JPH08243737A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPH08243737A
JPH08243737A JP4815395A JP4815395A JPH08243737A JP H08243737 A JPH08243737 A JP H08243737A JP 4815395 A JP4815395 A JP 4815395A JP 4815395 A JP4815395 A JP 4815395A JP H08243737 A JPH08243737 A JP H08243737A
Authority
JP
Japan
Prior art keywords
solder
iron
chuck
tip
soldering iron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4815395A
Other languages
Japanese (ja)
Inventor
Hiroshi Tanaka
博 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP4815395A priority Critical patent/JPH08243737A/en
Publication of JPH08243737A publication Critical patent/JPH08243737A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To prevent the overmelting of solder and to prevent the occurrence of a joining defect by bringing the front end of an iron tip mounted at a solder iron near to a mouthpiece part and bending this front end. CONSTITUTION: The bar-shaped solder 12 is put into a solder case 4 and a knocking cover 2 at the top end of this solder case 4 is pushed, by which the solder 12 is extruded via an operating mechanism consisting of a spring 5, a shaft joint 6, a mouthpiece 7, a fastener 8, a trisected chuck 9, a holding chuck 10 and a front end pipe 11. On the other hand, the solder iron 1 is mounted at the side face of an outside cylinder 3 covering the solder case 4 and the solder iron 13 is bent in mid-way so as to intersect with the solder 12 extruded from the front end pipe 11. The iron tip 13 is mounted at the solder iron 1 and its front end is brought near to the mouthpiece part 7 and is bent. The solder 13 is melted by electric heating. As a result, the specified amt. of the solder is extruded from the front end pipe.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半田付け装置に関す
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a soldering device.

【0002】[0002]

【従来の技術】従来、半田(はんだ)付け作業を行う場
合、半田鏝(はんだごて)と半田をそれぞれの手に持つ
ことにより作業を行っていた。即ち、半田鏝と半田が別
々であった為、特に導線等の接合作業を行う場合、半田
鏝、半田、導線の3つを同時に扱う必要があり、作業性
が悪かった。
2. Description of the Related Art Conventionally, when performing a soldering operation, the soldering iron (solder iron) and the solder are held in their respective hands. That is, since the soldering iron and the solder are separate, it is necessary to handle the soldering iron, the solder, and the conductor wire at the same time, especially when the conductor wire and the like are joined, and the workability is poor.

【0003】また、半田の溶かす量を調節するため、手
先の微妙な操作を必要としていたが、操作間違いをした
場合、適量以上の半田が溶着し、接合不良の原因となっ
ていた。
Further, in order to adjust the melting amount of the solder, it is necessary to perform a delicate operation of the hand. However, if the operation is mistaken, a proper amount or more of the solder will be welded, causing a defective joint.

【0004】[0004]

【発明が解決しようとする課題】半田鏝、半田及び半田
付けする部材の3つを同時に手で扱うことによる作業性
の悪さを改善し、適量以上の半田が溶着する危険性を減
少させるため、本発明は、半田鏝、半田を両手で持た
ず、片手で扱えるように改善し、また、半田を溶かす量
が容易に調節できる半田付け装置を提供することを目的
としている。
In order to improve the poor workability by simultaneously handling the soldering iron, the solder, and the member to be soldered by hand at the same time, and to reduce the risk of welding an appropriate amount of solder, SUMMARY OF THE INVENTION It is an object of the present invention to provide a soldering apparatus which is improved so that the soldering iron and the solder can be handled by one hand without holding them by both hands, and the amount of melting the solder can be easily adjusted.

【0005】[0005]

【課題を解決するための手段】本発明の半田付け装置
は、頭頂部に押し蓋を設け内部に芯棒状の半田を装填し
た外筒と、押し蓋を押す毎に半田を予め定めた長さだけ
押し出す口金部と、外筒に取り付けられ電熱を供給する
半田鏝と、半田鏝に取り付けられ先端部を口金部に近づ
けて曲げられた鏝先とを備えたことを特徴としている。
The soldering apparatus of the present invention comprises an outer cylinder having a push lid at the top of the head and a core rod-shaped solder loaded therein, and a predetermined length of solder for each push of the push lid. It is characterized in that it is provided with a mouthpiece part that pushes out only, a soldering iron attached to the outer cylinder to supply electric heat, and a iron tip attached to the soldering iron and bent so that its tip end is close to the mouthpiece portion.

