JPH08250657A - Ball grid array package with removable module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a BGA package, which enables the use of components which are in capable of withstanding an environmental stresses in a surface- mounting process. SOLUTION: A semiconductor device 18 is mounted on a substrate 16 and is electrically coupled with solder balls 22. One pieces of a terminal 26 or more than one piece of terminals 26 are coupled with the substrate 16 and are electrically coupled with the device 18. A freely detachable module 14 has auxiliary components 28 and 30. The module has a module main body 36 for housing the components and at the same time, has one piece of an electrical connector 32 or more than one piece of electrical connectors 32, which are engaged with the respective terminals and are used for enabling the module to hold on the substrate and for enabling the components to couple electrically with the device 12. It is also possible to connect the terminals to with the balls 22, so that the components are provided on a circuit board as an option or that it is possible to provide the components in the freely detachable module.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention generally relates to semiconductor packaging technology, and more particularly to a ball grid array package and a removable module assembly.

[0002]

2. Description of the Related Art As circuit complexity increases, P
The need for increasing the density of integrated circuits on C (printed circuit) boards or PC boards increases. A major advance in the field of circuit board technology has been the advent of surface mount technology for mounting and connecting integrated circuit components onto printed circuit boards. As known in the art,
Surface mountable integrated circuit packages allow the package to be connected to the flat surface of a circuit board without the need to provide plated through holes in the circuit board. Therefore, surface mount technology increases the theoretical component density of the circuit board as well as the degree of freedom available to the board designer. This is because it is only necessary to consider the position of the integrated circuit leads on a single surface of the multilayer circuit board, not on all sides of the board.

To counter the increasing density of integrated circuits on PC boards, BGA (ball grid array) integrated circuit package types have become popular in the art. A conventional BGA package is similar in layout and arrangement to a PBA (pin grid array) package in that it has an array of connections on the underside of the integrated circuit package. However, instead of the pin connector used in the PGA package, the BGA package uses solder balls positioned at each connection position. As is known in the art, BGA packages are attached to a printed circuit board by reflowing solder balls to make connections to conductors on the surface of the printed circuit board. BGA packages offer the important advantage of being self-aligned. Because the surface tension of the solder is BGA
The tendency is to pull the package into proper alignment with the corresponding conductors on the printed circuit board.

As a technical background, various types of BGA
Packages are known in the art, eg, "cavity up" type and "cavity down".
There is a type. Conventional cavity-up BGA packages mount the integrated circuit chip face up in the cavity or recess (or on the surface) of the package substrate and make a wire bond between the package and the chip on this side. Attaching and then transfer-molding or otherwise providing plastic on the chips and bond wires to provide environmental protection to the chips and wires. Solder balls are provided on the side of the substrate opposite the chips and allow the packaged chips to be mounted on the system printed circuit board. Conventional cavity down integrated circuit packages mount an integrated circuit chip in or on the surface of a cavity in a substrate, then attach bond wires to it and mold plastic around the chip. . In this type of package, the solder balls are provided on the same side of the board as the chips, so that after the packaged chips are attached to the circuit board, the chips are inverted.

The major drawback of using BGA packages is that they are compared to non-surface mountable packages such as dual in-line (DIP) and similar packages.
It is the magnitude of the thermal and mechanical stresses exerted on the package during the assembly procedure. To attach the dual in-line integrated circuit package to the circuit board, wave solder the lower side of the circuit board with the pins of the integrated circuit package extending through the plated through holes in the circuit board. Done by. Thus, the circuit board itself isolates the integrated circuit package body from the high temperature solder and the harsh chemicals that expose the soldered lead tips. However, since the leads of the BGA package are soldered to the same surface of the printed circuit board as the package, the BGA package and its contents are directly exposed to high temperatures and used in the soldering process such as flags, solders, etc. And exposed to harsh chemicals such as cleaning solvents.

