating a state of air volume distribution by a cooling resistance plate provided on an electronic circuit board.

FIG. 2 is a diagram illustrating a cooling effect of a cooling resistance plate.

FIG. 3 is a diagram showing an example of the present invention showing a specific mounting example of a cooling resistance plate on an electronic circuit board.

[Explanation of symbols]

 11 Electronic Circuit Board 12 Cooling Resistance Plate 13, 14 Semiconductor Element 33 Cooling Plate Mounting Plate 34 Screw

Claims (1)

[Claims] 1. A cooling device for an electronic circuit having an electronic circuit board on which a large number of semiconductor elements having different heat generation values are mounted,
A cooling resistance plate that blocks a part of the fluid that cools the semiconductor element that generates a small amount of heat and guides more cooling fluid to the semiconductor element that generates a large amount of heat is installed upstream of the semiconductor element that generates a small amount of heat. Cooling device for electronic circuits.