【0006】[0006]

【作用】本発明の半田付け装置においては、外筒の頭頂
部に押し蓋を設け、内部に芯棒状の半田を装填し、外筒
の先端部に口金部を設け、押し蓋を押す毎に半田を予め
定めた長さだけ押し出し、外筒に半田鏝を取り付けて電
熱を供給し、半田鏝に半田先を取り付け、鏝先の先端部
を口金部に近づけて曲げたことを特徴としている。
In the soldering apparatus of the present invention, a push lid is provided on the crown of the outer cylinder, core rod-shaped solder is loaded inside, and a cap portion is provided at the tip of the outer cylinder. It is characterized in that the solder is extruded by a predetermined length, the solder iron is attached to the outer cylinder to supply electric heat, the solder tip is attached to the solder iron, and the tip of the iron tip is bent close to the mouthpiece.

【0007】[0007]

【実施例】次に本発明の半田付け装置の一実施例を説明
する。図1において、外筒3は頭頂部にノックカバー
(押し蓋)2を設け、内部に芯棒状の半田12を装填して
いる。半田12は外筒3と同芯状に設けられた半田ケース
4に収納されている。半田ケース4の先端にはスプリン
グ5が設けられており、軸継手6、締め具8、三つ割チ
ャック(具)9、保持チャック(具)10、先端パイプ11
および口金7によって口金部を構成している。そして、
ノックカバー2を押す毎に半田12を予め定めた長さだけ
押し出す。半田鏝1は外筒3に取り付けられ電気の供給
によって熱を発生する。鏝先13は半田鏝1に取り付けら
れ先端部を口金部に近づけて曲げられており、電熱によ
って半田12を溶解する。
EXAMPLE An example of the soldering apparatus of the present invention will be described below. In FIG. 1, an outer cylinder 3 is provided with a knock cover (pushing lid) 2 on the top of the head thereof, and a core rod-shaped solder 12 is loaded therein. The solder 12 is housed in a solder case 4 provided concentrically with the outer cylinder 3. A spring 5 is provided at the tip of the solder case 4, and a shaft joint 6, a fastener 8, a three-way chuck (tool) 9, a holding chuck (tool) 10, a tip pipe 11 are provided.
And the base 7 constitutes a base part. And
Each time the knock cover 2 is pushed, the solder 12 is pushed out by a predetermined length. The soldering iron 1 is attached to the outer cylinder 3 and generates heat by supplying electricity. The iron tip 13 is attached to the soldering iron 1 and is bent with its tip portion close to the mouthpiece portion, and melts the solder 12 by electric heat.

【0008】即ち、図1は、本発明を適用した装置の一
例であり、半田を供給する装置と半田鏝1が一体化した
構造を示している。
That is, FIG. 1 shows an example of a device to which the present invention is applied, and shows a structure in which a device for supplying solder and a soldering iron 1 are integrated.

【0009】棒状にした半田12を半田ケース4の中に入
れ、半田ケース4の上端に取り付けたノックカバー2を
押すことにより、スプリング5、軸継手6、口金7、締
め具8、三つ割チャック9、保持チャック10、先端パイ
プ11よりなる動作機構を経て半田12が押し出される。
By inserting the rod-shaped solder 12 into the solder case 4 and pushing the knock cover 2 attached to the upper end of the solder case 4, the spring 5, the shaft coupling 6, the mouthpiece 7, the fastener 8, and the three-part split The solder 12 is pushed out through an operating mechanism including a chuck 9, a holding chuck 10 and a tip pipe 11.

【0010】一方、半田鏝1は半田ケース4を覆ってい
る外筒3の側面に取り付けられ、鏝先13は先端パイプ11
より押し出される半田12と交差するように途中で曲折し
ている。
On the other hand, the soldering iron 1 is attached to the side surface of the outer cylinder 3 which covers the solder case 4, and the ironing tip 13 is a tip pipe 11.
It is bent halfway so that it intersects the solder 12 that is pushed out more.

【0011】次に、半田12を供給する為の動作機構を説
明する。棒状の半田12を半田ケース4に入れた時、半田
12は自然落下で三つ割チャック9の後ろまで落ち、図2
の状態になる。
Next, an operation mechanism for supplying the solder 12 will be described. When the rod-shaped solder 12 is put in the solder case 4, the solder
12 drops by gravity to the back of the three-way chuck 9,
It becomes the state of.

【0012】そこで、半田ケース4の上端に取り付けた
ノックカバー2を一回押すと、その動力は、三つ割チャ
ック9に伝達し、三つ割チャック9は押し下げられる。
三つ割チャック9が押し下げられると締め具8は、口金
7によって三つ割チャック9から外れ、三つ割チャック
9は開いた状態になる。それと同時に半田12は保持チャ
ック10の上端まで落ち、図3の状態になる。
Then, when the knock cover 2 attached to the upper end of the solder case 4 is pushed once, the power thereof is transmitted to the three-piece chuck 9, and the three-piece chuck 9 is pushed down.
When the three-piece chuck 9 is pushed down, the fastener 8 is disengaged from the three-piece chuck 9 by the mouthpiece 7, and the three-piece chuck 9 is opened. At the same time, the solder 12 drops to the upper end of the holding chuck 10 and becomes the state of FIG.