Semiconductor devices encapsulated in BGA packages are typically able to withstand the environmental stresses of the surface mount process, while other components that are part of the package are sufficiently durable. May not have sex. In particular, complementary metal-oxide-semiconductor (CMO
S) As a result of advances in manufacturing and design technology, the use of battery power in many electronic circuit functions is becoming more and more popular. As is known, CMOS integrated circuits can operate under extremely low active power conditions, such as static random access memory (SR).
In the case of CMOS memory devices such as AM), the power requirements for maintaining data are extremely low. These low power requirements allow operation and data retention in electronic systems driven by conventional lithium batteries and other cell types, without the need for backup power supplies on the system board itself. Has improved the portability and reliability of modern systems. However, conventional batteries are not capable of reliably withstanding the temperature and chemical conditions to which integrated circuits are exposed during surface mount assembly. Certain types of batteries can be permanently damaged by exposure to temperatures on the order of 181 ° C., which is below the temperature of certain solders used in surface mount processes.
Other components, such as the quartz crystal resonator used in connection with the on-chip oscillator, may also be affected by such harsh environmental conditions.

In "gull wing" surface mount packages, the use of a removable module that attaches to the package is described in US patent application Ser. No. 08/11.
No. 4,750, "Surface Mountable Integrated Circuit Package with Detachable Module (Surface Mount)
Able Integrated Circuit P
ackage With Detachable Mo
Dule) ", Siegel et al. Filed Aug. 31, 1993, attorney reference 93-C-53, and U.S. patent application Ser. No. 08 / 225,227, "Surface Mountable Integrated Circuits with Low Profile Detachable Modules".
grated Circuit Package Wi
th Low-Profile Detachable
Module) ", Sigelet al. 1994
Filed Apr. 8, 1994 (Attorney Docket No. 940-C-44), these two applications are SGS-
Transferred to Thomson Miketronics, Inc. However, BGAs typically do not have sufficient clearance above the system PC board to allow the use of mechanical connection means of the type described.

[0008]

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and solves the above-mentioned drawbacks of the prior art, and cannot endure the environmental stress of the surface mounting process. BGA that makes it possible to use
Intended to provide the package.

[0009]

According to one aspect of the present invention, an integrated circuit package includes a lower module for attachment to a printed circuit board and an upper module removably connected to the lower module. There is. The upper module has a housing, a data collection component provided in the housing, and an upper module connection circuit for providing an electrical connection to the data collection component. The lower module has a substrate, a processing circuit coupled to the substrate, and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit.

According to another aspect of the invention, an integrated circuit package has a lower module for mounting to a printed circuit board and an upper module removably connected to the lower module. The upper module has a housing, a communication device provided in the housing, and an upper module connection circuit for providing an electrical connection to the communication device. The lower module has a substrate, a processing circuit coupled to the substrate, and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit.

According to yet another aspect of the invention, an integrated circuit package has a lower module for mounting on a printed circuit board and an upper module removably connected to the lower module. The upper module has a housing, an output device provided in the housing, and an upper module connection circuit for providing electrical connection to the output device. The lower module has a substrate, a processing circuit coupled to the substrate, and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit.

According to still another aspect of the present invention, an integrated circuit package includes a lower module for mounting on an integrated circuit board and an upper module removably connected to the lower module. The upper module has a housing, a battery, a real-time clock crystal and a system clock crystal within the housing, and an upper module connection circuit for providing electrical connection to the battery and the crystal. The lower module has a substrate, a processing circuit coupled to the substrate, and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit.

According to yet another aspect of the present invention, there is provided a system for packaging an integrated circuit component including a ball grid array substrate having a plurality of solder balls bonded thereto. A semiconductor device is mounted on the substrate and electrically coupled to the solder balls. One or more terminals are coupled to the substrate and electrically coupled to the semiconductor device. The removable module includes one or more auxiliary components. The module has a body portion for accommodating the component and one or more engageable respective terminals for holding the module to a substrate and electrically coupling the component to a semiconductor device. It has an electrical connector of.