【0013】その後、ノックカバー2を押していた手を
離すと、スプリング5が軸継手6と半田ケース4を引き
離すため、三つ割チャックは軸継手6、口金7に対して
上にスライドし、締め具8によって三つ割チャック9と
半田12が固定される。つまり図4の状態になる。
Thereafter, when the hand pushing the knock cover 2 is released, the spring 5 pulls the shaft joint 6 and the solder case 4 away from each other, so that the three-way chuck slides up against the shaft joint 6 and the mouthpiece 7 and tightens. The three-piece chuck 9 and the solder 12 are fixed by the tool 8. That is, the state shown in FIG. 4 is obtained.

【0014】次に、再度ノックカバー2を押すと(2回
目の操作)その途中までは、三つ割チャック9と締め具
8は同時に下へ移動するので、半田12も一緒に押し下げ
られ、図5の状態になる。
Next, when the knock cover 2 is pushed again (second operation), the half-divided chuck 9 and the fastener 8 move downward at the same time, so that the solder 12 is also pushed down. It becomes the state of 5.

【0015】更にノックカバー2を押していくと、締め
具8は口金7によってある距離以上押し下がらなくな
り、三つ割チャック9と半田12のみ下へ移動する。三つ
割チャック9が押し下げられていくうち、締め具が外れ
るので三つ割チャック9は外側へ開き、図6の状態に移
る。
When the knock cover 2 is further pushed, the fastener 8 cannot be pushed down for a certain distance by the mouthpiece 7, and only the three-divided chuck 9 and the solder 12 are moved downward. While the three-divided chuck 9 is being pushed down, the fastener is released, so that the three-divided chuck 9 is opened to the outside and the state shown in FIG. 6 is entered.

【0016】次に、ノックカバー2から手を離すと、ス
プリング5によって三つ割チャック9は上に移動する。
この時、締め具8は三つ割チャック9に引っ掛かり、三
つ割チャック9と共に上へ移動するので、三つ割チャッ
ク9は開いたままで、図7の状態に移る。
Next, when the hand is released from the knock cover 2, the spring 5 moves the three-divided chuck 9 upward.
At this time, since the fastener 8 is caught by the three-piece chuck 9 and moves upward together with the three-piece chuck 9, the three-piece chuck 9 remains open and the state shown in FIG. 7 is entered.

【0017】更に三つ割チャック9と締め具8が上に移
動すると締め具8が軸継手6に当たり、そこで止まるの
で、三つ割チャックのみが上へ移動し、締め具8によっ
て締め付けられる。図4と同様の状態となる。
Further, when the three-piece chuck 9 and the fastener 8 move upward, the fastener 8 comes into contact with the shaft coupling 6 and stops there. Therefore, only the three-piece chuck moves upward and is tightened by the fastener 8. The state is the same as in FIG.

【0018】図4乃至図7の操作を繰り返しで、必要な
長さの半田12が繰り出される。
By repeating the operations shown in FIGS. 4 to 7, the solder 12 having a required length is delivered.

【0019】以上、ノックカバー2を押すことにより、
一定量の半田12を先端パイプ11に押し出すことが可能と
なり、更に半田ケース4の外筒3と半田鏝1が一体化さ
れている為に、半田12と半田鏝1を片手で取り扱うこと
ができる。
As described above, by pushing the knock cover 2,
A certain amount of solder 12 can be pushed out to the tip pipe 11, and since the outer cylinder 3 of the solder case 4 and the soldering iron 1 are integrated, the solder 12 and the soldering iron 1 can be handled with one hand. .

【0020】前記構成及び作用で、一定量の半田12を先
端パイプ12に押し出すことにより、半田12が溶け過ぎて
接合不良となることを防止し、更に、半田鏝1と半田12
を供給する部分とが一体化されている為に片手で取り扱
え、作業性が向上する。
With the above-described structure and operation, by pushing a certain amount of the solder 12 to the tip pipe 12, it is possible to prevent the solder 12 from being excessively melted and causing a joint failure, and further, the soldering iron 1 and the solder 12
Since it is integrated with the part that supplies, it can be handled with one hand, improving workability.