The present invention offers various advantages over the prior art. For example, firstly, the present invention allows mounting a ball grid array package on a printed circuit board without exposing certain components to the stresses of the surface mounting process. Moreover, in one embodiment of the invention, the electrical connection between the module and the substrate also acts as a mechanical means for securing the module to the substrate. In another embodiment, when the package is bonded to a printed circuit board, the module can optionally be used, depending on whether the components are available on the board,
It is possible to bond the module to the solder balls on the board.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to FIGS. 1A and 1B, there is shown a schematic front view and cross-sectional view of a ball grid array package having removable modules. The overall package 10 is designed for incorporation into a printed circuit board using standard techniques. The package 10 has a lower module 12 and an upper module 14. The lower module 12 has a substrate 16 which may be formed using conventional die attachment techniques such as conductive epoxy or eutectic mount semiconductor chip 1.
8 are attached. Semiconductor chip 18 (hereinafter also referred to as "chip" 18) is, for example, a microprocessor, memory, logic device, analog device, or other electronic function implemented as a single chip or multi-chip integrated circuit as is known in the art. It can be a solid state integrated circuit such as a device. The integrated circuit is bonded to the substrate using bond wires 20.

Substrate 16 may be a ceramic substrate, a printed circuit board, or other similar substrate having a conductive interconnect system formed thereon or therein for carrying electrical signals to and from chip 18. It is possible. Bond wires 20 connect the bond pads on chip 18 to the conductive interconnect system on the substrate. The conductive interconnect system is coupled to solder balls 22 on the lower surface of substrate 16. The solder balls 22 can be formed using a conventional technique such as a solder mask. Chip 18 and bond wire 20 are covered by encapsulant 24, which can be, for example, a plastic molding compound, epoxy, potting compound, or other conventional integrated circuit encapsulant.

Connectors 26a-26d (collectively referred to as connectors 26) are disposed on the substrate 16 and couple the upper module 14 to the lower module 12 (FIG. 2).
reference). In the preferred embodiment, the connector 26 provides a mechanical connection for securely attaching the upper module 14 to the lower module 12 as well as the upper module 1.
Electrical connections are provided for coupling the components in FIG. As shown in FIG. 1B, the connector 26
Has an hourglass shape, on which cooperating connectors can be arranged. As shown in FIG. 1B,
A connector 26 is provided through the board 16 where it is mated with the board interconnect structure. On the other hand, it is possible to connect the connector 26 to the interconnection structure of the substrate on the upper surface or at an intermediate level if the substrate is of a multi-layer type.

The upper module 14 contains replaceable parts in case of failure due to thermal and mechanical stresses applied to the package during the assembly procedure. For example, the upper module 14 shown in FIG.
8 and a second part 30. Connector 32a-3
2d connects to the corresponding connectors 26a-26d, forming mechanical and electrical connections. In the preferred embodiment, the connector 32 has a plurality of springs arranged in a cylindrical shape, the springs comprising:
In the enlarged form, an hourglass shape corresponding to the connector 26 is formed. Lead tabs 34a and 34b are coupled between the first component 28 and respective connectors 32a and 32d. Lead tabs 34b and 34c are coupled between the second component and respective connectors 32c and 32c. The first component 28, the second component 30, the connector 32, and the lead tab 34 are housed in the main body 36.

The package 10 is usually attached to a printed circuit board as follows. First, the lower module 12 is mounted to a circuit board by surface mounting or other conventional method, along with other integrated circuits provided on the integrated circuit. After surface mounting using vapor phase reflow, convection, IR (infrared) heating or any other suitable technique, the upper module 14 is connected to the lower module 12 via respective connectors 26 and 32. The connector forms the physical and electrical connection between the two modules.

Therefore, the contents of the upper module 14 are
Like the lower module 12, it is not exposed to solder, flux, solvents, extreme temperatures, etc. during the surface mount process. As a result, the reliability of the contents of the upper module 14 is not degraded by the surface mount process. Further, the upper module 14 is
The connectors 26 and 32 can be disengaged by pulling away the lower module 14 from the lower module 14 and easily replaced as needed. Thus, replacement of the upper module 14 can be done without the need to remove it from the circuit board to which the package 10 is attached. Moreover, if the circuit board requires additional soldering, the upper module can be removed and then replaced after the soldering is complete.

FIG. 3 shows one embodiment of the connectors 26 and 32 in more detail. The connector 26 is substantially hourglass shaped. The connector 32 has a plurality of springs 38 which, in the expanded state, form an hourglass shape which substantially corresponds to the shape of the connector 26. When the connector 26 is inserted into the connector 32, the spring 38 is compressed into a generally cylindrical shape until it is allowed to expand into the narrow portion 40 of the connector 26. It should be noted that the combination of connectors 26 and 32 is but one example of a number of connectors that can be used to hold upper module 14 to lower module 12.