【0021】前記実施例においては、半田鏝1は特に温
度のコントロール機能を付けていないが、例えば、電力
量調整装置を半田鏝部に追加した場合でも本発明が有効
であることは明らかである。
In the above-mentioned embodiment, the soldering iron 1 does not have a temperature control function, but it is clear that the present invention is effective even when a power amount adjusting device is added to the soldering iron portion. .

【0022】又、前記実施例において、半田12の送り出
しは、軸先端のノックカバー2を押し出す方式としてい
るが、軸の中央部にあるノブを操作する方式や、キャッ
プをスライド(移動)させることにより操作する方式と
しても半田鏝と軸を一体化する本発明が有効であること
は明らかである。
In the above embodiment, the solder 12 is sent out by pushing the knock cover 2 at the tip of the shaft, but the knob at the center of the shaft is operated or the cap is slid (moved). It is apparent that the present invention in which the soldering iron and the shaft are integrated is effective as a method of operating by.

【0023】[0023]

【発明の効果】本実施例により、半田が溶け過ぎて接合
不良となることを防止し、一定量の半田を先端パイプか
ら押し出すことができる。
According to the present embodiment, it is possible to prevent the solder from being melted too much to cause a defective joint and to push out a certain amount of solder from the tip pipe.

【0024】更に、半田鏝と半田を供給する部分とが一
体化されている為に、片手で取り扱え、作業性が向上す
る。
Further, since the soldering iron and the portion for supplying the solder are integrated, the soldering iron can be handled with one hand and the workability is improved.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す半田付け装置の断面図で
ある。
FIG. 1 is a sectional view of a soldering device showing an embodiment of the present invention.

【図2】図1の作用を示す部分断面図である。FIG. 2 is a partial cross-sectional view showing the operation of FIG.

【図3】図1の作用を示す部分断面図である。FIG. 3 is a partial cross-sectional view showing the operation of FIG.

【図4】図1の作用を示す部分断面図である。FIG. 4 is a partial cross-sectional view showing the operation of FIG.

【図5】図1の作用を示す部分断面図である。FIG. 5 is a partial cross-sectional view showing the operation of FIG.

【図6】図1の作用を示す部分断面図である。FIG. 6 is a partial cross-sectional view showing the operation of FIG.

【図7】図1の作用を示す部分断面図である。FIG. 7 is a partial cross-sectional view showing the operation of FIG.

【符号の説明】[Explanation of symbols]

1 半田鏝 2 ノックカバー 3 外筒 13 鏝先 1 Solder iron 2 Knock cover 3 Outer cylinder 13 Iron tip

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 頭頂部に押し蓋を設け内部に芯棒状の半
田を装填した外筒と、前記押し蓋を押す毎に前記半田を
予め定めた長さだけ押し出す口金部と、前記外筒に取り
付けられ電熱を供給する半田鏝と、半田鏝に取り付けら
れ先端部を前記口金部に近づけて曲げられた鏝先と、を
具備してなる半田付け装置。
1. An outer cylinder provided with a push lid on the top of the head and having core-shaped solder loaded therein, a mouthpiece portion for pushing out the solder by a predetermined length each time the push lid is pushed, and the outer cylinder. A soldering device comprising: a soldering iron attached to supply electric heat; and a soldering iron tip attached to the soldering iron and bent so that a tip end portion is close to the mouthpiece portion.
JP4815395A 1995-03-08 1995-03-08 Soldering device Pending JPH08243737A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4815395A JPH08243737A (en) 1995-03-08 1995-03-08 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4815395A JPH08243737A (en) 1995-03-08 1995-03-08 Soldering device

Publications (1)

Publication Number Publication Date
JPH08243737A true JPH08243737A (en) 1996-09-24

Family

ID=12795430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4815395A Pending JPH08243737A (en) 1995-03-08 1995-03-08 Soldering device

Country Status (1)

Country Link
JP (1) JPH08243737A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006064533A1 (en) * 2004-12-13 2006-06-22 Meinan Dental Trading Co., Ltd. Wire material holder
CN107671384A (en) * 2017-11-04 2018-02-09 成都飞赛特科技有限公司 A kind of medical bent cuboid solder horn of maintenance
CN107671383A (en) * 2017-11-04 2018-02-09 成都飞赛特科技有限公司 A kind of medical bent cone solder horn of maintenance

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006064533A1 (en) * 2004-12-13 2006-06-22 Meinan Dental Trading Co., Ltd. Wire material holder
CN107671384A (en) * 2017-11-04 2018-02-09 成都飞赛特科技有限公司 A kind of medical bent cuboid solder horn of maintenance
CN107671383A (en) * 2017-11-04 2018-02-09 成都飞赛特科技有限公司 A kind of medical bent cone solder horn of maintenance

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