4a-4d show an embodiment of the invention in which upper module 14 includes one or more components 42 for collecting data and the lower module is It includes circuitry for processing and / or storing data 44. Package 1 of Figures 4a-4d
0 is shown as having a single data collection component 42 housed therein, but a single upper module 1
It is possible to store a plurality of data collection components 42 or a combination of the data collection components 42 and other components in the unit 4.

FIG. 4a shows a schematic cross section of a package 10 having an upper module 14 with a temperature sensitive device 46 such as a thermocouple or thermistor. The temperature sensing device 46 is connected to the chip 1 via the connectors 26 and 32 and the lead 34.
Connected to eight. The temperature sensing device 46 is used in connection with the circuit 18, for example to shut down the circuit when a dangerous temperature is reached inside the circuit housing or to operate additional cooling means such as an auxiliary fan. It is possible to Further, the temperature sensing device can be used in an air conditioner for adjusting the temperature.

FIG. 4b shows a schematic cross section of a package 10 having an upper module 14 with a moisture sensitive device 48 such as a hygrometer. Hygrometer 48 is coupled to chip 18 via connectors 26 and 32 and leads 34. Chip 18 may have control circuitry that generates control signals in response to atmospheric humidity. The hygrometer and chip 18 can be used, for example, to control an air conditioner to maintain a proper environment in residential and office buildings.

FIG. 4c shows a schematic cross section of a package 10 having an upper module 14 with a pressure gauge 50. The pressure gauge 50 includes the connectors 26 and 32 and the lead 34.
Is connected to the chip 18 via. Chip 18 may have control circuitry that generates control signals in response to atmospheric air pressure. A pressure gauge can be used, for example, when a predetermined pressure is reached or in order for a device to respond to changes in air pressure.

FIG. 4d shows a magnetic field sensing device 5 such as a magnetic field meter.
Package 1 with upper module 14 comprising 2
0 shows a schematic cross-sectional view of 0. Magnetic field meter 52 is connector 2
6 and 32 and leads 34 to chip 18. Chip 18 may have control circuitry that produces control signals in response to a magnetic field. Magnetic field meter 52
Can be used, for example, as part of a security device in a store to detect magnetic fields on an assembly line or to detect shoplifted merchandise. The chip is capable of processing information from the magnetometer 52 to distinguish parts or identify security tags.

It should be noted that other data acquisition components 46 may be used within the upper module 14. This aspect of the invention offers significant advantages over the prior art. First, as mentioned above, the upper module is replaceable, so that it is possible to bond the data acquisition component to the circuit after surface mounting, while protecting the component from damage. There is. Second, the upper module 14 allows for easy replacement of parts that may fail or become inaccurate over time. Third, it is possible to use a single lower module 12 with multiple upper modules for customization purposes. For example,
It is possible to have multiple upper modules ready for use with data acquisition components of varying sensitivities. Therefore, the package 10 with the thermistor can be used with an upper module of the type that regulates temperature in the office, and must maintain a precise temperature with narrow tolerances together with another upper module with a highly sensitive thermistor. It is possible to use it in a hospital or factory where it does not work.

FIG. 5 illustrates one embodiment of the present invention in which upper module 14 includes one or more components 54 for wireless communication, and the lower module is wireless. It includes circuitry for processing data from communication components. In this case,
Although the package 10 of Fig. 1 shows a state in which a single wireless communication component is housed therein, a plurality of wireless communication components or a combination of wireless communication components and other components can be provided in a single upper module. It can be stored.

In FIG. 5, the upper module 14 houses an antenna 56 for receiving communication signals. Chip 18 processes the signal received by the antenna. The chip receives (or sends) a communication signal, for example
It is also possible to have analog circuits for conditioning and digital circuits for processing the received or transmitted data. This type of package is useful in many areas. First, it is possible to use the package in connection with a PCMCIA board (mainly used in portable computers) to provide wireless modem communication. Providing both the processing circuitry and the antenna in a single package reduces the cost and complexity of manufacturing such a substrate. Another application is the GPS (Geostationary Positioning Station) device, where the package provides a single chip for use in automobiles, ships and similar applications.

6a-6c show another embodiment of the present invention in which the upper module 14 contains one or more components for outputting information and the lower module outputs. It contains circuitry for processing and conditioning the data to the part. Also in this case, although the package 10 of FIG. 5 shows a state in which a single output component is housed, a plurality of output components and a plurality of output components and other components are included in the single upper module 14. It is possible to store the combination with.

In FIG. 6a, the upper module contains a display device 58, such as an LCD (liquid crystal display) or LED (light emitting diode) display. Chip 18 can be one of many components for which display 58 is desired. For example,
In one application, the chip 18 can include a clock circuit and the display device 58 can output data and time. In another application, the display device is capable of outputting the value of one or more registers of a microprocessor or microcontroller. In yet another application, the display device 58 is capable of outputting status signals to the modem chip. There are an unlimited number of ways of using the display 58.

In FIG. 6a, a plurality of signals are communicated to the display device 58 via the connector 59. Ground and power signals are used to power the display from the lower module 12. Display 58
Is assumed to have circuitry to convert and buffer the serial signal from lower module 12. On the other hand, additional connections can be used to provide parallel data communication between the display device 58 and the chip 18.

FIG. 6b shows an upper module comprising an audio output device 60, such as a speaker or buzzer, for providing audio output from the chip 18.
Audio output devices can be used to provide manufacturers with an easy-to-assemble solution. For example, the output device can be used with a radio frequency receiver chip in connection with handheld games, or with a DSP (Digital Signal Processor). Another application is in personal computers to reduce manufacturing costs.

FIG. 6c illustrates an upper module that includes a vibrating device 62 for providing tactile signals, such as a vibrating device, in response to control signals from the chip 18. This device can be used, for example, in conjunction with a pager circuit to notify a user of incoming messages.

The aspects of the present invention as shown in FIGS. 6a-6c provide significant advantages over the prior art. First, as mentioned above, the upper module is replaceable, allowing the output components to be coupled into the circuit after surface mounting, thus protecting them from damage. . Second, the upper module 14
Enables easy replacement of parts if they fail over time. Third, the package can provide the manufacturer with an easy-to-assemble solution.

FIG. 7 is a schematic cross-section of a package with the upper module 14 containing two crystals 66 and 68 (one for the system and another for the real-time clock) and a battery 64 to be used in the computer system. Shows. Chip 18 has conditioning circuitry for generating the system clock signal for distribution throughout the computer system and real-time clock circuitry for providing time and date outputs. Such circuits reduce the cost of manufacturing computer motherboards and provide the aforementioned advantages when using surface mount technology to manufacture motherboards.

It is possible to combine the two or more embodiments shown in connection with FIGS. 4a-4d and 5, 6a-6c and 7. For example, the embodiment of FIG.
It is possible to combine with the thermistor of a. Other combinations are equally beneficial.

Furthermore, it is possible to house components different from those described above in the upper module 14. Furthermore,
Various forms of connectors can be used to couple the upper module 14 to the lower module 12. Other connector methods that use mechanical connectors to hold the upper module 14 to the lower module 12 include, for example, the above-referenced US patent application Ser. No. 08 / 114,75.
No. 0 and US patent application Ser. No. 08 / 225,227.

8A and 8B show a connector 2 which forms an electrical connection to a circuit board after soldering and soldering.
6 shows the first and second embodiments of the electrical connection between the solder ball 6 and the solder ball 22. In FIG. 8A, at least some of the connectors 26 are electrically coupled to the solder balls 22. Although the connection between the connector 26 and the solder ball 22 is shown in FIG. 8A as a direct connection on the bottom surface of the substrate 16, this connection is made on any layer (or layers) of the multilayer substrate. It is possible. FIG. 8A shows
Furthermore, the connection between the solder ball 22 and the pad 38 electrically coupled to the bond wire 20 is shown.

This embodiment is flexible to the circuit board designer in designing whether the circuit board contains one or more components that may be housed within the upper module 14. There is an advantage in having the property. If the designer decides to build the component (ie battery and / or resonator) on the circuit board,
The upper module 14 is unnecessary. In this case, the lower module 12 can be mounted on the circuit board as described above, and thus the lower module 12 can be connected as a stand-alone circuit package and to auxiliary components such as batteries and resonators. Acts as a simple package. It is possible to provide multiple top modules so that a designer can purchase either the battery or the resonator on the substrate and purchase the top module 14 with only the components that are needed. .

FIG. 10 illustrates this side of the preferred embodiment in a block diagram. The lower module 12 is mounted on the circuit board 40 together with the other circuits 42. Optional components 44, such as on-board rechargeable batteries, can be incorporated into circuit board 40. Assuming that the upper module 14, which is typically coupled to the chip on the lower module 12, contains only the battery, the upper module 14 is not needed if the rechargeable battery is not on the circuit board. On the other hand, if the optional component 44 is not designed to be built into the circuit board 40, then the upper module containing the battery can be used to supply the battery to the chip on the lower module 12. is there.

This aspect of the invention is particularly useful in connection with semiconductor products that can be used in many applications. For example, shown in FIG. 1 where chip 18 is a static random access memory (SRAM) and top module 14 contains a battery, so that the SRAM retains information when power to the circuit board is interrupted. It may be desirable to have different types of packages 10. The same lower module 12,
Each of (1) when on-chip power is desired, (2) when power is supplied to the SRAM by an on-board backup battery when the system is in a power-off state, and (3) when battery backup is not required. It can be used in some cases. These three
By providing a package that achieves all one function, the cost of designing multiple products is eliminated.

FIG. 8B shows a second embodiment, in which the components in the upper module 14 are connected to the chip 18 via pads 32 but with electrical connection to the circuit board. is not.

9A and 9B show different embodiments of connectors 26 and 32. Connector 2 in FIG. 9A
6 has a metal male connector provided with a flange 28 on the upper part. The connector 32 comprises a circular member having a plurality of spring arms 46 that bend outward when pressed against the flange 28 and return inward when the flange is located within the spring arm 46. .
This connector is similar to the commonly used connector for 9V batteries.

In FIG. 9B, the connector 26 is the pin connector 3.
2 shows an embodiment in the case of a metal female connector that cooperates with 2. The pin connector 32 is designed to be held in place by friction when pushed into the female connector 26. This is done, for example, by using ribbed (or textured) pin connectors 32, or by solid pins 32 and, for example, springs or internally formed fingers (corresponding clasps at pins 32). Can be achieved by using a socket 26 that holds the pin therein, such as interlocking with) or any other suitable socket 26. In most cases, the physical connection between the upper and lower modules is maintained by friction.

The embodiment shown in FIGS. 9A and 9B allows the upper and lower modules 14 and 12 to be provided without the need for mechanical clips or similar devices to hold the modules together. It is possible to bring them into an engaged state. This means that the circuit board and the board 1
It is especially useful in BGA devices where the clearance to 6 is very small.

Although the specific embodiments of the present invention have been described in detail above, the present invention should not be limited to these specific examples, and various modifications can be made without departing from the technical scope of the present invention. It goes without saying that the above can be modified.

[Brief description of drawings]

FIG. 1A is a schematic front view showing a preferred embodiment of a ball grid array package incorporating a detachable module.

1B is a schematic cross-sectional view of the ball grid array package of FIG. 1A.

FIG. 2 is a schematic plan view showing a ball grid array substrate having a sealed semiconductor device.

FIG. 3 is a schematic view showing a preferred embodiment of a connector for coupling an upper module and a lower module of the package of the present invention.

FIG. 4A is a schematic cross-sectional view showing an example of a package in which a data collection device is incorporated in the upper module of this package.

FIG. 4B is a schematic cross-sectional view showing an example of a package in which a data collection device is incorporated in the upper module of this package.

FIG. 4C is a schematic cross-sectional view showing an example of a package in which a data collection device is incorporated in the upper module of this package.

FIG. 4D is a schematic cross-sectional view showing an example of a package in which a data collection device is incorporated in the upper module of this package.

FIG. 5 is a schematic cross-sectional view showing a package in which a communication device is incorporated in the upper module of this package.

FIG. 6A is a schematic view showing an example of a state in which an output device is incorporated in the upper module of this package.

FIG. 6B is a schematic view showing an example of a state in which the output device is incorporated in the upper module of this package.

FIG. 6C is a schematic view showing an example of a state in which the output device is incorporated in the upper module of this package.

FIG. 7 is a schematic cross-sectional view showing a state where one battery and two crystals are incorporated in the upper module of this package.

8A is a schematic bottom view showing an example of the ball grid array substrate of FIG. 2. FIG.

8B is a schematic bottom view showing an example of the ball grid array substrate of FIG. 2. FIG.

FIG. 9A is a schematic diagram illustrating one embodiment of electrically and physically coupling a removable module to a substrate.

FIG. 9B is a schematic diagram illustrating an embodiment of electrically and physically coupling a removable module to a substrate.

FIG. 10 is a schematic view showing a usage state of a ball grid array package having a connection as shown in FIG. 8B together with a circuit board.

[Explanation of symbols]

 10 Package 12 Lower Module 14 Upper Module 16 Substrate 18 Semiconductor Chip 20 Bond Wire 22 Solder Ball 24 Sealant 26 Connector

 ─────────────────────────────────────────────────── ─── Continued Front Page (72) Inventor Frank Sigmand United States, Texas 75019, Koppel, Quiet Valley 316 (72) Inventor Fred Chevreton United States, Texas 75007, Carrollton, Branch Hollow Drive 2035 (72) Inventor Robert H. ． Bond USA, Texas 75023, Plano, Chamberlain Drive 2208 (72) Inventor Harry Em. Siegel United States, Texas 76053, Hurst, Wheelwood Drive 825

Claims (43)

[Claims] 1. An integrated circuit package, an upper module comprising a housing, a data collection component provided in the housing, and an upper module connection circuit for providing an electrical connection to the data collection component, and a substrate. A lower module having a processing circuit coupled to the substrate and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit. Integrated circuit package. 2. The integrated circuit package according to claim 1, wherein the data collection component has a temperature sensing device. 3. The integrated circuit package according to claim 2, wherein the temperature sensing device has a thermistor. 4. The integrated circuit package according to claim 2, wherein the temperature sensing device includes a thermocouple. 5. The integrated circuit package according to claim 1, wherein the data collection component includes a humidity sensitive device. 6. The integrated circuit package according to claim 5, wherein the processing circuit has a control circuit that generates a control signal in response to humidity of the atmosphere. 7. The integrated circuit package according to claim 1, wherein the processing circuit includes a pressure sensitive device. 8. The integrated circuit package according to claim 7, wherein the processing circuit has a control circuit that generates a control signal in response to atmospheric pressure. 9. The integrated circuit package according to claim 1, wherein the processing circuit includes a magnetic field detection device. 10. The integrated circuit package according to claim 7, wherein the processing circuit has a control circuit that generates a control signal in response to a magnetic field. 11. An integrated circuit package, an upper module comprising a housing, a wireless communication device provided in the housing, and an upper module connection circuit for providing an electrical connection to the wireless communication device, and a substrate. A lower module comprising a processing circuit coupled to the substrate and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit. Integrated circuit package. 12. The integrated circuit package according to claim 11, wherein the wireless communication device has an antenna. 13. The integrated circuit package according to claim 12, wherein the processing circuit comprises an analog circuit for processing a signal received by the antenna. 14. The integrated circuit package according to claim 13, wherein the processing circuit further includes a digital circuit that processes a signal from the analog circuit. 15. The integrated circuit package according to claim 13, wherein the digital circuit comprises a geostationary positioning circuit. 16. The integrated circuit package according to claim 12, wherein the processing circuit comprises an analog circuit for processing a signal to be transmitted by the antenna. 17. The integrated circuit package of claim 16, wherein the processing circuit further comprises a digital circuit that processes a signal to be delivered to the analog circuit. 18. An integrated circuit package, an upper module comprising a housing, an output device provided in the housing, and an upper module connection circuit for providing electrical connection to the output device; a substrate; A lower module comprising a processing circuit coupled to the substrate and a lower module connection circuit electrically coupled to the processing circuit to provide a removable connection with the upper module connection circuit. Integrated circuit package. 19. The integrated circuit package according to claim 18, wherein the output device has a speaker. 20. The integrated circuit package according to claim 18, wherein the output device comprises a display. 21. The integrated circuit package according to claim 18, wherein the output device has a device for providing a tactile signal. 22. The integrated circuit package according to claim 21, wherein the device for providing the tactile signal includes a vibration device. 23. The integrated circuit package according to claim 18, wherein the output device has a buzzer. 24. The integrated circuit package according to claim 18, wherein the processing circuit comprises a digital signal processing device. 25. In an integrated circuit package, a housing, a battery provided in the housing, a first crystal supplying a clock signal to a real-time clock, and a second crystal supplying a clock signal for a system clock. An upper module comprising an upper module connection circuit for providing electrical connection to the battery and the first and second crystals; a substrate; a processing circuit coupled to the substrate; and an attachment / detachment of the upper module connection circuit. A lower module comprising a lower module connection circuit electrically coupled to the processing circuit to provide a flexible connection. 26. The integrated circuit package according to claim 25, wherein the processing circuit comprises a real-time clock circuit for supplying time and data output and a clock circuit for supplying a system clock signal. 27. In a system for packaging integrated circuit components, a ball grid array substrate, a plurality of solder balls bonded to the substrate, a semiconductor device bonded to the solder ball, and the semiconductor device bonded to the substrate. One or more terminals electrically coupled to the module, a module including an auxiliary component, a body portion for the module to include the component, and the module holding the module to the substrate and the component To engage each of the terminals to electrically couple a terminal to the semiconductor device 1
A system comprising: one or more electrical connectors. 28. The method of claim 27, wherein the terminal has a metal post with an enlarged upper portion, and the connector has a deformable metal clip for clamping to the post. System to do. 29. The connector of claim 27, wherein the connector has a pin and the terminal has a metal post having a hole formed to receive the pin. system. 30. The system according to claim 27, wherein the auxiliary component is a battery. 31. The system of claim 27, wherein the auxiliary component is a resonator. 32. The method of claim 27, wherein the terminals are asymmetrically arranged on the substrate such that the module is capable of engaging the terminals when properly oriented with respect to the substrate. A system characterized by being present. 33. The system of claim 27, wherein the one or more terminals are electrically coupled to respective solder balls. 34. In a system for packaging integrated circuit components, a ball grid array substrate, a plurality of solder balls coupled to the substrate, a semiconductor device coupled to the solder balls, and solders coupled to the substrate and each solder. One or more terminals electrically coupled to the ball, a module including an auxiliary component, the module including a body portion for accommodating the component, the component electrically connected to the semiconductor device. And one or more electrical connectors that engage each of the terminals for positive coupling. 35. The system of claim 34, wherein the electrical connector mechanically engages the terminals to retain the module against the substrate. 36. The method of claim 35, wherein the terminal has a metal post with an enlarged upper portion and the connector has a deformable metal clip for clamping to the post. System to do. 37. The system of claim 35, wherein the connector has a pin and the terminal has a metal post having a hole formed therein to receive the pin. 38. The system according to claim 34, wherein the auxiliary component is a battery. 39. The system according to claim 34, wherein the auxiliary component is a resonator. 40. The terminals according to claim 34, wherein the terminals are asymmetrically arranged on the substrate such that the modules are capable of engaging the terminals when properly oriented with respect to the substrate. A system characterized by that. 41. A method of mounting an integrated circuit on a printed circuit board, wherein a ball grid array board having a semiconductor device mounted thereon is mounted on the printed circuit board, and terminals, connectors and modules of the board are physically connected. And attaching electrical modules to the substrate to provide both electrical connection and electrical connection. 42. The mounting of claim 41, wherein the mounting step comprises mounting a module including batteries and terminals and connectors on the board and a battery such that the module provides both physical and electrical connections. A method of having. 43. The method of claim 41, wherein the step of attaching includes attaching to the substrate a module that includes terminals and connectors on the substrate and a resonator so that the module provides both physical and electrical connections. Features and methods of having.